SBAS280E − JUNE 2003 − REVISED MAY 2007 FEATURES D Data Rate: 1.25MSPS D Signal-to-Noise Ratio: 93dB D Total Harmonic Distortion: −101dB D Spurious-Free Dynamic Range: 103dB D Linear Phase with 615kHz Bandwidth D Passband Ripple: ±0.0025dB D Adjustable FIFO Output Buffer (ADS1626 only) D Selectable On-Chip Reference D Directly Connects to TMS320C6000 DSPs D Adjustable Power Dissipation: 150 to 515mW D Power Down Mode D Supplies: Analog +5V DESCRIPTION The ADS1625 and ADS1626 are high-speed, high-precision, delta-sigma analog-to-digital converters (ADCs) with 18-bit resolution. The data rate is 1.25 mega samples per second (MSPS), the bandwidth (−3dB) is 615kHz, and passband ripple is less than ±0.0025dB (to 550kHz). Both devices offer the same outstanding performance at these speeds with a signal-to-noise ratio up to 93dB, total harmonic distortion down to −101dB, and a spurious-free dynamic range up to 103dB. The ADS1626 includes an adjustable first-in, first-out buffer (FIFO) for the output data. The input signal is measured against a voltage reference that can be generated on-chip or supplied externally. The digital output data are provided over a simple parallel interface that easily connects to digital signal processors (DSPs). An out-of-range monitor reports when the input range has been exceeded. The ADS1625/6 operate from a +5V analog supply (AVDD) and +3V digital supply (DVDD). The digital I/O supply (IOVDD) operates from +2.7 to +5.25V, enabling the digital interface to support a range of logic families. The analog power dissipation is set by an external resistor and can be reduced when operating at slower speeds. A power-down mode, activated by a digital I/O pin, shuts down all circuitry. The ADS1625/6 are offered in a TQFP-64 package using TI PowerPAD technology. Digital +3V Digital I/O +2.7V to +5.25V APPLICATIONS D Scientific Instruments D Automated Test Equipment D Data Acquisition D Medical Imaging D Vibration Analysis VREFP VREFN VMID The ADS1625 and ADS1626, along with their 16-bit, 5MSPS counterparts, the ADS1605 and ADS1606, are well-suited for the demanding measurement requirements of scientific instrumentation, automated test equipment, data acquisition, and medical imaging. RBIAS VCAP AVDD DVDD IOVDD PD REFEN RESET CLK CS RD DRDY OTR Reference and Bias Circuits AINP AINN ∆Σ Modulator I/O Interface Digital Filter ADS1626 Only FIFO ADS1625 ADS1626 DOUT[17:0] FIFO_LEV[2:0] AGND DGND Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. Copyright 2003−2007, Texas Instruments Incorporated ! "# $ %& $ " '&(% ) )&%$ %"# $'%"%$ ' * #$ " +$ $&#$ $)) ,- )&% '%$$ )$ %$$- %&) $ " '#$ www.ti.com www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 ORDERING INFORMATION PRODUCT PACKAGE−LEAD PACKAGE DESIGNATOR(1) SPECIFIED TEMPERATURE RANGE PACKAGE MARKING ADS1625 HTQFP−64 PAP −40°C to +85°C ADS1625I ADS1626 HTQFP−64 PAP −40°C to +85°C ADS1626I ORDERING NUMBER TRANSPORT MEDIA, QUANTITY ADS1625IPAPT Tape and Reel, 250 ADS1625IPAPR Tape and Reel, 1000 ADS1626IPAPT Tape and Reel, 250 ADS1626IPAPR Tape and Reel, 1000 (1) For the most current specifications and package information, refer to our web site at www.ti.com. PRODUCT FAMILY ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) ADS1625/26 UNIT AVDD to AGND −0.3 to +6 V DVDD to DGND −0.3 to +3.6 V IOVDD to DGND −0.3 to +6 V AGND to DGND −0.3 to +0.3 V Input Current 100, Momentary mA Input Current 10, Continuous mA Analog I/O to AGND −0.3 to AVDD + 0.3 V Digital I/O to DGND −0.3 to IOVDD + 0.3 V +150 °C Operating Temperature Range −40 to +105 °C Storage Temperature Range −60 to +150 °C Maximum Junction Temperature Lead Temperature (soldering, 10s) +260 °C (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. 2 PRODUCT RESOLUTION DATA RATE FIFO? ADS1605 16 Bits 5.0MSPS No ADS1606 16 Bits 5.0MSPS Yes ADS1625 18 Bits 1.25MSPS No ADS1626 18 Bits 1.25MSPS Yes This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 ELECTRICAL CHARACTERISTICS All specifications at −40°C to +85°C, AVDD = 5V, DVDD = IOVDD = 3V, fCLK = 40MHz, External VREF = +3V, VCM = 2.0V, FIFO disabled, and RBIAS = 37kΩ, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Analog Input 0dBFS Differential input voltage (VIN) (AINP − AINN) −2dBFS −6dBFS −20dBFS ±1.467VREF ±1.165VREF V ±0.735VREF ±0.147VREF V 2.0 V Common-mode input voltage (VCM) (AINP + AINN) / 2 Absolute input voltage (AINP or AINN with respect to AGND) V V 0dBFS −0.1 4.7 V −2dBFS input and smaller 0.1 4.2 V Dynamic Specifications Data rate Signal-to-noise ratio (SNR) Total harmonic distortion (THD) 1.25 fCLK 40MHz Ǔ MSPS fIN = 10kHz, −2dBFS fIN = 10kHz, −6dBFS 93 dB 90 dB fIN = 10kHz, −20dBFS fIN = 100kHz, −2dBFS 76 dB 93 dB fIN = 100kHz, −6dBFS fIN = 100kHz, −20dBFS 90 dB 76 dB fIN = 500kHz, −2dBFS fIN = 500kHz, −6dBFS 93 dB 90 dB fIN = 500kHz, −20dBFS fIN = 10kHz, −2dBFS 76 dB 70 −101 dB fIN = 10kHz, −6dBFS fIN = 10kHz, −20dBFS −103 dB −96 dB fIN = 100kHz, −2dBFS fIN = 100kHz, −6dBFS −95 dB −101 dB fIN = 100kHz, −20dBFS fIN = 500kHz, −2dBFS −114 dB −110 dB −98 fIN = 500kHz, −6dBFS fIN = 500kHz, −20dBFS Signal-to-noise and distortion (SINAD) ǒ −90 dB −96 dB fIN = 10kHz, −2dBFS fIN = 10kHz, −6dBFS 92 dB 89 dB fIN = 10kHz, −20dBFS fIN = 100kHz, −2dBFS 76 dB 91 dB 89 dB 76 dB fIN = 500kHz, −2dBFS fIN = 500kHz, −6dBFS 93 dB 90 dB fIN = 500kHz, −20dBFS 76 dB fIN = 100kHz, −6dBFS fIN = 100kHz, −20dBFS 69 3 www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 ELECTRICAL CHARACTERISTICS (continued) All specifications at −40°C to +85°C, AVDD = 5V, DVDD = IOVDD = 3V, fCLK = 40MHz, External VREF = +3V, VCM = 2.0V, FIFO disabled, and RBIAS = 37kΩ, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Spurious-free dynamic range (SFDR) Intermodulation distortion (IMD) fIN = 10kHz, −2dBFS fIN = 10kHz, −6dBFS 104 dB 106 dB fIN = 10kHz, −20dBFS fIN = 100kHz, −2dBFS 99 dB 97 dB 103 dB 102 dB fIN = 500kHz, −2dBFS fIN = 500kHz, −6dBFS 120 dB 113 dB fIN = 500kHz, −20dBFS 99 dB −98 dB 4 ns fIN = 100kHz, −6dBFS fIN = 100kHz, −20dBFS 92 f1 = 495kHz, −2dBFS f2 = 505kHz, −2dBFS Aperture delay Digital Filter Characteristics Passband 0 550 Passband ripple 575 −3.0dB attenuation 615 Passband transition Stop band 0.7 Stop band attenuation ǒ fCLK 40MHz fCLK Ǔ Ǔ fCLK 40MHz Ǔ ± 0.0025 kHz dB kHz kHz ǒ Ǔ 39.3 f CLK 40MHz Ǔ MHz dB 20.8 To ±0.001% fCLK 40MHz 40MHz 72 Group delay Settling time ǒ ǒ −0.1dB attenuation ǒ ǒ ǒ 36.8 40MHz fCLK Ǔ Ǔ 40MHz fCLK µs µs Static Specifications Resolution No missing codes Bits 1.5 LSB, rms 3.5 LSB 18 Input referred noise Integral nonlinearity 18 −2.0dBFS signal Bits Differential nonlinearity ±0.5 LSB Offset error 0.05 %FSR 1 ppmFSR/°C Offset error drift Gain error 0.25 % Gain error drift Excluding reference drift 10 ppm/°C Common-mode rejection at DC 75 dB Power-supply rejection at DC 65 dB 4 www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 ELECTRICAL CHARACTERISTICS (continued) All specifications at −40°C to +85°C, AVDD = 5V, DVDD = IOVDD = 3V, fCLK = 40MHz, External VREF = +3V, VCM = 2.0V, FIFO disabled, and RBIAS = 37kΩ, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Voltage Reference(1) VREF = (VREFP − VREFN) VREFP 2.5 3.0 3.2 V 3.75 4.0 4.25 V VREFN 0.75 1.0 1.25 V VMID 2.3 2.5 2.8 VREF drift Startup time V Internal reference (REFEN = low) 50 ppm/°C Internal reference (REFEN = low) 15 ms Clock Input Frequency (fCLK) 1 Duty Cycle fCLK = 40MHz 40 50 MHz 55 % 0.7 IOVDD IOVDD V DGND 0.3 IOVDD V 45 Digital Input/Output VIH VIL VOH VOL IOH = 50µA IOL = 50µA Input leakage DGND < VDIGIN < IOVDD 0.8 IOVDD V 0.2 IOVDD V ±10 µA Power-Supply Requirements AVDD 4.75 5.25 V DVDD 2.7 3.3 V IOVDD 2.7 AVDD current (IAVDD) 5.25 V REFEN = low 110 135 mA REFEN = high 85 105 mA 27 35 mA 3 5 mA 515 645 mW DVDD current (IDVDD) IOVDD current (IIOVDD) IOVDD = 3V Power dissipation AVDD = 5V, DVDD = 3V, IOVDD = 3V, REFEN = high PD = low, CLK disabled 5 mW Temperature Range Specified −40 +85 °C Operating −40 +105 °C Storage −60 +150 °C Thermal Resistance, qJA qJC PowerPAD soldered to PCB with 2oz. trace and copper pad. 25 °C/W 0.5 °C/W (1) The specification limits for VREF, VREFP, VREFN, and VMID apply when using the internal or an external reference. The internal reference voltages are bounded by the limits shown. When using an external reference, the limits indicate the allowable voltages that can be applied to the reference pins. 5 www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 DEFINITIONS Absolute Input Voltage Offset Error Absolute input voltage, given in volts, is the voltage of each analog input (AINN or AINP) with respect to AGND. Offset Error, given in % of FSR, is the output reading when the differential input is zero. Aperture Delay Offset Error Drift Aperture delay is the delay between the rising edge of CLK and the sampling of the input signal. Common-Mode Input Voltage Offset error drift, given in ppm of FSR/_C, is the drift over temperature of the offset error. The offset error is specified as the larger of the drift from ambient (TA = 25_C) to the minimum or maximum operating temperatures. Common-mode input voltage (VCM) is the average voltage of the analog inputs: Signal-to-Noise Ratio (SNR) (AINP ) AINN) 2 Differential Input Voltage Differential input voltage (VIN) is the voltage difference between the analog inputs: (AINP−AINN). Differential Nonlinearity (DNL) DNL, given in least-significant bits (LSB) of the output code, is the maximum deviation of the output code step sizes from the ideal value of 1LSB. Full-Scale Range (FSR) FSR is the difference between the maximum and minimum measurable input signals. For the ADS1625, FSR = 2 × 1.467VREF. Gain Error Gain error, given in %, is the error of the full-scale input signal with respect to the ideal value. Gain Error Drift Gain error drift, given in ppm/_C, is the drift over temperature of the gain error. The gain error is specified as the larger of the drift from ambient (TA = 25_C) to the minimum or maximum operating temperatures. Integral Nonlinearity (INL) INL, given in least significant bits (LSB) of the output code, is the maximum deviation of the output codes from a bestfit line. Intermodulation Distortion (IMD) IMD, given in dB, is measured while applying two input signals of the same magnitude, but with slightly different frequencies. It is calculated as the difference between the rms amplitude of the input signal to the rms amplitude of the peak spurious signal. 6 SNR, given in dB, is the ratio of the rms value of the input signal to the sum of all the frequency components below fCLK/2 (the Nyquist frequency) excluding the first six harmonics of the input signal and the dc component. Signal-to-Noise and Distortion (SINAD) SINAD, given in dB, is the ratio of the rms value of the input signal to the sum of all the frequency components below fCLK/2 (the Nyquist frequency) including the harmonics of the input signal but excluding the dc component. Spurious Free Dynamic Range (SFDR) SFDR, given in dB, is the difference between the rms amplitude of the input signal to the rms amplitude of the peak spurious signal. Total Harmonic Distortion (THD) THD, given in dB, is the ratio of the sum of the rms value of the first six harmonics of the input signal to the rms value of the input signal. www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 VREFP VREFP VMID VREFN VREFN VCAP AVDD AGND CLK AGND DGND IOVDD DVDD DGND NC NC PIN ASSIGNMENTS 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 AGND 1 48 FIFO_LEV[2] (ADS1626 Only) ADS1625 ADS1626 AVDD 2 47 FIFO_LEV[1] (ADS1626 Only) AGND 3 TQFP PACKAGE (TOP VIEW) 46 FIFO_LEV[0] (ADS1626 Only) AINN 4 45 NC AINP 5 44 DOUT[17] AGND 6 43 DOUT[16] AVDD 7 42 DOUT[15] RBIAS 8 41 DOUT[14] PowerPAD AGND 9 TM 40 DOUT[13] AVDD 10 39 DOUT[12] AGND 11 38 DOUT[11] AVDD 12 37 DOUT[10] REFEN 13 36 DOUT[9] IOVDD 14 35 DOUT[8] DGND 15 34 DOUT[7] RESET CS RD DRDY DGND 27 28 29 30 31 32 DOUT[5] DGND 26 DOUT[4] 25 DOUT[3] 24 DOUT[2] 22 23 DOUT[1] 21 DOUT[0] 20 DVDD 19 OTR 18 PD 33 DOUT[6] 17 DVDD NC 16 Terminal Functions TERMINAL NAME NO. TYPE AGND 1, 3, 6, 9, 11, 55, 57 Analog Analog ground AVDD 2, 7, 10, 12, 58 Analog Analog supply AINN 4 Analog input Negative analog input AINP 5 Analog input Positive analog input RBIAS 8 Analog REFEN 13 Digital input: active low DESCRIPTION Terminal for external analog bias setting resistor Internal reference enable. Internal pull-down resistor of 170kΩ to DGND. NC 16, 45, 49, 50 PD 17 Digital input: active low DVDD 18, 26, 52 Digital Digital supply DGND 15, 19, 25, 51, 54 Digital Digital ground RESET 20 Digital input: active low Reset digital filter CS 21 Digital input: active low Chip select RD 22 Digital input: active low Read enable OTR 23 Digital output DRDY Must be left unconnected Power down all circuitry. Internal pull-up resistor of 170kΩ to DGND. Active when analog inputs are out of range 24 Digital output: active low DOUT [17:0] 27−44 Digital output Data ready on falling edge Data output. DOUT[17] is the MSB and DOUT[0] is the LSB. FIFO_LEV[2:0] 46−48 Digital input FIFO level (for the ADS1626 only). FIFO_LEV[2] is MSB. NOTE: These terminals must be left unconnected on the ADS1625. IOVDD 14, 53 Digital CLK 56 Digital input VCAP 59 Analog Terminal for external bypass capacitor connection to internal bias voltage 60, 61 Analog Negative reference voltage 62 Analog Midpoint voltage 63, 64 Analog Positive reference voltage VREFN VMID VREFP Digital I/O supply Clock input 7 www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 PARAMETER MEASUREMENT INFORMATION t2 t1 CLK t2 t3 t4 DRDY t4 t6 t5 DOUT[17:0] Data N Data N + 2 Data N + 1 NOTE: CS and RD tied low. Figure 1. Data Retrieval Timing (ADS1625, ADS1626 with FIFO Disabled) RD, CS t7 t8 DOUT[17:0] Figure 2. DOUT Inactive/Active Timing (ADS1625, ADS1626 with FIFO Disabled) TIMING REQUIREMENTS FOR FIGURE 1 AND FIGURE 2 SYMBOL t1 1/t1 DESCRIPTION CLK period (1/fCLK) fCLK TYP MAX UNIT 20 25 1000 ns 1 40 50 10 MHz t2 CLK pulse width, high or low t3 Rising edge of CLK to DRDY low t4 DRDY pulse width high or low t5 Falling edge of DRDY to data invalid 10 ns t6 Falling edge of DRDY to data valid 15 ns t7 Rising edge of RD and/or CS inactive (high) to DOUT high impedance 15 ns t8 Falling edge of RD and/or CS active (low) to DOUT active. 