TI SN74HC175D

 SCLS299D − JANUARY 1996 − REVISED SEPTEMBER 2003
D
D
D
D
D
Wide Operating Voltage Range of 2 V to 6 V
Outputs Can Drive Up To 10 LSTTL Loads
Low Power Consumption, 80-µA Max ICC
Contain Four Flip-Flops With Double-Rail
Outputs
Typical tpd = 13 ns
D ±4-mA Output Drive at 5 V
D Low Input Current of 1 µA Max
D Applications Include:
− Buffer/Storage Registers
− Shift Registers
− Pattern Generators
SN54HC175 . . . FK PACKAGE
(TOP VIEW)
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
4Q
4Q
4D
3D
3Q
3Q
CLK
1Q
1D
NC
2D
2Q
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
4Q
4D
NC
3D
3Q
2Q
GND
NC
CLK
3Q
CLR
1Q
1Q
1D
2D
2Q
2Q
GND
1Q
CLR
NC
VCC
4Q
SN54HC175 . . . J OR W PACKAGE
SN74HC175 . . . D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
NC − No internal connection
description/ordering information
These positive-edge-triggered D-type flip-flops have a direct clear (CLR) input. The ’HC175 devices feature
complementary outputs from each flip-flop.
ORDERING INFORMATION
PACKAGE†
TA
PDIP − N
SN74HC175N
Tube of 40
SN74HC175D
Reel of 2500
SN74HC175DR
Reel of 250
SN74HC175DT
SOP − NS
Reel of 2000
SN74HC175NSR
HC175
SSOP − DB
Reel of 2000
SN74HC175DBR
HC175
Tube of 90
SN74HC175PW
Reel of 2000
SN74HC175PWR
Reel of 250
SN74HC175PWT
CDIP − J
Tube of 25
SNJ54HC175J
SNJ54HC175J
CFP − W
Tube of 150
SNJ54HC175W
SNJ54HC175W
LCCC − FK
Tube of 55
SNJ54HC175FK
TSSOP − PW
−55°C
−55
C to 125
125°C
C
TOP-SIDE
MARKING
Tube of 25
SOIC − D
−40°C
−40
C to 85
85°C
C
ORDERABLE
PART NUMBER
SN74HC175N
HC175
HC175
SNJ54HC175FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003, Texas Instruments Incorporated
! " #$%! " &$'(#! )!%*
)$#!" # ! "&%##!" &% !+% !%" %," "!$%!"
"!)) -!.* )$#! &#%""/ )%" ! %#%""(. #($)%
!%"!/ (( &%!%"*
&)$#!" #&(! ! 0121 (( &%!%" % !%"!%)
$(%"" !+%-"% !%)* (( !+% &)$#!" &)$#!
&#%""/ )%" ! %#%""(. #($)% !%"!/ (( &%!%"*
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCLS299D − JANUARY 1996 − REVISED SEPTEMBER 2003
description/ordering information (continued)
Information at the data (D) inputs meeting the setup time requirements is transferred to the outputs on the
positive-going edge of the clock (CLK) pulse. Clock triggering occurs at a particular voltage level and is not
related directly to the transition time of the positive-going edge of CLK. When CLK is at either the high or low
level, the D input has no effect at the output.
FUNCTION TABLE
(each flip-flop)
INPUTS
CLR
CLK
OUTPUTS
D
Q
Q
H
L
X
X
L
H
↑
H
H
L
H
↑
L
L
H
H
L
X
Q0
Q0
logic diagram (positive logic)
CLR
CLK
1D
1
9
4
1D
2
1Q
C1
R
3
1Q
To Three Other Channels
Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
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• DALLAS, TEXAS 75265
SCLS299D − JANUARY 1996 − REVISED SEPTEMBER 2003
recommended operating conditions (see Note 3)
SN54HC175
VCC
Supply voltage
VIH
VCC = 2 V
VCC = 4.5 V
High-level input voltage
VCC = 6 V
VCC = 2 V
VIL
VI
VO
Input voltage
NOM
MAX
2
5
6
NOM
MAX
2
5
6
1.5
3.15
3.15
4.2
4.2
0
VCC = 6 V
UNIT
V
V
0.5
0.5
1.35
1.35
1.8
1.8
VCC
VCC
VCC = 2 V
VCC = 4.5 V
Input transition rise/fall time
MIN
1.5
0
Output voltage
∆t/∆v
MIN
VCC = 4.5 V
VCC = 6 V
Low-level input voltage
SN74HC175
0
VCC
VCC
0
1000
1000
500
500
400
400
V
V
V
ns
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VOH
VOL
TEST CONDITIONS
Ci
SN54HC175
MIN
MAX
SN74HC175
MIN
MAX
UNIT
2V
1.9
1.998
1.9
1.9
IOH = −20 µA
4.4
4.499
4.4
4.4
6V
5.9
5.999
5.9
5.9
IOH = −4 mA
IOH = −5.2 mA
4.5 V
3.98
4.3
3.7
3.84
6V
5.48
5.8
5.2
5.34
2V
0.002
0.1
0.1
0.1
IOL = 20 µA
4.5 V
0.001
0.1
0.1
0.1
6V
0.001
0.1
0.1
0.1
4.5 V
0.17
0.26
0.4
0.33
6V
0.15
0.26
0.4
0.33
6V
±0.1
±100
±1000
±1000
nA
8
160
80
µA
10
10
10
pF
VI = VIH or VIL
VI = VIH or VIL
VI = VCC or 0
VI = VCC or 0,
TA = 25°C
MIN
TYP
MAX
4.5 V
IOL = 4 mA
IOL = 5.2 mA
II
ICC
VCC
IO = 0
6V
2 V to 6 V
POST OFFICE BOX 655303
3
• DALLAS, TEXAS 75265
V
V
3
SCLS299D − JANUARY 1996 − REVISED SEPTEMBER 2003
timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
VCC
fclock
Clock frequency
CLR low
tw
Pulse duration
CLK high or low
Data
tsu
