TI SA5532ADR

NE5532, NE5532A
SA5532, SA5532A
www.ti.com................................................................................................................................................... SLOS075I – NOVEMBER 1979 – REVISED APRIL 2009
DUAL LOW-NOISE OPERATIONAL AMPLIFIERS
FEATURES
1
•
•
•
•
•
•
NE5532, NE5532A . . . D, P, OR PS PACKAGE
SA5532, SA5532A . . . D OR P PACKAGE
(TOP VIEW)
Equivalent Input Noise Voltage:
5 nV/√Hz Typ at 1 kHz
Unity-Gain Bandwidth: 10 MHz Typ
Common-Mode Rejection Ratio: 100 dB Typ
High DC Voltage Gain: 100 V/mV Typ
Peak-to-Peak Output Voltage Swing 26 V Typ
With VCC± = ±15 V and RL = 600 Ω
High Slew Rate: 9 V/µs Typ
1OUT
1
8
VCC+
1IN–
2
7
2OUT
1IN+
3
6
2IN–
VCC–
4
5
2IN+
DESCRIPTION/ORDERING INFORMATION
The NE5532, NE5532A, SA5532, and SA5532A are high-performance operational amplifiers combining excellent
dc and ac characteristics. They feature very low noise, high output-drive capability, high unity-gain and
maximum-output-swing bandwidths, low distortion, high slew rate, input-protection diodes, and output
short-circuit protection. These operational amplifiers are compensated internally for unity-gain operation. These
devices have specified maximum limits for equivalent input noise voltage.
ORDERING INFORMATION (1)
PACKAGE (2)
TA
PDIP – P
0°C to 70°C
SOIC – D
(2)
NE5532AP
Reel of 2500
NE5532DR
Tube of 75
NE5532AD
Reel of 2500
NE5532ADR
PDIP – P
Tube of 50
SOIC – D
NE5532AP
NE5532D
Reel of 2000
TOP-SIDE MARKING
NE5532P
Tube of 75
SOP – PS
–40°C to 85°C
(1)
Tube of 50
ORDERABLE PART NUMBER
NE5532P
N5532
N5532A
NE5532PSR
N5532
NE5532APSR
N5532A
SA5532P
SA5532P
SA5532AP
SA5532AP
Tube of 75
SA5532D
Reel of 2500
SA5532DR
Tube of 75
SA5532AD
Reel of 2500
SA5532ADR
SA5532
SA5532A
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1979–2009, Texas Instruments Incorporated
NE5532, NE5532A
SA5532, SA5532A
SLOS075I – NOVEMBER 1979 – REVISED APRIL 2009................................................................................................................................................... www.ti.com
SCHEMATIC (EACH AMPLIFIER)
VCC+
36 pF
IN+
37 pF
14 pF
15 W
OUT
7 pF
IN–
15 W
460 W
VCC–
Component values shown are nominal.
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VCC
Supply voltage (2)
VCC+
22 V
VCC–
–22 V
Input voltage, either input (2) (3)
Input current
VCC±
(4)
±10 mA
Duration of output short circuit (5)
θJA
Package thermal impedance
(6) (7)
TJ
Operating virtual-junction temperature
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
(5)
(6)
(7)
2
Unlimited
D package
97°C/W
P package
85°C/W
PS package
95°C/W
150°C
–65°C to 150°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential voltages, are with respect to the midpoint between VCC+ and VCC–.
The magnitude of the input voltage must never exceed the magnitude of the supply voltage.
Excessive input current will flow if a differential input voltage in excess of approximately 0.6 V is applied between the inputs, unless
some limiting resistance is used.
The output may be shorted to ground or either power supply. Temperature and/or supply voltages must be limited to ensure the
maximum dissipation rating is not exceeded.
