SPANSION S25FL064P0XBHIS30

S25FL064P
64-Mbit CMOS 3.0 Volt Flash Memory
with 104-MHz SPI (Serial Peripheral Interface) Multi I/O Bus
Data Sheet
S25FL064P Cover Sheet
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.
Publication Number S25FL064P_00
Revision 08
Issue Date January 29, 2013
D a t a
S h e e t
Notice On Data Sheet Designations
Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of
product information or intended specifications throughout the product life cycle, including development,
qualification, initial production, and full production. In all cases, however, readers are encouraged to verify
that they have the latest information before finalizing their design. The following descriptions of Spansion data
sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion Inc. is developing one or more specific
products, but has not committed any design to production. Information presented in a document with this
designation is likely to change, and in some cases, development on the product may discontinue. Spansion
Inc. therefore places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion Inc.
The information is intended to help you evaluate this product. Do not design in this product without
contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed
product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment
to production has taken place. This designation covers several aspects of the product life cycle, including
product qualification, initial production, and the subsequent phases in the manufacturing process that occur
before full production is achieved. Changes to the technical specifications presented in a Preliminary
document should be expected while keeping these aspects of production under consideration. Spansion
places the following conditions upon Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. The Preliminary status of this document indicates that product qualification has been
completed, and that initial production has begun. Due to the phases of the manufacturing process that
require maintaining efficiency and quality, this document may be revised by subsequent versions or
modifications due to changes in technical specifications.”
Combination
Some data sheets contain a combination of products with different designations (Advance Information,
Preliminary, or Full Production). This type of document distinguishes these products and their designations
wherever necessary, typically on the first page, the ordering information page, and pages with the DC
Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first
page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes
are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include
those affecting the number of ordering part numbers available, such as the addition or deletion of a speed
option, temperature range, package type, or VIO range. Changes may also include those needed to clarify a
description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following
conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. Spansion Inc. deems the products to have been in sufficient production volume such
that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local sales office.
2
S25FL064P
S25FL064P_00_08 January 29, 2013
S25FL064P
64-Mbit CMOS 3.0 Volt Flash Memory
with 104-MHz SPI (Serial Peripheral Interface) Multi I/O Bus
Data Sheet
Distinctive Characteristics
Architectural Advantages
 Single power supply operation
– Full voltage range: 2.7 to 3.6V read and write operations
 Memory architecture
– Uniform 64 kB sectors
– Top or bottom parameter block (Two 64-kB sectors (top or
bottom) broken down into sixteen 4-kB sub-sectors each)
– 256-byte page size
– Backward compatible with the S25FL064A device
 Program
–
–
–
–
Page Program (up to 256 bytes) in 1.5 ms (typical)
Program operations are on a page by page basis
Accelerated programming mode via 9V W#/ACC pin
Quad Page Programming
 Erase
–
–
–
–
Bulk erase function
Sector erase (SE) command (D8h) for 64 kB sectors
Sub-sector erase (P4E) command (20h) for 4 kB sectors
Sub-sector erase (P8E) command (40h) for 8 kB sectors
 Cycling endurance
– 100,000 cycles per sector typical
 Data retention
 Process technology
– Manufactured on 0.09 µm MirrorBit® process technology
 Package option
–
–
–
–
–
Industry Standard Pinouts
16-pin SO package (300 mils)
8-contact WSON package (6 x 8 mm)
24-ball BGA package (6 x 8 mm), 5 x 5 pin configuration
24-ball BGA package (6 x 8 mm), 6 x 4 pin configuration
Performance Characteristics
 Speed
– Normal READ (Serial): 40 MHz clock rate
– FAST_READ (Serial): 104 MHz clock rate (maximum)
– DUAL I/O FAST_READ: 80 MHz clock rate or
20 MB/s effective data rate
– QUAD I/O FAST_READ: 80 MHz clock rate or
40 MB/s effective data rate
 Power saving standby mode
– Standby Mode 80 µA (typical)
– Deep Power-Down Mode 3 µA (typical)
Memory Protection Features
 Memory protection
– 20 years typical
 Device ID
– JEDEC standard two-byte electronic signature
– RES command one-byte electronic signature for backward
compatibility
 One time programmable (OTP) area for permanent, secure
identification; can be programmed and locked at the factory
or by the customer
– W#/ACC pin works in conjunction with Status Register Bits to
protect specified memory areas
– Status Register Block Protection bits (BP2, BP1, BP0) in status
register configure parts of memory as read-only
Software Features
– SPI Bus Compatible Serial Interface
 CFI (Common Flash Interface) compliant: allows host system
to identify and accommodate multiple flash devices
Publication Number S25FL064P_00
Revision 08
Issue Date January 29, 2013
D a t a
S h e e t
General Description
The S25FL064P is a 3.0 Volt (2.7V to 3.6V), single-power-supply flash memory device. The device consists
of 128 uniform 64 kB sectors with the two (Top or Bottom) 64 kB sectors further split up into thirty-two 4 kB
sub sectors. The S25FL064P device is fully backward compatible with the S25FL064A device.
The device accepts data written to SI (Serial Input) and outputs data on SO (Serial Output). The devices are
designed to be programmed in-system with the standard system 3.0-volt VCC supply.
The S25FL064P device adds the following high-performance features using 5 new instructions:
 Dual Output Read using both SI and SO pins as output pins at a clock rate of up to 80 MHz
 Quad Output Read using SI, SO, W#/ACC and HOLD# pins as output pins at a clock rate of up to 80 MHz
 Dual I/O High Performance Read using both SI and SO pins as input and output pins at a clock rate of up
to 80 MHz
 Quad I/O High Performance Read using SI, SO, W#/ACC and HOLD# pins as input and output pins at a
clock rate of up to 80 MHz
 Quad Page Programming using SI, SO, W#/ACC and HOLD# pins as input pins to program data at a clock
rate of up to 80 MHz
The memory can be programmed 1 to 256 bytes at a time, using the Page Program command. The device
supports Sector Erase and Bulk Erase commands.
Each device requires only a 3.0-volt power supply (2.7V to 3.6V) for both read and write functions. Internally
generated and regulated voltages are provided for the program operations. This device requires a high
voltage supply to the W#/ACC pin to enable the Accelerated Programming mode.
The S25FL064P device also offers a One-Time Programmable area (OTP) of up to 128-bits (16 bytes) for
permanent secure identification and an additional 490 bytes of OTP space for other use. This OTP area can
be programmed or read using the OTPP or OTPR instructions.
4
S25FL064P
S25FL064P_00_08 January 29, 2013
D a t a
S h e e t
Table of Contents
Distinctive Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.
Input/Output Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.1
Valid Combinations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.
Spansion SPI Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
7.
Device Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.1
Byte or Page Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.2
Quad Page Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.3
Dual and Quad I/O Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.4
Sector Erase / Bulk Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.5
Monitoring Write Operations Using the Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.6
Active Power and Standby Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.7
Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.8
Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.9
Data Protection Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.10 Hold Mode (HOLD#) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.11 Accelerated Programming Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8.
Sector Address Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
9.
Command Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.1
Read Data Bytes (READ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.2
Read Data Bytes at Higher Speed (FAST_READ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.3
Dual Output Read Mode (DOR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.4
Quad Output Read Mode (QOR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.5
DUAL I/O High Performance Read Mode (DIOR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.6
Quad I/O High Performance Read Mode (QIOR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.7
Read Identification (RDID) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.8
Read-ID (READ_ID). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.9
Write Enable (WREN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.10 Write Disable (WRDI). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.11 Read Status Register (RDSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.12 Read Configuration Register (RCR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.13 Write Registers (WRR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.14 Page Program (PP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.15 QUAD Page Program (QPP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.16 Parameter Sector Erase (P4E, P8E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.17 Sector Erase (SE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.18 Bulk Erase (BE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.19 Deep Power-Down (DP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.20 Release from Deep Power-Down (RES) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.21 Clear Status Register (CLSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.22 OTP Program (OTPP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.23 Read OTP Data Bytes (OTPR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
23
24
25
26
27
28
29
31
35
36
36
37
38
39
41
42
43
44
45
46
47
48
49
49
10.
OTP Regions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10.1 Programming OTP Address Space . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10.2 Reading OTP Data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10.3 Locking OTP Regions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
50
50
50
50
11.
Power-up and Power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
12.
Initial Delivery State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
January 29, 2013 S25FL064P_00_08
S25FL064P
15
15
15
15
15
15
15
16
16
18
19
20
5
D a t a
6
S h e e t
13.
Program Acceleration via W#/ACC Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
14.
Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
14.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
15.
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
16.
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
17.
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
18.
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
18.1 Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
19.
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
19.1 SO3 016 — 16-pin Wide Plastic Small Outline Package (300-mil Body Width) . . . . . . . . . .
19.2 WNF 008 — WSON 8-contact (6 x 8 mm) No-Lead Package . . . . . . . . . . . . . . . . . . . . . . . .
19.3 FAB024 — 24-ball Ball Grid Array (6 x 8 mm) package . . . . . . . . . . . . . . . . . . . . . . . . . . . .
19.4 FAC024 — 24-ball Ball Grid Array (6 x 8 mm) package . . . . . . . . . . . . . . . . . . . . . . . . . . . .
20.
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
S25FL064P
61
61
62
63
64
S25FL064P_00_08 January 29, 2013
D a t a
S h e e t
Figures
Figure 2.1
Figure 2.2
Figure 2.3
Figure 2.4
Figure 6.1
Figure 6.2
Figure 7.1
Figure 9.1
Figure 9.2
Figure 9.3
Figure 9.4
Figure 9.5
Figure 9.6
Figure 9.7
Figure 9.8
Figure 9.9
Figure 9.10
Figure 9.11
Figure 9.12
Figure 9.13
Figure 9.14
Figure 9.15
Figure 9.16
Figure 9.17
Figure 9.18
Figure 9.19
Figure 9.20
Figure 9.21
Figure 9.22
Figure 9.23
Figure 9.24
Figure 9.25
Figure 9.26
Figure 9.27
Figure 10.1
Figure 10.2
Figure 11.1
Figure 11.2
Figure 13.1
Figure 14.1
Figure 14.2
Figure 17.1
Figure 18.1
Figure 18.2
Figure 18.3
Figure 18.4
Figure 18.5
16-pin Plastic Small Outline Package (SO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
8-contact WSON Package (6 x 8 mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6 x 8 mm 24-ball BGA Package, 5 x 5 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6x8 mm 24-ball BGA Package, 6x4 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Bus Master and Memory Devices on the SPI Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
SPI Modes Supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Hold Mode Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Read Data Bytes (READ) Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Read Data Bytes at Higher Speed (FAST_READ) Command Sequence . . . . . . . . . . . . . . . 25
Dual Output Read Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Quad Output Read Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
DUAL I/O High Performance Read Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Continuous Dual I/O High Performance Read Instruction Sequence . . . . . . . . . . . . . . . . . . 29
QUAD I/O High Performance Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Continuous QUAD I/O High Performance Instruction Sequence. . . . . . . . . . . . . . . . . . . . . . 30
Read Identification (RDID) Command Sequence and Data-Out Sequence . . . . . . . . . . . . . 31
Read-ID (RDID) Command Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Write Enable (WREN) Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Write Disable (WRDI) Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Read Status Register (RDSR) Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Read Configuration Register (RCR) Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . .38
Write Registers (WRR) Instruction Sequence – 8 data bits . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Write Registers (WRR) Instruction Sequence – 16 data bits . . . . . . . . . . . . . . . . . . . . . . . . . 40
Page Program (PP) Command Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
QUAD Page Program Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Parameter Sector Erase (P4E, P8E) Instruction Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . 43
Sector Erase (SE) Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Bulk Erase (BE) Command Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Deep Power-Down (DP) Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Release from Deep Power-Down (RES) Command Sequence . . . . . . . . . . . . . . . . . . . . . . . 47
Release from Deep Power-Down and RES Command Sequence . . . . . . . . . . . . . . . . . . . . 48
Clear Status Register (CLSR) Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
OTP Program Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Read OTP Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
OTP Memory Map - Part 1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
OTP Memory Map - Part 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Power-Up Timing Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Power-down and Voltage Drop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
ACC Program Acceleration Timing Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Maximum Negative Overshoot Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Maximum Positive Overshoot Waveform. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
AC Measurements I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
SPI Mode 0 (0,0) Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
SPI Mode 0 (0,0) Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
HOLD# Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Write Protect Setup and Hold Timing during WRR when SRWD = 1 . . . . . . . . . . . . . . . . . . 60
January 29, 2013 S25FL064P_00_08
S25FL064P
7
D a t a
S h e e t
Tables
Table 5.1
Table 7.1
Table 7.2
Table 7.3
Table 7.4
Table 8.1
Table 8.2
Table 9.1
Table 9.2
Table 9.3
Table 9.4
Table 9.5
Table 9.6
Table 9.7
Table 9.8
Table 9.9
Table 11.1
Table 13.1
Table 15.1
Table 16.1
Table 17.1
8
S25FL064P Valid Combinations Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Suggested Cross Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Configuration Register Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
TBPROT = 0 (Starts Protection from TOP of Array) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
TBPROT=1 (Starts Protection from BOTTOM of Array) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
S25FL064P Sector Address Table TBPARM=0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
S25FL064P Sector Address Table TBPARM=1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Instruction Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
Manufacturer & Device ID - RDID (JEDEC 9Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Product Group CFI Query Identification String . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Product Group CFI System Interface String . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Product Group CFI Device Geometry Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Product Group CFI Primary Vendor-Specific Extended Query . . . . . . . . . . . . . . . . . . . . . . . .34
READ_ID Data-Out Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
S25FL064P Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
Protection Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
Power-Up / Power-Down Voltage and Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
ACC Program Acceleration Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
DC Characteristics (CMOS Compatible) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56
Test Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57
S25FL064P
S25FL064P_00_08 January 29, 2013
D a t a
S h e e t
1. Block Diagram
SRAM
PS
X
D
E
C
Array - L
Array - R
Logic
RD
DATA PATH
January 29, 2013 S25FL064P_00_08
S25FL064P
W# / ACC / IO2
HOLD# / IO3
VCC
GND
SO / IO1
SI / IO0
SCK
CS#
IO
9
D a t a
S h e e t
2. Connection Diagrams
Figure 2.1 16-pin Plastic Small Outline Package (SO)
HOLD#/IO3
1
16
SCK
VCC
2
15
SI/IO0
DNC
3
14
DNC
DNC
4
13
DNC
DNC
5
12
DNC
DNC
6
11
DNC
CS#
7
10
GND
SO/IO1
8
9
W#/ACC/IO2
Note
DNC = Do Not Connect (Reserved for future use)
Figure 2.2 8-contact WSON Package (6 x 8 mm)
CS#
1
SO/IO1
2
8
VCC
7
HOLD#/IO3
WSON
W#/ACC/IO2
3
6
SCK
GND
4
5
SI/IO0
Note
There is an exposed central pad on the underside of the USON package. This should not be connected to any voltage or signal line on the
PCB. Connecting the central pad to GND (VSS) is possible, provided PCB routing ensures 0 mV difference between voltage at the USON
GND (VSS) lead and the central exposed pad.
Figure 2.3 6 x 8 mm 24-ball BGA Package, 5 x 5 Pin Configuration
1
2
3
4
5
NC
NC
NC
NC
NC
SCK
GND
VCC
NC
NC
CS#
NC
SO/IO1
NC
NC
A
B
C
NC W#/ACC/IO2 NC
D
SI/IO0 HOLD#/IO3
NC
E
10
S25FL064P
NC
NC
NC
S25FL064P_00_08 January 29, 2013
D a t a
S h e e t
Figure 2.4 6x8 mm 24-ball BGA Package, 6x4 Pin Configuration
January 29, 2013 S25FL064P_00_08
A1
A2
A3
A4
NC
NC
NC
NC
B1
B2
B3
B4
NC
SCK
GND
VCC
C1
C2
C3
C4
NC
CS#
NC W#/ACC/IO2
D1
D2
D3
NC
SO/IO1
D4
SI/IO0 HOLD#/IO3
E1
E2
E3
E4
NC
NC
NC
NC
F1
F2
F3
F4
NC
NC
NC
NC
S25FL064P
11
D a t a
S h e e t
3. Input/Output Descriptions
Signal
I/O
Description
SO/IO1
I/O
Serial Data Output: Transfers data serially out of the device on the falling edge of SCK.
Functions as an input pin in Dual and Quad I/O, and Quad Page Program modes.
SI/IO0
I/O
Serial Data Input: Transfers data serially into the device. Device latches commands,
addresses, and program data on SI on the rising edge of SCK. Functions as an output pin in
Dual and Quad I/O mode.
SCK
Input
Serial Clock: Provides serial interface timing. Latches commands, addresses, and data on SI on
rising edge of SCK. Triggers output on SO after the falling edge of SCK.
CS#
Input
Chip Select: Places device in active power mode when driven low. Deselects device and places
SO at high impedance when high. After power-up, device requires a falling edge on CS# before
any command is written. Device is in standby mode when a program, erase, or Write Status
Register operation is not in progress.
