ISM88 Series 3.2 mm x 5.0 mm Ceramic Package SMD Oscillator, LVPECL Product Features: Applications: Surface Mount Package Low Jitter Reflow Compatible Compatible with Leadfree Processing Test Equipment Server & Storage Sonet /SDH Frequency 25 MHz to 350.000 MHz Output Level VOH = VCC - 1.02 VDC Min. VOL = Vcc - 1.62 VDC Max. Duty Cycle 50% ±5% Rise / Fall Time 1.0 nS Max. Output Load 50 to Vcc - 2.0 VDC Frequency Stability ±25ppm Enable Phase Delay 2 mS Max. Disable Phase Delay 200 nS Max. Supply Voltage See Input Voltage Table, Tolerance ±5 % Current 55 mA Typical, 90 mA Max. Operating 0 C to +70 C Storage -40 C to +85 C Integrated Jitter RMS 0.3 typ. (12 KHz to 20 MHz Band) Part Number Guide Package ISM88 - Recommended Pad Layout Pin Connection 1 Enable 2 N.C. 3 VSS 4 Output 5 Comp. Output 6 VDD Sample Part Number: Input Voltage Operating Temperature Symmetry (Duty Cycle) 3 = 3.3 V 1 = 0 C to +70 C 5 = 45 / 55 Max. 6 = 2.5 V 2 = -40 C to +85 C Dimension Units: mm ISM88 – 3159AH - 156.250 Output 9 = LVPECL Stability (in ppm) Enable / Disable Frequency A = 25* H = Enable - 156.250 MHz Z = 30 B = 50 C = 100 NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 6) and GND (pin 3) to minimize power supply noise. * Not available for all temperature ranges and frequencies. ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 01/11_A Specifications subject to change without notice Page 1 ISM88 Series 3.2 mm x 5.0 mm Ceramic Package SMD Oscillator, LVPECL Pb Free Solder Reflow Profile: Typical Application: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e4 (Au over Ni over W base metalization). Tape and Reel Information: Quantity per Reel A B C D E F 1000 16 +/-.3 8 +/-.2 7.5 +/-.2 17.5 +/-1 50 / 60 / 80 180 / 250 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: ILSI and Date Code (YWW) Line 2: Frequency ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 01/11_A Specifications subject to change without notice Page 2