15 ns NOTE: DOUT[17:0] and DRDY load = 10pF. 8 MIN ns 10 ns 16 t1 ns www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 CLK t11 t9 RESET t12 t 10 DRDY t3 Settled Data DOUT[17:0] NOTE: CS and RD tied low. Figure 3. Reset Timing (ADS1625, ADS1626 with FIFO Disabled) TIMING REQUIREMENTS FOR FIGURE 3 SYMBOL DESCRIPTION t3 Rising edge of CLK to DRDY low t9 RESET pulse width t10 Delay from RESET active (low) to DRDY forced high and DOUT forced low t11 RESET rising edge to falling edge of CLK t12 Delay from DOUT active to valid DOUT (settling to 0.001%) MIN TYP MAX 10 UNIT ns 50 ns 9 −5 ns 10 46 ns DRDY Cycles NOTE: DOUT[17:0] and DRDY load = 10pF. 9 www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 t1 t2 CLK t2 t 13 t14 DRDY t15 t16 CS(1) t21 t 17 RD t20 t18 DOUT[17:0] t19 D1 DL(2) D2 (1) CS may be tied low. (2) The number of data readings (DL) is set by the FIFO level. Figure 4. Data Retrieval Timing (ADS1626 with FIFO Enabled) RD, CS t7 t8 DOUT[17:0] Figure 5. DOUT Inactive/Active Timing (ADS1626 with FIFO Enabled) TIMING REQUIREMENTS FOR FIGURE 4 AND FIGURE 5 SYMBOL DESCRIPTION TYP MAX UNIT 25 1000 ns t1 CLK period (1/fCLK) 20 t2 CLK pulse width, high or low 10 t7 Rising edge of RD and/or CS inactive (high) to DOUT high impedance 7 15 ns t8 Falling edge of RD and/or CS active (low) to DOUT active. 7 15 ns t13 Rising edge of CLK to DRDY high t14 DRDY period t15 DRDY positive pulse width t16 RD high hold time after DRDY goes low t17 CS low before RD goes low ns 12 32 × FIFO Level(1) 1 ns CLK Cycles CLK Cycles 0 ns 0 ns RD negative pulse width 10 ns t19 RD positive pulse width 10 ns t20 RD high before DRDY toggles 2 CLK Cycles t21 RD high before CS goes high 0 ns t18 NOTE: DOUT[17:0] and DRDY load = 10pF. (1) See FIFO section for more details. 10 MIN www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 CLK t11 RESET t9 t26 t25 DRDY t23 RD t24 Figure 6. Reset Timing (ADS1626 with FIFO Enabled) TIMING REQUIREMENTS FOR FIGURE 6 SYMBOL DESCRIPTION MIN t9 RESET pulse width 50 t11 RESET rising edge to falling edge of CLK −5 TYP MAX UNIT ns 10 ns t23 RD pulse low after RESET goes high 32 CLK Cycles t24 RD pulse high before first DRDY pulse after RESET goes high 32 CLK Cycles t25 DRDY low after RESET goes low t26 Delay from RESET high to valid DOUT (settling to 0.001%) 32 × (FIFO level + 1) CLK Cycles See Table 4 DRDY Cycles 11 www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 TYPICAL CHARACTERISTICS All specifications at TA = 25°C, AVDD = 5V, DVDD = IOVDD = 3V, fCLK = 40MHz, External VREF = +3V, VCM = 2.0V, and RBIAS = 37kΩ, unless otherwise noted. SPECTRAL RESPONSE SPECTRAL RESPONSE 0 0 Amplitude (dB) −40 −60 −80 −100 f IN = 10kHz, −6dBFS SNR = 90dB THD = −103dB SFDR = 106dB −20 −40 Amplitude (dB) fIN = 10kHz, −2dBFS SNR = 93dB THD = −101dB SFDR = 104dB −20 −60 −80 −100 −120 −120 −140 −140 −160 −160 0 125 250 375 500 625 0 125 Frequency (kHz) SPECTRAL RESPONSE 625 −60 −80 −100 f IN = 100kHz, −6dBFS SNR = 90dB THD = −101dB SFDR = 103dB −20 −40 Amplitude (dB) f IN = 100kHz, −2dBFS SNR = 93dB THD = −95dB SFDR = 97dB −40 Amplitude (dB) 500 0 −20 −60 −80 −100 −120 −120 −140 −140 −160 −160 0 125 250 375 500 625 0 125 Frequency (kHz) 250 375 500 625 500 625 Frequency (kHz) SPECTRAL RESPONSE SPECTRAL RESPONSE 0 0 f IN = 500kHz, −2dBFS SNR = 93dB THD = −114dB SFDR = 120dB −40 f IN = 500kHz, −6dBFS SNR = 90dB THD = −110dB SFDR = 113dB −20 −40 Amplitude (dB) −20 Amplitude (dB) 375 SPECTRAL RESPONSE 0 −60 −80 −100 −60 −80 −100 −120 −120 −140 −140 −160 −160 0 125 250 375 Frequency (kHz) 12 250 Frequency (kHz) 500 625 0 125 250 375 Frequency (kHz) www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 TYPICAL CHARACTERISTICS (continued) All specifications at TA = 25°C, AVDD = 5V, DVDD = IOVDD = 3V, fCLK = 40MHz, External VREF = +3V, VCM = 2.0V, and RBIAS = 37kΩ, unless otherwise noted. NOISE HISTOGRAM INTERMODULATION RESPONSE 0 9k VIN = 0V 8k 7k −40 Amplitude (dB) Occurrences f IN1 = 495kHz f IN2 = 505kHz IMD = −98dB −20 6k 5k 4k 3k −60 −80 −100 −120 1k −140 0 −160 −10 −9 −8 −7 −6 −5 −4 −3 −2 −1 0 1 2 3 4 5 6 7 8 9 10 2k 400 450 SIGNAL−TO−NOISE RATIO, TOTAL HARMONIC DISTORTION, AND SPURIOUS−FREE DYNAMIC RANGE vs INPUT SIGNALAMPLITUDE 90 THD VIN = −6dBFS SNR (dB) SNR, THD, and SFDR (dB) VIN = −2dBFS 80 70 SNR 60 50 85 80 VIN = −20dBFS 40 30 75 fIN = 100kHz 20 10 −70 70 −60 −50 −40 −30 −20 −10 0 1k 10k Input Signal Amplitude, VIN (dB) 130 −85 125 120 VIN = −20dBFS SFDR (dB) THD (dB) −105 1M SPURIOUS−FREE DYNAMIC RANGE vs INPUT FREQUENCY −80 VIN = −2dBFS −100 100k Input Frequency, f IN (Hz) TOTAL HARMONIC DISTORTION vs INPUT FREQUENCY −95 600 95 SFDR 90 −90 550 SIGNAL−TO−NOISE RATIO vs INPUT FREQUENCY 110 100 500 Frequency (MHz) Output Code (LSB) VIN = −6dBFS 115 105 −110 100 −115 95 −120 VIN = −6dBFS 110 VIN = −2dBFS VIN = −20dBFS 90 1k 10k 100k Input Frequency, fIN (Hz) 1M 1k 10k 100k 1M Input Frequency, fIN (Hz) 13 www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 TYPICAL CHARACTERISTICS (continued) All specifications at TA = 25°C, AVDD = 5V, DVDD = IOVDD = 3V, fCLK = 40MHz, External VREF = +3V, VCM = 2.0V, and RBIAS = 37kΩ, unless otherwise noted. SIGNAL−TO−NOISE RATIO vs INPUT COMMON−MODE VOLTAGE TOTAL HARMONIC DISTORTION vs INPUT COMMON−MODE VOLTAGE −80 95 94 VIN = −2dBFS 93 −85 91 VIN = −6dBFS 90 −90 THD (dB) SNR (dB) 92 89 VIN = −2dBFS −95 −100 88 VIN = −6dBFS 87 −105 f IN = 100kHz 86 f IN = 100kHz −110 85 1.5 1.7 110 1.9 2.1 2.3 2.5 2.7 2.9 1.5 1.9 2.1 2.3 2.5 2.7 Input Common−Mode Voltage, VCM (V) SPURIOUS−FREE DYNAMIC RANGE vs INPUT COMMON−MODE VOLTAGE SIGNAL−TO−NOISE RATIO vs CLK FREQUENCY 2.9 92 VIN = −6dBFS 105 1.7 Input Common−Mode Voltage, VCM (V) RBIAS = 30kΩ 90 95 90 RBIAS = 37kΩ 88 VIN = −2dBFS SNR (dB) SFDR (dB) 100 85 RBIAS = 45kΩ 83 RBIAS = 50kΩ 84 80 RBIAS = 60kΩ 75 fIN = 100kHz 70 82 fIN = 100kHz, −6dBFS 80 65 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9 10 15 20 Input Common−Mode Voltage, VCM (V) TOTAL HARMONIC DISTORTION vs CLK FREQUENCY 35 40 45 50 55 60 110 fIN = 100kHz, −6dBFS RBIAS = 60kΩ −80 105 RBIAS = 30kΩ RBIAS = 50kΩ 100 −85 SFDR (dB) THD (dB) 30 SPURIOUS−FREE DYNAMIC RANGE vs CLK FREQUENCY −75 R BIAS = 45kΩ −90 RBIAS = 37kΩ −95 95 RBIAS = 45kΩ 90 RBIAS = 37kΩ 85 RBIAS = 50kΩ RBIAS = 30kΩ −100 80 −105 fIN = 100kHz, −6dBFS RBIAS = 60kΩ 75 10 15 20 25 30 35 40 45 CLK Frequency, fCLK (MHz) 14 25 CLK Frequency, fCLK (MHz) 50 55 60 10 15 20 25 30 35 40 45 CLK