U6805B Hex-Driver with Thermal Monitoring Description The hex-driver IC includes 6 non-inverted and current limited output stages with an open collector. Common thermal shutdown protects outputs against critical junction temperature. Each output can sink 20 mA, parallel output operation is possible. The digital inputs have Schmitt-trigger function with pull-up current sources to 5 V. Features D Six input comparators with Schmitt-trigger D ESD protection to human body model: "2000 V (C = 100 pF, R = 1.5 kW) characteristic D Input clamping current capability to "10 mA D Output stages: – Short circuit protected with diode D Integrated protection cells (EMC, ESD, RF) – Load-dump protected @ 1 kW dedicated to all input stages – No crosstalk on adjacent channels D Common shutdown by junction temperature monitor – Clamping current @ – 2 mA D Low voltage reset with hysteresis – Jump start possible Ordering Information Extended Type Number U6805B–FP Package SO14 Remarks Block Diagram VS 11 VO1 VO2 VO3 VO4 VO5 VO6 1 2 5 7 3 6 Thermal shutdown 4 GND Under voltage detection VS=5 V 14 VI1 13 VI2 12 10 VI3 VI4 VS 9 VI5 8 VI6 13334 Figure 1. TELEFUNKEN Semiconductors Rev. A3, 28-Apr-97 1 (5) U6805B Pin Description VO1 1 14 VI1 VO2 2 13 VI2 VO3 3 12 VI3 GND 4 11 VO4 5 10 VI4 VO5 6 9 VI5 VO6 7 8 VI6 VS Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Symbol VO1 VO2 VO3 GND VO4 VO5 VO6 VI6 VI5 VI4 VS VI3 VI2 VI1 Function Output 1 Output 2 Output 3 Ground Output 4 Output 5 Output 6 Input 6 Input 5 Input 4 Supply voltage, 5 V Input 3 Input 2 Input 1 13335 Figure 2. Pinning Basic Circuitry " Integrated circuit, U6805B, requires a stabilized supply voltage (VS = 5 V 5%) to comply with its electrical characteristics. An external buffer capacitor of C = 100 nF value is recommended. An integrated 14-V Z-diode between VS and ground protects the supply pin. All input stages are provided with an integrated 250 kW pull–up resistor and can be directly connected to a microcontroller. All output stages are open collectors each capable of sinking 20 mA. Recommended external components: Pull–up resistor, R = 1 kW Capacitor to GND, C = 470 pF, see figure 3 Functional Description General ON state: Low level at the input stage activates the corresponding output stage. OFF state: The internal pull-up resistor gives high level to the input comparator and deactivates the output stage. " 7-V Z-diodes between each input pin and GND are capable of 10 mA clamping currents without crosstalk on adjacent input stages. " A total clamping current of 30 mA should be observed with respect to the power dissipation. 2 (5) Current Limitation of the Output Stages and Overtemperature Shut-down A temperature dependent current limitation between 25 and 100 mA protects the stages during a short. Additionally the chip temperature is monitored. For Tchip > 148_C all outputs are disabled and automatically enabled with a hysteresis of DTChip > 5 K. Refer to hexdriver U6807B if the temperature shut down is not required. Transients and Load-Dump An integrated 28-V Z-diode protects each output stage against transients and load-dump (Schaffner pulses). With the help of external 1-kW resistor , the output transistor is capable of the corresponding current which flows during each of these conditions. Apart from that, outputs are short circuit and overload protected. Low Voltage Detection When supply voltage is switched on, a power-on reset pulse is generated internally, which disables all output stages until a defined supply voltage level is reached. The low voltage detection is provided with a hysteresis of Vhyst = 0.5 V typically. TELEFUNKEN Semiconductors Rev. A3, 28-Apr-97 U6805B Absolute Maximum Ratings Parameters Symbol Value Unit VS 7.0 V Ambient temperature range Tamb –40 to +125 Storage temperature range Tstg –50 to +150 Tj +150 _C _C _C Symbol Value Unit RthJA 120 K/W Supply voltage Maximum junction temperature Thermal Resistance Parameters Junction ambient Electrical Characteristics " VS = 5 V 5%, Tamb = 25_C, reference point pin 4 (GND), unless otherwise specified, see figure 1. Parameters Max. Unit 4.75 5.25 V IS IS 0.8 7 3.2 13 mA mA VTH(ON) VTH(OFF) 3.7 3.0 4.6 3.8 V V Low voltage hysteresis Vhyst 0.55 1.05 V Temperature shut down TChip 140 149 Temperature shut-down hysteresis Thyst 5 _C _C Z-diode protection voltage VI 6.7 8.5 V Z-diode clamping current II Pull-up resistor RI Supply Test Conditions / Pins Supply current Inputs open Inputs closed to GND Low voltage detection threshold ON OFF VS Typ. Pins 8, 9, 10, 12, 13 and 14 Switching threshold OFF ON Hysteresis Outputs Min. Pin 11 Supply voltage Inputs Symbol 170 "10 250 305 mA kW VI VI 3.3 1.8 V V Vhyst 1.5 V Pins 1, 2, 3, 5, 6 and 7 Z-diode protection voltage VO 26.5 Integrated capacitor V 5 pF Leakage current ILeak 2.5 mA Saturation voltage (I = 20 mA) VSat 0.7 V Current limitation Ilimit Propagation delay (470 pF, 1 kW, 20 V) TELEFUNKEN Semiconductors Rev. A3, 28-Apr-97 td 25 mA 5 ms 3 (5) U6805B Application Circuit VS=5 V VBatt Load 100 nF VO1 VI2 VO2 VI3 Micro controller R VI1 VI4 VI5 R R R R R 6x 1kΩ VO3 U6805B VO4 Hexdriver IC VO5 VI6 VO6 C C C C C C 6x 470 pF 13336 Figure 3. Application schematic Package Information Package SO14 Dimensions in mm 5.2 4.8 8.75 3.7 1.4 0.25 0.10 0.4 1.27 6.15 5.85 7.62 14 0.2 3.8 8 technical drawings according to DIN specifications 13035 14 4 (5) 8 TELEFUNKEN Semiconductors Rev. A3, 28-Apr-97 U6805B Ozone Depleting Substances Policy Statement It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances ( ODSs). The Montreal Protocol ( 1987) and its London Amendments ( 1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency ( EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively. TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423 TELEFUNKEN Semiconductors Rev. A3, 28-Apr-97 5 (5)