TI SN74LVC574ARGYR

SCAS301R − JANUARY 1993 − REVISED MARCH 2005
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
CLK
All Ports (5-V Input/Output Voltage With
3.3-V VCC)
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
1D
2D
3D
4D
5D
6D
7D
8D
20
19 1Q
3
18 2Q
4
17 3Q
16 4Q
15 5Q
5
6
8
14 6Q
13 7Q
9
12 8Q
7
10
11
3D
4D
5D
6D
7D
1Q
1
2
SN54LVC574A . . . FK PACKAGE
(TOP VIEW)
2D
1D
OE
VCC
SN74LVC574A . . . RGY PACKAGE
(TOP VIEW)
VCC
OE
1D
2D
3D
4D
5D
6D
7D
8D
GND
D
CLK
SN54LVC574A . . . J OR W PACKAGE
SN74LVC574A . . . DB, DGV, DW, N, NS,
OR PW PACKAGE
(TOP VIEW)
D
OE
D
D
−40°C to 125°C, and −55°C to 125°C
Max tpd of 7 ns at 3.3 V
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
GND
D
D
D Support Mixed-Mode Signal Operation on
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
2Q
3Q
4Q
5Q
6Q
8D
GND
CLK
8Q
7Q
D Operate From 1.65 V to 3.6 V
D Inputs Accept Voltages to 5.5 V
D Specified From −40°C to 85°C,
description/ordering information
The SN54LVC574A octal edge-triggered D-type flip-flop is designed for 2.7-V to 3.6-V VCC operation, and the
SN74LVC574A octal edge-triggered D-type flip-flop is designed for 1.65-V to 3.6-V VCC operation.
These devices feature 3-state outputs designed specifically for driving highly capacitive or relatively
low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional
bus drivers, and working registers.
On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels at the data (D) inputs.
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high
or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive
the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus
lines without interface or pullup components.
OE does not affect the internal operations of the flip-flops. Old data can be retained or new data can be entered
while the outputs are in the high-impedance state.
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow through the device when it is powered down.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2005, Texas Instruments Incorporated
!" # $%&" !# '%()$!" *!"&+
*%$"# $ " #'&$$!"# '& ",& "&# &-!# #"%&"#
#"!*!* .!!"/+ *%$" '$&##0 *&# " &$&##!)/ $)%*&
"&#"0 !)) '!!&"&#+
'*%$"# $')!" " 12
!)) '!!&"&# !& "&#"&*
%)&## ",&.#& "&*+ !)) ",& '*%$"#
'*%$"
'$&##0 *&# " &$&##!)/ $)%*& "&#"0 !)) '!!&"&#+
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCAS301R − JANUARY 1993 − REVISED MARCH 2005
description/ordering information (continued)
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of these devices as translators
in a mixed 3.3-V/5-V system environment.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
PACKAGE†
TA
QFN − RGY
Reel of 1000
SN74LVC574ARGYR
VFBGA − GQN
−40°C
−40
C to 85
85°C
C
PDIP − N
Reel of 1000
LC574A
SN74LVC574AZQNR
Tube of 20
SN74LVC574AN
Tube of 25
SN74LVC574ADW
Reel of 2000
SN74LVC574ADWR
SOP − NS
Reel of 2000
SN74LVC574ANSR
LVC574A
SSOP − DB
Reel of 2000
SN74LVC574ADBR
LC574A
Tube of 70
SN74LVC574APW
Reel of 2000
SN74LVC574APWR
Reel of 250
SN74LVC574APWT
TVSOP − DGV
Reel of 2000
SN74LVC574ADGVR
LC574A
CDIP − J
Tube of 20
SNJ54LVC574AJ
SNJ54LVC574AJ
CFP − W
Tube of 85
SNJ54LVC574AW
SNJ54LVC574AW
LCCC − FK
Tube of 55
SNJ54LVC574AFK
SOIC − DW
TSSOP − PW
−55°C
−55
C to 125
125°C
C
LC574A
SN74LVC574AGQNR
VFBGA − ZQN (Pb-free)
−40°C
−40
C to 125
125°C
C
TOP-SIDE
MARKING
SN74LVC574AN
LVC574A
LC574A
SNJ54LVC574AFK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
GQN OR ZQN PACKAGE
(TOP VIEW)
1
2
3
terminal assignments
4
1
2
3
4
A
A
1D
OE
1Q
B
B
3D
3Q
VCC
2D
C
C
5D
4D
5Q
4Q
D
D
7D
7Q
6D
6Q
E
E
GND
8D
CLK
8Q
FUNCTION TABLE
(each flip-flop)
INPUTS
2
OE
CLK
D
OUTPUT
Q
L
↑
H
H
L
↑
L
L
L
L
X
Q0
H
X
X
Z
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
2Q
SCAS301R − JANUARY 1993 − REVISED MARCH 2005
logic diagram (positive logic)
OE
CLK
1
11
C1
1D
2
19
1Q
1D
To Seven Other Channels
Pin numbers shown are for the DB, DGV, DW, FK, J, N, NS, PW, RGY, and W packages.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6.5 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6.5 V
Voltage range applied to any output in the high-impedance or power-off state, VO
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6.5 V
Voltage range applied to any output in the high or low state, VO
(see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA
Package thermal impedance, θJA (see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
(see Note 3): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92°C/W
(see Note 3): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
(see Note 3): GQN/ZQN package . . . . . . . . . . . . . . . . . . . . . . . . . . . 78°C/W
(see Note 3): N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
(see Note 3): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
(see Note 3): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
(see Note 4): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Power dissipation, Ptot (TA = −40°C to 125°C) (see Notes 5 and 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 mW
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The value of VCC is provided in the recommended operating conditions table.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