The package thermal impedance is calculated in accordance with JESD 51-7.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) - TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
Submit Documentation Feedback
Copyright © 1979–2009, Texas Instruments Incorporated
Product Folder Link(s): NE5532 NE5532A SA5532 SA5532A
NE5532, NE5532A
SA5532, SA5532A
www.ti.com................................................................................................................................................... SLOS075I – NOVEMBER 1979 – REVISED APRIL 2009
RECOMMENDED OPERATING CONDITIONS
MIN
MAX
UNIT
VCC+
Supply voltage
5
15
V
VCC–
Supply voltage
–5
–15
V
NE5532, NE5532A
0
70
SA5532, SA5532A
–40
85
TYP
MAX
0.5
4
TA
Operating free-air temperature
°C
ELECTRICAL CHARACTERISTICS
VCC± = ±15 V, TA = 25°C (unless otherwise noted)
TEST CONDITIONS (1)
PARAMETER
VIO
Input offset voltage
IIO
Input offset current
IIB
Input bias current
VICR
Common-mode input-voltage range
VOPP
Maximum peak-to-peak output-voltage
swing
AVD
Large-signal differential-voltage
amplification
MIN
TA = 25°C
VO = 0
TA = Full range (2)
5
TA = 25°C
TA = Full range
10
(2)
200
TA = 25°C
200
TA = Full range (2)
RL ≥ 2 kΩ, VO±10 V
800
1000
mV
nA
nA
±12
±13
V
24
26
V
TA = 25°C
15
50
TA = Full range (2)
10
TA = 25°C
25
TA = Full range (2)
15
RL ≥ 600 Ω, VCC± = ±15 V
RL ≥ 600 Ω, VO = ±10 V
150
UNIT
V/mV
100
Avd
Small-signal differential-voltage
amplification
f = 10 kHz
2.2
V/mV
BOM
Maximum output-swing bandwidth
RL = 600 Ω, VO = ±10 V
140
kHz
B1
Unity-gain bandwidth
RL = 600 Ω, CL = 100 pF
10
MHz
ri
Input resistance
300
kΩ
zo
Output impedance
30
AVD = 30 dB, RL = 600 Ω, f = 10 kHz
CMRR Common-mode rejection ratio
Ω
VIC = VICR min
70
100
dB
VCC± = ±9 V to ±15 V, VO = 0
80
100
dB
10
38
60
mA
8
16
mA
kSVR
Supply-voltage rejection ratio
(ΔVCC±/ΔVIO)
IOS
Output short-circuit current
ICC
Total supply curent
VO = 0, No load
Crosstalk attenuation (VO1/VO2)
V01 = 10 V peak, f = 1 kHz
(1)
(2)
0.3
110
dB
All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.
Full temperature ranges are: –40°C to 85°C for the SA5532 and SA5532A, and 0°C to 70°C for the NE5532 and NE5532A.
Copyright © 1979–2009, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Link(s): NE5532 NE5532A SA5532 SA5532A
3
NE5532, NE5532A
SA5532, SA5532A
SLOS075I – NOVEMBER 1979 – REVISED APRIL 2009................................................................................................................................................... www.ti.com
OPERATING CHARACTERISTICS
VCC± = ±15 V, TA = 25°C (unless otherwise noted)
PARAMETER
SR
TEST CONDITIONS
Slew rate at unity gain
Vn
Equivalent input noise voltage
In
Equivalent input noise current
4
Submit Documentation Feedback
TYP
MAX
NE5532A, SA5532A
MIN
TYP
MAX
UNIT
9
9
V/µs
10
10
%
f = 30 Hz
8
8
10
f = 1 kHz
5
5
6
f = 30 Hz
2.7
2.7
f = 1 kHz
0.7
0.7
VI = 100 mV, RL = 600 Ω,
AVD = 1, CL = 100 pF
Overshoot factor
NE5532, SA5532
MIN
nV/√Hz
pA/√Hz
Copyright © 1979–2009, Texas Instruments Incorporated
Product Folder Link(s): NE5532 NE5532A SA5532 SA5532A
PACKAGE OPTION ADDENDUM
www.ti.com
4-Feb-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
NE5532AD
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532ADE4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532ADG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532ADR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532ADRE4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532ADRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532AIP
OBSOLETE
PDIP
P
8
TBD
Call TI
NE5532AP
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
NE5532APE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
NE5532APSR
ACTIVE
SO
PS
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532APSRE4
ACTIVE
SO
PS
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532APSRG4
ACTIVE
SO
PS
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532DE4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532DG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532DR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532DRE4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532DRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NE5532IP
OBSOLETE
PDIP
P
8
NE5532P
ACTIVE
PDIP
P
8
NE5532PE4
ACTIVE
PDIP
P
8
NE5532PSR
ACTIVE
SO
PS
8
NE5532PSRE4
ACTIVE
SO
PS
NE5532PSRG4
ACTIVE
SO
SA5532AD
ACTIVE
SA5532ADE4
ACTIVE
Lead/Ball Finish
MSL Peak Temp (3)
Call TI
TBD
Call TI
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
PS
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SOIC
D
8
75
Green (RoHS &
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 1
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
4-Feb-2009
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SA5532ADG4
ACTIVE
SOIC
D
8
SA5532ADR
ACTIVE
SOIC
D
SA5532ADRE4
ACTIVE
SOIC
SA5532ADRG4
ACTIVE
SA5532AP
Lead/Ball Finish
MSL Peak Temp (3)
no Sb/Br)
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SA5532APE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SA5532D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SA5532DE4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SA5532DG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SA5532DR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SA5532DRE4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SA5532DRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SA5532P
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SA5532PE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
4-Feb-2009
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Feb-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
NE5532ADR
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
NE5532APSR
SO
PS
8
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
NE5532DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
NE5532PSR
SO
PS
8
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
SA5532ADR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
SA5532DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Feb-2009
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
NE5532ADR
SOIC
D
8
2500
340.5
338.1
20.6
NE5532APSR
SO
PS
8
2000
346.0
346.0
33.0
NE5532DR
SOIC
D
8
2500
340.5
338.1
20.6
NE5532PSR
SO
PS
8
2000
346.0
346.0
33.0
SA5532ADR
SOIC
D
8
2500
340.5
338.1
20.6
SA5532DR
SOIC
D
8
2500
340.5
338.1
20.6
Pack Materials-Page 2
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