Frequency, fCLK (MHz) 50 55 60 www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 TYPICAL CHARACTERISTICS (continued) All specifications at TA = 25°C, AVDD = 5V, DVDD = IOVDD = 3V, fCLK = 40MHz, External VREF = +3V, VCM = 2.0V, and RBIAS = 37kΩ, unless otherwise noted. SIGNAL−TO−NOISE RATIO vs TEMPERATURE TOTAL HARMONIC DISTORTION vs TEMPERATURE −91 100 −93 VIN = −2dBFS 95 THD (dB) 90 SNR (dB) VIN = −2dBFS −95 VIN = −6dBFS 85 80 −97 VIN = −20dBFS −99 −101 VIN = −20dBFS 75 VIN = −6dBFS −103 fIN = 100kHz 70 −40 fIN = 100kHz −15 10 35 60 −105 −40 85 −15 10 35 60 Temperature (_ C) Temperature (_C) SPURIOUS−FREE DYNAMIC RANGE vs TEMPERATURE POWER−SUPPLY CURRENT vs TEMPERATURE 106 85 120 VIN = −6dBFS IAVDD (REFEN = Low) 104 100 IAVDD (REFEN = High) VIN = −20dBFS Current (mA) SFDR (dB) 102 100 98 VIN = −2dBFS 96 80 60 20 94 fIN = 100kHz 92 −40 −15 10 35 60 IDVDD + I IOVDD 40 RBIAS = 37kΩ fCLK = 40MHz 0 −40 85 −15 Temperature (_C) 10 35 60 85 Temperature (_ C) SUPPLY CURRENT vs CLK FREQUENCY ANALOG SUPPLY CURRENT vs RBIAS 125 140 AVDD = 5V, DVDD = IOVDD = 3V, REFEN = High 130 Analog Current, IAVDD (mA) 105 Supply Current (mA) DVDD = IOVDD = 3V IAVDD (RBIAS = 37kΩ) 85 65 I AVDD (RBIAS = 60kΩ) 45 I DVDD + IIOVDD 25 120 110 100 REFEN = Low 90 80 70 REFEN = High 60 5 fCLK = 40MHz 50 5 15 25 35 45 CLK Frequency, fCLK (MHz) 55 65 30 35 40 45 50 55 60 RBIAS (kΩ) 15 www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 TYPICAL CHARACTERISTICS (continued) All specifications at TA = 25°C, AVDD = 5V, DVDD = IOVDD = 3V, fCLK = 40MHz, External VREF = +3V, VCM = 2.0V, and RBIAS = 37kΩ, unless otherwise noted. INTEGRAL NONLINEARITY DIFFERENTIAL NONLINEARITY 4 3 0.5 fIN = 100Hz, −2dBFS 0.4 fIN = 100Hz, −2dBFS 0.3 0.2 DNL (LSB) INL (LSB) 2 1 0 −1 0 −0.1 −0.2 −2 −0.3 −3 −0.4 −4 −100k −80k −60k −40k −20k 0 20k 40k 60k Output Code (LSB) 16 0.1 80k 100k −0.5 −100k −80k −60k −40k −20k 0 20k 40k 60k Output Code (LSB) 80k 100k www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 OVERVIEW The ADS1625 and ADS1626 are high-performance delta-sigma ADCs with a default oversampling ratio of 32. The modulator uses an inherently stable 2-1-1 pipelined delta-sigma modulator architecture incorporating proprietary circuitry that allows for very linear high-speed operation. The modulator samples the input signal at 40MSPS (when fCLK = 40MHz). A low-ripple, linear-phase digital filter decimates the modulator output to provide data output word rates of 1.25MSPS with a signal passband out to 615kHz. Conceptually, the modulator and digital filter measure the differential input signal, VIN = (AINP – AINN), against the scaled differential reference, VREF = (VREFP – VREFN), as shown in Figure 7. The voltage reference can either be generated internally or supplied externally. An 18-bit parallel data bus, designed for direct connection to DSPs, outputs the data. A separate power supply for the I/O allows flexibility for interfacing to different logic families. Out-ofrange conditions are indicated with a dedicated digital output pin. Analog power dissipation is controlled using an external resistor. This allows reduced dissipation when operating at slower speeds. When not in use, power consumption can be dramatically reduced using the PD pin. The ADS1626 incorporates an adjustable FIFO for the output data. The level of the FIFO is set by the FIFO_LEV[2:0] pins. Other than the FIFO, the ADS1625 and ADS1626 are identical, and together are referred to as the ADS1625/6. ANALOG INPUTS (AINP, AINN) The ADS1625/6 measures the differential signal, VIN = (AINP − AINN), against the differential reference, VREF = (VREFP – VREFN). The reference is scaled internally so that the full-scale differential input voltage is 1.467VREF. That is, the most positive measurable differential input is 1.467VREF, which produces the most VREFP VREFN positive digital output code of 7FFFh. Likewise, the most negative measurable differential input is –1.467VREF, which produces the most negative digital output code of 8000h. The ADS1625/6 supports a very wide range of input signals. For VREF = 3V, the full scale input voltages are ±4.4V. Having such a wide input range makes out-of-range signals unlikely. However, should an out-of-range signal occur, digital output OTR will go high. To achieve the highest analog performance, it is recommended that the inputs be limited to ±1.165VREF (−2dBFS). For VREF = 3V, the corresponding recommended input range is ±3.78V. The analog inputs must be driven with a differential signal to achieve optimum performance. The recommended common-mode voltage of the input signal, V CM + AINP ) AINN, is 2.0V. For signals larger than 2 −2dBFS, the input common-mode voltage needs to be raised in order to meet the absolute input voltage specifications. The Typical Characteristics show how performance varies with input common-mode voltage. In addition to the differential and common-mode input voltages, the absolute input voltage is also important. This is the voltage on either input (AINP or AINN) with respect to AGND. The range for this voltage is: −0.1V < (AINN or AINP) < 4.6V. If either input is taken below –0.1V, ESD protection diodes on the inputs will turn on. Exceeding 4.6V on either input will result in degradation in the linearity performance. ESD protection diodes will also turn on if the inputs are taken above AVDD (+5V). For signals below –2dBFS, the recommended absolute input voltage is: 0.1V < (AINN or AINP) < 4.2V Keeping the inputs within this range provides for optimum performance. IOVDD Σ VREF 1.467 1.467VREF OTR AINP AINN Σ VIN Σ∆ Modulator Digital Filter Parallel Interface ADS1626 Only FIFO DOUT[17:0] FIFO_LEV[2:0] Figure 7. Conceptual Block Diagram 17 www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 INPUT CIRCUITRY The ADS1625/6 uses switched-capacitor circuitry to measure the input voltage. Internal capacitors are charged by the inputs and then discharged internally with this cycle repeating at the frequency of CLK. Figure 8 shows a conceptual diagram of these circuits. Switches S2 represent the net effect of the modulator circuitry in discharging the sampling capacitors, the actual implementation is different. The timing for switches S1 and S2 is shown in Figure 9. S1 ADS1625 ADS1626 AINP input to AGND, improve linearity and should be placed as close to the pins as possible. Place the drivers close to the inputs and use good capacitor bypass techniques on their supplies; usually a smaller high-quality ceramic capacitor in parallel with a larger capacitor. Keep the resistances used in the driver circuits low—thermal noise in the driver circuits degrades the overall noise performance. When the signal can be ac-coupled to the ADS1625/6 inputs, a simple RC filter can set the input common-mode voltage. The ADS1625/6 is a high-speed, high-performance ADC. Special care must be taken when selecting the