Metal Package Full Size DIP and Half DIP, TTL / HC-MOS HCOF/HCOH Series HCOF Package 20.7 Applications: Product Features: Low Jitter, Non-PLL Based Output CMOS/TTL Compatible Logic Levels Compatible with Leadfree Processing Fibre Channel Server & Storage Sonet /SDH 802.11 / Wifi T1/E1, T3/E3 System Clock 4 3 1 2 12.6 7.62 Frequency 1 MHz to 160.000 MHz Output Level HC-MOS TTL Duty Cycle ‘0’ = 0.1 Vcc Max., ‘1’ = 0.9 Vcc Min. ‘0’ = 0.4 VDC Max., ‘1’ = 2.4 VDC Min. Specify 50% ±10% or ±5% See Table in Part Number Guide Rise / Fall Time 5 nS Max. @ Vcc = +3.3 VDC, 10 nS Max. @ Vcc = +5 VDC *** Output Load Fo < 50 MHz = 10 TTL, Fo > 50 MHz = 5 LSTTL See Table in Part Number Guide See Frequency Stability Table (Includes room temperature tolerance and stability over operating temperature) 10 mS Max. 15.24 5.1 Max. 6 Min. 0.048 Frequency Stability Start-up Time 0.36 HCOH Package 12.6 4 3 1 2 12.6 Enable / Disable Time Supply Voltage 100 nS Max. Current 40 mA Max. @ 3.3 VDC, 85 mA Max. @ 5.0 VDC *** Operating See Operating Temperature Table in Part Number Guide Storage -55 C to +125 C See Input Voltage Table, tolerance ±5 % 7.62 7.62 5.1 Max. 6 Min. Jitter: RMS(1sigma) 1 MHz-75 MHz 76 MHz-160 MHz Max Integrated 1 MHz-75 MHz 76 MHz-160 MHz Max Total Jitter 1 MHz-75 MHz 76 MHz-160 MHz 5 pS RMS (1 sigma) Max. accumulated jitter (20K adjacent periods) 3 pS RMS (1 sigma) Max. accumulated jitter (20K adjacent periods) 0.36 1.5 pS RMS (1 sigma -12KHz to 20MHz) 1 pS RMS (1 sigma -12KHz to 20MHz) HCOF HCOH - Dimension Units: mm Pin 1 2 3 4 50 pS p-p (100K adjacent periods) 30 pS p-p (100K adjacent periods) Part Number Guide Package 0.48 Input Voltage Sample Part Number: Operating Temperature Symmetry (Duty Cycle) 5 = 5.0 V 1 = 0 C to +70 C 5 = 45 / 55 Max. 3 = 3.3 V 6 = -10 C to +70 C 6 = 40 / 60 Max. Connection Enable / N.C. GND Output Vcc HCOF - 3153BH - 20.000 Output Stability (in ppm) Enable / Disable **E = 10 H = Enable 3 = 15 pF HC-MOS **D = 15 O = N/C 3 = -20 C to +70 C 6 = 30 pF **F = 20 4 = -30 C to +75 C 5 = 50 pF HC-MOS (<40 MHz) A = 25 1 = 10TTL / 15 pF HC-MOS B = 50 2 = -40 C to +85 C C = 100 NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise. * Not available at all frequencies. ** Not available for all temperature ranges. *** Frequency, supply, and load related parameters. ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 12/10_A Specifications subject to change without notice Page 1 Frequency - 20.000 MHz Metal Package Full Size DIP and Half DIP, TTL / HC-MOS Pb Free Solder Reflow Profile: HCOF/HCOH Series Typical Application: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal). Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: ILSI and Date Code Line 2: XXXXXX (Part Number detail = HCOH-XXXXXX-Freq.) Line 3: Frequency ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 12/10_A Specifications subject to change without notice Page 2