Setup time before CLK↑
CLR inactive
th
CLK↑
Hold time, data after CLK
TA = 25°C
MIN
MAX
SN54HC175
MIN
MAX
SN74HC175
MIN
MAX
2V
6
4.2
5
4.5 V
31
21
25
6V
36
25
29
2V
80
120
100
4.5 V
16
24
20
6V
14
20
17
2V
80
120
100
4.5 V
16
24
20
6V
14
20
17
2V
100
150
125
4.5 V
20
30
25
6V
17
25
21
2V
100
150
125
4.5 V
20
30
25
6V
17
25
21
2V
0
0
0
4.5 V
0
0
0
6V
0
0
0
UNIT
MHz
ns
ns
ns
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
CLR
Any
tpd
CLK
tt
Any
Any
VCC
MIN
TA = 25°C
TYP
MAX
SN54HC175
MIN
MAX
SN74HC175
MIN
2V
6
12
4.2
5
4.5 V
31
50
21
25
6V
36
60
25
29
MAX
UNIT
MHz
2V
52
150
255
190
4.5 V
15
30
45
38
6V
13
26
38
32
2V
58
150
255
190
4.5 V
16
30
45
38
6V
13
26
38
32
2V
38
75
110
90
4.5 V
8
15
22
19
6V
6
13
19
16
ns
ns
operating characteristics, TA = 25°C
PARAMETER
Cpd
4
TEST CONDITIONS
Power dissipation capacitance per flip-flop
POST OFFICE BOX 655303
No load
• DALLAS, TEXAS 75265
TYP
30
UNIT
pF
SCLS299D − JANUARY 1996 − REVISED SEPTEMBER 2003
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
VCC
High-Level
Pulse
Test
Point
50%
50%
0V
tw
CL = 50 pF
(see Note A)
VCC
Low-Level
Pulse
50%
50%
0V
LOAD CIRCUIT
VOLTAGE WAVEFORMS
PULSE DURATIONS
Input
VCC
50%
50%
0V
tPLH
Reference
Input
VCC
50%
In-Phase
Output
50%
10%
0V
tsu
Data
Input 50%
10%
90%
tr
tPHL
VCC
50%
10% 0 V
90%
90%
tr
th
90%
tPHL
Out-of-Phase
Output
90%
VOLTAGE WAVEFORMS
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
tPLH
50%
10%
tf
tf
VOH
50%
10%
VOL
tf
50%
10%
90%
VOH
VOL
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. For clock inputs, fmax is measured when the input duty cycle is 50%.
D. The outputs are measured one at a time with one input transition per measurement.
E. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
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5
PACKAGE OPTION ADDENDUM
www.ti.com
14-Mar-2007
PACKAGING INFORMATION
(1)
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
84089012A
ACTIVE
LCCC
FK
20
1
TBD
8408901EA
ACTIVE
CDIP
J
16
1
TBD
Lead/Ball Finish
MSL Peak Temp (3)
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
8408901FA
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
JM38510/65308BEA
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
JM38510/65308BFA
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
N / A for Pkg Type
SN54HC175J
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
SN74HC175D
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC175DBR
ACTIVE
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC175DBRE4
ACTIVE
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC175DE4
ACTIVE
SOIC
D
16
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC175DR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC175DRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC175DT
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC175DTE4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC175N
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74HC175NE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74HC175NSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC175NSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC175PW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC175PWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC175PWLE
OBSOLETE
TSSOP
PW
16
SN74HC175PWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC175PWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC175PWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC175PWTE4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SNJ54HC175FK
ACTIVE
LCCC
FK
20
1
TBD
SNJ54HC175J
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54HC175W
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
40
TBD
The marketing status values are defined as follows:
Addendum-Page 1
Call TI
Call TI
POST-PLATE N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com
14-Mar-2007
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
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MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
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