TI HC132

SCLS034F − DECEMBER 1982 − REVISED NOVEMBER 2004
D
D
D
Wide Operating Voltage Range of 2 V to 6 V
Outputs Can Drive Up To 10 LSTTL Loads
Low Power Consumption, 20-µA Max ICC
Typical tpd = 14 ns
±4-mA Output Drive at 5 V
Low Input Current of 1 µA Max
Operation From Very Slow Input
Transitions
Temperature-Compensated Threshold
Levels
High Noise Immunity
Same Pinouts as ’HC00
SN54HC132 . . . J OR W PACKAGE
SN74HC132 . . . D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
1A
1B
1Y
2A
2B
2Y
GND
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
4B
4A
4Y
3B
3A
3Y
SN54HC132 . . . FK PACKAGE
(TOP VIEW)
1B
1A
NC
VCC
4B
D
D
D
D
D
D
D
description/ordering information
Each circuit functions as a NAND gate, but
because of the Schmitt action, it has different input
threshold levels for positive- and negative-going
signals. The ’HC132 devices perform the Boolean
function Y = A • B or Y = A + B in positive logic.
1Y
NC
2A
NC
2B
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
4A
NC
4Y
NC
3B
2Y
GND
NC
3Y
3A
These circuits are temperature compensated and
can be triggered from the slowest of input ramps
and still give clean jitter-free output signals.
4
NC − No internal connection
ORDERING INFORMATION
PACKAGE†
TA
PDIP − N
SN74HC132N
Tube of 50
SN74HC132D
Reel of 2500
SN74HC132DR
Reel of 250
SN74HC132DT
SOP − NS
Reel of 2000
SN74HC132NSR
HC132
SSOP − DB
Reel of 2000
SN74HC132DBR
HC132
Tube of 90
SN74HC132PW
Reel of 2000
SN74HC132PWR
Reel of 250
SN74HC132PWT
CDIP − J
Tube of 25
SNJ54HC132J
SNJ54HC132J
CFP − W
Tube of 150
SNJ54HC132W
SNJ54HC132W
LCCC − FK
Tube of 55
SNJ54HC132FK
TSSOP − PW
−55°C
−55
C to 125
125°C
C
TOP-SIDE
MARKING
Tube of 25
SOIC − D
−40°C
−40
C to 85
85°C
C
ORDERABLE
PART NUMBER
SN74HC132N
HC132
HC132
SNJ54HC132FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2004, Texas Instruments Incorporated
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POST OFFICE BOX 655303
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1
SCLS034F − DECEMBER 1982 − REVISED NOVEMBER 2004
FUNCTION TABLE
(each gate)
INPUTS
A
B
OUTPUT
Y
H
H
L
L
X
H
X
L
H
logic diagram (positive logic)
A
Y
B
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54HC132
MIN
VCC
VI
Supply voltage
2
Input voltage
0
VO
TA
Output voltage
Operating free-air temperature
NOM
5
SN74HC132
MAX
MIN
NOM
5
6
2
0
0
VCC
VCC
−55
125
MAX
UNIT
6
V
V
0
VCC
VCC
−40
85
°C
V
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
2
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SCLS034F − DECEMBER 1982 − REVISED NOVEMBER 2004
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
VT+
VT−
MAX
SN74HC132
MIN
MAX
2V
0.7
1.2
1.5
0.7
1.5
0.7
1.5
4.5 V
1.55
2.5
3.15
1.55
3.15
1.55
3.15
6V
2.1
3.3
4.2
2.1
4.2
2.1
4.2
2V
0.3
0.6
1
0.3
1
0.3
1
4.5 V
0.9
1.6
2.45
0.9
2.45
0.9
2.45
6V
1.2
2
3.2
1.2
3.2
1.2
3.2
UNIT
V
V
0.6
1.2
0.2
1.2
0.2
1.2
0.4
0.9
2.1
0.4
2.1
0.4
2.1
6V
0.5
1.3
2.5
0.5
2.5
0.5
2.5
2V
1.9
1.998
1.9
1.9
IOH = −20 µA
4.5 V
4.4
4.499
4.4
4.4
6V
5.9
5.999
5.9
5.9
IOH = −4 mA
IOH = −5.2 mA
4.5 V
3.98
4.3
3.7
3.84
6V
5.48
5.8
5.2
5.34
2V
0.002
0.1
0.1
0.1
IOL = 20 µA
4.5 V
0.001
0.1
0.1
0.1
6V
0.001
0.1
0.1
0.1
4.5 V
0.17
0.26
0.4
0.33
6V
0.15
0.26
0.4
0.33
6V
±0.1
±100
±1000
±1000
nA
2
40
20
µA
10
10
10
pF
IOL = 4 mA
IOL = 5.2 mA
VI = VCC or 0
VI = VCC or 0,
MIN
0.2
VI = VIH or VIL
II
ICC
SN54HC132
2V
VI = VIH or VIL
VOL
TA = 25°C
TYP
MAX
4.5 V
VT+ − VT−
VOH
MIN
IO = 0
6V
Ci
2 V to 6 V
3
V
V
V
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
TYP
MAX
SN54HC132
SN74HC132
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC
2V
60
120
186
156
tpd
A or B
Y
4.5 V
18
25
37
31
6V
14
21
32
27