HOLD#/IO3
I/O
Hold: Pauses any serial communication with the device without deselecting it. When driven low,
SO is at high impedance, and all input at SI and SCK are ignored. Requires that CS# also be
driven low. Functions as an output pin in Quad I/O mode.
W#/ACC/IO2
I/O
Write Protect: Protects the memory area specified by Status Register bits BP2:BP0. When
driven low, prevents any program or erase command from altering the data in the protected
memory area. Functions as an output pin in Quad I/O mode.
VCC
Input
Supply Voltage
GND
Input
Ground
4. Logic Symbol
VCC
SO/IO1
SI/IO0
SCK
CS#
W#/ACC/IO2
HOLD#/IO3
GND
12
S25FL064P
S25FL064P_00_08 January 29, 2013
D a t a
5.
S h e e t
Ordering Information
The ordering part number is formed by a valid combination of the following:
S25FL
064
P
0X
M
F
I
00
1
Packing Type
0
= Tray
1
= Tube
3
= 13” Tape and Reel
Model Number (Additional Ordering Options)
03 = 6 x 4 pin configuration BGA package
02 = 5 x 5 pin configuration BGA package
00 = 16-pin SO package / 8-contact WSON package
Temperature Range
I
=
Industrial (–40°C to + 85°C)
V
=
Automotive In-cabin (–40°C to +105°C)
Package Materials
F
= Lead (Pb)-free
H
= Low-Halogen, Lead (Pb)-free
Package Type
M
= 16-pin SO package
N
= 8-contact WSON 6 x 8mm package
B
= 24-ball BGA 6 x 8 mm package, 1.00 mm pitch
Speed
0X =
104 MHz
Device Technology
P
= 0.09 µm MirrorBit® Process Technology
Density
064 =
64 Mbit
Device Family
S25FL
Spansion Memory 3.0 Volt-Only, Serial Peripheral Interface (SPI) Flash Memory
5.1
Valid Combinations
Table 5.1 lists the valid combinations configurations planned to be supported in volume for this device.
Table 5.1 S25FL064P Valid Combinations Table
S25FL064P Valid Combinations
Base Ordering
Part Number
Speed Option
Package &
Temperature
MFI,NFI
S25FL064P
0X
MFV, NFV
BHI, BHV
January 29, 2013 S25FL064P_00_08
S25FL064P
Model
Number
Packing Type
00
0, 1, 3
02, 03
0, 3
Package Marking
FL064P + (Temp) + F
13
D a t a
6.
S h e e t
Spansion SPI Modes
A microcontroller can use either of its two SPI modes to control Spansion SPI flash memory devices:
 CPOL = 0, CPHA = 0 (Mode 0)
 CPOL = 1, CPHA = 1 (Mode 3)
Input data is latched in on the rising edge of SCK, and output data is available from the falling edge of SCK for
both modes.
When the bus master is in standby mode, SCK is as shown in Figure 6.2 for each of the two modes:
 SCK remains at 0 for (CPOL = 0, CPHA = 0 Mode 0)
 SCK remains at 1 for (CPOL = 1, CPHA = 1 Mode 3)
Figure 6.1 Bus Master and Memory Devices on the SPI Bus
SO
SPI Interface with
(CPOL, CPHA) =
(0, 0) or (1, 1)
SI
SCK
SCK SO SI
SCK SO SI
SCK SO SI
Bus Master
SPI Memory
Device
CS3
CS2
SPI Memory
Device
SPI Memory
Device
CS1
CS#
HOLD#
W#/ACC
CS#
HOLD#
W#/ACC
CS#
HOLD#
W#/ACC
Note
The Write Protect/Accelerated Programming (W#/ACC) and Hold (HOLD#) signals should be driven high (logic level 1) or low (logic level 0)
as appropriate.
Figure 6.2 SPI Modes Supported
CS#
CPOL CPHA
Mode 0
0
0
SCK
Mode 3
1
1
SCK
SI
MSB
SO
14
MSB
S25FL064P
S25FL064P_00_08 January 29, 2013
D a t a
S h e e t
7. Device Operations
All Spansion SPI devices accept and output data in bytes (8 bits at a time). The SPI device is a slave device
that supports an inactive clock while CS# is held low.
7.1
Byte or Page Programming
Programming data requires two commands: Write Enable (WREN), which is one byte, and a Page Program
(PP) sequence, which consists of four bytes plus data. The Page Program sequence accepts from 1 byte up
to 256 consecutive bytes of data (which is the size of one page) to be programmed in one operation.
Programming means that bits can either be left at 0, or programmed from 1 to 0. Changing bits from 0 to 1
requires an erase operation.
7.2
Quad Page Programming
The Quad Page Program (QPP) instruction allows up to 256 bytes of data to be programmed using 4 pins as
inputs at the same time, thus effectively quadrupling the data transfer rate, compared to the Page Program
(PP) instruction. The Write Enable Latch (WEL) bit must be set to a 1 using the Write Enable (WREN)
command prior to issuing the QPP command.
7.3
Dual and Quad I/O Mode
The S25FL064P device supports Dual and Quad I/O operation when using the Dual/Quad Output Read Mode
and the Dual/Quad I/O High Performance Mode instructions. Using the Dual or Quad I/O instructions allows
data to be transferred to or from the device at two to four times the rate of standard SPI devices. When
operating in the Dual or Quad I/O High Performance Mode (BBh or EBh instructions), data can be read at fast
speed using two or four data bits at a time, and the 3-byte address can be input two or four address bits at a
time.
7.4
Sector Erase / Bulk Erase
The Sector Erase (SE) and Bulk Erase (BE) commands set all the bits in a sector or the entire memory array
to 1. While bits can be individually programmed from 1 to 0, erasing bits from 0 to 1 must be done on a sectorwide (SE) or array-wide (BE) level. In addition to the 64-kB Sector Erase (SE), the S25FL064P device also
offers 4-kB Parameter Sector Erase (P4E) and 8-kB Parameter Sector Erase (P8E).
7.5
Monitoring Write Operations Using the Status Register
The host system can determine when a Write Register, program, or erase operation is complete by
monitoring the Write in Progress (WIP) bit in the Status Register. The Read from Status Register command
provides the state of the WIP bit. In addition, the S25FL064P device offers two additional bits in the Status
Register (P_ERR, E_ERR) to indicate whether a Program or Erase operation was a success or failure.
7.6
Active Power and Standby Power Modes
The device is enabled and in the Active Power mode when Chip Select (CS#) is Low. When CS# is high, the
device is disabled, but may still be in the Active Power mode until all program, erase, and Write Registers
operations have completed. The device then goes into the Standby Power mode, and power consumption
drops to ISB. The Deep Power-Down (DP) command provides additional data protection against inadvertent
signals. After writing the DP command, the device ignores any further program or erase commands, and
reduces its power consumption to IDP.
January 29, 2013 S25FL064P_00_08
S25FL064P
15
D a t a
7.7
S h e e t
Status Register
The Status Register contains the status and control bits that can be read or set by specific commands (see
Table 9.1 on page 23). These bits configure different protection configurations and supply information of
operation of the device. (for details see Table 9.8, S25FL064P Status Register on page 37):
 Write In Progress (WIP): Indicates whether the device is performing a Write Registers, program or erase
operation.
 Write Enable Latch (WEL): Indicates the status of the internal Write Enable Latch.
 Block Protect (BP2, BP1, BP0): Non-volatile bits that define memory area to be software-protected
against program and erase commands.
 Erase Error (E_ERR): The Erase Error Bit is used as an Erase operation success and failure check.
 Program Error (P_ERR): The Program Error Bit is used as an program operation success and failure check.
 Status Register Write Disable (SRWD): Places the device in the Hardware Protected mode when this bit
is set to 1 and the W#/ACC input is driven low. In this mode, the non-volatile bits of the Status Register
(SRWD, BP2, BP1, BP0) become read-only bits.
7.8
Configuration Register
The Configuration Register contains the control bits that can be read or set by specific commands. These bits
configure different configurations and security features of the device.
 The FREEZE bit locks the BP2-0 bits in Status Register and the TBPROT and TBPARM bits in the
Configuration Register. Note that once the FREEZE bit has been set to 1, then it cannot be cleared to 0
until a power-on-reset is executed. As long as the FREEZE bit is set to 0, then the other bits of the
Configuration Register, including FREEZE bit, can be written to.
 The QUAD bit is non-volatile and sets the pin out of the device to Quad mode; that is, W#/ACC becomes
IO2 and HOLD# becomes IO3. The instructions for Serial, Dual Output, and Dual I/O reads function as
normal. The W#/ACC and HOLD# functionality does not work when the device is set in Quad mode.
 The TBPARM bit defines the logical location of the 4 kB parameter sectors. The parameter sectors consist
of thirty two 4 kB sectors. All sectors other than the parameter sectors are defined to be 64-kB uniform in
size. When TBPARM is set to a 1, the 4 kB parameter sectors starts at the top of the array. When TBPARM
is set to a 0, the 4 kB parameter sectors starts at the bottom of the array. Note that once this bit is set to a
1, it cannot be changed back to 0. The desired state of TBPARM must be selected during the initial
configuration of the device during system manufacture; before the first program or erase operation on the
main flash array. TBPARM must not be programmed after programming or erasing is done in the main flash
array.
 The BPNV bit defines whether or not the BP2-0 bits in the Status Register are volatile or non-volatile.
When BPNV is set to a 1, the BP2-0 bits in the Status Register are volatile and will be reset to binary 111
after power on reset. When BPNV is set to a 0, the BP2-0 bits in the Status Register are non-volatile. Note
that once this bit is set to a 1, it cannot be changed back to 0.
 The TBPROT bit defines the operation of the block protection bits BP2, BP1, and BP0 in the Status
Register. When TBPROT is set to a 0, then the block protection is defined to start from the top of the array.
When TBPROT is set to a 1, then the block protection is defined to start from the bottom of the array. Note
that once this bit is set to a 1, it cannot be changed back to 0. The desired state of TBPROT must be
selected during the initial configuration of the device during system manufacture; before the first program
or erase operation on the main flash array. TBPROT must not be programmed after programming or
erasing is done in the main flash array.
Note: It is suggested that the Block Protection & Parameter sectors not be set to the same area of the array;
otherwise, the user cannot utilize the Parameter sectors if they are protected. The following matrix shows the
recommended settings.
16
S25FL064P
S25FL064P_00_08 January 29, 2013
D a t a
S h e e t
Table 7.1 Suggested Cross Settings
TBPARM
TBPROT
Array Overview
Parameter Sectors - Bottom
0
0
BP Protection - Top
(Default)
0
1
Not recommended (Parameters & BP Protection are both Bottom)
1
0
Not recommended (parameters & BP Protection are both Top)
1
1
Parameter Sectors - Top of Array (high address)
BP Protection - Bottom of Array (low address
Table 7.2 Configuration Register Table
Bit
Bit Name
7
NA
-
Bit Function
Not Used
Description
6
NA
-
Not Used
5
TBPROT
Configures start of block protection
1 = Bottom Array (low address)
0 = Top Array (high address) (Default)
4
NA
-
Do Not Use
3
BPNV
Configures BP2-0 bits in the Status Register
1 = Volatile
0 = Non-volatile (Default)
2
TBPARM
Configures Parameter sector location
1 = Top Array (high address)
0 = Bottom Array (low address) (Default)
1
QUAD
Puts the device into Quad I/O mode
1 = Quad I/O
0 = Dual or Serial I/O (Default)
0
FREEZE
Locks BP2-0 bits in the Status Register
1 = Enabled
0 = Disabled (Default)
Note
(Default) indicates the value of each Configuration Register bit set upon initial factory shipment.
January 29, 2013 S25FL064P_00_08
S25FL064P
17
D a t a
7.9
S h e e t
Data Protection Modes
Spansion SPI flash memory devices provide the following data protection methods:
 The Write Enable (WREN) command: Must be written prior to any command that modifies data. The
WREN command sets the Write Enable Latch (WEL) bit. The WEL bit resets (disables writes) on power-up
or after the device completes the following commands:
– Page Program (PP)
– Sector Erase (SE)
– Bulk Erase (BE)
– Write Disable (WRDI)
– Write Register (WRR)
– Parameter 4 kB Sector Erase (P4E)
– Parameter 8 kB Sector Erase (P8E)
– Quad Page Programming (QPP)
– OTP Byte Programming (OTPP)
 Software Protected Mode (SPM): The Block Protect (BP2, BP1, BP0) bits define the section of the
memory array that can be read but not programmed or erased. Table 7.3 and Table 7.4 shows the sizes
and address ranges of protected areas that are defined by Status Register bits BP2:BP0.
 Hardware Protected Mode (HPM): The Write Protect (W#/ACC) input and the Status Register Write
Disable (SRWD) bit together provide write protection.
 Clock Pulse Count: The device verifies that all program, erase, and Write Register commands consist of
a clock pulse count that is a multiple of eight before executing them.
Table 7.3 TBPROT = 0 (Starts Protection from TOP of Array)
Status Register Block
Memory Array
Protected
Address Range
Protected Sectors
Unprotected
Address Range
Unprotected
Sectors
Protected
Portion of
Total Memory
Area
BP2
BP1
BP0
0
0
0
None
0
000000h-7FFFFFh
SA127:SA0
0
0
0
1
7E0000h-7FFFFFh
(2) SA127:SA126
000000h-7DFFFFh
SA125:SA0
1/64
0
1
0
7C0000h-7FFFFFh
(4) SA127:SA124
000000h-7BFFFFh
SA123:SA0
1/32
0
1
1
780000h-7FFFFFh
(8) SA127:SA120
000000h-77FFFFh
SA119:SA0
1/16
1
0
0
700000h-7FFFFFh
(16) SA127:SA112
000000h-6FFFFFh
SA111:SA0
1/8
1
0
1
600000h-7FFFFFh
(32) SA127:SA96
000000h-5FFFFFh
SA95:SA0
1/4
1
1
0
400000h-7FFFFFh
(64) SA127:SA64
000000h-3FFFFFh
SA63:SA0
1/2
1
1
1
000000h-7FFFFFh
(128) SA127:SA0
None
None
All
Table 7.4 TBPROT=1 (Starts Protection from BOTTOM of Array)
Status Register Block
18
Memory Array
Protected
Address Range
Unprotected
Address Range
Unprotected
Sectors
0
000000h-7FFFFFh
SA0:SA127
0
(2) SA0:SA1
020000h-7FFFFFh
SA2:SA127
1/64
(4) SA0:SA3
040000h-7FFFFFh
SA4:SA127
1/32
(8) SA0:SA7
080000h-7FFFFFh
SA8:SA127
1/16
000000h-0FFFFFh
(16) SA0:SA15
100000h-7FFFFFh
SA16:SA127
1/8
1
000000h-1FFFFFh
(32) SA0:SA31
200000h-7FFFFFh
SA32:SA127
1/4
1
0
000000h-3FFFFFh
(64) SA0:SA63
400000h-7FFFFFh
SA64:SA127
1/2
1
1
000000h-7FFFFFh
(128) SA0:SA127
None
None
All
BP2
BP1
BP0
0
0
0
None
0
0
1
000000h-01FFFFh
0
1
0
000000h-03FFFFh
0
1
1
000000h-07FFFFh
1
0
0
1
0
1
1
Protected
Sectors
Protected
Portion of
Total Memory
Area
S25FL064P
S25FL064P_00_08 January 29, 2013
D a t a
7.10
S h e e t
Hold Mode (HOLD#)
The Hold input (HOLD#) stops any serial communication with the device, but does not terminate any Write
Registers, program or erase operation that is currently in progress.
The Hold mode starts on the falling edge of HOLD# if SCK is also low (see Figure 7.1, standard use). If the
falling edge of HOLD# does not occur while SCK is low, the Hold mode begins after the next falling edge of
SCK (non-standard use).
The Hold mode ends on the rising edge of HOLD# signal (standard use) if SCK is also low. If the rising edge
of HOLD# does not occur while SCK is low, the Hold mode ends on the next falling edge of CLK (nonstandard use) See Figure 7.1.
The SO output is high impedance, and the SI and SCK inputs are ignored (don’t care) for the duration of the
Hold mode.
CS# must remain low for the entire duration of the Hold mode to ensure that the device internal logic remains
unchanged. If CS# goes high while the device is in the Hold mode, the internal logic is reset. To prevent the
device from reverting to the Hold mode when device communication is resumed, HOLD# must be held high,
followed by driving CS# low.
Note: The HOLD Mode feature is disabled when Quad mode is enabled, i.e., Quad bit in the Configuration
register is set to 1.
