TI SN74AHC139D

SN54AHC139, SN74AHC139
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS
SCLS259K – DECEMBER 1995 – REVISED MARCH 2003
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
2G
2A
2B
2Y0
2Y1
2Y2
2Y3
1A
1B
1Y0
1Y1
1Y2
1Y3
16
1A
1G
NC
VCC
1
SN54AHC139 . . . FK PACKAGE
(TOP VIEW)
1B
1Y0
NC
1Y1
1Y2
15 2G
14 2A
2
3
13 2B
12 2Y0
4
5
11 2Y1
10 2Y2
6
7
8
9
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
2A
2B
NC
2Y0
2Y1
1Y3
GND
NC
2Y3
2Y2
16
VCC
1
SN74AHC139 . . . RGY PACKAGE
(TOP VIEW)
2Y3
1G
1A
1B
1Y0
1Y1
1Y2
1Y3
GND
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
2G
SN54AHC139 . . . J OR W PACKAGE
SN74AHC139 . . . D, DB, DGV, N, NS
OR PW PACKAGE
(TOP VIEW)
D
1G
D
D
Operating Range 2-V to 5.5-V VCC
Designed Specifically for High-Speed
Memory Decoders and Data-Transmission
Systems
Incorporate Two Enable Inputs to Simplify
Cascading and/or Data Reception
GND
D
D
NC – No internal connection
description/ordering information
The ’AHC139 devices are dual 2-line to 4-line decoders/demultiplexers designed for 2-V to 5.5-V VCC operation.
These devices are designed to be used in high-performance memory-decoding or data-routing applications
requiring very short propagation delay times. In high-performance memory systems, these decoders can be
used to minimize the effects of system decoding. When used with high-speed memories utilizing a fast enable
circuit, the delay times of these decoders and the enable time of the memory usually are less than the typical
access time of the memory. This means that the effective system delay introduced by the decoders is negligible.
ORDERING INFORMATION
Tape and reel
SN74AHC139RGYR
HA139
PDIP – N
Tube
SN74AHC139N
SN74AHC139N
Tube
SN74AHC139D
Tape and reel
SN74AHC139DR
SOP – NS
Tape and reel
SN74AHC139NSR
AHC139
SSOP – DB
Tape and reel
SN74AHC139DBR
HA139
Tube
SN74AHC139PW
Tape and reel
SN74AHC139PWR
TVSOP – DGV
Tape and reel
SN74AHC139DGVR
HA139
CDIP – J
Tube
SNJ54AHC139J
SNJ54AHC139J
CFP – W
Tube
SNJ54AHC139W
SNJ54AHC139W
LCCC – FK
Tube
SNJ54AHC139FK
SNJ54AHC139FK
TSSOP – PW
–55°C to 125°C
TOP-SIDE
MARKING
QFN – RGY
SOIC – D
–40°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
AHC139
HA139
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003, Texas Instruments Incorporated
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN54AHC139, SN74AHC139
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS
SCLS259K – DECEMBER 1995 – REVISED MARCH 2003
description/ordering information (continued)
The active-low enable (G) input can be used as a data line in demultiplexing applications. These
decoders/demultiplexers feature fully buffered inputs, each of which represents only one normalized load to its
driving circuit.
FUNCTION TABLE
(each decoder/demultiplexer)
INPUTS
OUTPUTS
SELECT
G
B
A
Y0
Y1
Y2
Y3
H
X
X
H
H
H
H
L
L
L
L
H
H
H
L
L
H
H
L
H
H
L
H
L
H
H
L
H
L
H
H
H
H
H
L
logic diagram (positive logic)
4
1G
5
6
1A
Select
Inputs
1B
1Y0
1
1Y1
1Y2
2
7
3
1Y3
Data
Outputs
12
2G
11
10
2A
Select
Inputs
2B
2Y1
2Y2
14
9
13
Pin numbers shown are for the D, DB, DGV, J, N, NS, PW, RGY, and W packages.
