TSC SS32

SS32 - SS315
3.0 AMPS. Surface Mount Schottky Barrier Rectifiers
SMC/DO-214AB
.126(3.20)
.114(2.90)
.245(6.22)
.220(5.59)
Features
.280(7.11)
.260(6.60)
For surface mounted application
Easy pick and place
Metal to silicon rectifier, majority carrier conduction
Low power loss, high efficiency
High current capability, low VF
High surge current capability
Plastic material used carriers Underwriters
Laboratory Classification 94V-0
Epitaxial construction
High temperature soldering:
260oC / 10 seconds at terminals
.012(.31)
.006(.15)
.103(2.62)
.079(2.00)
.061(1.56)
.050(1.26)
.008(.20)
.004(.10)
.063(1.6)
.039(1.0)
.320(8.13)
.305(7.75)
Mechanical Data
Dimensions in inches and (millimeters)
Case: JEDEC DO-214AB Molded plastic
Terminals: Pure tin plated, lead free
Polarity: Indicated by cathode band
Packaging: 16mm tape per EIA STD RS-481
Weight: 0.21 gram
Maximum Ratings and Electrical Characteristics
Rating at 25oC ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Symbol SS SS SS SS
Type Number
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified
Current at TL(See Fig. 1)
Peak Forward Surge Current, 8.3 ms Single
Half Sine-wave Superimposed on Rated
Load (JEDEC method )
Maximum Instantaneous Forward Voltage
(Note 1)
IF= 3.0A @ 25oC
@ 100oC
o
Maximum DC Reverse Current @ TA =25 C at
o
Rated DC Blocking Voltage
@ TA=125 C
Typical Thermal Resistance ( Note 2 )
VRRM
VRMS
VDC
32
20
14
20
33
30
21
30
34
40
28
40
SS
36
60
42
60
35
50
35
50
SS
39
90
63
90
SS
310
100
70
100
SS Units
315
150
V
105
V
150
V
3.0
I(AV)
IFSM
100
VF
0.5
0.4
70
0.75
0.65
0.5
IR
10
R θJL
R θJA
Operating Temperature Range
TJ
-55 to +125
Storage Temperature Range
TSTG
Notes:
1. Pulse Test with PW=300 usec, 1% Duty Cycle
- 46 -
A
5
17
55
A
V
0.85
0.95
0.70
0.80
0.1
0.5
-55 to +150
-55 to +150
mA
mA
o
C/W
o
o
C
C
Version: B07
RATINGS AND CHARACTERISTIC CURVES (SS32 THRU SS315)
FIG.1- MAXIMUM FORWARD CURRENT DERATING
CURVE
100
AVERAGE FORWARD CURRENT. (A)
RESISTIVE OR
INDUCTIVE LOAD
SS35-SS315
SS32-SS34
2
1
PCB MOUNTED ON 0.6X0.6"
(16X16mm) COPPER PAD AREAS
50
60
70
80
90
100
110
120
130
140
150
PEAK FORWARD SURGE CURRENT. (A)
3
0
FIG.2- MAXIMUM NON-REPETITIVE PEAK FORWARD
SURGE CURRENT
AT RATED TL
8.3ms Single Half Sine Wave
JEDEC Method
80
60
40
20
01
160
10
NUMBER OF CYCLES AT 60Hz
o
LEAD TEMPERATURE. ( C)
FIG.4- TYPICAL REVERSE CHARACTERISTICS
FIG.3- TYPICAL FORWARD CHARACTERISTICS
20
40
TJ=25 0C
10
0
TJ=125C
10
INSTANTANEOUS REVERSE CURRENT. (mA)
INSTANTANEOUS FORWARD CURRENT. (A)
SS35-SS36
SS32-SS34
1
SS39-SS310
0.1
1
0
TJ=75C
0.1
0.01
TJ=25 0C
SS315
PULSE WIDTH=300 S
1% DUTY CYCLE
0.01
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
SS32-SS34
SS35-SS315
0.001
0
1.6
TRANSCIENT THERMAL IMPEDANCE, ( oC/W)
JUNCTION CAPACITANCE.(pF)
40
60
80
100
120
140
FIG.6- TYPICAL TRANSIENT THERMAL
CHARACTERISTICS
FIG.5- TYPICAL JUNCTION CAPACITANCE
1000
0
TJ=25C
f=1.0MHz
Vsig=50mVp-p
100
SS32-SS34
SS35-SS36
SS39-SS315
1
20
PERCENT OF RATED PEAK REVERSE VOLTAGE. (%)
FORWARD VOLTAGE. (V)
10
0.1
100
10
REVERSE VOLTAGE. (V)
100
100
10
1
0.1
0.01
0.1
1
10
t, PULSE DURATION, (sec)
Version: B07
100