4. The package thermal impedance is calculated in accordance with JESD 51-5.
5. For the DW package: above 70°C the value of Ptot derates linearly with 8 mW/K.
6. For the DB, DGV, N, NS, and PW packages: above 60°C the value of Ptot derates linearly with 5.5 mW/K.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SCAS301R − JANUARY 1993 − REVISED MARCH 2005
recommended operating conditions (see Note 7)
SN54LVC574A
−55 TO 125°C
MIN
MAX
2
3.6
Operating
VCC
Supply voltage
VIH
VIL
High-level input voltage
VI
Input voltage
Data retention only
VO
Output voltage
IOH
High-level output current
IOL
Low-level output current
∆t/∆v
Input transition rise or fall rate
V
1.5
VCC = 2.7 V to 3.6 V
VCC = 2.7 V to 3.6 V
Low-level input voltage
UNIT
2
V
0.8
V
0
5.5
V
High or low state
0
3−state
0
VCC
5.5
V
VCC = 2.7 V
VCC = 3 V
−12
VCC = 2.7 V
12
VCC = 3 V
24
−24
6
mA
mA
ns/V
NOTE 7: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
recommended operating conditions (see Note 7)
SN74LVC574A
Operating
VCC
Supply voltage
VIH
High-level input
voltage
VIL
Low-level input
voltage
VI
Input voltage
VO
IOH
Output voltage
High-level
output current
Data retention only
TA = 25°C
MIN
MAX
MIN
MAX
MIN
MAX
1.65
1.65
3.6
1.65
3.6
3.6
−40 TO 85°C
−40 TO 125°C
V
1.5
1.5
1.5
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
0.65 × VCC
0.65 × VCC
0.65 × VCC
1.7
1.7
1.7
VCC = 2.7 V to 3.6 V
VCC = 1.65 V to 1.95 V
2
2
2
0.35 × VCC
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
0.35 × VCC
0.7
V
0.35 × VCC
0.7
0.8
UNIT
0.7
0.8
V
0.8
0
5.5
0
5.5
0
5.5
V
High or low state
0
0
0
VCC
5.5
0
3−state
VCC
5.5
VCC
5.5
V
0
0
VCC = 1.65 V
VCC = 2.3 V
−4
−4
−4
−8
−8
−8
VCC = 2.7 V
VCC = 3 V
−12
−12
−12
−24
−24
−24
VCC = 1.65 V
VCC = 2.3 V
4
4
4
8
8
8
VCC = 2.7 V
VCC = 3 V
12
12
12
24
24
24
6
6
6
IOL
Low-level
output current
∆t/∆v
Input transition rise or fall rate
mA
mA
ns/V
NOTE 7: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCAS301R − JANUARY 1993 − REVISED MARCH 2005
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN54LVC574A
PARAMETER
TEST CONDITIONS
VCC
IOH = −100 µA
VOH
2.7 V to 3.6 V
2.7 V
VCC − 0.2
2.2
3V
2.4
3V
2.2
IOH = −12 mA
IOH = −24 mA
IOL = 100 µA
−55 TO 125°C
MIN TYP†
MAX
UNIT
V
2.7 V to 3.6 V
0.2
IOL = 12 mA
IOL = 24 mA
2.7 V
0.4
3V
0.55
II
IOZ
VI = 5.5 V or GND
VO = 0 to 5.5 V
3.6 V
±5
µA
3.6 V
±15
µA
ICC
VI = VCC or GND
3.6 V ≤ VI ≤ 5.5 V‡
VOL
∆ICC
Ci
10
IO = 0
One input atVCC − 0.6 V, Other inputs at VCC or GND
VI = VCC or GND
Co
VO = VCC or GND
† TA = 25°C
‡ This applies in the disabled state only.