test equipment and setup used with this device. Pay particular attention to the signal sources to ensure they do not limit performance when measuring the ADS1625/6. S2 10pF 8pF 392Ω VMID − S1 V IN 392Ω 40pF 392Ω OPA2822 2 0.01µ F AINN S2 10pF 8pF VCM (1) AINP 100pF 392Ω 1µ F 1kΩ (2 ) 392Ω VMID V CM (1 ) AGND VIN Figure 8. Conceptual Diagram of Internal Circuitry Connected to the Analog Inputs 49.9Ω (2) 392Ω 40pF 392Ω OPA2822 100pF(3) AD S162 5 AD S162 6 (2 ) 1kΩ 2 0.01µ F 49.9Ω AINN (2) V CM (1 ) 100pF 392Ω 1µ F AGND t SAMPLE = 1/f CLK (1) Recommended VC M = 2.0V. (2) Optional ac−coupling circuit provides common−mode input voltage. (3) Increase to 390pF when f IN ≤ 100kHz for improved SNR and THD. On S1 Off On S2 Off Figure 10. Recommended Driver Circuit Using the OPA2822 Figure 9. Timing for the Switches in Figure 2 22pF 24.9Ω AINP DRIVING THE INPUTS 392Ω 392Ω The external circuits driving the ADS1625/6 inputs must be able to handle the load presented by the switching capacitors within the ADS1625/6. Input switches S1 in Figure 9 are closed approximately of the sampling period, tsample, allowing only ≈12ns for the internal capacitors to be charged by the inputs, when fCLK = 40MHz. Figure 10 and Figure 11 show the recommended circuits when using single-ended or differential op amps, respectively. The analog inputs must be driven differentially to achieve optimum performance. The external capacitors, between the inputs and from each 18 100pF −VIN VCM ADS1625 THS4503 100pF +VIN 392Ω 392Ω ADS1626 24.9Ω AINN 100pF 22pF Figure 11. Recommended Driver Circuits Using the THS4503 Differential Amplifier www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 REFERENCE INPUTS (VREFN, VREFP, VMID) The ADS1625 can operate from an internal or external voltage reference. In either case, reference voltage VREF is set by the differential voltage between VREFN and VREFP: VREF = (VREFP – VREFN). VREFP and VREFN each use two pins, which should be shorted together. VMID equals approximately 2.5V and is used by the modulator. VCAP connects to an internal node, and must also be bypassed with an external capacitor. For the best analog performance, it is recommended that an external reference voltage (VREF) of 3.0V be used. and VREFN = 1V. The external circuitry must be capable of providing both a dc and a transient current. Figure 13 shows a simplified diagram of the internal circuitry of the reference when the internal reference is disabled. As with the input circuitry, switches S1 and S2 open and close as shown in Figure 9. ADS1625 ADS1626 S1 VREFP VREFP To use the internal reference, set the REFEN pin low. This activates the internal circuitry that generates the reference voltages. The internal reference voltages are applied to the pins. Good bypassing of the reference pins is critical to achieve optimum performance and is done by placing the bypass capacitors as close to the pins as possible. Figure 12 shows the recommended bypass capacitor values. Use high quality ceramic capacitors for the smaller values. Avoid loading the internal reference with external circuitry. If the ADS1625/6 internal reference is to be used by other circuitry, buffer the reference voltages to prevent directly loading the reference pins. ADS1625 ADS1626 10µF 0.1µF VREFN VREFN 50pF S1 Figure 13. Conceptual Internal Circuitry for the Reference When REFEN = High Figure 14 shows the recommended circuitry for driving these reference inputs. Keep the resistances used in the buffer circuits low to prevent excessive thermal noise from degrading performance. Layout of these circuits is critical; make sure to follow good high-speed layout practices. Place the buffers, and especially the bypass capacitors, as close to the pins as possible. VCAP is unaffected by the setting on REFEN and must be bypassed when using the internal or an external reference. VREFP VREFP 392Ω 22µF 22µF S2 300Ω INTERNAL REFERENCE (REFEN = LOW) 0.001µ F ADS1625 ADS1626 VMID 0.1µF 10µF 0.1µF VREFP VREFP OPA2822 10µ F 4V 22µF 0.1µ F 392Ω VREFN VREFN 10µF 0.001µ F 22 µ F 22 µ F 0.1 µ F 0.1µF VCAP 0.1µF VMID OPA2822 10 µ F 2.5V 0.1µ F 392Ω AGND 22 µ F 0.001 µ F Figure 12. Reference Bypassing When Using the Internal Reference VREFN VREFN OPA2822 1V 10 µ F 0.1µ F EXTERNAL REFERENCE (REFEN = HIGH) To use an external reference, set the REFEN pin high. This deactivates the internal generators for VREFP, VREFN and VMID, and saves approximately 25mA of current on the analog supply (AVDD). The voltages applied to these pins must be within the values specified in the Electrical Characteristics table. Typically VREFP = 4V, VMID = 2.5V VCAP 0.1µ F AGND Figure 14. Recommended Buffer Circuit When Using an External Reference 19 www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 CLOCK INPUT (CLK) Table 2. Output Code Versus Input Signal The ADS1625/6 requires an external clock signal to be applied to the CLK input pin. The sampling of the modulator is controlled by this clock signal. As with any high-speed data converter, a high quality clock is essential for optimum performance. Crystal clock oscillators are the recommended CLK source; other sources, such as frequency synthesizers, are usually not adequate. Make sure to avoid excess ringing on the CLK input; keeping the trace as short as possible will help. Measuring high-frequency, large-amplitude signals requires tight control of clock jitter. The uncertainty during sampling of the input from clock jitter limits the maximum achievable SNR. This effect becomes more pronounced with higher frequency and larger magnitude inputs. Fortunately, the ADS1625/6 oversampling topology reduces clock jitter sensitivity over that of Nyquist rate converters like pipeline and successive approximation converters by a factor of √32. In order to not limit the ADS1625/6 SNR performance, keep the jitter on the clock source below the values shown in Table 1. When measuring lower frequency and lower amplitude inputs, more CLK jitter can be tolerated. In determining the allowable clock source jitter, select the worst-case input (highest frequency, largest amplitude) that will be seen in the application. INPUT SIGNAL (INP – INN) IDEAL OUTPUT CODE(1) OTR ≥ +1.467VREF (> 0dB)(2) 1FFFFh 1 ≥ +1.467VREF (0dB) 1FF57h 0 +1.467V REF 00001h 0 2 17 * 1 0 00000h 0 −1.467V REF 3FFFFh 0 ǒ2 2 * 1 Ǔ 200A8h 0 ǒ2 2 * 1Ǔ (2) 20000h 1 2 17 *1 v −1.467V REF v −1.467V REF 17 17 17 17 (1) Excludes effects of noise, INL, offset and gain errors. (2) Large step inputs. OUT-OF-RANGE INDICATION (OTR) If the output code on DOUT[17:0] exceeds the positive or negative full-scale, the out-of-range digital output OTR will go high on the falling edge of DRDY. When the output code returns within the full-scale range, OTR returns low on the falling edge of DRDY. DATA RETRIEVAL Table 1. Maximum Allowable Clock Source Jitter for Different Input Signal Frequencies and Amplitude