2
2Y0
15
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
2Y3
SN54AHC139, SN74AHC139
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS
SCLS259K – DECEMBER 1995 – REVISED MARCH 2003
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±75 mA
Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
(see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W
(see Note 2): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W
(see Note 2): N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
(see Note 2): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
(see Note 2): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
(see Note 3): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
3. The package thermal impedance is calculated in accordance with JESD 51-5.
recommended operating conditions (see Note 4)
SN54AHC139
VCC
Supply voltage
VIH
High-level input voltage
VCC = 2 V
VCC = 3 V
VCC = 5.5 V
VCC = 2 V
VIL
Low-level input voltage
SN74AHC139
MIN
MAX
MIN
MAX
2
5.5
2
5.5
1.5
V
1.5
2.1
2.1
3.85
3.85
0.5
VCC = 3 V
VCC = 5.5 V
UNIT
V
0.5
0.9
0.9
1.65
1.65
V
VI
VO
Input voltage
0
5.5
0
5.5
V
Output voltage
0
VCC
–50
0
VCC
–50
V
IOH
High-level output current
VCC = 2 V
VCC = 3.3 V ± 0.3 V
VCC = 5 V ± 0.5 V
VCC = 2 V
IOL
∆t/∆v
Low-level output current
Input transition rise or fall rate
–4
–4
–8
–8
50
50
VCC = 3.3 V ± 0.3 V
VCC = 5 V ± 0.5 V
4
4
8
8
VCC = 3.3 V ± 0.3 V
VCC = 5 V ± 0.5 V
100
100
20
20
mA
mA
mA
mA
ns/V
TA
Operating free-air temperature
–55
125
–40
85
°C
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SN54AHC139, SN74AHC139
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS
SCLS259K – DECEMBER 1995 – REVISED MARCH 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
MIN
TA = 25°C
TYP
MAX
2V
1.9
2
1.9
1.9
3V
2.9
3
2.9
2.9
4.5 V
4.4
4.5
4.4
4.4
IOH = –4 mA
3V
2.58
2.48
2.48
IOH = –8 mA
4.5 V
3.94
3.8
3.8
PARAMETER
TEST CONDITIONS
IOH = –50 mA
VOH
IOL = 50 mA
VOL
IOL = 4 mA
II
ICC
Ci
IOL = 8 mA
VI = 5.5 V or GND
VI = VCC or GND,
VI = VCC or GND
IO = 0
VCC
SN54AHC139
MIN
MAX
SN74AHC139
MIN
MAX
UNIT
V
2V
0.1
0.1
0.1
3V
0.1
0.1
0.1
4.5 V
0.1
0.1
0.1
3V
0.36
0.5
0.44
4.5 V
0.36
0.5
0.44
0 V to 5.5 V
±0.1
±1*
±1
mA
4
40
40
mA
10
pF
5.5 V
5V
2
10
V
* On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.
switching characteristics over recommended operating free-air temperature range,
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
tPLH
tPHL
A or B
Y
CL = 15 pF
tPLH
tPHL
G
Y
CL = 15 pF
tPLH
tPHL
A or B
Y
CL = 50 pF
tPLH
tPHL
G
Y
CL = 50 pF
TA = 25°C
MIN
TYP
MAX
SN54AHC139
SN74AHC139
MIN
MAX
MIN
MAX
7.2**
11**
1**
13**
1
13
7.2**
11**
1**
13**
1
13
6.4**
9.2**
1**
11**
1
11
6.4**
9.2**
1**
11**
1
11
9.7
14.5
1
16.5
1
16.5
9.7
14.5
1
16.5
1
16.5
8.9
12.7
1
14.5
1
14.5
8.9
12.7
1
14.5
1
14.5
UNIT
ns
ns
ns
ns
** On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
tPLH
tPHL
A or B
Y
CL = 15 pF
tPLH
tPHL
G
Y
CL = 15 pF
tPLH
tPHL
A or B
Y
CL = 50 pF
tPLH
tPHL
G
Y
CL = 50 pF
MIN
TA = 25°C
TYP
MAX
MAX
MIN
MAX
7.2**
1**
8.5**
1
8.5
5**
7.2**
1**
8.5**
1
8.5
4.4**
6.3**
1**
7.5**
1
7.5
4.4**
6.3**
1**
7.5**
1
7.5
6.5
9.2
1
10.5
1
10.5
6.5
9.2
1
10.5
1
10.5
5.9
8.3
1
9.5
1
9.5
5.9
8.3
1
9.5
1
9.5
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
POST OFFICE BOX 655303
SN74AHC139
MIN
5**
** On products compliant to MIL-PRF-38535, this parameter is not production tested.
4
SN54AHC139
• DALLAS, TEXAS 75265
UNIT
ns
ns
ns
ns
SN54AHC139, SN74AHC139
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS
SCLS259K – DECEMBER 1995 – REVISED MARCH 2003
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance
No load,
TYP
f = 1 MHz
UNIT
13
pF
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
RL = 1 kΩ
From Output
Under Test
Test
Point
S1
VCC
Open
TEST
GND
CL
(see Note A)
CL
(see Note A)
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
VCC
50% VCC
Timing Input
tw
VCC
Input
50% VCC
50% VCC
0V
th
tsu
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VCC
50% VCC
Input
50% VCC
0V
tPLH
In-Phase
Output
tPHL
50% VCC
tPHL
Out-of-Phase
Output
VOH
50% VCC
VOL
Output
Waveform 1
S1 at VCC
(see Note B)
VOH
50% VCC
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
50% VCC
50% VCC
0V
tPZL
tPLZ
≈VCC
50% VCC
tPZH
tPLH
50% VCC
VCC
Output
Control
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.3 V
VOL
tPHZ
50% VCC
VOH – 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74AHC139D
ACTIVE
SOIC
D
16
SN74AHC139DBLE
OBSOLETE
SSOP
DB
16
SN74AHC139DBR
ACTIVE
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC139DBRE4
ACTIVE
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC139DE4
ACTIVE
SOIC
D
16
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC139DGVR
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC139DGVRE4
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC139DR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC139DRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC139N
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74AHC139NE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74AHC139NSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC139NSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC139PW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC139PWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC139PWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC139PWLE
OBSOLETE
TSSOP
PW
16
SN74AHC139PWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC139PWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC139PWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC139RGYR
ACTIVE
QFN
RGY
16
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SN74AHC139RGYRG4
ACTIVE
QFN
RGY
16
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
40
Green (RoHS &
no Sb/Br)
TBD
40
TBD
(1)
Lead/Ball Finish
CU NIPDAU
Call TI
Call TI
MSL Peak Temp (3)
Level-1-260C-UNLIM
Call TI
Call TI
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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