Figure 7.1 Hold Mode Operation
SCK
HOLD#
Hold
Condition
(standard use)
January 29, 2013 S25FL064P_00_08
S25FL064P
Hold
Condition
(non-standard use)
19
D a t a
7.11
S h e e t
Accelerated Programming Operation
The device offers accelerated program operations through the ACC function. This function is primarily
intended to allow faster manufacturing throughput at the factory. If the system asserts VHH on this pin, the
device uses the higher voltage on the pin to reduce the time required for program operations. Removing VHH
from the W#/ACC pin returns the device to normal operation. Note that the W#/ACC pin must not be at VHH
for operations other than accelerated programming, or device damage may result. In addition, the W#/ACC
pin must not be left floating or unconnected; inconsistent behavior of the device may result.
Note: The ACC function is disabled during Quad I/O Mode.
8. Sector Address Table
The Sector Address tables show the size of the memory array, sectors, and pages. The device uses pages to
cache the program data before the data is programmed into the memory array. Each page or byte can be
individually programmed (bits are changed from 1 to 0). The data is erased (bits are changed from 0 to 1) on
a sub-sector, sector- or device-wide basis using the P4E/P8E, SE or BE commands. Table 8.1 and Table 8.2
show the starting and ending address for each sector. The complete set of sectors comprises the memory
array of the flash device.
20
S25FL064P
S25FL064P_00_08 January 29, 2013
D a t a
S h e e t
Table 8.1 S25FL064P Sector Address Table TBPARM=0
Sector
SA127
SA126
SA125
SA124
SA123
SA122
SA121
SA120
SA119
SA118
SA117
SA116
SA115
SA114
SA113
SA112
SA111
SA110
SA109
SA108
SA107
SA106
SA105
SA104
SA103
SA102
SA101
SA100
SA99
SA98
SA97
SA96
SA95
SA94
SA93
SA92
SA91
SA90
SA89
SA88
SA87
SA86
SA85
Address range
Start
End
address
Address
7F0000h
7FFFFFh
7E0000h
7EFFFFh
7D0000h
7DFFFFh
7C0000h
7CFFFFh
7B0000h
7BFFFFh
7A0000h
7AFFFFh
790000h
79FFFFh
780000h
78FFFFh
770000h
77FFFFh
760000h
76FFFFh
750000h
75FFFFh
740000h
74FFFFh
730000h
73FFFFh
720000h
72FFFFh
710000h
71FFFFh
700000h
70FFFFh
6F0000h
6FFFFFh
6E0000h
6EFFFFh
6D0000h
6DFFFFh
6C0000h
6CFFFFh
6B0000h
6BFFFFh
6A0000h
6AFFFFh
690000h
69FFFFh
680000h
68FFFFh
670000h
67FFFFh
660000h
66FFFFh
650000h
65FFFFh
640000h
64FFFFh
630000h
63FFFFh
620000h
62FFFFh
610000h
61FFFFh
600000h
60FFFFh
5F0000h
5FFFFFh
5E0000h
5EFFFFh
5D0000h
5DFFFFh
5C0000h
5CFFFFh
5B0000h
5BFFFFh
5A0000h
5AFFFFh
590000h
59FFFFh
580000h
58FFFFh
570000h
57FFFFh
560000h
56FFFFh
550000h
55FFFFh
Sector
SA84
SA83
SA82
SA81
SA80
SA79
SA78
SA77
SA76
SA75
SA74
SA73
SA72
SA71
SA70
SA69
SA68
SA67
SA66
SA65
SA64
SA63
SA62
SA61
SA60
SA59
SA58
SA57
SA56
SA55
SA54
SA53
SA52
SA51
SA50
SA49
SA48
SA47
SA46
SA45
SA44
SA43
SA42
Address range
Start
End
address
Address
540000h
54FFFFh
530000h
53FFFFh
520000h
52FFFFh
510000h
51FFFFh
500000h
50FFFFh
4F0000h
4FFFFFh
4E0000h
4EFFFFh
4D0000h
4DFFFFh
4C0000h
4CFFFFh
4B0000h
4BFFFFh
4A0000h
4AFFFFh
490000h
49FFFFh
480000h
48FFFFh
470000h
47FFFFh
460000h
46FFFFh
450000h
45FFFFh
440000h
44FFFFh
430000h
43FFFFh
420000h
42FFFFh
410000h
41FFFFh
400000h
40FFFFh
3F0000h
3FFFFFh
3E0000h
3EFFFFh
3D0000h
3DFFFFh
3C0000h
3CFFFFh
3B0000h
3BFFFFh
3A0000h
3AFFFFh
390000h
39FFFFh
380000h
38FFFFh
370000h
37FFFFh
360000h
36FFFFh
350000h
35FFFFh
340000h
34FFFFh
330000h
33FFFFh
320000h
32FFFFh
310000h
31FFFFh
300000h
30FFFFh
2F0000h
2FFFFFh
2E0000h
2EFFFFh
2D0000h
2DFFFFh
2C0000h
2CFFFFh
2B0000h
2BFFFFh
2A0000h
2AFFFFh
Sector
SA41
SA40
SA39
SA38
SA37
SA36
SA35
SA34
SA33
SA32
SA31
SA30
SA29
SA28
SA27
SA26
SA25
SA24
SA23
SA22
SA21
SA20
SA19
SA18
SA17
SA16
SA15
SA14
SA13
SA12
SA11
SA10
SA9
SA8
SA7
SA6
SA5
SA4
SA3
SA2
SA1
SA0
Address range
Start
End
address
Address
290000h
29FFFFh
280000h
28FFFFh
270000h
27FFFFh
260000h
26FFFFh
250000h
25FFFFh
240000h
24FFFFh
230000h
23FFFFh
220000h
22FFFFh
210000h
21FFFFh
200000h
20FFFFh
1F0000h
1FFFFFh
1E0000h
1EFFFFh
1D0000h
1DFFFFh
1C0000h
1CFFFFh
1B0000h
1BFFFFh
1A0000h
1AFFFFh
190000h
19FFFFh
180000h
18FFFFh
170000h
17FFFFh
160000h
16FFFFh
150000h
15FFFFh
140000h
14FFFFh
130000h
13FFFFh
120000h
12FFFFh
110000h
11FFFFh
100000h
10FFFFh
0F0000h
0FFFFFh
0E0000h
0EFFFFh
0D0000h
0DFFFFh
0C0000h
0CFFFFh
0B0000h
0BFFFFh
0A0000h
0AFFFFh
090000h
09FFFFh
080000h
08FFFFh
070000h
07FFFFh
060000h
06FFFFh
050000h
05FFFFh
040000h
04FFFFh
030000h
03FFFFh
020000h
02FFFFh
010000h
01FFFFh
000000h
00FFFFh
Sector
SS31
SS30
SS29
SS28
SS27
SS26
SS25
SS24
SS23
SS22
SS21
SS20
SS19
SS18
SS17
SS16
SS15
SS14
SS13
SS12
SS11
SS10
SS9
SS8
SS7
SS6
SS5
SS4
SS3
SS2
SS1
SS0
Address range
Start
End
address
Address
01F000h
01E000h
01D000h
01C000h
01B000h
01A000h
019000h
018000h
017000h
016000h
015000h
014000h
013000h
012000h
011000h
010000h
00F000h
00E000h
00D000h
00C000h
00B000h
00A000h
009000h
008000h
007000h
006000h
005000h
004000h
003000h
002000h
001000h
000000h
01FFFFh
01EFFFh
01DFFFh
01CFFFh
01BFFFh
01AFFFh
019FFFh
018FFFh
017FFFh
016FFFh
015FFFh
014FFFh
013FFFh
012FFFh
011FFFh
010FFFh
00FFFFh
00EFFFh
00DFFFh
00CFFFh
00BFFFh
00AFFFh
009FFFh
008FFFh
007FFFh
006FFFh
005FFFh
004FFFh
003FFFh
002FFFh
001FFFh
000FFFh
Note
Sector SA0 is split up into sub-sectors SS0 - SS15 (dark gray shading)
Sector SA1 is split up into sub-sectors SS16 - SS31(light gray shading)
January 29, 2013 S25FL064P_00_08
S25FL064P
21
D a t a
S h e e t
Table 8.2 S25FL064P Sector Address Table TBPARM=1
Sector
SS31
SS30
SS29
SS28
SS27
SS26
SS25
SS24
SS23
SS22
SS21
SS20
SS19
SS18
SS17
SS16
SS15
SS14
SS13
SS12
SS11
SS10
SS9
SS8
SS7
SS6
SS5
SS4
SS3
SS2
SS1
SS0
Address range
Start
End
address
Address
7FF000h
7FFFFFh
7FE000h
7FEFFFh
7FD000h
7FDFFFh
7FC000h
7FCFFFh
7FB000h
7FBFFFh
7FA000h
7FAFFFh
7F9000h
7F9FFFh
7F8000h
7F8FFFh
7F7000h
7F7FFFh
7F6000h
7F6FFFh
7F5000h
7F5FFFh
7F4000h
7F4FFFh
7F3000h
7F3FFFh
7F2000h
7F2FFFh
7F1000h
7F1FFFh
7F0000h
7F0FFFh
7EF000h
7EFFFFh
7EE000h
7EEFFFh
7ED000h
7EDFFFh
7EC000h
7ECFFFh
7EB000h
7EBFFFh
7EA000h
7EAFFFh
7E9000h
7E9FFFh
7E8000h
7E8FFFh
7E7000h
7E7FFFh
7E6000h
7E6FFFh
7E5000h
7E5FFFh
7E4000h
7E4FFFh
7E3000h
7E3FFFh
7E2000h
7E2FFFh
7E1000h
7E1FFFh
7E0000h
7E0FFFh
Sector
SA127
SA126
SA125
SA124
SA123
SA122
SA121
SA120
SA119
SA118
SA117
SA116
SA115
SA114
SA113
SA112
SA111
SA110
SA109
SA108
SA107
SA106
SA105
SA104
SA103
SA102
SA101
SA100
SA99
SA98
SA97
SA96
SA95
SA94
SA93
SA92
SA91
SA90
SA89
SA88
SA87
SA86
Address range
Start
End
address
Address
7F0000h
7FFFFFh
7E0000h
7EFFFFh
7D0000h
7DFFFFh
7C0000h
7CFFFFh
7B0000h
7BFFFFh
7A0000h
7AFFFFh
790000h
79FFFFh
780000h
78FFFFh
770000h
77FFFFh
760000h
76FFFFh
750000h
75FFFFh
740000h
74FFFFh
730000h
73FFFFh
720000h
72FFFFh
710000h
71FFFFh
700000h
70FFFFh
6F0000h
6FFFFFh
6E0000h
6EFFFFh
6D0000h
6DFFFFh
6C0000h
6CFFFFh
6B0000h
6BFFFFh
6A0000h
6AFFFFh
690000h
69FFFFh
680000h
68FFFFh
670000h
67FFFFh
660000h
66FFFFh
650000h
65FFFFh
640000h
64FFFFh
630000h
63FFFFh
620000h
62FFFFh
610000h
61FFFFh
600000h
60FFFFh
5F0000h
5FFFFFh
5E0000h
5EFFFFh
5D0000h
5DFFFFh
5C0000h
5CFFFFh
5B0000h
5BFFFFh
5A0000h
5AFFFFh
590000h
59FFFFh
580000h
58FFFFh
570000h
57FFFFh
560000h
56FFFFh
Sector
SA85
SA84
SA83
SA82
SA81
SA80
SA79
SA78
SA77
SA76
SA75
SA74
SA73
SA72
SA71
SA70
SA69
SA68
SA67
SA66
SA65
SA64
SA63
SA62
SA61
SA60
SA59
SA58
SA57
SA56
SA55
SA54
SA53
SA52
SA51
SA50
SA49
SA48
SA47
SA46
SA45
SA44
SA43
Address range
Start
End
address
Address
550000h
55FFFFh
540000h
54FFFFh
530000h
53FFFFh
520000h
52FFFFh
510000h
51FFFFh
500000h
50FFFFh
4F0000h
4FFFFFh
4E0000h
4EFFFFh
4D0000h
4DFFFFh
4C0000h
4CFFFFh
4B0000h
4BFFFFh
4A0000h
4AFFFFh
490000h
49FFFFh
480000h
48FFFFh
470000h
47FFFFh
460000h
46FFFFh
450000h
45FFFFh
440000h
44FFFFh
430000h
43FFFFh
420000h
42FFFFh
410000h
41FFFFh
400000h
40FFFFh
3F0000h
3FFFFFh
3E0000h
3EFFFFh
3D0000h
3DFFFFh
3C0000h
3CFFFFh
3B0000h
3BFFFFh
3A0000h
3AFFFFh
390000h
39FFFFh
380000h
38FFFFh
370000h
37FFFFh
360000h
36FFFFh
350000h
35FFFFh
340000h
34FFFFh
330000h
33FFFFh
320000h
32FFFFh
310000h
31FFFFh
300000h
30FFFFh
2F0000h
2FFFFFh
2E0000h
2EFFFFh
2D0000h
2DFFFFh
2C0000h
2CFFFFh
2B0000h
2BFFFFh
Sector
SA42
SA41
SA40
SA39
SA38
SA37
SA36
SA35
SA34
SA33
SA32
SA31
SA30
SA29
SA28
SA27
SA26
SA25
SA24
SA23
SA22
SA21
SA20
SA19
SA18
SA17
SA16
SA15
SA14
SA13
SA12
SA11
SA10
SA9
SA8
SA7
SA6
SA5
SA4
SA3
SA2
SA1
SA0
Address range
Start
End
address
Address
2A0000h
2AFFFFh
290000h
29FFFFh
280000h
28FFFFh
270000h
27FFFFh
260000h
26FFFFh
250000h
25FFFFh
240000h
24FFFFh
230000h
23FFFFh
220000h
22FFFFh
210000h
21FFFFh
200000h
20FFFFh
1F0000h
1FFFFFh
1E0000h
1EFFFFh
1D0000h
1DFFFFh
1C0000h
1CFFFFh
1B0000h
1BFFFFh
1A0000h
1AFFFFh
190000h
19FFFFh
180000h
18FFFFh
170000h
17FFFFh
160000h
16FFFFh
150000h
15FFFFh
140000h
14FFFFh
130000h
13FFFFh
120000h
12FFFFh
110000h
11FFFFh
100000h
10FFFFh
0F0000h
0FFFFFh
0E0000h
0EFFFFh
0D0000h
0DFFFFh
0C0000h
0CFFFFh
0B0000h
0BFFFFh
0A0000h
0AFFFFh
090000h
09FFFFh
080000h
08FFFFh
070000h
07FFFFh
060000h
06FFFFh
050000h
05FFFFh
040000h
04FFFFh
030000h
03FFFFh
020000h
02FFFFh
010000h
01FFFFh
000000h
00FFFFh
Note
Sector SA126 is split up into sub-sectors SS0 - SS15 (dark gray shading)
Sector SA127 is split up into sub-sectors SS16 - SS31 (light gray shading)
22
S25FL064P
S25FL064P_00_08 January 29, 2013
D a t a
9.
S h e e t
Command Definitions
The host system must shift all commands, addresses, and data in and out of the device, beginning with the
most significant bit. On the first rising edge of SCK after CS# is driven low, the device accepts the one-byte
command on SI (all commands are one byte long), most significant bit first. Each successive bit is latched on
the rising edge of SCK. Table 9.1 lists the complete set of commands.
Every command sequence begins with a one-byte command code. The command may be followed by
address, data, both, or nothing, depending on the command. CS# must be driven high after the last bit of the
command sequence has been written.
The Read Data Bytes (READ), Read Data Bytes at Higher Speed (FAST_READ), Dual Output Read (DOR),
Quad Output Read (QOR), Dual I/O High Performance Read (DIOR), Quad I/O High Performance Read
(QIOR), Read Status Register (RDSR), Read Configuration Register (RCR), Read OTP Data (OTPR), Read
Manufacturer and Device ID (READ_ID), Read Identification (RDID) and Release from Deep Power-Down
and Read Electronic Signature (RES) command sequences are followed by a data output sequence on SO.
CS# can be driven high after any bit of the sequence is output to terminate the operation.
The Page Program (PP), Quad Page Program (QPP), 64 kB Sector Erase (SE), 4 kB Parameter Sector
Erase (P4E), 8 kB Parameter Sector Erase (P8E), Bulk Erase (BE), Write Status and Configuration Registers
(WRR), Program OTP space (OTPP), Write Enable (WREN), or Write Disable (WRDI) commands require that
CS# be driven high at a byte boundary, otherwise the command is not executed. Since a byte is composed of
eight bits, CS# must therefore be driven high when the number of clock pulses after CS# is driven low is an
exact multiple of eight.
The device ignores any attempt to access the memory array during a Write Registers, program, or erase
operation, and continues the operation uninterrupted.
The instruction set is listed in Table 9.1.
