VISHAY U1D

New Product
U1B, U1C & U1D
Vishay General Semiconductor
Surface Mount Ultrafast Plastic Rectifier
FEATURES
• Oxide planar chip junction
• Ultrafast recovery time
• Low forward voltage, low power losses
• High forward surge capability
• Meets MSL level 1, per J-STD-020, LF maximum
peak of 260 °C
• Solder dip 260 °C, 40 s
DO-214AC (SMA)
• Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
TYPICAL APPLICATIONS
For use in low voltage, high frequency rectifier
of switching power supplies, freewheeling diodes,
dc-to-dc converters or polarity protection application.
PRIMARY CHARACTERISTICS
IF(AV)
1.0 A
VRRM
100 V, 150 V, 200 V
IFSM
30 A
MECHANICAL DATA
trr
15 ns
Case: DO-214AC (SMA)
VF at IF = 1.0 A
0.76 V
Epoxy meets UL 94V-0 flammability rating
TJ max.
150 °C
Terminals: Matte tin plated leads, solderable per
J-STD-002 and JESD22-B102
E3 suffix for consumer grade, meets JESD 201 class
1A whisker test
Polarity: Color band denotes cathode end
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
Device marking code
U1B
U1C
U1D
U1B
U1C
U1D
100
150
200
UNIT
Maximum repetitive peak reverse voltage
VRRM
Maximum average forward rectified current (Fig. 1)
IF(AV)
1.0
A
Peak forward surge current 8.3 ms single half sine-wave
superimposed on rated load
IFSM
30
A
TJ, TSTG
- 55 to + 150
°C
Operating junction and storage temperature range
Document Number: 89065
Revision: 13-May-08
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
V
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New Product
U1B, U1C & U1D
Vishay General Semiconductor
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
TEST CONDITIONS
SYMBOL
TYP.
MAX.
0.82
0.87
0.87
0.92
0.71
0.76
0.78
0.84
UNIT
IF = 0.6 A
IF = 1.0 A
TA = 25 °C
IF = 0.6 A
IF = 1.0 A
TA = 100 °C
rated VR
TA = 25 °C
TA = 100 °C
IR
55
5.0
100
µA
IF = 0.5 A, IR = 1.0 A,
Irr = 0.25 A
TA = 25 °C
trr
-
15
ns
IF = 0.6 A, dI/dt = 50 A/µs,
VR = 30 V, Irr = 0.1 IRM
TA = 25 °C
TA = 100 °C
trr
24
29
-
ns
Storage charge
IF = 0.6 A, dI/dt = 50 A/µs,
VR = 30 V, Irr = 0.1 IRM
TA = 25 °C
TA = 100 °C
Qrr
7
13
-
nC
Typical junction capacitance
4.0 V, 1 MHz
CJ
6.8
-
pF
Instantaneous forward voltage
Reverse current (2)
Reverse recovery time
(1)
V
VF
Notes:
(1) Pulse test: 300 µs pulse width, 1 % duty cycle
(2) Pulse test: Pulse width ≤ 40 ms
THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
U1B
U1C
Typical thermal resistance (1)
U1D
UNIT
115
22
RθJA
RθJM
°C/W
Note:
(1) Free air, mounted on recommended copper pad area
ORDERING INFORMATION (Example)
PREFERRED P/N
UNIT WEIGHT (g)
PREFERRED PACKAGE CODE
BASE QUANTITY
DELIVERY MODE
U1D-E3/61T
0.064
61T
1800
7" diameter plastic tape and reel
U1D-E3/5AT
0.064
5AT
7500
13" diameter plastic tape and reel
RATINGS AND CHARACTERISTICS CURVES
(TA = 25 °C unless otherwise noted)
1.0
1.2
D = 0.8
Average Power Loss (W)
Average Forward Current (A)
D = 0.5
1.0
0.8
0.6
0.4
0.2
D = 0.3
0.8
D = 0.2
D = 1.0
D = 0.1
0.6
0.4
T
0.2
D = tp/T
tp
0.8
1.0
0
0
80
90
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2
100
110
120
130
140
150
0
0.2
0.4
0.6
1.2
TM - Mount Temperature (°C)
Average Forward Current (A)
Figure 1. Forward Derating Curve
Figure 2. Forward Power Loss Characteristics
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
Document Number: 89065
Revision: 13-May-08
New Product
U1B, U1C & U1D
Vishay General Semiconductor
10
TA = 150 °C
1
Junction Capactiance (pF)
Instantaneous Forward Current (A)
10
TA = 125 °C
TA = 100 °C
0.1
TA = 25 °C
0.01
0.1
0.3
0.5
0.7
0.9
1.1
TJ = 25 °C
f = 1.0 MHz
Vstg = 50 mVp-p
1
0.1
1.3
1
100
Figure 5. Typical Junction Capacitance
Figure 3. Typical Instantaneous Forward Characteristics
100
Transient Thermal Impedance (°C/W)
1000
Instantaneous Reverse Current (µA)
10
Reverse Voltage (V)
Instantaneous Forward Voltage (V)
TA = 150 °C
100
TA = 125 °C
TA = 100 °C
10
1
TA = 25 °C
0.1
20
30
40
50
60
70
80
90
10
1
0.001
0.01
10
Junction to Ambient
100
0.01
0.1
1
10
100
Percent of Rated Peak Reverse Voltage (%)
t - Pulse Duration (s)
Figure 4. Typical Reverse Characteristics
Figure 6. Typical Transient Thermal Impedance
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
DO-214AC (SMA)
Cathode Band
Mounting Pad Layout
0.110 (2.79)
0.100 (2.54)
0.065 (1.65)
0.049 (1.25)
0.177 (4.50)
0.157 (3.99)
0.012 (0.305)
0.006 (0.152)
0.060 (1.52)
MIN.
0.208 (5.28)
REF.
0.090 (2.29)
0.078 (1.98)
0.060 (1.52)
0.030 (0.76)
0.074 (1.88)
MAX.
0.066 (1.68)
MIN.
0.008 (0.203)
0 (0)
0.208 (5.28)
0.194 (4.93)
Document Number: 89065
Revision: 13-May-08
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
www.vishay.com
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Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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