RC4560 www.ti.com ..................................................................................................................................................... SLOS457A – JANUARY 2005 – REVISED APRIL 2008 DUAL AUDIO OPERATIONAL AMPLIFIER FEATURES 1 • • • • Operating Voltage . . . ±2 V to ±18 V Low Noise Voltage . . . 1.2 µVrms (Typ) Wide GBW . . . 15 MHz (Typ) Low THD . . . 0.05% (Typ) • • Slew Rate . . . 5.5 V/µsec (Typ) Suitable for Applications Such as Audio Preamplifier, Active Filter, Headphone Amplifier, Industrial Measurement Equipment DESCRIPTION/ORDERING INFORMATION The RC4560 is a high-gain, wide-bandwidth, dual operational amplifier capable of driving 20 V peak-to-peak into 400-Ω loads. The RC4560 combines many of the features of the RC4558, but with wider bandwidth and higher slew rate, making this device ideal for active filters, data and telecommunications, and many instrumentation applications. ORDERING INFORMATION (1) PACKAGE (2) TA PDIP – P –40°C to 85°C SOIC – D TSSOP – PW (1) (2) ORDERABLE PART NUMBER Tube of 50 RC4560IP Tube of 75 RC4560ID Reel of 2500 RC4560IDR Tube of 150 RC4560IPW Reel of 2000 RC4560IPWR TOP-SIDE MARKING RC4560IP R4560I R4560I For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005–2008, Texas Instruments Incorporated RC4560 SLOS457A – JANUARY 2005 – REVISED APRIL 2008 ..................................................................................................................................................... www.ti.com EQUIVALENT CIRCUIT VCC+ Output − Input + Input VCC− ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VCC± Supply voltage ±18 V Input voltage (any input) ±15 V Output current ±50 mA D package θJA Package thermal impedance (2) (3) TJ Operating virtual junction temperature Tstg Storage temperature range (1) (2) (3) 2 97°C/W P package 85°C/W PW package 149°C/W 150°C −60°C to 125°C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can impact reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback Copyright © 2005–2008, Texas Instruments Incorporated Product Folder Link(s): RC4560 RC4560 www.ti.com ..................................................................................................................................................... SLOS457A – JANUARY 2005 – REVISED APRIL 2008 RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) VCC+ VCC– Supply voltage MIN MAX 2 16 –2 –16 ±30 UNIT V VID Differential input voltage VICR Input common mode range –14 14 V V TA Operating free-air temperature range –40 85 °C TYP MAX ELECTRICAL CHARACTERISTICS VCC± = ±15 V, TA = 25°C (unless otherwise noted) PARAMETER VIO Input offset voltage IIO Input offset current IIB Input bias current AVD Large-signal differential voltage amplification ri Input resistance VO Output voltage swing VICR Common-mode input voltage range TEST CONDITIONS RS ≤ 10 kΩ RL ≥ 2 kΩ, VO = ±10 V CMRR Common-mode rejection ratio kSVR Supply-voltage rejection ratio (1) ICC Supply current (all amplifiers) (1) MIN 86 UNIT 0.5 6 mV 5 200 nA 40 500 nA 100 dB MΩ 0.3 5 RL ≥ 2 kΩ ±12 ±14 IO = 25 mA ±10 ±12.5 V ±12 ±14 V RS ≤ 10 kΩ 70 90 dB RS ≤ 10 kΩ 76.5 90 dB 4.3 5.7 mA Measured with VCC± differentially varied simultaneously from ±4 V to ±15 V OPERATING CHARACTERISTICS VCC± = ±15 V, TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS TYP UNIT SR Slew rate at unity gain 5.5 V/µs GBW Gain bandwidth product 15 MHz THD Total harmonic distortion VO = 5 V, RL = 2 kΩ, f = 1 kHz, AVD = 20 dB 0.05 % Vn Equivalent input noise voltage RIAA, RS ≤ 2 kΩ, 30-kHz LPF 1.2 µVrms Submit Documentation Feedback Copyright © 2005–2008, Texas Instruments Incorporated Product Folder Link(s): RC4560 3 PACKAGE OPTION ADDENDUM www.ti.com 25-Apr-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty RC4560ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4560IDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4560IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4560IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4560IDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4560IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4560IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type RC4560IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type RC4560IPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4560IPWE4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4560IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4560IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4560IPWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4560IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 25-Apr-2008 provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 26-Apr-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant RC4560IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 RC4560IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 26-Apr-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) RC4560IDR SOIC D 8 2500 340.5 338.1 20.6 RC4560IPWR TSSOP PW 8 2000 346.0 346.0 29.0 Pack Materials-Page 2 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDI001A – JANUARY 1995 – REVISED JUNE 1999 P (R-PDIP-T8) PLASTIC DUAL-IN-LINE 0.400 (10,60) 0.355 (9,02) 8 5 0.260 (6,60) 0.240 (6,10) 1 4 0.070 (1,78) MAX 0.325 (8,26) 0.300 (7,62) 0.020 (0,51) MIN 0.015 (0,38) Gage Plane 0.200 (5,08) MAX Seating Plane 0.010 (0,25) NOM 0.125 (3,18) MIN 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.430 (10,92) MAX 0.010 (0,25) M 4040082/D 05/98 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. 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