Table 9.1 Instruction Set
Operation
Read
Write Control
Erase
Command
Status &
Configuration
Register
Mode Bit
Cycle
Dummy
Bytes
Data
Bytes
(03h) 0000 0011
Read Data bytes
3
0
0
1 to ∞
(0Bh) 0000 1011
Read Data bytes at Fast Speed
3
0
1
1 to ∞
DOR
(3Bh) 0011 1011
Dual Output Read
3
0
1
1 to ∞
QOR
(6Bh) 0110 1011
Quad Output Read
3
0
1
1 to ∞
DIOR
(BBh) 1011 1011
Dual I/O High Performance Read
3
1
0
1 to ∞
QIOR
(EBh) 1110 1011
Quad I/O High Performance Read
3
1
2
1 to ∞
RDID
(9Fh) 1001 1111
Read Identification
0
0
0
1 to 81
READ_ID
(90h) 1001 0000
Read Manufacturer and Device Identification
3
0
0
1 to ∞
WREN
(06h) 0000 0110
Write Enable
0
0
0
0
WRDI
(04h) 0000 0100
Write Disable
0
0
0
0
P4E
(20h) 0010 0000
4 kB Parameter Sector Erase
3
0
0
0
P8E
(40h) 0100 0000
8 kB (two 4 kB) Parameter Sector Erase
3
0
0
0
SE
(D8h) 1101 1000
64 kB Sector Erase
3
0
0
0
Bulk Erase
0
(60h) 0110 0000 or
(C7h) 1100 0111
0
0
0
0
0
PP
(02h) 0000 0010
Page Programming
3
0
0
1 to 256
QPP
(32h) 0011 0010
Quad Page Programming
3
0
0
1 to 256
RDSR
(05h) 0000 0101
Read Status Register
0
0
0
1 to ∞
WRR
(01h) 0000 0001
Write (Status & Configuration) Registers
0
0
0
1 to 2
RCR
(35h) 0011 0101
Read Configuration Register (CFG)
0
0
0
1 to ∞
(30h) 0011 0000
Reset the Erase and Program Fail Flag (SR5 and
SR6) and restore normal operation)
0
0
0
0
DP
OTP
Address
Bytes
READ
CLSR
Power Saving
Description
FAST_READ
BE
Program
One Byte Command
Code
(B9h) 1011 1001
Deep Power-Down
0
0
0
0
(ABh) 1010 1011
Release from Deep Power-Down Mode
0
0
0
0
(ABh) 1010 1011
Release from Deep Power-Down and Read Electronic
Signature
0
0
3
1 to ∞
OTPP
(42h) 0100 0010
Programs one byte of data in OTP memory space
3
0
0
1
OTPR
(4Bh) 0100 1011
Read data in the OTP memory space
3
0
1
1 to ∞
RES
January 29, 2013 S25FL064P_00_08
S25FL064P
23
D a t a
9.1
S h e e t
Read Data Bytes (READ)
The Read Data Bytes (READ) command reads data from the memory array at the frequency (fR) presented at
the SCK input, with a maximum speed of 40 MHz. The host system must first select the device by driving CS#
low. The READ command is then written to SI, followed by a 3 byte address (A23-A0). Each bit is latched on
the rising edge of SCK. The memory array data, at that address, are output serially on SO at a frequency fR,
on the falling edge of SCK.
Figure 9.1 and Table 9.1 on page 23 detail the READ command sequence. The first address byte specified
can start at any location of the memory array. The device automatically increments to the next higher address
after each byte of data is output. The entire memory array can therefore be read with a single READ
command. When the highest address is reached, the address counter reverts to 00000h, allowing the read
sequence to continue indefinitely.
The READ command is terminated by driving CS# high at any time during data output. The device rejects any
READ command issued while it is executing a program, erase, or Write Registers operation, and continues
the operation uninterrupted.
Figure 9.1 Read Data Bytes (READ) Command Sequence
CS#
Mode 3
SCK
0
1
2 3
4
5
6
7
8
9 10
28 29 30 31 32 33 34 35 36 37 38 39
Mode 0
Command
24 Bit Address
23 22 21
SI
3 2 1 0
MSB
SO
Hi-Z
Data Out 1
7 6 5 4 3 2
Data Out 2
1 0 7
MSB
24
S25FL064P
S25FL064P_00_08 January 29, 2013
D a t a
9.2
S h e e t
Read Data Bytes at Higher Speed (FAST_READ)
The FAST_READ command reads data from the memory array at the frequency (fC) presented at the SCK
input, with a maximum speed of 104 MHz. The host system must first select the device by driving CS# low.
The FAST_READ command is then written to SI, followed by a 3 byte address (A23-A0) and a dummy byte.
Each bit is latched on the rising edge of SCK. The memory array data, at that address, are output serially on
SO at a frequency fC, on the falling edge of SCK.
The FAST_READ command sequence is shown in Figure 9.2 and Table 9.1 on page 23. The first address
byte specified can start at any location of the memory array. The device automatically increments to the next
higher address after each byte of data is output. The entire memory array can therefore be read with a single
FAST_READ command. When the highest address is reached, the address counter reverts to 000000h,
allowing the read sequence to continue indefinitely.
The FAST_READ command is terminated by driving CS# high at any time during data output. The device
rejects any FAST_READ command issued while it is executing a program, erase, or Write Registers
operation, and continues the operation uninterrupted.
Figure 9.2 Read Data Bytes at Higher Speed (FAST_READ) Command Sequence
CS#
Mode 3
SCK
0
1
2
3
4
5
Command
7
8
9
10
28 29 30
31 32 33
24 Bit Address
23 22 21
SI
SO
6
34 35 36 37 38
39
40 41
42 43 44 45
46
47
Mode 0
3
2
Hi-Z
Dummy Byte
1
0
7
6
5
4
3
2
1
0
7
MSB
January 29, 2013 S25FL064P_00_08
S25FL064P
6
5
4
3
DATA OUT 1
2
1
0
7
MSB
DATA OUT 2
25
D a t a
9.3
S h e e t
Dual Output Read Mode (DOR)
The Dual Output Read instruction is similar to the FAST_READ instruction, except that the data is shifted out
2 bits at a time using 2 pins (SI/IO0 and SO/IO1) instead of 1 bit, at a maximum frequency of 80 MHz. The
Dual Output Read mode effectively doubles the data transfer rate compared to the FAST_READ instruction.
The host system must first select the device by driving CS# low. The Dual Output Read command is then
written to SI, followed by a 3-byte address (A23-A0) and a dummy byte. Each bit is latched on the rising edge
of SCK. Then the memory contents, at the address that is given, are shifted out two bits at a time through the
IO0 (SI) & IO1 (SO) pins at a frequency fC on the falling edge of SCK.
The Dual Output Read command sequence is shown in Figure 9.3 and Table 9.1 on page 23. The first
address byte specified can start at any location of the memory array. The device automatically increments to
the next higher address after each byte of data is output. The entire memory array can therefore be read with
a single Dual Output Read command. When the highest address is reached, the address counter reverts to
00000h, allowing the read sequence to continue indefinitely.
It is important that the I/O pins be set to high-impedance prior to the falling edge of the first data out clock.
The Dual Output Read command is terminated by driving CS# high at any time during data output. The
device rejects any Dual Output Read command issued while it is executing a program, erase, or Write
Registers operation, and continues the operation uninterrupted.
Figure 9.3 Dual Output Read Instruction Sequence
CS#
0
1
2
3
4
5
6
7
8
9 10
28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47
SCK
24 Bit
Address
Instruction
SI/IO0
23 22 21
*
3
Dummy Byte
2
Hi-Z
SO/IO1
1
0
7
6
5
4
3
2
SI Switches from Input to Output
1
0
6
4
2
0
6
4
2
0
6
7
5
3
1
7
5
3
1
7
*
*
Byte 1
*
Byte 2
*MSB
26
S25FL064P
S25FL064P_00_08 January 29, 2013
D a t a
9.4
S h e e t
Quad Output Read Mode (QOR)
The Quad Output Read instruction is similar to the FAST_READ instruction, except that the data is shifted out
4 bits at a time using 4 pins (SI/IO0, SO/IO1, W#/ACC/IO2 and HOLD#/IO3) instead of 1 bit, at a maximum
frequency of 80 MHz. The Quad Output Read mode effectively doubles the data transfer rate compared to the
Dual Output Read instruction, and is four times the data transfer rate of the FAST_READ instruction.
The host system must first select the device by driving CS# low. The Quad Output Read command is then
written to SI, followed by a 3-byte address (A23-A0) and a dummy byte. Each bit is latched on the rising edge
of SCK. Then the memory contents, at the address that are given, are shifted out four bits at a time through
IO0 (SI), IO1 (SO), IO2 (W#/ACC), and IO3 (HOLD#) pins at a frequency fC on the falling edge of SCK.
The Quad Output Read command sequence is shown in Figure 9.4 and Table 9.1 on page 23. The first
address byte specified can start at any location of the memory array. The device automatically increments to
the next higher address after each byte of data is output. The entire memory array can therefore be read with
a single Quad Output Read command. When the highest address is reached, the address counter reverts to
00000h, allowing the read sequence to continue indefinitely.
It is important that the I/O pins be set to high-impedance prior to the falling edge of the first data out clock.
The Quad Output Read command is terminated by driving CS# high at any time during data output. The
device rejects any Quad Output Read command issued while it is executing a program, erase, or Write
Registers operation, and continues the operation uninterrupted.
The Quad bit of Configuration Register must be set (CR Bit1 = 1) to enable the Quad mode capability of the
S25FL device.
Figure 9.4 Quad Output Read Instruction Sequence
CS#
0
1
2
3
4
5
6
7
8
9 10
28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47
SCK
Instruction
SI/IO0
SO/IO1
W#/ACC/IO2
HOLD#/IO3
Hi-Z
24 Bit
Address
23 22 21
*
3 2 1
Hi-Z
Hi-Z
Dummy Byte
0
7 6 5
4 3
2 1 0
*
SI Switches from Input to Output
4 0
4 0
4 0
4 0
4
5
1
5
1
5
5
1 5
6
2
6
2 6
2
6
2
6
7
3
7
3 7
3
7
3
7
1
*
*
*
*
*
DATA DATA DATA DATA
OUT 1 OUT 2 OUT 3 OUT 4
January 29, 2013 S25FL064P_00_08
S25FL064P
*MSB
27
D a t a
9.5
S h e e t
DUAL I/O High Performance Read Mode (DIOR)
The Dual I/O High Performance Read instruction is similar to the Dual Output Read instruction, except that it
improves throughput by allowing input of the address bits (A23-A0) using 2 bits per SCK via two input pins
(SI/IO2 and SO/IO1), at a maximum frequency of 80 MHz.
The host system must first select the device by driving CS# low. The Dual I/O High Performance Read
command is then written to SI, followed by a 3-byte address (A23-A0) and a 1-byte Mode instruction, with two
bits latched on the rising edge of SCK. Then the memory contents, at the address that is given, are shifted out
two bits at a time through IO0 (SI) and IO1 (SO).
The DUAL I/O High Performance Read command sequence is shown in Figure 9.5 and Table 9.1
on page 23. The first address byte specified can start at any location of the memory array. The device
automatically increments to the next higher address after each byte of data is output. The entire memory
array can therefore be read with a single DUAL I/O High Performance Read command. When the highest
address is reached, the address counter reverts to 00000h, allowing the read sequence to continue
indefinitely.
In addition, address jumps can be done without exiting the Dual I/O High Performance Mode through the
setting of the Mode bits (after the Address (A23-0) sequence, as shown in Figure 9.5). This added feature
removes the need for the instruction sequence and greatly improves code execution (XIP). The upper nibble
(bits 7-4) of the Mode bits control the length of the next Dual I/O High Performance instruction through the
inclusion or exclusion of the first byte instruction code. The lower nibble (bits 3-0) of the Mode bits are DON’T
CARE (“x”). If the Mode bits equal Axh, then the device remains in Dual I/O High Performance Read Mode
and the next address can be entered (after CS# is raised high and then asserted low) without requiring the
BBh instruction opcode, as shown in Figure 9.6, thus eliminating eight cycles for the instruction sequence.
However, if the Mode bits are any value other than Axh, then the next instruction (after CS# is raised high and
then asserted low) requires the instruction sequence, which is normal operation. The following sequences will
release the device from Dual I/O High Performance Read mode; after which, the device can accept standard
SPI instructions:
1. During the Dual I/O High Performance Instruction Sequence, if the Mode bits are any value other
than Axh, then the next time CS# is raised high and then asserted low, the device will be released
from Dual I/O High Performance Read mode.
2. Furthermore, during any operation, if CS# toggles high to low to high for eight cycles (or less) and
data input (IO0 & IO1) are not set for a valid instruction sequence, then the device will be released
from Dual I/O High Performance Read mode.
It is important that the I/O pins be set to high-impedance prior to the falling edge of the first data out clock.
The read instruction can be terminated by driving the CS# pin to the logic high state. The CS# pin can be
driven high at any time during data output to terminate a read operation.
Figure 9.5 DUAL I/O High Performance Read Instruction Sequence
CS#
0
1
2
3
4
5
6
7
8
9
10
18
19
20
21
22
23
24
25
26
27
28
29
30
31
SCK
24 Bit
Address
Instruction
SI/IO0
Hi-Z
SO/IO1
IO0 & IO1 Switches from Input to Output
22 20
2
0
6
4
2
0
6
4
2
0
6
4
2
0
6
23 21
*
3
1
7
5
3
1
7
5
3
1
7
5
3
1
7
*
*
Mode Bits
28
S25FL064P
*
Byte 1
*
Byte 2
*MSB
S25FL064P_00_08 January 29, 2013
D a t a
S h e e t
Figure 9.6 Continuous Dual I/O High Performance Read Instruction Sequence
CS#
0
1
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
SCK
24 Bit
Address
SI/IO0
SO/IO1
IO0 & IO1 Switches from Input to Output
22 20
2
0
6
4
2
0
6
4
2
0
6
4
2
0
6
23
3
1
7
5
3
1
7
5
3
1
7
5
3
1
7
*
21
Mode Bits
9.6
*
*
*
Byte 1
*
Byte 2
*MSB
Quad I/O High Performance Read Mode (QIOR)
The Quad I/O High Performance Read instruction is similar to the Quad Output Read instruction, except that
it further improves throughput by allowing input of the address bits (A23-A0) using 4 bits per SCK via four
input pins (SI/IO0, SO/IO1, W#/ACC/IO2 and HOLD#/IO3), at a maximum frequency of 80 MHz.
The host system must first select the device by driving CS# low. The Quad I/O High Performance Read
command is then written to SI, followed by a 3-byte address (A23-A0) and a 1-byte Mode instruction, with four
bits latched on the rising edge of SCK. Note that four dummy clocks are required prior to the data input. Then
the memory contents, at the address that is given, are shifted out four bits at a time through IO0 (SI), IO1
(SO), IO2 (W#/ACC), and IO3 (HOLD#).
The Quad I/O High Performance Read command sequence is shown in Figure 9.7 and Table 9.1 on page 23.
The first address byte specified can start at any location of the memory array. The device automatically
increments to the next higher address after each byte of data is output. The entire memory array can
therefore be read with a single Quad I/O High Performance Read command. When the highest address is
reached, the address counter reverts to 00000h, allowing the read sequence to continue indefinitely.
In addition, address jumps can be done without exiting the Quad I/O High Performance Mode through the
setting of the Mode bits (after the Address (A23-0) sequence, as shown in Figure 9.7). This added feature the
removes the need for the instruction sequence and greatly improves code execution (XIP). The upper nibble
(bits 7-4) of the Mode bits control the length of the next Quad I/O High Performance instruction through the
inclusion or exclusion of the first byte instruction code. The lower nibble (bits 3-0) of the Mode bits are DON'T
CARE (“x”). If the Mode bits equal Axh, then the device remains in Quad I/O High Performance Read Mode
and the next address can be entered (after CS# is raised high and then asserted low) without requiring the
EBh instruction opcode, as shown in Figure 9.8, thus eliminating eight cycles for the instruction sequence.
The following sequences will release the device from Quad I/O High Performance Read mode; after which,
the device can accept standard SPI instructions:
1. During the Quad I/O High Performance Instruction Sequence, if the Mode bits are any value other
than Axh, then the next time CS# is raised high and then asserted low the device will be released
from Quad I/O High Performance Read mode.
2. Furthermore, during any operation, if CS# toggles high to low to high for eight cycles (or less) and
data input (IO0, IO1, IO2, & IO3) are not set for a valid instruction sequence, then the device will be
released from Quad I/O High Performance Read mode.
It is important that the I/O pins be set to high-impedance prior to the falling edge of the first data out clock.
The read instruction can be terminated by driving the CS# pin to the logic high state. The CS# pin can be
driven high at any time during data output to terminate a read operation.