POST OFFICE BOX 655303
3.6 V
10
2.7 V to 3.6 V
500
V
µA
A
µA
3.3 V
4
pF
3.3 V
5.5
pF
• DALLAS, TEXAS 75265
5
SCAS301R − JANUARY 1993 − REVISED MARCH 2005
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN74LVC574A
PARAMETER
TEST CONDITIONS
IOH = −100 µA
IOH = −4 mA
VOH
VCC
1.65 V to 3.6 V
IOH = −8 mA
IOH = −12 mA
IOH = −24 mA
IOL = 100 µA
TA = 25°C
MIN
TYP
−40 TO 85°C
MAX
MIN
MAX
−40 TO 125°C
MIN
1.65 V
VCC − 0.2
1.29
VCC − 0.2
1.2
VCC − 0.2
1.2
2.3 V
1.9
1.7
1.7
2.7 V
2.2
2.2
2.2
3V
2.4
2.4
2.4
3V
2.3
2.2
UNIT
MAX
V
2.2
1.65 V to 3.6 V
0.1
0.2
0.2
IOL = 4 mA
IOL = 8 mA
1.65 V
0.24
0.45
0.45
2.3 V
0.3
0.7
0.7
IOL = 12 mA
IOL = 24 mA
2.7 V
0.4
0.4
0.4
3V
0.55
0.55
0.55
II
Ioff
VI = 5.5 V or GND
VI or VO = 5.5 V
3.6 V
±1
±5
±5
µA
0
±4
±10
±10
µA
IOZ
VI = 0 to 5.5 V
VI = VCC or GND
3.6 V ≤ VI ≤ 5.5 V†
3.6 V
µA
VOL
ICC
IO = 0
∆ICC
One input at VCC − 0.6 V,
Other inputs at VCC or
GND
Ci
VI = VCC or GND
Co
VO = VCC or GND
† This applies in the disabled state only.
3.6 V
2.7 V to 3.6 V
±1
±10
±10
1.5
10
10
1.5
10
10
500
500
500
V
µA
A
µA
3.3 V
4
pF
3.3 V
5.5
pF
timing requirements over recommended operating free-air temperature range (unless otherwise
noted) (see Figure 1)
SN54LVC574A
VCC
−55 TO 125°C
MIN
6
fclock
Clock frequency
tw
Pulse duration, CLK high or low
tsu
Setup time, data before CLK↑
th
Hold time, data after CLK↑
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
2.7 V
150
3.3 V ± 0.3 V
150
2.7 V
3.3
3.3 V ± 0.3 V
3.3
2.7 V
2
3.3 V ± 0.3 V
2
2.7 V
2
3.3 V ± 0.3 V
2
UNIT
MAX
MHz
ns
ns
ns
SCAS301R − JANUARY 1993 − REVISED MARCH 2005
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 1)
SN54LVC574A
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
−55 TO 125°C
VCC
MIN
fmax
2.7 V
150
3.3 V ± 0.3 V
150
CLK
Q
ten
OE
Q
tdis
OE
Q
MHz
8
2.7 V
tpd
UNIT
MAX
3.3 V ± 0.3 V
1
7
1
7.5
0.5
6.4
ns
9
2.7 V
3.3 V ± 0.3 V
7
2.7 V
3.3 V ± 0.3 V
ns
ns
timing requirements over recommended operating free-air temperature range (unless otherwise
noted) (see Figure 1)
SN74LVC574A
VCC
fclock
tw
tsu
th
Clock frequency
Pulse duration, CLK high or low
Setup time, data before CLK↑
Hold time, data after CLK↑
TA = 25°C
MIN
TYP
MAX
−40 TO 85°C
MIN
MAX
−40 TO 125°C
MIN
1.8 V ± 0.15 V
55
55
40
2.5 V ± 0.2 V
95
95
80
2.7 V
150
150
150
3.3 V ± 0.3 V
150
150
150
1.8 V ± 0.15 V
9
9
2.5 V ± 0.2 V
4
4
4
2.7 V
3.3
3.3
3.3
3.3 V ± 0.3 V
3.3
3.3
3.3
6
6
6
2.5 V ± 0.2 V
4
4
4
2.7 V
2
2
2
3.3 V ± 0.3 V
2
2
2
1.8 V ± 0.15 V
4
4
4
2.5 V ± 0.2 V
2
2
2
2.7 V
1.5
1.5
1.5
3.3 V ± 0.3 V
1.5
1.5
1.5
• DALLAS, TEXAS 75265
MHz
9
1.8 V ± 0.15 V
POST OFFICE BOX 655303
UNIT
MAX
ns
ns
ns
7
SCAS301R − JANUARY 1993 − REVISED MARCH 2005
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 1)
SN74LVC574A
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC
1.8 V ± 0.15 V
fmax
tpd
CLK
ten
OE
tdis
OE
Q
Q
Q
TA = 25°C
MIN
TYP
MAX
55
−40 TO 85°C
MIN
MAX
55
MIN
UNIT
MAX
40
2.5 V ± 02 V
95
95
80
2.7 V
150
150
150
3.3 V ± 0.3 V
150
150
150
1.8 V ± 0.15 V
1.0
7.1
21.5
1
21.6
1.0
21.6
2.5 V ± 0.2 V
1.0
4.9
10.0
1
10.5
1.0
10.5
2.7 V
1.0
5.0
7.8
1
8
1.0
8.0
3.3 V ± 0.3 V
2.2
4.6
6.8
2.2
7
2.2
7.0
1.8 V ± 0.15 V
1.0
6.6
19.0
1
19.5
1.0
19.5
2.5 V ± 0.2 V
1.0
4.8
10.0
1
10.5
1.0
10.5
2.7 V
1.0
5.5
8.3
1
8.5
1.0
8.5
MHz
3.3 V ± 0.3 V
1.5
4.4
7.3
1.5
7.5
1.5
7.5
1.8 V ± 0.15 V
1.0
5.4
18.3
1
18.8
1.0
18.8
2.5 V ± 0.2 V
1.0
3.0
7.3
1
7.8
1.0
7.8
2.7 V
1.0
4.0
6.8
1
7
1.0
7.3
3.3 V ± 0.3 V
1.7
3.9
6.2
1.7
6.4
1.7
6.6
3.3 V ± 0.3 V
tsk(o)
−40 TO 125°C
1
1
ns
ns
ns
ns
operating characteristics, TA = 25°C
TEST
CONDITIONS
PARAMETER
Outputs enabled
Cpd
Power dissipation capacitance per flip−flop
f = 10 MHz
Outputs disabled