MAXIMUM FREQUENCY MAXIMUM AMPLITUDE MAXIMUM ALLOWABLE CLOCK SOURCE JITTER (RMS) 500kHz −2dB 7ps 500kHz −20dB 50ps 100kHz −2dB 35ps 100kHz −20dB 285ps INPUT SIGNAL Data retrieval is controlled through a simple parallel interface. The falling edge of the DRDY output indicates new data are available. To activate the output bus, both CS and RD must be low, as shown in Table 3. On the ADS1625, both of these signals can be tied low. On the ADS1626 with FIFO enabled, only CS can be tied low because RD must toggle to operate the FIFO. See the FIFO section for more details. Make sure the DOUT bus does not drive heavy loads (> 20pF), as this will degrade performance. Use an external buffer when driving an edge connector or cables. Table 3. Truth Table for CS and RD DATA FORMAT The 18-bit output data is in binary two’s complement format, as shown in Table 2. Under normal operation, the output codes range between 200A8h to 1FF57h. Signals less than −1.467VREF will clip at 200A8h and likewise, signals greater than 1.467VREF will clip at 1FF57h. For large step changes on the inputs, the output clips at the positive full-scale value of 1FFFFh (positive transients) or the negative full-scale value of 20000h (negative transients). 20 CS RD DOUT[17:0] 0 0 Active 0 1 High impedance 1 0 High impedance 1 1 High impedance www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 RESETTING THE ADS1625 RESETTING THE ADS1626 The ADS1625 and ADS1626 with FIFO disabled are asynchronously reset when the RESET pin is taken low. During reset, all of the digital circuits are cleared, DOUT[17:0] are forced low, and DRDY forced high. It is recommended that the RESET pin be released on the falling edge of CLK. Afterwards, DRDY goes low on the second rising edge of CLK. Allow 46 DRDY cycles for the digital filter to settle before retrieving data. See Figure 3 for the timing specifications. The ADS1626 with the FIFO enabled requires a different reset sequence than the ADS1625, as shown in Figure 16. Ignore any DRDY toggles that occur while RESET is low. Release RESET on the rising edge of CLK, then afterwards toggle RD to complete the reset sequence. Reset can be used to synchronize multiple ADS1625s. All devices to be synchronized must use a common CLK input. With the CLK inputs running, pulse RESET on the falling edge of CLK, as shown in Figure 15. Afterwards, the converters will be converting synchronously with the DRDY outputs updating simultaneously. After synchronization, allow 46 DRDY cycles (t12) for output data to fully settle. Clock RESET CLK DRDY DOUT[17:0] DRDY1 DOUT[17:0]1 ADS16252 RESET CLK DRDY DOUT[17:0] Ignore t26 DRDY RD Toggle RD to complete reset sequence After resetting, the settling time for the ADS1626 is 46 CLK cycles, regardless of the FIFO level. Therefore, for higher FIFO levels, it takes fewer DRDY cycles to settle because the DRDY period is longer. Table 4 shows the number of DRDY cycles required to settle for each FIFO level. DRDY2 DOUT[17:0]2 CLK RESET RESET Figure 16. Resetting the ADS1626 with the FIFO Enabled ADS16251 RESET CLK t12 DRDY1 Settled Data DOUT[17:0]1 Table 4. ADS1626 Reset Settling FIFO LEVEL FILTER SETTLING TIME AFTER RESET (t26 in units of DRDY cycles ) 2 23 4 12 6 8 8 6 10 5 12 4 14 4 DRDY2 Settled Data DOUT[17:0]2 Synchronized Figure 15. Synchronizing Multiple Converters 21 www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 SETTLING TIME IMPULSE RESPONSE The settling time is an important consideration when measuring signals with large steps or when using a multiplexer in front of the analog inputs. The ADS1625/6 digital filter requires time for an instantaneous change in signal level to propagate to the output. Figure 18 plots the normalized response for an input applied at t = 0. The X-axis units of time are DRDY cycles. As shown in Figure 18, the peak of the impulse takes 26 DRDY cycles to propagate to the output. For fCLK = 40MHz, a DRDY cycle is 0.8µs in duration and the propagation time (or group delay) is 26 × 0.8µs = 20.8µs. Figure 17 shows the settling error as a function of time for a full-scale signal step applied at t = 0. This figure uses DRDY cycles for the time scale (X-axis). After 46 DRDY cycles, the settling error drops below 0.001%. For fCLK = 40MHz, this corresponds to a settling time of 36.8µs. 101 Settling Error (%) 0.8 0.6 0.4 0.2 0 −0.2 −0.4 100 0 10 20 30 40 Time (DRDY cycles) 10−1 Figure 18. Impulse Response 10−2 10−3 10−4 25 30 35 40 Settling Time (DRDY cycles) Figure 17. Settling Time 22 1.0 Normalized Response Be sure to allow the filter time to settle after applying a large step in the input signal, switching the channel on a multiplexer placed in front of the inputs, resetting the ADS1625/6, or exiting the power-down mode. 45 50 50 60 www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 FREQUENCY RESPONSE 0.0025 0.0015 0.0010 0.0005 0 −0.0005 −0.0010 Figure 20 shows the passband ripple from dc to 550kHz (fCLK = 40MHz). Figure 21 shows a closer view of the passband transition by plotting the response from 500kHz to 640kHz (fCLK = 40MHz). 20 −0.0015 −0.0020 −0.0025 0 300 400 500 600 1 0 −1 −2 −3 −4 fC LK = 40MHz −5 −20 Magnitude (dB) 200 Figure 20. Passband Ripple f CLK = 40MHz 0 100 Frequency (kHz) Magnitude (dB) The overall frequency response repeats at multiples of the CLK frequency. To help illustrate this, Figure 22 shows the response out to 120MHz (fCLK = 40MHz). Notice how the passband response repeats at 40MHz, 80MHz and 120MHz; it is important to consider this when there is high-frequency noise present with the signal. The modulator bandwidth extends to 100MHz. High-frequency noise around 40MHz and 80MHz will not be attenuated by either the modulator or the digital filter. This noise will alias back in-band and reduce the overall SNR performance unless it is filtered out prior to the ADS1625/6. To prevent this, place an anti-alias filter in front of the ADS1625/6 that rolls off before 39MHz. fCLK = 40MHz 0.0020 Magnitude (dB) The linear phase FIR digital filter sets the overall frequency response. Figure 19 shows the frequency response from dc to 20MHz for fCLK = 40MHz. The frequency response of the ADS1625/6 filter scales directly with CLK frequency. For example, if the CLK frequency is decreased by half (to 20MHz), the values on the X-axis in Figure 19 would need to be scaled by half, with the span becoming dc to 10MHz. −6 −40 500 520 540 560 580 600 620 640 Frequency (kHz) −60 −80 Figure 21. Passband Transition −100 −120 −140 2 4 6 8 10 12 14 16 18 20 20 Frequency (MHz) Figure 19. Frequency Response. fCL K = 40MHz 0 −20 Magnitude (dB) 0 −40 −60 −80 −100 −120 −140 0 20 40 60 80 100 120 Frequency (MHz) Figure 22. Frequency Response Out to 120MHz 23 www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 FIFO (ADS1626 ONLY) The ADS1626 includes an adjustable level first-in first-out buffer (FIFO) for the output data. The FIFO allows data to be temporarily stored within the ADS1626 to provide more flexibility for the host controller when retrieving data. Pins FIFO_LEV[2:0] set the level or depth of the FIFO. Note that these pins must be left unconnected on the ADS1625. The FIFO is enabled by setting at least one of the FIFO_LEV inputs high. Table 5 shows the corresponding FIFO level and DRDY period for the different combinations of FIFO_LEV[2:0] settings. For the best performance when using the FIFO, it is recommended to: 1. 