January 29, 2013 S25FL064P_00_08
S25FL064P
29
D a t a
S h e e t
Figure 9.7 QUAD I/O High Performance Instruction Sequence
CS#
0
1
2
3
4
5
6
7
8
9
13 14 15 16 17 18 19 20 21 22 23 24 25 26
SCK
24 Bit
Address
Instruction
SI/IO0
Hi-Z
SO/IO1
IO’s Switches from Input to Output
20 16
0
4
0
4
0
4
0
4
21 17
1
5
1
5
1
5
1
5
22 18
2
6
2
6
2
6
2
6
7
3
3
7
Hi-Z
W#/ACC/IO2
Hi-Z
HOLD#/IO3
3
23 19
*
7
3
*
Mode Bits DUMMY DUMMY
7
*
*
Byte 1
Byte 2
*
*MSB
Figure 9.8 Continuous QUAD I/O High Performance Instruction Sequence
CS#
0
1
4
5
6
7
8
9
10
11
12
13
14
15
16
SCK
24 Bit
Address
SI/IO0
IO’s Switches from Input to Output
20
16
0
4
0
1
5
4
0
4
0
4
1
5
1
5
1
5
6
2
6
2
6
3
7
3
7
*
Byte 2
*
SO/IO1
21
17
W#/ACC/IO2
22
18
2
6
2
HOLD#/IO3
23
19
3
7
3
*
* Bits DUMMY
Mode
7
DUMMY
*
Byte 1
*MSB
30
S25FL064P
S25FL064P_00_08 January 29, 2013
D a t a
9.7
S h e e t
Read Identification (RDID)
The Read Identification (RDID) command outputs the one-byte manufacturer identification, followed by the
two-byte device identification and the bytes for the Common Flash Interface (CFI) tables. The manufacturer
identification is assigned by JEDEC; for Spansion devices, it is 01h. The device identification (2 bytes) and
CFI bytes are assigned by the device manufacturer.
See Table 9.2 on page 32 for device ID data.
The Common Flash Interface (CFI) specification outlines device and host system software interrogation
handshake, which allows vendor-specified software algorithms to be used for entire families of devices.
Software support can then be device-independent, JEDEC ID-independent, and forward- and backwardcompatible for the specified flash device families. Flash vendors can standardize their existing interfaces for
long-term compatibility. The system can read CFI information at the addresses given in Table 9.3.
The host system must first select the device by driving CS# low. The RDID command is then written to SI,
and each bit is latched on the rising edge of SCK. One byte of manufacture identification, two bytes of device
identification and sixty-six bytes of extended device identification are then output from the memory array on
SO at a frequency fR, on the falling edge of SCK. The maximum clock frequency for the RDID (9Fh)
command is 50 MHz (Normal Read). The manufacturer ID and Device ID can be read repeatedly by applying
multiples of 648 clock cycles. The manufacturer ID, Device ID and CFI table can be continuously read as long
as CS# is held low with a clock input.
The RDID command sequence is shown in Figure 9.9 and Table 9.1 on page 23.
Driving CS# high after the device identification data has been read at least once terminates the RDID
command. Driving CS# high at any time during data output (for example, while reading the extended CFI
bytes), also terminates the RDID operation.
The device rejects any RDID command issued while it is executing a program, erase, or Write Registers
operation, and continues the operation uninterrupted.
Figure 9.9 Read Identification (RDID) Command Sequence and Data-Out Sequence
CS#
0
1
2
3
4
5
6
7
8
9
10
28
29
30
31
32
33
34
652 653 654
655
SCK
Instruction
SI
Extended Device Information
Manufacturer / Device Identification
High Impedance
SO
January 29, 2013 S25FL064P_00_08
S25FL064P
0
1
2
20
21
22
23
24
25
26
644
645
646
1 647
31
D a t a
S h e e t
Table 9.2 Manufacturer & Device ID - RDID (JEDEC 9Fh)
Manuf.
ID
Device
S25FL064P SPI flash
# Extended
bytes
Device Id
Byte 0
Byte 1
Byte 2
Byte 3
01h
02h
16h
4Dh
Notes
1. Byte 0 is Manufacturer ID of Spansion.
2. Byte 1 & 2 is Device Id.
3. Byte 3 is Extended Device Information String Length, to indicate how many Extended Device Information bytes will follow.
4. Bytes 4, 5 and 6 are Spansion reserved (do not use).
5. For Bytes 07h-0Fh and 3Dh-3Fh, the data will be read as 0xFF.
6. Bytes 10h-50h are factory programmed per JEDEC standard.
Table 9.3 Product Group CFI Query Identification String
Byte
Data
10h
51h
11h
52h
12h
59h
13h
02h
14h
00h
15h
40h
16h
00h
17h
00h
18h
00h
19h
00h
1Ah
00h
Description
Query Unique ASCII string “QRY”
Primary OEM Command Set
Address for Primary Extended Table
Alternate OEM Command Set
(00h = none exists)
Address for Alternate OEM Extended Table
(00h = none exists)
Table 9.4 Product Group CFI System Interface String
32
Byte
Data
1Bh
27h
VCC Min. (erase/program): (D7-D4: Volt, D3-D0: 100 mV)
Description
1Ch
36h
VCC Max. (erase/program): (D7-D4: Volt, D3-D0: 100 mV)
1Dh
00h
VPP Min. voltage (00h = no VPP pin present)
1Eh
00h
VPP Max. voltage (00h = no VPP pin present)
1Fh
0Bh
Typical timeout per single byte program 2N µs
20h
0Bh
Typical timeout for Min. size Page program 2N µs
(00h = not supported)
21h
09h
Typical timeout per individual sector erase 2N ms
22h
10h
Typical timeout for full chip erase 2N ms (00h = not supported)
23h
01h
Max. timeout for byte program 2N times typical
24h
01h
Max. timeout for page program 2N times typical
25h
02h
Max. timeout per individual sector erase 2N times typical
26h
01h
Max. timeout for full chip erase 2N times typical
(00h = not supported)
S25FL064P
S25FL064P_00_08 January 29, 2013
D a t a
S h e e t
Table 9.5 Product Group CFI Device Geometry Definition
Byte
Data
27h
17h
Device Size = 2 N byte;
Description
28h
05h
Flash Device Interface Description;
00h = x8 only
01h = x16 only
29h
02h = x8/x16 capable
03h = x32 only
05h
04h = Single I/O SPI, 3-byte address
05h = Multi I/O SPI, 3-byte address
2Ah
08h
2Bh
00h
2Ch
02h
2Dh
1Fh
2Eh
00h
2Fh
10h
30h
00h
31h
7Dh
32h
00h
33h
00h
34h
01h
35h
00h
36h
00h
37h
00h
38h
00h
39h
00h
3Ah
00h
3Bh
00h
3Ch
00h
Max. number of bytes in multi-byte write = 2N
(00 = not supported)
Number of Erase Block Regions within device
1 = Uniform Device, 2 = Parameter Block
Erase Block Region 1 Information (refer to CFI publication 100)
Erase Block Region 2 Information (refer to CFI publication 100)
Erase Block Region 3 Information (refer to CFI publication 100)
Erase Block Region 4 Information (refer to CFI publication 100)
January 29, 2013 S25FL064P_00_08
S25FL064P
33
D a t a
S h e e t
Table 9.6 Product Group CFI Primary Vendor-Specific Extended Query
Byte
Data
40h
50h
Description
41h
52h
42h
49h
43h
31h
Major version number, ASCII
44h
33h
Minor version number, ASCII
45h
15h
Address Sensitive Unlock (Bits 1-0)
00b = Required, 01b = Not Required
Process Technology (Bits 5-2)
0000b = 0.23 µm Floating Gate
0001b = 0.17 µm Floating Gate
0010b = 0.23 µm MirrorBit
0010b = 0.20 µm MirrorBit
0011b = 0.11 µm Floating Gate
0100b = 0.11 µm MirrorBit
0101b = 0.09 µm MirrorBit
1000b = 0.065 µm MirrorBit
46h
00h
Erase Suspend
0 = Not Supported, 1 = Read Only, 2 = Read & Write
47h
02h
Sector Protect
00 = Not Supported, X = Number of sectors in per smallest group
48h
00h
Temporary Sector Unprotect
00 = Not Supported, 01 = Supported
49h
05h
Sector Protect/Unprotect Scheme
04 = High Voltage Method
05 = Software Command Locking Method
08 = Advanced Sector Protection Method
4Ah
00h
Simultaneous Operation
00 = Not Supported, X = Number of Sectors outside Bank 1
4Bh
01h
Burst Mode Type
00 = Not Supported, 01 = Supported
4Ch
03h
Page Mode Type
00 = Not Supported, 01 = 4 Word Page, 02 = 8 Word Page,
03 = 256 Byte Page
4Dh
85h
ACC (Acceleration) Supply Minimum
00 = Not Supported, (D7-D4: Volt, D3-D0: 100 mV)
4Eh
95h
ACC (Acceleration) Supply Maximum
00 = Not Supported, (D7-D4: Volt, D3-D0: 100 mV)
4Fh
07h
W# Protection
07 = Uniform Device with Top or Bottom Write Protect (user select)
50h
00h
Program Suspend
00 = Not Supported, 01 = Supported
Query-unique ASCII string “PRI”
Note
CFI data related to VCC and time-outs may differ from actual VCC and time-outs of the product. Please consult the Ordering Information
tables to obtain the VCC range for particular part numbers. Please consult the AC Characteristics on page 58 for typical timeout
specifications.
34
S25FL064P
S25FL064P_00_08 January 29, 2013
D a t a
9.8
S h e e t
Read-ID (READ_ID)
The READ_ID instruction provides the S25FL064P manufacturer and device information and is provided as
an alternative to the Release from Deep Power-Down and Read Electronic Signature (RES), and the JEDEC
Read Identification (RDID) commands.
The instruction is initiated by driving the CS# pin low and shifting in (via the SI input pin) the instruction code
“90h” followed by a 24-bit address (which is either 00000h or 00001h). Following this, the Manufacturer ID
and the Device ID are shifted out on the SO output pin starting after the falling edge of the SCK serial clock
input signal. If the 24-bit address is set to 000000h, the Manufacturer ID is read out first followed by the
Device ID. If the 24-bit address is set to 000001h, then the Device ID is read out first followed by the
Manufacturer ID. The Manufacturer ID and the Device ID are always shifted out on the SO output pin with the
MSB first, as shown in Figure 10-14. Once the device is in Read-ID mode, the Manufacturer ID and Device ID
output data toggles between address 000000H and 000001H until terminated by a low to high transition on
the CS# input pin. The maximum clock frequency for the Read-ID (90h) command is at 104 MHz
(FAST_READ). The Manufacturer ID & Device ID is output continuously until terminated by a low to high
transition on CS# chip select input pin.
Figure 9.10 Read-ID (RDID) Command Timing Diagram
CS#
0
1
2
3
4
5
6
7
8
9
10
28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47
SCK
Instruction
SI
24-Bit Address
23 22 21
3
2
1
0
MSB
Manufacture Identification
Device Identification
High Impedance
7
SO
6
5
4
3
2
1
0
Table 9.7 READ_ID Data-Out Sequence
Address
Uniform
Manufacturer Identification
00000h
01h
Device Identification
00001h
16h
January 29, 2013 S25FL064P_00_08
S25FL064P
35
D a t a
9.9
S h e e t
Write Enable (WREN)
The Write Enable (WREN) command (see Figure 9.11) sets the Write Enable Latch (WEL) bit to a 1, which
enables the device to accept a Write Status Register, program, or erase command. The WEL bit must be set
prior to every Page Program (PP), Quad Page Program (QPP), Parameter Sector Erase (P4E, P8E), Erase
(SE or BE), Write Registers (WRR) and OTP Program (OTPP) command.
The host system must first drive CS# low, write the WREN command, and then drive CS# high.
Figure 9.11 Write Enable (WREN) Command Sequence
CS#
0
Mode 3
SCK
1
2
3
4
5
6
7
Mode 0
Command
SI
Hi-Z
SO
9.10
Write Disable (WRDI)
The Write Disable (WRDI) command (see Figure 9.12) resets the Write Enable Latch (WEL) bit to a 0, which
disables the device from accepting a Page Program (PP), Quad Page Program (QPP), Parameter Sector
Erase (P4E, P8E), Erase (SE, BE), Write Registers (WRR) and OTP Program (OTPP) command. The host
system must first drive CS# low, write the WRDI command, and then drive CS# high.
Any of following conditions resets the WEL bit:
 Power-up
 Write Disable (WRDI) command completion
 Write Registers (WRR) command completion
 Page Program (PP) command completion
 Quad Page Program (QPP) completion
 Parameter Sector Erase (P4E, P8E) completion
 Sector Erase (SE) command completion
 Bulk Erase (BE) command completion
 OTP Program (OTPP) completion
Figure 9.12 Write Disable (WRDI) Command Sequence
CS#
Mode 3
0 1 2 3 4 5 6 7
SCK Mode 0
Command
SI
Hi-Z
SO
36
S25FL064P
S25FL064P_00_08 January 29, 2013
D a t a
9.11
S h e e t
Read Status Register (RDSR)
The Read Status Register (RDSR) command outputs the state of the Status Register bits. Table 9.8 shows
the status register bits and their functions. The RDSR command may be written at any time, even while a
program, erase, or Write Registers operation is in progress. The host system should check the Write In
Progress (WIP) bit before sending a new command to the device if an operation is already in progress.
Figure 9.13 shows the RDSR command sequence, which also shows that it is possible to read the Status
Register continuously until CS# is driven high. The maximum clock frequency for the RDSR command is
104 MHz.
Table 9.8 S25FL064P Status Register
Bit
Status Register Bit
Bit Function
7
SRWD
Status Register Write Disable
6
P_ERR
Programming Error Occurred
5
E_ERR
Erase Error Occurred
4
BP2
3
BP1
2
BP0
1
WEL
Write Enable Latch
0
WIP
Write in Progress
Block Protect
Description
1 = Protects when W#/ACC is low
0 = No protection, even when W#/ACC is low
0 = No Error
1 = Error occurred
0 = No Error
1 = Error occurred
Protects selected Block from Program or Erase
1 = Device accepts Write Registers, program or erase commands
0 = Ignores Write Registers, program or erase commands
1 = Device Busy a Write Registers, program or erase operation is in
progress
0 = Ready. Device is in standby mode and can accept commands.
Figure 9.13 Read Status Register (RDSR) Command Sequence
CS#
Mode 3
SCK
0 1
2
3
4
5
6
7
8
9 10 11 12 13 14 15
Mode 0
Command
SI
SO
Hi-Z
7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7
MSB
Status Register Out
MSB
Status Register Out
The following describes the status and control bits of the Status Register.
Write In Progress (WIP) bit: Indicates whether the device is busy performing a Write Registers, program, or
erase operation. This bit is read-only, and is controlled internally by the device. If WIP is 1, one of these
operations is in progress; if WIP is 0, no such operation is in progress. This bit is a Read-only bit.
Write Enable Latch (WEL) bit: Determines whether the device will accept and execute a Write Registers,
program, or erase command. When set to 1, the device accepts these commands; when set to 0, the device
rejects the commands. This bit is set to 1 by writing the WREN command, and set to 0 by the WRDI
command, and is also automatically reset to 0 after the completion of a Write Registers, program, or erase
operation, and after a power down/power up sequence. WEL cannot be directly set by the WRR command.
January 29, 2013 S25FL064P_00_08
S25FL064P
37
D a t a
S h e e t
Block Protect (BP2, BP1, BP0) bits: Define the portion of the memory area that will be protected against
any changes to the stored data. The Block Protection (BP2, BP1, BP0) bits are either volatile or non-volatile,
depending on the state of the non-volatile bit BPNV in the Configuration register. The Block Protection (BP2,
BP1, BP0) bits are written with the Write Registers (WRR) instruction. When one or more of the Block Protect
(BP2, BP1, BP0) bits is set to 1’s, the relevant memory area is protected against Page Program (PP),
Parameter Sector Erase (P4E, P8E), Sector Erase (SE), Quad Page Programming (QPP) and Bulk Erase
(BE) instructions. If the Hardware Protected mode is enabled, BP2:BP0 cannot be changed.
The Bulk Erase (BE) instruction can be executed only when the Block Protection (BP2, BP1, BP0) bits are set
to 0’s.
The default condition of the BP2-0 bits is binary 000 (all 0’s).
Erase Error bit (E_ERR): The Erase Error Bit is used as a Erase operation success and failure check. When
the Erase Error bit is set to a “1”, it indicates that there was an error which occurred in the last erase
operation. With the Erase Error bit set to a “1”, this bit is reset with the Clear Status Register (CLSR)
command.
Program Error bit (P_ERR): The Program Error Bit is used as a Program operation success and failure
check. When the Program Error bit is set to a “1”, it indicates that there was an error which occurred in the last
program operation. With the Program Error bit set to a “1”, this bit is reset with the Clear Status Register
(CLSR) command.
Status Register Write Disable (SRWD) bit: Provides data protection when used together with the Write
Protect (W#/ACC) signal. The Status Register Write Disable (SRWD) bit is operated in conjunction with the
Write Protect (W#/ACC) input pin. The Status Register Write Disable (SRWD) bit and the Write Protect (W#/
ACC) signal allow the device to be put in the Hardware Protected mode. With the Status Register Write
Disable (SRWD) bit set to a “1” and the W#/ACC driven to the logic low state, the device enters the Hardware
Protected mode; the non-volatile bits of the Status Register (SRWD, BP2, BP1, BP0) and the nonvolatile bits
of the Configuration Register (TBPARM, TBPROT, BPNV and QUAD) become read-only bits and the Write
Registers (WRR) instruction opcode is no longer accepted for execution.