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
VCC
TYP
1.8 V
25
2.5 V
29
3.3 V
30
1.8 V
9
2.5 V
9
3.3 V
11
UNIT
pF
SCAS301R − JANUARY 1993 − REVISED MARCH 2005
PARAMETER MEASUREMENT INFORMATION
RL
From Output
Under Test
CL
(see Note A)
VLOAD
Open
S1
GND
RL
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
VLOAD
GND
LOAD CIRCUIT
INPUTS
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
2.7 V
3.3 V ± 0.3 V
VI
tr/tf
VCC
VCC
2.7 V
2.7 V
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
VM
VLOAD
CL
RL
V∆
VCC/2
VCC/2
1.5 V
1.5 V
2 × VCC
2 × VCC
6V
6V
30 pF
30 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
0.15 V
0.15 V
0.3 V
0.3 V
VI
Timing Input
VM
0V
tw
tsu
VI
Input
VM
VM
th
VI
Data Input
VM
VM
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VI
VM
Input
VM
0V
tPLH
tPHL
VOH
VM
Output
VM
VOL
tPHL
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPLH
VM
VM
VM
0V
tPLZ
tPZL
VLOAD/2
VM
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Waveform 2
S1 at GND
(see Note B)
VOL + V∆
VOL
tPHZ
tPZH
VOH
Output
VI
Output
Control
VM
VOH − V∆
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
SCAS301R − JANUARY 1993 − REVISED MARCH 2005
10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-9757601Q2A
ACTIVE
LCCC
FK
20
1
TBD
5962-9757601QRA
ACTIVE
CDIP
J
20
1
TBD
1
Lead/Ball Finish
MSL Peak Temp (3)
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
TBD
A42
N / A for Pkg Type
TBD
Call TI
5962-9757601QSA
ACTIVE
CFP
W
20
SN74LVC574ADBLE
OBSOLETE
SSOP
DB
20
SN74LVC574ADBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC574ADBRE4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC574ADGVR
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC574ADGVRE4
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC574ADW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC574ADWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC574ADWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC574ADWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC574AGQNR
ACTIVE
GQN
20
1000
TBD
SNPB
Level-1-240C-UNLIM
SN74LVC574AN
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LVC574ANE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LVC574ANSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC574ANSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC574APW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC574APWE4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC574APWLE
OBSOLETE
TSSOP
PW
20
SN74LVC574APWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC574APWRE4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC574APWRG4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC574APWT
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC574APWTE4
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC574ARGYR
ACTIVE
QFN
RGY
20
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
BGA MI
CROSTA
R JUNI
OR
TBD
Addendum-Page 1
Call TI
Call TI
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
Orderable Device
Status (1)
Package
Type
Package
Drawing
SN74LVC574ARGYRG4
ACTIVE
QFN
RGY
20
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SN74LVC574AZQNR
ACTIVE
ZQN
20
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
SNJ54LVC574AFK
ACTIVE
LCCC
FK
20
1
TBD
SNJ54LVC574AJ
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54LVC574AW
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
BGA MI
CROSTA
R JUNI
OR
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
POST-PLATE N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power Wireless www.ti.com/lpw
Mailing Address:
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright  2006, Texas Instruments Incorporated