2. 3. 4. Set IOVDD = 3V. Synchronize data retrieval with CLK. Minimize loading on outputs DOUT[17:0]. Ensure rise and fall times on CLK and RD are 1ns or longer. Table 5. FIFO Buffer Level Settings for the ADS1626 FIFO_LEV[2:0] FIFO BUFFER LEVEL DRDY PERIOD 000 0: disabled, operates like ADS1625 32/fCLK 001 2 010 4 64/fCLK 128/fCLK 011 6 192/fCLK 256/fCLK 100 8 101 10 110 12 320/fCLK 384/fCLK 111 14 448/fCLK FIFO Operation The ADS1626 FIFO collects the number of output readings set by the level corresponding to the FIFO_LEV[2:0] setting. When the specified level is reached, DRDY is pulsed high, indicating the data in the FIFO are ready to be read. The DRDY period is a function of the FIFO level, as shown in Table 5. To read the data, make sure CS is low (it is acceptable to tie it low) and then take RD low. The first, or oldest, data will be presented on the data output pins. After reading this data, advance to the next data reading by toggling RD. On the next falling edge 24 of RD, the second data are present on the data output pins. Continue this way until all the data have been read from the FIFO, making sure to take RD high when complete. Afterwards, wait until DRDY toggles and repeat the readback cycle. Figure 23 shows an example readback when FIFO_LEV[2:0] = 010 (level = 4). Readback considerations The exact number of data readings set by the FIFO level must be read back each time DRDY toggles. The one exception is that readback can be skipped entirely. In this case, the DRDY period increases to 512 CLK period. Figure 24 illustrates an example when readback is skipped with the FIFO level = 4. Do not read back more or less readings from the FIFO than set by the level. This interrupts the FIFO operation and can cause DRDY to stay low indefinitely. If this occurs, the RESET pin must be toggled followed by a RD pulse. This resets the ADS1626 FIFO and also the digital filter, which must settle afterwards before valid data is ready. See the section, Resetting the ADS1626, for more details. Also note that the RD signal is independent of the CS signal. Therefore, when multiple devices are used, the RD signal should not be shared. Alternatively, individual RD signals can be generated by performing an OR operation with the CS signal. Setting the FIFO Level The FIFO level setting is usually a static selection that is set when power is first applied to the ADS1626. If the FIFO level needs to be changed after powerup, there are two options. One is to asynchronously set the new value on pin FIFO_LEV[2:0] then toggle RESET. Remember that the ADS1626 will need to settle after resetting. See the section, Resetting the ADS1626, for more details. The other option avoids requiring a reset, but needs synchronization of the FIFO level change with the readback. The FIFO_LEV[2:0] pins have to be changed after RD goes high after reading the first data, but before RD goes low to read the last data from the FIFO. The new FIFO level becomes active immediately and the DRDY period adjusts accordingly. When decreasing the FIFO level this way, make sure to give adequate time for readback of the data before setting the new, smaller level. Figure 25 illustrates an example of a synchronized FIFO level change from 4 to 8. www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 DRDY CS(1) RD Data1(2) DOUT[17:0] Data2 Data3 Data4 (1) CS can be tied low. (2) Data1 are the oldest data and Data4 are the most recent. Figure 23. Example of FIFO Readback when FIFO Level = 4 128/fCLK 512/fCLK DRDY RD Figure 24. Example of Skipping Readback when FIFO Level = 4 128/fCLK 256/fCLK DRDY RD FIFO_LEV[2:0] 010 (Level = 4) 100 (Level = 8) Change FIFO_LEV[2:0] here Figure 25. Example of Synchronized Change of FIFO Level from 4 to 8 25 www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 ANALOG POWER DISSIPATION POWER DOWN (PD) An external resistor connected between the RBIAS pin and the analog ground sets the analog current level, as shown in Figure 26. The current is inversely proportional to the resistor value. Table 6 shows the recommended values of RBIAS for different CLK frequencies. Notice that the analog current can be reduced when using a slower frequency CLK input, because the modulator has more time to settle. Avoid adding any capacitance in parallel to RBIAS, since this will interfere with the internal circuitry used to set the biasing. When not in use, the ADS1625/6 can be powered down by taking the PD pin low. All circuitry will be shutdown, including the voltage reference. To minimize the digital current during power down, stop the clock signal supplied to the CLK input. There is an internal pull-up resistor of 170kΩ on the PD pin, but it is recommended that this pin be connected to IOVDD if not used. If using the ADS1626 with the FIFO enabled, issue a reset after exiting the power-down mode. Make sure to allow time for the reference to start up after exiting power-down mode. The internal reference typically requires 15ms. After the reference has stabilized, allow at least 100 DRDY cycles for the modulator and digital filter to settle before retrieving data. ADS1625 ADS1626 POWER SUPPLIES RBIAS RBIAS AGND Figure 26. External Resistor Used to Set Analog Power Dissipation Table 6. Recommended RBIAS Resistor Values for Different CLK Frequencies fCLK DATA RATE RBIAS TYPICAL POWER DISSIPATION WITH REFEN HIGH 10MHz 312.5kHz 65kΩ 150mW 20MHz 625kHz 60kΩ 305mW 30MHz 937.5kHz 50kΩ 390mW 40MHz 1.25MHz 37kΩ 515mW 26 Three supplies are used on the ADS1625/6: analog (AVDD), digital (DVDD) and digital I/O (IOVDD). Each supply must be suitably bypassed to achieve the best performance. It is recommended that a 1µF and 0.1µF ceramic capacitor be placed as close to each supply pin as possible. Connect each supply-pin bypass capacitor to the associated ground, see Figure 27. Each main supply bus should also be bypassed with a bank of capacitors from 47µF to 0.1µF, as shown. The IO and digital supplies (IOVDD and DVDD) can be connected together when using the same voltage. In this case, only one bank of 47µF to 0.1µF capacitors is needed on the main supply bus, though each supply pin must still be bypassed with a 1µF and 0.1µF ceramic capacitor. www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 DVDD 47µF 4.7µF 1µF 0.1µF 47µF 4.7µF 1µF 0.1µF 47µF 4.7µF 1µF 0.1µF IOVDD 53 52 51 DGND CP DVDD 54 DGND AVDD 55 