TI R4580I

SLOS412C − APRIL 2003 − REVISED MARCH 2004
D
D
D
D
D
D
D
D
Operating Voltage . . . ±2 V to ±18 V
Low Noise Voltage . . . 0.8 µVrms (TYP)
Wide GBW . . . 12 MHz (TYP)
Low THD . . . 0.0005% (TYP)
Slew Rate . . . 5 V/µs (TYP)
Suitable for Applications Such As Audio
Preamplifier, Active Filter, Headphone
Amplifier, Industrial Measurement
Equipment
Drop-In Replacement for NJM4580
Pin and Function Compatible With LM833,
NE5532, NJM4558/9, and NJM4560/2/5
D, P, OR PW PACKAGE
(TOP VIEW)
1OUT
1IN−
1IN+
VCC−
1
8
2
7
3
6
4
5
VCC+
2OUT
2IN−
2IN+
description/ordering information
The RC4580 is a dual operational amplifier that has been designed optimally for audio applications, such as
improving tone control. It offers low noise, high gain bandwidth, low harmonic distortion, and high output current,
all of which make the device ideally suited for audio electronics, such as audio preamplifiers and active filters,
as well as industrial measurement equipment. When high output current is required, the RC4580 also can be
used as a headphone amplifier. Due to its wide operating supply voltage, the RC4580 also can be used in
low-voltage applications.
ORDERING INFORMATION
PACKAGE†
TA
PDIP (P)
−40°C
−40
C to 85
85°C
C
SOIC (D)
TSSOP (PW)
ORDERABLE
PART NUMBER
Tube of 50
RC4580IP
Tube of 75
RC4580ID
Reel of 2500
RC4580IDR
Tube of 150
RC4580IPW
Reel of 2000
RC4580IPWR
TOP-SIDE
MARKING
RC4580IP
R4580I
R4580I
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2004, Texas Instruments Incorporated
!" #$
# % & ## '($ # ) # "( "#
) "" $
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• DALLAS, TEXAS 75265
1
SLOS412C − APRIL 2003 − REVISED MARCH 2004
equivalent schematic
VCC+
Output
− Input
+ Input
VCC−
2
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• DALLAS, TEXAS 75265
SLOS412C − APRIL 2003 − REVISED MARCH 2004
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±18 V
Input voltage (any input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±15 V
Differential input voltage, VID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30 V
Output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Notes 1 and 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W
P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . 149°C/W
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −60°C to 125°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions
VCC+
VCC−
VICR
TA
Supply voltage
Input common-mode voltage range
Operating free-air temperature range
MIN
MAX
2
16
UNIT
−2
−16
−13.5
13.5
V
−40
85
°C
TYP
MAX
V
electrical characteristics, VCC± = ±15 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
RS ≤ 10 kΩ
VIO
IIO
Input offset voltage
IIB
AVD
Input bias current
Large-signal differential-voltage amplification
RL ≥ 2 kΩ, VO = ±10 V
VOM
VICR
Output voltage swing
RL ≥ 2 kΩ
CMRR
kSVR‡
Common-mode rejection ratio
RS ≤ 10 kΩ
Supply-voltage rejection ratio
RS ≤ 10 kΩ
Input offset current
Common-mode input voltage range
UNIT
0.5
3
mV
5
200
nA
100
500
nA
90
110
dB
±12
±13.5
V
±12
±13.5
V
80
110
dB
80
110
dB
ICC
Supply current (all amplifiers)
‡ Measured with VCC± varied simultaneously
6
9
mA
operating characteristics, VCC± = ±15 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TYP
UNIT
SR
Slew rate at unity gain
RL ≥ 2 kΩ
5
V/µs
GBW
Gain-bandwidth product
f = 10 kHz
12
MHz
THD
Total harmonic distortion
Vn
Equivalent input noise voltage
VO = 5 V, RL = 2 kΩ, f = 1 kHz, AVD = 20 dB
RIAA, RS ≤ 2.2 kΩ, 30-kHz LPF
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
0.0005%
0.8
µVrms
3
SLOS412C − APRIL 2003 − REVISED MARCH 2004
TYPICAL CHARACTERISTICS
MAXIMUM OUTPUT VOLTAGE SWING
vs
LOAD RESISTANCE
MAXIMUM OUTPUT VOLTAGE SWING
vs
FREQUENCY
30
Maximum Output Voltage Swing − V
Maximum Output Voltage Swing − V
15
VCC± = ±15 V
TA = 25°C
10
VOM+
5
0
−5
VOM−
−10
25
20
15
10
5
0
−15
1k
100
10 k
V+/V− = ±15 V
RL = 2 kΩ
TA = 25°C
1
5
10 50 60 70 80 100 200 300 500 700 1M 10M
Frequency − kHz
RL − Load Resistance − Ω
Figure 2
Figure 1
EQUIVALENT INPUT NOISE VOLTAGE
vs
FREQUENCY
Vn − Equivalent Input Noise Voltage − nV/ Hz
OUTPUT VOLTAGE SWING