Note that the P_ERR and E_ERR bits will not be set to a 1 if the application writes to a protected memory
area.
9.12
Read Configuration Register (RCR)
The Read Configuration Register (RCR) instruction opcode allows the Configuration Register contents to be
read out of the SO serial output pin. The Configuration Register contents may be read at any time, even while
a program, erase, or write cycle is in progress. When one of these cycles is in progress, it is recommended to
the user to check the Write In Progress (WIP) bit of the Status Register before issuing a new instruction
opcode to the device. The Configuration Register originally shows 00h when the device is first shipped from
the factory to the customer. (Refer to Section 7.8 on page 16 for more details).
Figure 9.14 Read Configuration Register (RCR) Instruction Sequence
CS#
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
0
7
17
18
19
20
21
22
23
1
0
SCK
In s t r u c t i o n
SI
Configuration Register Out
Configuration Register Out
SO
High Impedance
7
6
5
4
MSB
38
3
2
1
MSB
S25FL064P
6
5
4
3
2
7
MSB
S25FL064P_00_08 January 29, 2013
D a t a
9.13
S h e e t
Write Registers (WRR)
The Write Registers (WRR) command allows changing the bits in the Status and Configuration Registers. A
Write Enable (WREN) command, which itself sets the Write Enable Latch (WEL) in the Status Register, is
required prior to writing the WRR command. Table 9.8 shows the status register bits and their functions.
The host system must drive CS# low, then write the WRR command and the appropriate data byte on SI
Figure 9.15.
The WRR command cannot change the state of the Write Enable Latch (bit 1). The WREN command must be
used for that purpose.
The Status Register consists of one data byte in length; similarly, the Configuration Register is also one data
byte in length. The CS# pin must be driven to the logic low state during the entire duration of the sequence.
The WRR command also controls the value of the Status Register Write Disable (SRWD) bit. The SRWD bit
and W#/ACC pin together place the device in the Hardware Protected Mode (HPM). The device ignores all
WRR commands once it enters the Hardware Protected Mode (HPM). Table 9.9 shows that W#/ACC must be
driven low and the SRWD bit must be 1 for this to occur.
The Write Registers (WRR) instruction has no effect on the P/E Error and the WIP bits of the Status &
Configuration Registers. Any bit reserved for the future is always read as a 0
The CS# chip select input pin must be driven to the logic high state after the eighth (see Figure 9.15) or
sixteenth (see Figure 9.16) bit of data has been latched in. If not, the Write Registers (WRR) instruction is not
executed. If CS# is driven high after the eighth cycle then only the Status Register is written to; otherwise,
after the sixteenth cycle both the Status and Configuration Registers are written to. As soon as the CS# chip
select input pin is driven to the logic high state, the self-timed Write Registers cycle is initiated. While the
Write Registers cycle is in progress, the Status Register may still be read to check the value of the Write In
Progress (WIP) bit. The Write In Progress (WIP) bit is a 1 during the self-timed Write Registers cycle, and is a
0 when it is completed. When the Write Registers cycle is completed, the Write Enable Latch (WEL) is set to
a 0. The WRR command can operate at a maximum clock frequency of 104 MHz.
Figure 9.15 Write Registers (WRR) Instruction Sequence – 8 data bits
CS#
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
SCK
In st r u ct i o n
SI
St at u s Regi s t er In
7
6
5
4
3
2
1
0
MSB
SO
January 29, 2013 S25FL064P_00_08
High Impedance
S25FL064P
39
D a t a
S h e e t
Figure 9.16 Write Registers (WRR) Instruction Sequence – 16 data bits
S#
CS
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
SCK
Instruction
Status Register In
SI
7
6
5
4
3
2
Configuration Register In
1
0
7
6
5
4
3
2
1
0
MSB
MSB
High Impedance
SO
Table 9.9 Protection Modes
W#/
ACC
SRWD
Bit
1
1
1
0
0
0
0
1
Memory Content
Mode
Write Protection of Registers
Protected Area
Unprotected Area
Software
Protected
(SPM)
Status & Configuration Registers are Writable
(if WREN instruction has set the WEL bit). The
values in the SRWD, BP2, BP1, & BP0 bits &
those in the Configuration Register can be
changed
Protected against Page
Program, Parameter
Sector Erase, Sector
Erase, and Bulk Erase
Ready to accept Page
Program, Parameter
Sector Erase, & Sector
Erase instructions
Hardware
Protected
(HPM)
Status & Configuration Registers are Hardware
Write Protected. The values in the SRWD,
BP2, BP1, & BP0 bits & those in the
Configuration Register cannot be changed
Protected against Page
Program, Parameter
Sector Erase,
Sector Erase, and Bulk
Erase
Ready to accept Page
Program, Parameter
Sector Erase,
Sector Erase instructions
Note
As defined by the values in the Block Protect (BP2, BP1, BP0) bits of the Status Register, as shown in Table 7.3 on page 18.
Table 9.9 shows that neither W#/ACC or SRWD bit by themselves can enable HPM. The device can enter
HPM either by setting the SRWD bit after driving W#/ACC low, or by driving W#/ACC low after setting the
SRWD bit. However, the device disables HPM only when W#/ACC is driven high.
Note that HPM only protects against changes to the status register. Since BP2:BP0 cannot be changed in
HPM, the size of the protected area of the memory array cannot be changed. Note that HPM provides no
protection to the memory array area outside that specified by BP2:BP0 (Software Protected Mode, or SPM).
If W#/ACC is permanently tied high, HPM can never be activated, and only the SPM (BP2:BP0 bits of the
Status Register) can be used.
The Status and Configuration registers originally default to 00h, when the device is first shipped from the
factory to the customer.
Note: HPM is disabled when the Quad I/O Mode is enabled (Quad bit = 1 in the Configuration Register). W#
becomes IO2; therefore, HPM cannot be utilized.
40
S25FL064P
S25FL064P_00_08 January 29, 2013
D a t a
9.14
S h e e t
Page Program (PP)
The Page Program (PP) command changes specified bytes in the memory array (from 1 to 0 only). A WREN
command is required prior to writing the PP command.
The host system must drive CS# low, and then write the PP command, three address bytes, and at least one
data byte on SI. If the 8 least significant address bits (A7-A0) are not all zero, all transmitted data that goes
beyond the end of the currently selected page are programmed from the starting address of the same page
(from the address whose 8 least significant bits are all zero). CS# must be driven low for the entire duration of
the PP sequence. The command sequence is shown in Figure 9.17 and Table 9.1 on page 23.
The device programs only the last 256 data bytes sent to the device. If the 8 least significant address bits (A7A0) are not all zero, all transmitted data that goes beyond the end of the currently selected page are
programmed from the starting address of the same page (from the address whose 8 least significant bits are
all zero). If fewer than 256 data bytes are sent to device, they are correctly programmed at the requested
addresses without having any effect on the other bytes in the same page.
The host system must drive CS# high after the device has latched the 8th bit of the data byte, otherwise the
device does not execute the PP command. The PP operation begins as soon as CS# is driven high. The
device internally controls the timing of the operation, which requires a period of tPP. The Status Register may
be read to check the value of the Write In Progress (WIP) bit while the PP operation is in progress. The WIP
bit is 1 during the PP operation, and is 0 when the operation is completed. The device internally resets the
Write Enable Latch to 0 before the operation completes (the exact timing is not specified).
The device does not execute a Page Program (PP) command that specifies a page that is protected by the
Block Protect bits (BP2:BP0) (see Table 7.3 on page 18).
Figure 9.17 Page Program (PP) Command Sequence
CS#
0
Mode 3
5
4
3
6
8
7
28 29 30 31 32 33 34 35 36 37 38
9 10
39
Mode 0
24 Bit Address
3
23 22 21
2
1
0
MSB
6
5
4
3
2
1
0
2079
2078
2077
55
2075
51 52 53 54
2072
MSB
CS#
40 41 42 43 44 45 46 47 48 49 50
7
2076
SI
Data Byte 1
2074
Command
2073
SCK
2
1
SCK
Data Byte 2
SI
7
MSB
January 29, 2013 S25FL064P_00_08
6
5
4
3
2
Data Byte 3
1
0
7
6
5
4
MSB
S25FL064P
3
2
Data Byte 256
1
0
7
6
5
4
3
2
1
0
MSB
41
D a t a
9.15
S h e e t
QUAD Page Program (QPP)
The Quad Page Program instruction is similar to the Page Program instruction, except that the Quad Page
Program (QPP) instruction allows up to 256 bytes of data to be programmed at previously erased (FFh)
memory locations using four pins: IO0 (SI), IO1 (SO), IO2 (W#/ACC), and IO3 (HOLD#), instead of just one
pin (SI) as in the case of the Page Program (PP) instruction. This effectively increases the data transfer rate
by up to four times, as compared to the Page Program (PP) instruction. The QPP feature can improve
performance for PROM Programmer and applications that have slow clock speeds < 5 MHz. Systems with
faster clock speed will not realize much benefit for the QPP instruction since the inherent page program time
is much greater than the time it take to clock-in the data.
To use QPP, the Quad Enable Bit in the Configuration Register must be set (QUAD = 1). A Write Enable
instruction must be executed before the device will accept the Quad Page Program instruction (Status
Register-1, WEL = 1). The instruction is initiated by driving the CS# pin low then shifting the instruction code
“32h” followed by a 24 bit address (A23-A0) and at least one data byte, into the IO pins. The CS# pin must be
held low for the entire length of the instruction while data is being sent to the device. All other functions of
Quad Input Page Program are identical to standard Page Program. The QPP instruction sequence is shown
below.
Figure 9.18 QUAD Page Program Instruction Sequence
CS#
29
30
31
32
33
34
35
36
37
38
39
2
1
0
4
0
4
0
4
0
4
0
SO/IO1
5
1
5
1
5
1
5
1
W#/ACC/IO2
6
2
6
2
6
2
6
2
7
3
7
3
0
2
1
3
4
5
6
7
8
9
28
10
SCK
24 Bit
Address
Instruction
SI/IO0
3
21
23 22
*
3
7
HOLD#/IO3
3
7
*
Byte 1
*
Byte 2
*
Byte 3
*
Byte 4
543
542
541
540
539
538
537
536
CS#
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
SI/IO0
4
0
4
0
4
0
4
0
4
0
4
0
4
0
4
0
4
0
4
0
4
0
4
SO/IO1
5
1
5
1
5
1
5
1
5
1
5
1
5
1
5
1
5
1
5
1
5
1
5
1
W#/ACC/IO2
6
2
6
2
6
2
6
2
6
2
6
2
6
2
6
2
6
2
6
2
6
2
6
2
SCK
HOLD#/IO3
7
3
*
Byte 5
7
3
*
Byte 6
7
3
*
Byte 7
7
3
*
Byte 8
7
3
*
Byte 9
7
3
*
Byte 10
7
3
*
Byte 11
7
3
*
Byte 12
0
3
3
7
3
7
3
7
*
*
*
*
Byte 253 Byte 254 Byte 255 Byte 256
7
*MSB
42
S25FL064P
S25FL064P_00_08 January 29, 2013
D a t a
9.16
S h e e t
Parameter Sector Erase (P4E, P8E)
The Parameter Sector Erase (P4E, P8E) command sets all bits at all addresses within a specified sector to a
logic 1 (FFh). A WREN command is required prior to writing the Parameter Sector Erase commands.
The host system must drive CS# low, and then write the P4E or P8E command, plus three address bytes on
SI. Any address within the sector (see Table 8.1 on page 21 and Table 8.2 on page 22) is a valid address for
the P4E or P8E command. CS# must be driven low for the entire duration of the P4E/P8E sequence. The
command sequence is shown in Figure 9.19 and Table 9.1 on page 23.
The host system must drive CS# high after the device has latched the 24th bit of the P4E/P8E address,
otherwise the device does not execute the command. The parameter sector erase operation begins as soon
as CS# is driven high. The device internally controls the timing of the operation, which requires a period of
tSE. The Status Register may be read to check the value of the Write In Progress (WIP) bit while the
parameter sector erase operation is in progress. The WIP bit is 1 during the P4E/P8E operation, and is 0
when the operation is completed. The device internally resets the Write Enable Latch to 0 before the
operation completes (the exact timing is not specified).
A Parameter Sector Erase (P4E, P8E) instruction applied to a sector that has been Write Protected through
the Block Protect Bits will not be executed.
The Parameter Sector Erase Command (P4E, P8E) consists of an 8-bit instruction and a 24-bit address. The
Parameter sector is identified by the upper address bits (A23-A12). Any address within the Parameter sector
can be used in the Parameter Sector Erase Commands. If the address is not a valid 4 kB Parameter sector
address, the Parameter Sector Erase Command will be ignored, and the sector will not be erased.
The P8E Parameter Sector Erase Command erases two sequential 4 kB Parameter sectors. The Parameter
sector address LSB (A12) is disregarded so that the two Parameter sectors in the selected address space
can be erased. If the sector address (A23-A12) of Parameter sector n is an even number, Parameter sectors
n and n+1 will be erased. If the sector address (A23-A12) of Parameter sector n is an odd number, Parameter
sectors n and n-1 will be erased.
Figure 9.19 Parameter Sector Erase (P4E, P8E) Instruction Sequence
CS#
0
1
2
3
4
5
6
7
8
9
10
28 29 30 31
SCK
Instruction
24 Bit Address
23 22 21
SI
3
2
1
0
MSB
January 29, 2013 S25FL064P_00_08
S25FL064P
43
D a t a
9.17
S h e e t
Sector Erase (SE)
The Sector Erase (SE) command sets all bits at all addresses within a specified sector to a logic 1. A WREN
command is required prior to writing the SE command.
The host system must drive CS# low, and then write the SE command plus three address bytes on SI. Any
address within the sector (see Table 7.3 on page 18) is a valid address for the SE command. CS# must be
driven low for the entire duration of the SE sequence. The command sequence is shown in Figure 9.20 and
Table 9.1 on page 23.
The host system must drive CS# high after the device has latched the 24th bit of the SE address, otherwise
the device does not execute the command. The SE operation begins as soon as CS# is driven high. The
device internally controls the timing of the operation, which requires a period of tSE. The Status Register may
be read to check the value of the Write In Progress (WIP) bit while the SE operation is in progress. The WIP
bit is 1 during the SE operation, and is 0 when the operation is completed. The device internally resets the
Write Enable Latch to 0 before the operation completes (the exact timing is not specified).
The device only executes a SE command for those sectors which are not protected by the Block Protect bits
(BP2:BP0) (see Table 7.3 on page 18). Otherwise, the device ignores the command.
A 64 kB sector erase (D8h) command issued on 4 kB or 8 kB erase sectors will erase all sectors in the
specified 64 kB region. However, please note that a 4 kB sector erase (20h) or 8 kB sector erase (40h)
command will not work on a 64 kB sector.
Figure 9.20 Sector Erase (SE) Command Sequence
CS#
Mode 3
SCK
0
1
2
3
4
5
6
7
8
9
10
28
29
30
31
1
0
Mode 0
Command
SI
24 bit Address
23
22
21
3
2
MSB
SO
44
Hi-Z
S25FL064P
S25FL064P_00_08 January 29, 2013
D a t a
9.18
S h e e t
Bulk Erase (BE)
The Bulk Erase (BE) command sets all the bits within the entire memory array to logic 1s. A WREN command
is required prior to writing the BE command.
The host system must drive CS# low, and then write the BE command on SI. CS# must be driven low for the
entire duration of the BE sequence. The command sequence is shown in Figure 9.21 and Table 9.1
on page 23.
The host system must drive CS# high after the device has latched the 8th bit of the CE command, otherwise
the device does not execute the command. The BE operation begins as soon as CS# is driven high. The
device internally controls the timing of the operation, which requires a period of tBE. The Status Register may
be read to check the value of the Write In Progress (WIP) bit while the BE operation is in progress. The WIP
bit is 1 during the BE operation, and is 0 when the operation is completed. The device internally resets the
Write Enable Latch to 0 before the operation completes (the exact timing is not specified).
The device only executes a BE command if all Block Protect bits (BP2:BP0) are 0 (see Table 7.3
on page 18). Otherwise, the device ignores the command.
Figure 9.21 Bulk Erase (BE) Command Sequence
CS#
Mode 3
SCK
0
1
2
3
4
5
6
7
Mode 0
Command
SI
SO
January 29, 2013 S25FL064P_00_08
Hi-Z
S25FL064P
45
D a t a
9.19
S h e e t
Deep Power-Down (DP)
The Deep Power-Down (DP) command provides the lowest power consumption mode of the device. It is
intended for periods when the device is not in active use, and ignores all commands except for the Release
from Deep Power-Down (RES) command. The DP mode therefore provides the maximum data protection
against unintended write operations. The standard standby mode, which the device goes into automatically
when CS# is high (and all operations in progress are complete), should generally be used for the lowest
power consumption when the quickest return to device activity is required.
