SN74ALVC245 OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCES271D – APRIL 1999 – REVISED JULY 2004 • • DGV, DW, NS, OR PW PACKAGE (TOP VIEW) 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC OE B1 B2 B3 B4 B5 B6 B7 B8 VCC DIR A1 A2 A3 A4 A5 A6 A7 A8 GND RGY PACKAGE (TOP VIEW) 1 20 3 4 19 OE 18 B1 17 B2 5 6 16 B3 15 B4 7 8 14 B5 13 B6 2 A1 A2 A3 A4 A5 A6 A7 A8 12 B7 9 10 11 B8 Operates from 1.65 V to 3.6 V Max tpd of 3.4 ns at 3.3 V DIR • • ±24-mA Output Drive at 3.3 V Latch-Up Performance Exceeds 250 mA Per JESD 17 GND FEATURES DESCRIPTION/ORDERING INFORMATION This octal bus transceiver is designed for 1.65-V to 3.6-V VCC operation. The SN74ALVC245 is designed for asynchronous communication between data buses. The device transmits data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so the buses are effectively isolated. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. ORDERING INFORMATION PACKAGE (1) TA QFN - RGY SOIC - DW -40°C to 85°C SOP - NS TSSOP - PW TVSOP - DGV (1) ORDERABLE PART NUMBER Tape and reel SN74ALVC245RGYR Tube SN74ALVC245DW Tape and reel SN74ALVC245DWR Tape and reel SN74ALVC245NSR Tube SN74ALVC245PW Tape and reel SN74ALVC245PWR Tape and reel SN74ALVC245DGVR TOP-SIDE MARKING VA245 ALVC245 ALVC245 VA245 VA245 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2004, Texas Instruments Incorporated SN74ALVC245 OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCES271D – APRIL 1999 – REVISED JULY 2004 FUNCTION TABLE INPUTS OPERATION OE DIR L L B data to A bus L H A data to B bus H X Isolation LOGIC DIAGRAM (POSITIVE LOGIC) DIR 1 19 A1 OE 2 18 B1 To Seven Other Channels ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VCC Supply voltage range MIN MAX -0.5 4.6 Except I/O ports (2) -0.5 4.6 I/O ports (2) (3) -0.5 VCC + 0.5 -0.5 VCC + 0.5 UNIT V VI Input voltage range VO Output voltage range (2) (3) IIK Input clamp current VI < 0 -50 mA IOK Output clamp current VO < 0 -50 mA IO Continuous output current ±50 mA ±100 mA Continuous current through VCC or GND θJA Package thermal impedance DGV package (4) 92 DW package (4) 58 package (4) 60 PW package (4) 83 NS RGY package (5) Tstg (1) (2) (3) (4) (5) 2 Storage temperature range V V °C/W 37 -65 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. This value is limited to 4.6 V, maximum. The package thermal impedance is calculated in accordance with JESD 51-7. The package thermal impedance is calculated in accordance with JESD 51-5. SN74ALVC245 OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCES271D – APRIL 1999 – REVISED JULY 2004 RECOMMENDED OPERATING CONDITIONS (1) VCC Supply voltage VCC = 1.65 V to 1.95 V VIH High-level input voltage MIN MAX 1.65 3.6 Low-level input voltage VI Input voltage VO Output voltage IOH High-level output current IOL Low-level output current ∆t/∆v Input transition rise or fall rate TA Operating free-air temperature (1) V 0.65 × VCC VCC = 2.3 V to 2.7 V 1.7 VCC = 2.7 V to 3.6 V 2 V 0.35 × VCC VCC = 1.65 V to 1.95 V VIL UNIT VCC = 2.3 V to 2.7 V 0.7 VCC = 2.7 V to 3.6 V 0.8 V 0 VCC V 0 VCC V VCC = 1.65 V -4 VCC = 2.3 V -12 VCC = 2.7 V -12 VCC = 3 V -24 VCC = 1.65 V 4 VCC = 2.3 V 12 VCC = 2.7 V 12 VCC = 3 V 24 -40 mA mA 10 ns/V 85 °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 3 SN74ALVC245 OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCES271D – APRIL 1999 – REVISED JULY 2004 ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC IOH = -100 µA 1.65 V to 3.6 V 1.65 V IOH = -6 mA 2.3 V 2 2.3 V 1.7 2.7 V 2.2 3V 2.4 IOH = -24 mA 3V 2 IOL = 100 µA IOH = -12 mA MAX V 1.65 V to 3.6 V 0.2 1.65 V 0.45 IOL = 6 mA 2.3 V 0.4 2.3 V 