2V
28
75
110
95
4.5 V
8
15
22
19
6V
6
13
19
16
tt
Any
MIN
MAX
MIN
MAX
UNIT
ns
ns
operating characteristics, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance per gate
POST OFFICE BOX 655303
No load
• DALLAS, TEXAS 75265
TYP
20
UNIT
pF
3
SCLS034F − DECEMBER 1982 − REVISED NOVEMBER 2004
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
Test
Point
Input
VCC
50%
50%
0V
CL = 50 pF
(see Note A)
tPLH
In-Phase
Output
LOAD CIRCUIT
50%
10%
tPHL
90%
90%
tr
Input
50%
10%
90%
90%
tr
VCC
50%
10% 0 V
tPHL
Out-of-Phase
Output
90%
tf
VOH
50%
10%
VOL
tf
tPLH
50%
10%
tf
50%
10%
90%
VOH
VOL
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. The outputs are measured one at a time, with one input transition per measurement.
D. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303
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PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-89845022A
ACTIVE
LCCC
FK
20
1
TBD
5962-8984502CA
ACTIVE
CDIP
J
14
1
TBD
Lead/Ball Finish
MSL Peak Temp (3)
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
5962-8984502DA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
5962-8984502VCA
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
5962-8984502VDA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
N / A for Pkg Type
SN54HC132J
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
SN74HC132D
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
SN74HC132DBLE
OBSOLETE
SSOP
DB
14
SN74HC132DBR
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC132DBRE4
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC132DE4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC132DG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC132DR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC132DRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC132DRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC132DT
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC132DTE4
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC132N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74HC132NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74HC132NSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC132NSRE4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC132PW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC132PWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC132PWLE
OBSOLETE
TSSOP
PW
14
SN74HC132PWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC132PWRE4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC132PWT
ACTIVE
TSSOP
PW
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC132PWTE4
ACTIVE
TSSOP
PW
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TBD
TBD
Addendum-Page 1
Call TI
Call TI
Level-1-260C-UNLIM
Call TI
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SNJ54HC132FK
ACTIVE
LCCC
FK
20
1
TBD
SNJ54HC132J
ACTIVE
CDIP
J
14
1
TBD
SNJ54HC132W
ACTIVE
CFP
W
14
1
SNV54HC132J
ACTIVE
CDIP
J
14
SNV54HC132W
ACTIVE
CFP
W
14
Lead/Ball Finish
MSL Peak Temp (3)
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
TBD
A42
N / A for Pkg Type
TBD
Call TI
Call TI
TBD
Call TI
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
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MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
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• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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enhancements, improvements, and other changes to its products and services at any time and to discontinue
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
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