The host system must drive CS# low, and then write the DP command on SI. CS# must be driven low for the
entire duration of the DP sequence. The command sequence is shown in Figure 9.22 and Table 9.1
on page 23.
The host system must drive CS# high after the device has latched the 8th bit of the DP command, otherwise
the device does not execute the command. After a delay of tDP, the device enters the DP mode and current
reduces from ISB to IDP (see Table 16.1 on page 56).
Once the device has entered the DP mode, all commands are ignored except the RES command (which
releases the device from the DP mode). The RES command also provides the Electronic Signature of the
device to be output on SO, if desired (see Section 9.20 and 9.20.1).
DP mode automatically terminates when power is removed, and the device always powers up in the standard
standby mode. The device rejects any DP command issued while it is executing a program, erase, or Write
Registers operation, and continues the operation uninterrupted.
Figure 9.22 Deep Power-Down (DP) Command Sequence
CS#
tDP
Mode 3
SCK
0
1
2
3
4
5
6
7
Mode 0
Command
SI
SO
Hi-Z
Standby Mode
46
S25FL064P
Deep Power-down Mode
S25FL064P_00_08 January 29, 2013
D a t a
9.20
S h e e t
Release from Deep Power-Down (RES)
The device requires the Release from Deep Power-Down (RES) command to exit the Deep Power-Down
mode. When the device is in the Deep Power-Down mode, all commands except RES are ignored.
The host system must drive CS# low and write the RES command to SI. CS# must be driven low for the entire
duration of the sequence. The command sequence is shown in Figure 9.23 and Table 9.1 on page 23.
The host system must drive CS# high tRES(max) after the 8-bit RES command byte. The device transitions
from DP mode to the standby mode after a delay of tRES (see Figure 18.1). In the standby mode, the device
can execute any read or write command.
Note: The RES command does not reset the Write Enable Latch (WEL) bit.
Figure 9.23 Release from Deep Power-Down (RES) Command Sequence
CS#
Mode 3
SCK
0
1
2
3
4
5
6
7
Mode 0
Command
tRES
SI
SO
Hi-Z
Deep Power-down Mode
January 29, 2013 S25FL064P_00_08
S25FL064P
Standby Mode
47
D a t a
9.20.1
S h e e t
Release from Deep Power-Down and Read Electronic Signature (RES)
The device features an 8-bit Electronic Signature, which can be read using the RES command. See
Figure 9.24 and Table 9.1 on page 23 for the command sequence and signature value. The Electronic
Signature is not to be confused with the identification data obtained using the RDID command. The device
offers the Electronic Signature so that it can be used with previous devices that offered it; however, the
Electronic Signature should not be used for new designs, which should read the RDID data instead.
After the host system drives CS# low, it must write the RES command followed by 3 dummy bytes to SI (each
bit is latched on SI during the rising edge of SCK). The Electronic Signature is then output on SO; each bit is
shifted out on the falling edge of SCK. The RES operation is terminated by driving CS# high after the
Electronic Signature is read at least once. Additional clock cycles on SCK with CS# low cause the device to
output the Electronic Signature repeatedly.
When CS# is driven high, the device transitions from DP mode to the standby mode after a delay of tRES, as
previously described. The RES command always provides access to the Electronic Signature of the device
and can be applied even if DP mode has not been entered.
Any RES command issued while an erase, program, or Write Registers operation is in progress not executed,
and the operation continues uninterrupted.
Figure 9.24 Release from Deep Power-Down and RES Command Sequence
CS#
0
1
2
3
4
5
6
7
8
9
10
28
29
30 31
32
33
34
35
36
37
38
39
SCK
23 22 21
SI
t RES
3 Dummy
Bytes
Instruction
3
2
1
0
MSB
Electonic ID
High Impedance
SO
7
6
5
4
3
2
1
0
MSB
Deep Power-Down Mode
9.21
Standby Mode
Clear Status Register (CLSR)
The Clear Status Register command resets bit SR5 (Erase Fail Flag) and bit SR6 (Program Fail Flag). It is not
necessary to set the WEL bit before the Clear SR Fail Flags command is executed. The WEL bit will be
unchanged after this command is executed.
Figure 9.25 Clear Status Register (CLSR) Instruction Sequence
CS
S#
0
1
2
3
4
5
6
7
SCK
Instruction
SI
48
S25FL064P
S25FL064P_00_08 January 29, 2013
D a t a
9.22
S h e e t
OTP Program (OTPP)
The OTP Program command programs data in the OTP region, which is in a different address space from the
main array data. Refer to, “OTP Regions” for details on the OTP region. The protocol of the OTP Program
command is the same as the Page Program command, except that the OTP Program command requires
exactly one byte of data; otherwise, the command will be ignored. To program the OTP in bit granularity, the
rest of the bits within the data byte can be set to “1”.
The OTP memory space can be programmed one or more times, provided that the OTP memory space is not
locked (as described in “Locking OTP Regions”). Subsequent OTP programming can be performed only on
the unprogrammed bits (that is, “1” data).
Note: The Write Enable (WREN) command must precede the OTPP command before programming of the
OTP can occur.
Figure 9.26 OTP Program Instruction Sequence
CS#
0
1
2
3
4
5
6
7
8
9
10
28 29 30 31 32 33 34 35 36 37 38 39
SCK
24 Bit
Address
Instruction
SI
23 22 21
Data Byte 1
3
2
1
0
MSB
9.23
7
6
5
4
3
2
1
0
MSB
Read OTP Data Bytes (OTPR)
The Read OTP Data Bytes command reads data from the OTP region. Refer to “OTP Regions” for details on
the OTP region. The protocol of the Read OTP Data Bytes command is the same as the Fast Read Data
Bytes command except that it will not wrap to the starting address after the OTP address is at its maximum;
instead, the data will be indeterminate.
Figure 9.27 Read OTP Instruction Sequence
CS
0
1
2
3
4
5
6
7
8
9
10
28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47
SCK
24 Bit
Address
Instruction
SI
23 22 21
3
Dummy Byte
2
1
0
7
6
5
4
3
2
1
0
DATA OUT 1
SO
High Impedance
7
MSB
January 29, 2013 S25FL064P_00_08
S25FL064P
6
5
4
3
2
DATA OUT 2
1
0
7
MSB
49
D a t a
S h e e t
10. OTP Regions
The OTP Regions are separately addressable from the main array and consists of two 8-byte (ESN), thirty
16-byte, and one 10-byte regions that can be individually locked.
 The two 8-byte ESN region is a special order part (please contact your local Spansion sales representative
for further details). The two 8-byte regions enable permanent part identification through an Electronic
Serial Number (ESN). The customer can utilize the ESN to pair a flash device with the system CPU/ASIC
to prevent system cloning. The Spansion factory programs and locks the lower 8-byte ESN with a 64-bit
randomly generated, unique number. The upper 8-byte ESN is left blank for customer use or, if special
ordered, Spansion can program (and lock) in a unique customer ID.
Lock Register ESN1
(Bit 0)
Lock Register ESN2
(Bit 1)
ESN1 Region Contains
1h
1h
FFh
FFh
Unique random pattern
Factory/Customer
programmed pattern
Standard part
Special order part
0h
1h/0h
ESN2 Region Contains
 The thirty 16-byte and one 10-byte OTP regions are open for the customer usage.
 The thirty 16-byte, one 10-byte, and upper 8-byte ESN OTP regions can be individually locked by the end
user. Once locked, the data cannot changed. The locking process is permanent and cannot be undone.
The following general conditions should be noted with respect to the OTP Regions:
 On power-up, or following a hardware reset, or at the end of an OTPP or an OTPR command, the device
reverts to sending commands to the normal address space.
 Reads or Programs outside of the OTP Regions will be ignored
 The OTP Region is not accessible when the device is executing an Embedded Program or Embedded
Erase algorithm.
 The ACC function is not available when accessing the OTP Regions.
 The thirty 16-byte and one 10-byte OTP regions are left open for customer usage, but special care of the
OTP locking must be maintained, or else a malevolent user can permanently lock the OTP regions. This is
not a concern, if the OTP regions are not used.
10.1
Programming OTP Address Space
The protocol of the OTP Program command (42h) is the same as the Page Program command. Refer to
Table 9.1 for the command description and protocol. The OTP Program command can be issued multiple
times to any given OTP address, but this address space can never be erased. After a given OTP region is
programmed, it can be locked to prevent further programming with the OTP lock registers (refer to
Section 10.3). The valid address range for OTP Program is depicted in the figure below. OTP Program
operations outside the valid OTP address range will be ignored.
10.2
Reading OTP Data
The protocol of the OTP Read command (4Bh) is the same as that of the Fast Read command. Refer to
Table 9.1 for the command description and protocol. The valid address range for OTP Reads is depicted in
the figure below. OTP Read operations outside the valid OTP address range will yield indeterminate data.
10.3
Locking OTP Regions
In order to permanently lock the ESN and OTP regions, individual bits at the specified addresses can be set
to 0 to lock specific regions of OTP memory, as highlighted in Figures 10.1 and 10.2.
50
S25FL064P
S25FL064P_00_08 January 29, 2013
D a t a
S h e e t
Figure 10.1 OTP Memory Map - Part 1
OT P R EGION
ADDRESS
0x213h
16 bytes (OTP16)
0x204h
0x203h
16 bytes (OTP15)
0x1F4h
0x1F3h
16 bytes (OTP14)
0x1E4h
0x1E3
16 bytes (OTP13)
0x1D4h
0x1D3h
16 bytes (OTP12)
0x1C4h
0x1C3h
16 bytes (OTP11)
0x1B4h
0x1B3h
16 bytes (OTP10)
0x1A4h
0x1A3h
16 bytes (OTP9)
0x194h
0x193h
16 bytes (OTP8)
0x184h
0x183h
16 bytes (OTP7)
0x174h
0x173h
16 bytes (OTP6)
0x164h
0x163h
16 bytes (OTP5)
0x154h
0x153h
16 bytes (OTP4)
Address
0x112h
0x144h
0x143h
16 bytes (OTP3)
0x134h
0x133h
16 bytes (OTP2)
0x124h
0x123h
16 bytes (OTP1)
0x114h
0x113h
0x112h
0x111h
0x113h
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
8 bytes (ES N2)
0x10Ah
0x109h
8 bytes (ES N1)
0x102h
0x101h
0x100h
0x100h
Reserved
X
X
X
X
X
X
Bit 1 Bit 0
B it
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2- 7
Locks R egion…
OTP1
OTP2
OTP3
OTP4
OTP5
OTP6
OTP7
OTP8
OTP9
OTP10
OTP11
OTP12
OTP13
OTP14
OTP15
OTP16
ESN1
ES N2
R eserved
Notes
1. Bit 0 at address 0x100h locks ESN1 region.
2. Bit 1 at address 0x100h locks ESN2 region.
3. Bits 2-7 (“X”) are NOT programmable and will be ignored.
January 29, 2013 S25FL064P_00_08
S25FL064P
51
D a t a
S h e e t
Figure 10.2 OTP Memory Map - Part 2
ADDRESS
OT P R EGION
0x2FFh
10 bytes (OTP31)
0x2F6h
0x2F5h
16 bytes (OTP30)
0x2E6h
0x2E5
16 bytes (OTP29)
0x2D6h
0x2D5h
16 bytes (OTP28)
0x2C6h
0x2C5h
16 bytes (OTP27)
0x2B6h
0x2B5h
16 bytes (OTP26)
0x2A6h
0x2A5h
16 bytes (OTP25)
0x296h
0x295h
16 bytes (OTP24)
0x286h
0x285h
16 bytes (OTP23)
0x276h
0x275h
16 bytes (OTP22)
0x266h
0x265h
16 bytes (OTP21)
Address
0x214h
0x256h
0x255h
16 bytes (OTP20)
0x246h
0x245h
16 bytes (OTP19)
0x236h
0x235h
0x215h
16 bytes (OTP18)
0x226h
0x225h
16 bytes (OTP17)
0x216h
0x215h
0x214h
X
Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
B it
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
Locks Region…
OTP17
OTP18
OTP19
OTP20
OTP21
OTP22
OTP23
OTP24
OTP25
OTP26
OTP27
OTP28
OTP29
OTP30
OTP31
R eserved
Note
1. Bit 7 (“X”) at address 0x215h is NOT programmable and will be ignored.
52
S25FL064P
S25FL064P_00_08 January 29, 2013
D a t a
S h e e t
11. Power-up and Power-down
During power-up and power-down, certain conditions must be observed. CS# must follow the voltage applied
on VCC, and must not be driven low to select the device until VCC reaches the allowable values as follows
(see Figure 11.1 and Table 11.1 on page 54):
 At power-up, VCC (min.) plus a period of tPU
 At power-down, GND
A pull-up resistor on Chip Select (CS#) typically meets proper power-up and power-down requirements.
No Read, Write Registers, program, or erase command should be sent to the device until VCC rises to the
VCC min., plus a delay of tPU. At power-up, the device is in standby mode (not Deep Power-Down mode) and
the WEL bit is reset (0).
Each device in the host system should have the VCC rail decoupled by a suitable capacitor close to the
package pins (this capacitor is generally of the order of 0.1 µF), as a precaution to stabilizing the VCC feed.
When VCC drops from the operating voltage to below the minimum VCC threshold at power-down, all
operations are disabled and the device does not respond to any commands. Note that data corruption may
result if a power-down occurs while a Write Registers, program, or erase operation is in progress.
Figure 11.1 Power-Up Timing Diagram
Vcc
(max)
Vcc
(min)
Vcc
t PU
Full Device Access
Time
Figure 11.2 Power-down and Voltage Drop
January 29, 2013 S25FL064P_00_08
S25FL064P
53
D a t a
S h e e t
Table 11.1 Power-Up / Power-Down Voltage and Timing
Symbol
VCC(min)
VCC(cut-off)
VCC(low)
Parameter
Min
Max
Unit
VCC (minimum operation voltage)
2.7
VCC (Cut off where re-initialization is needed)
2.4
V
VCC (Low voltage for initialization to occur at read/standby)
VCC (Low voltage for initialization to occur at embedded)
0.2
V
tPU
VCC(min.) to device operation
TPD
VCC (low duration time)
V
2.3
300
1.0
µs
µs
12. Initial Delivery State
The device is delivered with the memory array erased i.e. all bits are set to 1 (FFh) upon initial factory
shipment. The Status Register and Configuration Register contains 00h (all bits are set to 0).
13. Program Acceleration via W#/ACC Pin
The program acceleration function requires applying VHH to the W#/ACC input, and then waiting a period of
tWC. Minimum tVHH rise and fall times is required for W#/ACC to change to VHH from VIL or VIH. Removing
VHH from the W#/ACC pin returns the device to normal operation after a period of tWC.
Figure 13.1 ACC Program Acceleration Timing Requirements
VHH
ACC
tWC
tWC
VIL or VIH
VIL or VIH
Command OK
tVHH
tVHH
Note
Only Read Status Register (RDSR) and Page Program (PP) operation are allow when ACC is at (VHH).
The W#/ACC pin is disabled during Quad I/O mode.
Table 13.1 ACC Program Acceleration Specifications
Symbol
54
Parameter
Min.
Max
9.5
Unit
VHH
ACC Pin Voltage High
8.5
tVHH
ACC Voltage Rise and Fall time
2.2
µs
tWC
ACC at VHH and VIL or VIH to First command
5
µs
S25FL064P
V
S25FL064P_00_08 January 29, 2013
D a t a
S h e e t
14. Electrical Specifications
14.1
Absolute Maximum Ratings
Description
Rating
Ambient Storage Temperature
-65°C to +150°C
-0.5V to VCC+0.5V
Voltage with Respect to Ground: All Inputs and I/Os
Output Short Circuit Current (Note 2)
200 mA
Notes
1. Minimum DC voltage on input or I/Os is -0.5V. During voltage transitions, inputs or I/Os may undershoot GND to -2.0V for periods of up to
20 ns. See Figure 14.1. Maximum DC voltage on input or I/Os is VCC + 0.5V. During voltage transitions inputs or I/Os may overshoot to
VCC + 2.0V for periods up to 20 ns. See Figure 14.2.
2. No more than one output may be shorted to ground at a time. Duration of the short circuit should not be greater than one second.
3. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only;
functional operation of the device at these or any other conditions above those indicated in the operational sections of this data sheet is
not implied. Exposure of the device to absolute maximum rating conditions for extended periods may affect device reliability.