vs
OUTPUT CURRENT
20
VCC± = ±15 V
Output Voltage Swing − V
15
VOM+
10
5
0
−5
−10
VOM−
−15
−20
1
10
100
IO − Output Current − mA
1000
30
VCC± = ±1.5 V
RS = 50 Ω
AV = 60 dB
TA = 25°C
20
10
0
10
1k
Frequency − Hz
Figure 4
Figure 3
4
100
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
10 k
100 k
SLOS412C − APRIL 2003 − REVISED MARCH 2004
TYPICAL CHARACTERISTICS
OPERATING CURRENT
vs
TEMPERATURE
OUTPUT VOLTAGE SWING
vs
TEMPERATURE
15
18
V O − Output Voltage Swing − V
I CC − Operating Current − mA
VOM+
VCC± = ±15 V
16
14
12
10
8
6
4
VCC± = 15 V
RL = 2 kΩ
10
5
0
−5
−10
VOM−
2
0
−55
−15
−40
0
25
70
85
−55
125
−40
0
25
TA − Ambient Temperature − °C
Figure 5
85
105
Figure 6
INPUT OFFSET VOLTAGE
vs
TEMPERATURE
INPUT BIAS CURRENT
vs
TEMPERATURE
100
400
VCC± = ±15 V
VCC± = ±15 V
IIB − Input Bias Current − nA
VIO − Input Offset Voltage − µV
70
TA − Ambient Temperature − °C
50
0
−50
300
200
100
0
−100
−50
−40
0
25
70
85
TA − Ambient Temperature − °C
125
−40
0
25
70
85
TA − Ambient Temperature − °C
Figure 7
Figure 8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SLOS412C − APRIL 2003 − REVISED MARCH 2004
TYPICAL CHARACTERISTICS
MAXIMUM OUTPUT VOLTAGE SWING
vs
OPERATING VOLTAGE
OPERATING CURRENT
vs
OPERATING VOLTAGE
7
TA = 25°C
TA = 25°C
RL = 2 kΩ
15
+VOM
6
10
5
Operating Current − mA
5
0
−5
−10
−VOM
4
3
2
1
−15
−20
±5
0
±10
±15
0
±0
±20
VCC+/VCC− − Operating Voltage − V
±4
±8
±10
±12
Figure 9
Figure 10
TOTAL HARMONIC DISTORTION
vs
OUTPUT VOLTAGE
VOLTAGE GAIN, PHASE
vs
FREQUENCY
±14
VCC± = ±15 V
RL = 2 kΩ
40-dB Amplification
TA = 25°C
40
35
20 kHz
20 Hz
0.001
30
−90
−120
20
−150
15
−210
5
−240
10 k
100 k
1M
Frequency − Hz
Figure 12
Figure 11
POST OFFICE BOX 655303
−180
10
0
10
−30
25
1 kHz
1
VO − Output Voltage − V
0
−60
Phase
Gain
0.1
±16
30
45
VCC± = ±15 V
Gain = 20 dB
RL = 2 kΩ
0.01
0.0001
6
±6
VCC+/VCC− − Operating Voltage − V
Voltage Gain − dB
THD − Total Harmonic Distortion − %
0.1
±2
• DALLAS, TEXAS 75265
−270
10 M
Phase − Deg
V O − Maximum Output Voltage Swing − V
20
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
RC4580ID
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
RC4580IDE4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
RC4580IDG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
RC4580IDR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
RC4580IDRE4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
RC4580IDRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
RC4580IP
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
RC4580IPE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
RC4580IPW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
RC4580IPWE4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
RC4580IPWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
RC4580IPWR
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
RC4580IPWRE4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
RC4580IPWRG4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Apr-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
30-Apr-2007
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
RC4580IDR
D
8
FMX
330
12
6.4
5.2
2.1
8
12
Q1
RC4580IDR
D
8
MLA
330
12
6.4
5.2
2.1
8
12
Q1
RC4580IPWR
PW
8
MLA
330
12
7.0
3.6
1.6
8
12
Q1
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
RC4580IDR
D
8
FMX
338.1
340.5
20.64
RC4580IDR
D
8
MLA
338.1
340.5
20.64
RC4580IPWR
PW
8
MLA
338.1
340.5
20.64
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Apr-2007
Pack Materials-Page 3
MECHANICAL DATA
MPDI001A – JANUARY 1995 – REVISED JUNE 1999
P (R-PDIP-T8)
PLASTIC DUAL-IN-LINE
0.400 (10,60)
0.355 (9,02)
8
5
0.260 (6,60)
0.240 (6,10)
1
4
0.070 (1,78) MAX
0.325 (8,26)
0.300 (7,62)
0.020 (0,51) MIN
0.015 (0,38)
Gage Plane
0.200 (5,08) MAX
Seating Plane
0.010 (0,25) NOM
0.125 (3,18) MIN
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
0.430 (10,92)
MAX
0.010 (0,25) M
4040082/D 05/98
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
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• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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