0.7 IOL = 24 mA UNIT 1.2 IOL = 4 mA IOL = 12 mA II TYP (1) VCC - 0.2 IOH = -4 mA VOH VOL MIN 2.7 V 0.4 3V 0.55 V VI = VCC or GND 3.6 V ±5 µA VO = VCC or GND 3.6 V ±10 µA ICC VI = VCC or GND, IO = 0 3.6 V 10 µA ∆ICC One input at VCC - 0.6 V, Other inputs at VCC or GND 3 V to 3.6 V 750 µA IOZ (2) Ci Control inputs VI = VCC or GND 3.3 V 4.5 pF Cio A or B ports VO = VCC or GND 3.3 V 11.5 pF (1) (2) All typical values are at VCC = 3.3 V, TA = 25°C. For I/O ports, the parameter IOZ includes the input leakage current. SWITCHING CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) FROM (INPUT) TO (OUTPUT) tpd A or B B or A ten OE A or B tdis OE A or B PARAMETER VCC = 1.8 V ± 0.15 V MIN VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V VCC = 2.7 V MAX MIN MAX 1.5 6 1 3.4 8.6 2 2.7 8 1 MIN UNIT MAX MIN MAX 3.5 3.6 1.3 3.4 ns 6 6.3 1.6 5.5 ns 4.8 5.3 1.7 5.5 ns OPERATING CHARACTERISTICS TA = 25°C PARAMETER Cpd 4 Power dissipation capacitance per transceiver TEST CONDITIONS Outputs enabled Outputs disabled CL = 0 pF, f = 10 MHz VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V TYP TYP TYP 25 27 30 0 0 0 UNIT pF SN74ALVC245 OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCES271D – APRIL 1999 – REVISED JULY 2004 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test Open GND CL (see Note A) RL TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUT VCC 1.8 V ± 0.15 V 2.5 V ± 0.2 V 2.7 V 3.3 V ± 0.3 V VI tr/tf VCC VCC 2.7 V 2.7 V ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 ns VM VLOAD CL RL V∆ VCC/2 VCC/2 1.5 V 1.5 V 2 × VCC 2 × VCC 6V 6V 30 pF 30 pF 50 pF 50 pF 1 kΩ 500 Ω 500 Ω 500 Ω 0.15 V 0.15 V 0.3 V 0.3 V tw VI Timing Input VM VM VM 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VM VM 0V tPLH Output Control (low-level enabling) tPLZ VLOAD/2 VM tPZH VOH VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPHL VM VI VM tPZL VI Input VOLTAGE WAVEFORMS PULSE DURATION th VI Data Input VM 0V 0V tsu Output VI VM Input Output Waveform 2 S1 at GND (see Note B) VOL + V∆ VOL tPHZ VOH VM VOH − V∆ 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 5 PACKAGE OPTION ADDENDUM www.ti.com 31-Mar-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74ALVC245DGVR ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245DGVRE4 ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245RGYR ACTIVE QFN RGY 20 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR SN74ALVC245RGYRG4 ACTIVE QFN RGY 20 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 31-Mar-2006 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74ALVC245DGVR ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245DGVRE4 ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245DGVRG4 ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC245RGYR ACTIVE QFN RGY 20 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74ALVC245RGYRG4 ACTIVE QFN RGY 20 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74ALVC245DGVR Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TVSOP DGV 20 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 SN74ALVC245DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74ALVC245PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 SN74ALVC245RGYR QFN RGY 20 1000 180.0 12.4 3.8 4.8 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74ALVC245DGVR TVSOP DGV 20 2000 346.0 346.0 29.0 SN74ALVC245DWR SOIC DW 20 2000 346.0 346.0 41.0 SN74ALVC245PWR TSSOP PW 20 2000 346.0 346.0 33.0 SN74ALVC245RGYR QFN RGY 20 1000 190.5 212.7 31.8 Pack Materials-Page 2 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. 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