SLOS412C − APRIL 2003 − REVISED MARCH 2004 D D D D D D D D Operating Voltage . . . ±2 V to ±18 V Low Noise Voltage . . . 0.8 µVrms (TYP) Wide GBW . . . 12 MHz (TYP) Low THD . . . 0.0005% (TYP) Slew Rate . . . 5 V/µs (TYP) Suitable for Applications Such As Audio Preamplifier, Active Filter, Headphone Amplifier, Industrial Measurement Equipment Drop-In Replacement for NJM4580 Pin and Function Compatible With LM833, NE5532, NJM4558/9, and NJM4560/2/5 D, P, OR PW PACKAGE (TOP VIEW) 1OUT 1IN− 1IN+ VCC− 1 8 2 7 3 6 4 5 VCC+ 2OUT 2IN− 2IN+ description/ordering information The RC4580 is a dual operational amplifier that has been designed optimally for audio applications, such as improving tone control. It offers low noise, high gain bandwidth, low harmonic distortion, and high output current, all of which make the device ideally suited for audio electronics, such as audio preamplifiers and active filters, as well as industrial measurement equipment. When high output current is required, the RC4580 also can be used as a headphone amplifier. Due to its wide operating supply voltage, the RC4580 also can be used in low-voltage applications. ORDERING INFORMATION PACKAGE† TA PDIP (P) −40°C −40 C to 85 85°C C SOIC (D) TSSOP (PW) ORDERABLE PART NUMBER Tube of 50 RC4580IP Tube of 75 RC4580ID Reel of 2500 RC4580IDR Tube of 150 RC4580IPW Reel of 2000 RC4580IPWR TOP-SIDE MARKING RC4580IP R4580I R4580I † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2004, Texas Instruments Incorporated !" #$ # % & ## '($ # ) # "( "# ) "" $ POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SLOS412C − APRIL 2003 − REVISED MARCH 2004 equivalent schematic VCC+ Output − Input + Input VCC− 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SLOS412C − APRIL 2003 − REVISED MARCH 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage, VCC+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±18 V Input voltage (any input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±15 V Differential input voltage, VID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30 V Output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Package thermal impedance, θJA (see Notes 1 and 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . 149°C/W Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −60°C to 125°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions VCC+ VCC− VICR TA Supply voltage Input common-mode voltage range Operating free-air temperature range MIN MAX 2 16 UNIT −2 −16 −13.5 13.5 V −40 85 °C TYP MAX V electrical characteristics, VCC± = ±15 V, TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN RS ≤ 10 kΩ VIO IIO Input offset voltage IIB AVD Input bias current Large-signal differential-voltage amplification RL ≥ 2 kΩ, VO = ±10 V VOM VICR Output voltage swing RL ≥ 2 kΩ CMRR kSVR‡ Common-mode rejection ratio RS ≤ 10 kΩ Supply-voltage rejection ratio RS ≤ 10 kΩ Input offset current Common-mode input voltage range UNIT 0.5 3 mV 5 200 nA 100 500 nA 90 110 dB ±12 ±13.5 V ±12 ±13.5 V 80 110 dB 80 110 dB ICC Supply current (all amplifiers) ‡ Measured with VCC± varied simultaneously 6 9 mA operating characteristics, VCC± = ±15 V, TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS TYP UNIT SR Slew rate at unity gain RL ≥ 2 kΩ 5 V/µs GBW Gain-bandwidth product f = 10 kHz 12 MHz THD Total harmonic distortion Vn Equivalent input noise voltage VO = 5 V, RL = 2 kΩ, f = 1 kHz, AVD = 20 dB RIAA, RS ≤ 2.2 kΩ, 30-kHz LPF POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 0.0005% 0.8 µVrms 3 SLOS412C − APRIL 2003 − REVISED MARCH 2004 TYPICAL CHARACTERISTICS MAXIMUM OUTPUT VOLTAGE SWING vs LOAD RESISTANCE MAXIMUM OUTPUT VOLTAGE SWING vs FREQUENCY 30 Maximum Output Voltage Swing − V Maximum Output Voltage Swing − V 15 VCC± = ±15 V TA = 25°C 10 VOM+ 5 0 −5 VOM− −10 25 20 15 10 5 0 −15 1k 100 10 k V+/V− = ±15 V RL = 2 kΩ TA = 25°C 1 5 10 50 60 70 80 100 200 300 500 700 1M 10M Frequency − kHz RL − Load Resistance − Ω Figure 2 Figure 1 EQUIVALENT INPUT NOISE VOLTAGE vs FREQUENCY Vn − Equivalent Input Noise Voltage − nV/ Hz OUTPUT VOLTAGE