AGND 2 57 AGND AGND 58 AVDD 1 CP IOVDD CP AVDD CP If using separate analog and digital ground planes, connect together on the ADS1625/6 PCB. 3 6 AGND 7 AVDD 9 AGND CP AGND NOTE: CP = 1µF | | 0.1µF ADS1625 ADS1626 CP 10 AVDD 11 AGND CP 12 AVDD 18 CP 19 25 DVDD DGND 15 DGND DGND 14 IOVDD CP DVDD DGND 26 CP Figure 27. Recommended Power-Supply Bypassing 27 www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 LAYOUT ISSUES APPLICATIONS The ADS1625/6 is a very high-speed, high-resolution data converter. In order to achieve the maximum performance, careful attention must be given to the printed circuit board (PCB) layout. Use good high-speed techniques for all circuitry. Critical capacitors should be placed close to pins as possible. These include capacitors directly connected to the analog and reference inputs and the power supplies. Make sure to also properly bypass all circuitry driving the inputs and references. INTERFACING THE ADS1625 TO THE TMS320C6000 There are two possible approaches for the ground plane on the PCB: a single common plane or two separate planes, one for the analog grounds and one for the digital grounds. When using only one common plane, isolate the flow of current on pin 58 from pin 1; use breaks on the ground plane to accomplish this. Pin 58 carries the switching current from the analog clocking for the modulator and can corrupt the quiet analog ground on pin 1. When using two planes, it is recommended that they be tied together right at the PCB. Do not try to connect the ground planes together after running separately through edge connectors or cables as this reduces performance and increases the likelihood of latchup. In general, keep the resistances used in the driving circuits for the inputs and reference low to prevent excess thermal noise from degrading overall performance. Avoid having the ADS1625/6 digital outputs drive heavy loads. Buffers on the outputs are recommended unless the ADS1625/6 is connected directly to a DSP or controller situated nearby. Additionally, make sure the digital inputs are driven with clean signals as ringing on the inputs can introduce noise. The ADS1625/6 uses TI PowerPAD technology. The PowerPAD is physically connected to the substrate of the silicon inside the package and must be soldered to the analog ground plane on the PCB using the exposed metal pad underneath the package for proper heat dissipation. Please refer to application report SLMA002, located at www.ti.com, for more details on the PowerPAD package. Figure 28 illustrates how to directly connect the ADS1625 to the TMS320C6000 DSP. The processor controls reading using output ARE. The ADS1625 is selected using the DSP control output, CE2. The ADS1625 18-bit data output bus is directly connected to the TMS320C6000 data bus. The data ready output from the ADS1625, DRDY, drives interrupt EXT_INT7 on the TMS320C6000. ADS1625 TMS320C6000 18 DOUT[17:0] XD[17:0] DRDY EXT_INT7 CS CE2 RD ARE Figure 28. ADS1625—TMS320C6000 Interface Connection INTERFACING THE ADS1626 TO THE TMS320C6000 Figure 29 illustrates how to directly connect the ADS1626 to the TMS320C6000 DSP. The processor controls reading using output ARE. The ADS1626 is permanently selected by grounding the CS pin. The ADS1626 18-bit data output bus is directly connected to the TMS320C6000 data bus. The data ready output from the ADS1626, DRDY, drives interrupt EXT_INT7 on the TMS320C6000. ADS1626 TMS320C6000 18 DOUT[17:0] DRDY XD[17:0] EXT_INT7 CS RD ARE Figure 29. ADS1626—TMS320C6000 Interface Connection 28 www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 INTERFACING THE ADS1625 TO THE TMS320VC5510 INTERFACING THE ADS1626 TO THE TMS320VC5510 Figure 30 illustrates how to connect the ADS1625 to the TMS320VC5510 DSP. The DSP controls reading using output ARE. The ADS1625 is selected using the DSP control output CE2. The ADS1625 18-bit data output bus is directly connected to the TMS320VC5510 data bus. The data ready output from the ADS1625, DRDY, drives the INT3 interrupt line on the TMS320VC5510. Figure 31 illustrates how to directly connect the ADS1626 to the TMS320VC5510 Digital Signal Processor. The processor controls reading the ADC using the ARE output. The ADS1626 is permanently selected by grounding the CS pin. If there are any additional devices connected to the TMS320VC5510 I/O space, address decode logic will be required between the ADC and the DSP to prevent data bus contention and ensure that only one device at a time is selected. The ADS1626 18-bit data output bus is directly connected to the TMS320VC5510. The data ready output from the ADS1626, DRDY, drives interrupt INT3 on the TMS320VC5510. ADS1625 TMS320VC5510 18 DOUT[17:0] D[17:0] DRDY INT3 CS CE2 RD ARE ADS1626 TMS320VC5510 18 DOUT[17:0] DRDY D[17:0] INT3 CS Figure 30. ADS1625—TMS320VC5510 Interface Connection RD ARE Figure 31. ADS1626—TMS320VC5510 Interface Connection Code Composer Studio, available from TI, provides support for interfacing TI DSPs through a collection of data converter plugins. Check the TI web site, located at www.ti.com/sc/dcplug-in, for the latest information on ADS1625/6 support. 29 www.ti.com SBAS280E − JUNE 2003 − REVISED MAY 2007 Revision History DATE REV PAGE SECTION 5/16/07 E 24 Readback Considerations DESCRIPTION Added last three sentences. NOTE: Page numbers for previous revisions may differ from page numbers in the current version. 30 PACKAGE OPTION ADDENDUM www.ti.com 16-May-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty ADS1625IPAPR ACTIVE HTQFP PAP 64 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS1625IPAPRG4 ACTIVE HTQFP PAP 64 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS1625IPAPT ACTIVE HTQFP PAP 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS1625IPAPTG4 ACTIVE HTQFP PAP 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS1626IPAPR ACTIVE HTQFP PAP 64 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS1626IPAPRG4 ACTIVE HTQFP PAP 64 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS1626IPAPT ACTIVE HTQFP PAP 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS1626IPAPTG4 ACTIVE HTQFP PAP 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 22-Sep-2007 TAPE AND REEL BOX INFORMATION Device Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant ADS1625IPAPR PAP 64 SITE 60 330 24 13.0 13.0 1.4 16 24 Q2 ADS1625IPAPT PAP 64 SITE 60 330 24 13.0 13.0 1.4 16 24 Q2 ADS1626IPAPR PAP 64 SITE 60 330 24 13.0 13.0 1.4 16 24 Q2 ADS1626IPAPT PAP 64 SITE 60 330 24 13.0 13.0 1.4 16 24 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 22-Sep-2007 Device Package Pins Site Length (mm) Width (mm) Height (mm) ADS1625IPAPR PAP 64 SITE 60 0.0 0.0 0.0 ADS1625IPAPT PAP 64 SITE 60 0.0 0.0 0.0 ADS1626IPAPR PAP 64 SITE 60 0.0 0.0 0.0 ADS1626IPAPT PAP 64 SITE 60 0.0 0.0 0.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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