Figure 14.1 Maximum Negative Overshoot Waveform
20 ns
20 ns
+0.8V
–0.5V
–2.0V
20 ns
Figure 14.2 Maximum Positive Overshoot Waveform
20 ns
VCC
+2.0V
VCC
+0.5V
2.0V
20 ns
20 ns
15. Operating Ranges
Table 15.1 Operating Ranges
Description
Ambient Operating Temperature (TA)
Positive Power Supply
Rating
Industrial
–40°C to +85°C
Automotive In-Cabin
–40°C to +105°C
Voltage Range
2.7V to 3.6V
Note
Operating ranges define those limits between which functionality of the device is guaranteed.
January 29, 2013 S25FL064P_00_08
S25FL064P
55
D a t a
S h e e t
16. DC Characteristics
This section summarizes the DC Characteristics of the device. Designers should check that the operating
conditions in their circuit match the measurement conditions specified in the Test Specifications in Table 17.1
on page 57, when relying on the quoted parameters.
Table 16.1 DC Characteristics (CMOS Compatible)
Limits
Symbol
Parameter
Test Conditions
Typ*
Min.
VCC
Supply Voltage
VHH
ACC Program Acceleration
Voltage
VIL
Unit
Max
2.7
3.6
V
8.5
9.5
V
Input Low Voltage
-0.3
0.3 x VCC
V
VIH
Input High Voltage
0.7 x VCC
VCC +0.5
V
VOL
Output Low Voltage
IOL = 1.6 mA, VCC = VCC min.
VOH
Output High Voltage
IOH = -0.1 mA
VCC = 2.7V to 3.6V
0.4
VCC-0.6
V
V
ILI
Input Leakage Current
VCC = VCC Max,
VIN = VCC or GND
±2
µA
ILO
Output Leakage Current
VCC = VCC Max,
VIN = VCC or GND
±2
µA
At 80 MHz
(Dual or Quad)
38
ICC1
Active Power Supply Current READ
(SO = Open)
At 104 MHz (Serial)
26
At 40 MHz (Serial)
15
ICC2
Active Power Supply Current
(Page Program)
CS# = VCC
26
mA
ICC3
Active Power Supply Current
(WRR)
CS# = VCC
15
mA
ICC4
Active Power Supply Current
(SE)
CS# = VCC
26
mA
ICC5
Active Power Supply Current
(BE)
CS# = VCC
26
mA
ISB1
Standby Current
CS# = VCC;
VIN = GND or VCC
80
200
µA
IPD
Deep Power-down Current
CS# = VCC;
VIN = GND or VCC
3
10
µA
mA
*Typical values are at TAI = 25°C and VCC = 3V
56
S25FL064P
S25FL064P_00_08 January 29, 2013
D a t a
S h e e t
17. Test Conditions
Figure 17.1 AC Measurements I/O Waveform
0.8 VCC
0.7 VCC
0.5 VCC
0.3 VCC
Input Levels
0.2 VCC
Input and Output
Timing Reference levels
Table 17.1 Test Specifications
Symbol
Parameter
CL
Load Capacitance
Min
Max
30
Input Rise and Fall Times
January 29, 2013 S25FL064P_00_08
Unit
pF
5
ns
Input Pulse Voltage
0.2 VCC to 0.8 VCC
V
Input Timing Reference Voltage
0.3 VCC to 0.7 VCC
V
Output Timing Reference Voltage
0.5 VCC
V
S25FL064P
57
D a t a
S h e e t
18. AC Characteristics
Figure 18.1 AC Characteristics
Symbol
(Notes)
fR
fC
Parameter
(Notes)
Min.
(Notes)
Typ
(Notes)
Max
(Notes)
Unit
MHz
SCK Clock Frequency for READ command
DC
40
SCK Clock Frequency for RDID command
DC
50
SCK Clock Frequency for all others:
FAST_READ, PP, QPP, P4E, P8E, SE, BE, DP,
RES, WREN, WRDI, RDSR, WRR, READ_ID
DC
104 (serial)
80 (dual/quad)
MHz
tWH, tCH (5)
Clock High Time
4.5
ns
tWL, tCL (5)
Clock Low Time
4.5
ns
tCRT, tCLCH
Clock Rise Time (slew rate)
0.1
V/ns
tCFT, tCHCL
Clock Fall Time (slew rate)
0.1
V/ns
tCS
CS# High Time (Read Instructions)
CS# High Time (Program/Erase)
10
tCSS
CS# Active Setup Time (relative to SCK)
3
tCSH
ns
50
ns
CS# Active Hold Time (relative to SCK)
3
ns
tSU:DAT
Data in Setup Time
3
ns
tHD:DAT
Data in Hold Time
2
tV
Clock Low to Output Valid
0
tHO
Output Hold Time
2
tDIS
Output Disable Time
ns
8 (Serial)Δ
9.5 (Dual/Quad)Δ
6.5 (Serial)∞
8 (Dual/Quad)∞
7 (Dual/Quad)Ω
ns
8
ns
ns
tHLCH
HOLD# Active Setup Time (relative to SCK)
3
ns
tCHHH
HOLD# Active Hold Time (relative to SCK)
3
ns
tHHCH
HOLD# Non Active Setup Time (relative to SCK)
3
ns
tCHHL
HOLD# Non Active Hold Time (relative to SCK)
3
ns
tHZ
HOLD# enable to Output Invalid
8
ns
tLZ
HOLD# disable to Output Valid
8
ns
tWPS
W#/ACC Setup Time (4)
20
tWPH
W#/ACC Hold Time (4)
100
tW
WRR Cycle Time
tPP
Page Programming (1)(2)
tEP
Page Programming (ACC = 9V) (1)(2)(3)
ns
ns
100
ms
1.5
3
ms
1.2
2.4
ms
sec
tSE
Sector Erase Time (64 kB) (1)(2)
0.5
2
tPE
Parameter Sector Erase Time(4 kB or 8 kB) (1)(2)
200
800
ms
tBE
Bulk Erase Time (1)(2)
64
128
sec
tRES
Deep Power-down to Standby Mode
30
µs
tDP
Time to enter Deep Power-down Mode
10
tVHH
ACC Voltage Rise and Fall time
tWC
ACC at VHH and VIL or VIH to first command
µs
2.2
µs
5
µs
Notes
1. Typical program and erase times assume the following conditions: 25°C, VCC = 3.0V; 10,000 cycles; checkerboard data pattern
2. Under worst-case conditions of 85°C; VCC = 2.7V; 100,000 cycles.
3. Acceleration mode (9V ACC) only in Program mode, not Erase.
4. Only applicable as a constraint for WRR instruction when SRWD is set to a 1.
5. tWH + tWL must be less than or equal to 1/fC.
6. Δ Full VCC range (2.7 – 3.6V) & CL = 30 pF
7. ∞ Regulated VCC range (3.0 – 3.6V) and CL = 30 pF
8. Ω Regulated VCC range (3.0 – 3.6V) and CL = 15 pF
58
S25FL064P
S25FL064P_00_08 January 29, 2013
D a t a
18.1
S h e e t
Capacitance
Symbol
CIN
COUT
Parameter
Test Conditions
Input Capacitance
(applies to SCK, PO7-PO0, SI, CS#)
Output Capacitance
(applies to PO7-PO0, SO)
Min
Typ
Max
Unit
VOUT = 0V
9.0
12.0
pF
VIN = 0V
12.0
16.0
pF
Notes:
1. Sampled, not 100% tested.
2. Test conditions TA = 25°C, f = 1.0 MHz.
3. For more information on pin capacitance, please consult the IBIS models.
Figure 18.2 SPI Mode 0 (0,0) Input Timing
tCS
CS#
tCSH
tCSH
tCSS
tCSS
SCK
tSU:DAT tHD:DAT
tCRT
SI
tCFT
MSB IN
SO
LSB IN
Hi-Z
Figure 18.3 SPI Mode 0 (0,0) Output Timing
CS#
tWH
SCK
tV
tHO
tWL
tV
SO
January 29, 2013 S25FL064P_00_08
tDIS
tHO
LSB OUT
S25FL064P
59
D a t a
S h e e t
Figure 18.4 HOLD# Timing
CS#
tCHHL
tHHCH
tHLCH
SCK
tCHHH
tHZ
tLZ
SO
SI
HOLD#
Figure 18.5 Write Protect Setup and Hold Timing during WRR when SRWD = 1
W#
tWPS
tWPH
CS#
SCK
SI
SO
60
Hi-Z
S25FL064P
S25FL064P_00_08 January 29, 2013
D a t a
S h e e t
19. Physical Dimensions
19.1
SO3 016 — 16-pin Wide Plastic Small Outline Package (300-mil Body Width)
January 29, 2013 S25FL064P_00_08
S25FL064P
61
D a t a
19.2
S h e e t
WNF 008 — WSON 8-contact (6 x 8 mm) No-Lead Package
NOTES:
PACKAGE
SYMBOL
1.
DIMENSIONING AND TOLERANCING CONFORMS TO
ASME Y14.5M - 1994.
2.
ALL DIMENSIONS ARE IN MILLMETERS.
3.
N IS THE TOTAL NUMBER OF TERMINALS.
4
DIMENSION “b” APPLIES TO METALLIZED TERMINAL AND IS
MEASURED BETWEEN 0.15 AND 0.30mm FROM TERMINAL
TIP. IF THE TERMINAL HAS THE OPTIONAL RADIUS ON THE
OTHER END OF THE TERMINAL, THE DIMENSION “b”
SHOULD NT BE MEASURED IN THAT RADIUS AREA.
WNF008
MIN
NOM
MAX
NOTE
e
1.27 BSC.
N
8
3
ND
4
5
L
0.45
0.50
b
0.35
0.40
0.55
0.45
D2
4.70
4.80
4.90
E2
5.70
5.80
5.90
4
5
ND REFER TO THE NUMBER OF TERMINALS ON D SIDE.
6.
MAX. PACKAGE WARPAGE IS 0.05mm.
D
6.00 BSC
7.
MAXIMUM ALLOWABLE BURRS IS 0.076mm IN ALL DIRECTIONS.
E
8.00 BSC
8
PIN #1 ID ON TOP WILL BE LASER MARKED.
9
BILATERAL COPLANARITY ZONE APPLIES TO THE EXPOSED
HEAT SINK SLUG AS WELL AS THE TERMINALS.
10
A MAXIMUM 0.15mm PULL BACK (L1) MAY BE PRESENT.
A
0.70
0.75
0.80
A1
0.00
0.02
0.05
K
L1
0.20 MIN.
0.00
---
0.15
10
g1015 \ 16-038.30 \ 07.21.11
62
S25FL064P
S25FL064P_00_08 January 29, 2013
D a t a
19.3
S h e e t
FAB024 — 24-ball Ball Grid Array (6 x 8 mm) package
January 29, 2013 S25FL064P_00_08
S25FL064P
63
D a t a
19.4
S h e e t
FAC024 — 24-ball Ball Grid Array (6 x 8 mm) package
PACKAGE
FAC024
JEDEC
N/A
DxE
SYMBOL
NOTES:
8.00 mm x 6.00 mm NOM
PACKAGE
MIN
NOM
MAX
A
---
---
1.20
A1
0.25
---
---
A2
0.70
---
0.90
NOTE
PROFILE
BALL HEIGHT
BODY THICKNESS
D
8.00 BSC.
BODY SIZE
E
6.00 BSC.
BODY SIZE
D1
5.00 BSC.
MATRIX FOOTPRINT
E1
3.00 BSC.
MATRIX FOOTPRINT
MD
6
MATRIX SIZE D DIRECTION
ME
4
MATRIX SIZE E DIRECTION
N
24
BALL COUNT
Øb
0.35
0.40
e
1.00 BSC.
SD/ SE
0.5/0.5
0.45
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JEP95, SECTION
4.3, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
BALL DIAMETER
n IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6
DATUM C IS THE SEATING PLANE AND IS DEFINED BY THE
CROWNS OF THE SOLDER BALLS.
7
BALL PITCHL
SOLDER BALL PLACEMENT
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
DEPOPULATED SOLDER BALLS
J
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
PACKAGE OUTLINE TYPE
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
10 OUTLINE AND DIMENSIONS PER CUSTOMER REQUIREMENT.
3642 F16-038.9 \ 09.10.09
64
S25FL064P
S25FL064P_00_08 January 29, 2013
D a t a
S h e e t
20. Revision History
Section
Description
Revision 01 (July 18, 2008)
Initial release
Revision 02 (July 2, 2009)
Distinctive Characteristics
Added BGA package information
Connection Diagrams
Added BGA package
Ordering Information
Valid Combinations
Configuration Register
Added Automotive In-cabin information
Added BGA package information
Corrected Valid Combination Table
Added Suggested Cross Setting Table
Updated Configuration Register Table
Accelerated Programming Operation
Added note for ACC function
Command Definitions
Updated Instruction Set Table
Dual Output Read Mode (DOR)
Added statement for Dual Output Read command.
Quad Output Read Mode (QOR)
Added statement for Dual Output Read command
Updated Read Identification description
Read Identification (RDID)
Updated figure for RDID
Updated CFI table for 29h and 45h
Read Status Register (RDSR)
Added note for P_ERR and E_ERR
Read Configuration Register (RCR)
Updated figure for RCR
Write Registers (WRR)
Added note for HPM
Parameter Sector Erase (P4E, P8E)
Sector Erase (SE)
Updated description for P4E/P8E command
Updated figure for Parameter Sector Erase
Updated description for SE command
Release from Deep Power-Down (RES) Added note for RES command
Release from Deep Power-Down and
Read Electronic Signature (RES)
OTP Regions
Updated figure for RES
Updated descriptions
Added ESN1 ESN2 Table
Power-up and Power-down
Updated Power-Up / Power-Down Voltage and Timing Table
DC Characteristics
Updated ICC1 and ICC3
AC Characteristics
Physical Dimensions
Added Automotive In-cabin spec for fC
Updated tWH, tCH and tWL, tCL
Added BGA 6 x 8 mm package
Revision 03 (October 5, 2009)
Global
Changed all references to RDID clock rate from 40 to 50 MHz
Added “5 x 5 pin configuration” to Figure 2.3 title
Connection Diagrams
Added 6 x 4 pin configuration BGA connection diagram
Added note regarding exposed central pad on bottom of package to the WSON connection diagram
Ordering Information
Added 02 and 03 model numbers for BGA packages
Added Low-Halogen material option
Changed valid BGA model number combinations to 02 and 03
Valid Combinations
Changed valid BGA material option to Low-Halogen
Added Automotive In-Cabin temperature valid combination for BGA packages
Removed Note 1
Physical Dimensions
Added FAC024 BGA package
AC Characteristics
Removed 76 MHz Automotive in-cabin spec and Note 9
January 29, 2013 S25FL064P_00_08
S25FL064P
65
D a t a
Section
S h e e t
Description
Revision 04 (April 5, 2011)
Configuration Register
Clarified that TBPARM and TBPROT must be selected at the initial configuration of the device,
before any program or erase operations
Command Definitions
In the Instruction Set table, corrected the CLSR Data Byte Cycle value from 1 to 0
Parameter Sector Erase (P4E, P8E)
Clarified proper Parameter Sector Erase command usage on different types of sectors
Sector Erase (SE)
Clarified that the device only executes a SE command for those sectors which are not protected by
the Block Protection Bits
Clarified that a 64 kB sector erase command will work on 4 kB and 8 kB sectors
Clear Status Register (CLSR)
Removed incomplete statement regarding internal state machine
Corrected ESN1 and ESN2 Register data on a standard part from 0h to FFh
OTP Regions
Corrected Lock Register ESN1 data on a special order part from 1h to 0h
Clarified that for locking OTP regions, “setting the bit” refers to changing the value from 1 to 0
Physical Dimensions
Updated S03106 package outline drawing to latest revision
Updated WNF008 package outline drawing to latest revision
Revision 05 (November 18, 2011)
Power-Up / Power-Down Voltage and
Timing Table
Corrected tPU
Initial Delivery State
Modified section
Capacitance
Added notes to table
Revision 06 (September 21, 2012)
AC Characteristics
Changed Output Hold Time (tHO) to 2 ns (min)
Revision 07 (October 30, 2012)
Command Definitions
Instruction Set table: Corrected the value of RES, OTPP, and OTPR commands
Write Registers (WRR)
Protection Mode table: Added Parameter Sector Erase to Memory Content columns for clarification
Parameter Sector Erase (P4E, P8E)
Updated the table reference
Revision 08 (January 29, 2013)
Capacitance
66
Added “Typical” values column
Corrected “Max” values for CIN / COUT (Input / Output Capacitance)
S25FL064P
S25FL064P_00_08 January 29, 2013
D a t a
S h e e t
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as
contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to
you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal
operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under
the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country,
the prior authorization by the respective government entity will be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Spansion product under
development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this
document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose,
merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any
damages of any kind arising out of the use of the information in this document.
Copyright © 2008-2013 Spansion Inc. All rights reserved. Spansion®, the Spansion logo, MirrorBit®, MirrorBit® Eclipse™, ORNAND™ and
combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names used
are for informational purposes only and may be trademarks of their respective owners.
January 29, 2013 S25FL064P_00_08
S25FL064P
67