SWING vs OUTPUT CURRENT 20 VCC± = ±15 V Output Voltage Swing − V 15 VOM+ 10 5 0 −5 −10 VOM− −15 −20 1 10 100 IO − Output Current − mA 1000 30 VCC± = ±1.5 V RS = 50 Ω AV = 60 dB TA = 25°C 20 10 0 10 1k Frequency − Hz Figure 4 Figure 3 4 100 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 10 k 100 k SLOS412C − APRIL 2003 − REVISED MARCH 2004 TYPICAL CHARACTERISTICS OPERATING CURRENT vs TEMPERATURE OUTPUT VOLTAGE SWING vs TEMPERATURE 15 18 V O − Output Voltage Swing − V I CC − Operating Current − mA VOM+ VCC± = ±15 V 16 14 12 10 8 6 4 VCC± = 15 V RL = 2 kΩ 10 5 0 −5 −10 VOM− 2 0 −55 −15 −40 0 25 70 85 −55 125 −40 0 25 TA − Ambient Temperature − °C Figure 5 85 105 Figure 6 INPUT OFFSET VOLTAGE vs TEMPERATURE INPUT BIAS CURRENT vs TEMPERATURE 100 400 VCC± = ±15 V VCC± = ±15 V IIB − Input Bias Current − nA VIO − Input Offset Voltage − µV 70 TA − Ambient Temperature − °C 50 0 −50 300 200 100 0 −100 −50 −40 0 25 70 85 TA − Ambient Temperature − °C 125 −40 0 25 70 85 TA − Ambient Temperature − °C Figure 7 Figure 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SLOS412C − APRIL 2003 − REVISED MARCH 2004 TYPICAL CHARACTERISTICS MAXIMUM OUTPUT VOLTAGE SWING vs OPERATING VOLTAGE OPERATING CURRENT vs OPERATING VOLTAGE 7 TA = 25°C TA = 25°C RL = 2 kΩ 15 +VOM 6 10 5 Operating Current − mA 5 0 −5 −10 −VOM 4 3 2 1 −15 −20 ±5 0 ±10 ±15 0 ±0 ±20 VCC+/VCC− − Operating Voltage − V ±4 ±8 ±10 ±12 Figure 9 Figure 10 TOTAL HARMONIC DISTORTION vs OUTPUT VOLTAGE VOLTAGE GAIN, PHASE vs FREQUENCY ±14 VCC± = ±15 V RL = 2 kΩ 40-dB Amplification TA = 25°C 40 35 20 kHz 20 Hz 0.001 30 −90 −120 20 −150 15 −210 5 −240 10 k 100 k 1M Frequency − Hz Figure 12 Figure 11 POST OFFICE BOX 655303 −180 10 0 10 −30 25 1 kHz 1 VO − Output Voltage − V 0 −60 Phase Gain 0.1 ±16 30 45 VCC± = ±15 V Gain = 20 dB RL = 2 kΩ 0.01 0.0001 6 ±6 VCC+/VCC− − Operating Voltage − V Voltage Gain − dB THD − Total Harmonic Distortion − % 0.1 ±2 • DALLAS, TEXAS 75265 −270 10 M Phase − Deg V O − Maximum Output Voltage Swing − V 20 PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty RC4580ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4580IDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4580IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4580IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4580IDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4580IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4580IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type RC4580IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type RC4580IPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4580IPWE4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4580IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4580IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4580IPWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4580IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 30-Apr-2007 TAPE AND REEL INFORMATION Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com Device 30-Apr-2007 Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant RC4580IDR D 8 FMX 330 12 6.4 5.2 2.1 8 12 Q1 RC4580IDR D 8 MLA 330 12 6.4 5.2 2.1 8 12 Q1 RC4580IPWR PW 8 MLA 330 12 7.0 3.6 1.6 8 12 Q1 TAPE AND REEL BOX INFORMATION Device Package Pins Site Length (mm) Width (mm) Height (mm) RC4580IDR D 8 FMX 338.1 340.5 20.64 RC4580IDR D 8 MLA 338.1 340.5 20.64 RC4580IPWR PW 8 MLA 338.1 340.5 20.64 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 30-Apr-2007 Pack Materials-Page 3 MECHANICAL DATA MPDI001A – JANUARY 1995 – REVISED JUNE 1999 P (R-PDIP-T8) PLASTIC DUAL-IN-LINE 0.400 (10,60) 0.355 (9,02) 8 5 0.260 (6,60) 0.240 (6,10) 1 4 0.070 (1,78) MAX 0.325 (8,26) 0.300 (7,62) 0.020 (0,51) MIN 0.015 (0,38) Gage Plane 0.200 (5,08) MAX Seating Plane 0.010 (0,25) NOM 0.125 (3,18) MIN 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.430 (10,92) MAX 0.010 (0,25) M 4040082/D 05/98 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001 For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. 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