STMICROELECTRONICS M24C64-F

M24C64-W M24C64-R M24C64-F
M24C64-DF
64-Kbit serial I²C bus EEPROM
Datasheet − production data
Features
■
Compatible with all I2C bus modes:
– 1 MHz
– 400 kHz
– 100 kHz
■
Memory array:
– 64 Kbit (8 Kbytes) of EEPROM
– Page size: 32 bytes
– Additional Write lockable page
(M24C64-D order codes)
■
Single supply voltage:
– 1.7 V to 5.5 V over –40 °C / +85 °C
■
Write:
– Byte Write within 5 ms
– Page Write within 5 ms
■
Random and sequential Read modes
■
Write protect of the whole memory array
■
Enhanced ESD/Latch-Up protection
■
More than 4 million Write cycles
■
More than 200-year data retention
■
Packages:
– RoHS compliant and halogen-free
(ECOPACK®)
TSSOP8 (DW)
169 mil width
SO8 (MN)
150 mil width
PDIP8 (BN)
UFDFPN8
(MC)
WLCSP (CS)
August 2012
This is information on a product in full production.
Doc ID 16891 Rev 27
Thin WLCSP (CT)
preliminary data
1/42
www.st.com
1
Contents
M24C64-W M24C64-R M24C64-F M24C64-DF
Contents
1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2
Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1
Serial Clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2
Serial Data (SDA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3
Chip Enable (E2, E1, E0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4
Write Control (WC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.5
VSS (ground) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.6
Supply voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.6.1
2.6.2
Operating supply voltage VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.6.3
Device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.6.4
Power-down conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3
Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4
Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5
4.1
Start condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.2
Stop condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.3
Data input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.4
Acknowledge bit (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.5
Device addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.1
5.2
Write operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.1.1
Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5.1.2
Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5.1.3
Write Identification Page (M24C64-D only) . . . . . . . . . . . . . . . . . . . . . . 17
5.1.4
Lock Identification Page (M24C64-D only) . . . . . . . . . . . . . . . . . . . . . . 17
5.1.5
ECC (Error Correction Code) and Write cycling . . . . . . . . . . . . . . . . . . 18
5.1.6
Minimizing Write delays by polling on ACK . . . . . . . . . . . . . . . . . . . . . . 19
Read operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.2.1
2/42
Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Doc ID 16891 Rev 27
M24C64-W M24C64-R M24C64-F M24C64-DF
Contents
5.2.2
Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5.2.3
Sequential Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5.3
Read Identification Page (M24C64-D only) . . . . . . . . . . . . . . . . . . . . . . . 21
5.4
Read the lock status (M24C64-D only) . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6
Initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7
Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
8
DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
9
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
10
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Doc ID 16891 Rev 27
3/42
List of tables
M24C64-W M24C64-R M24C64-F M24C64-DF
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
4/42
Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Most significant address byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Least significant address byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Operating conditions (voltage range W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Operating conditions (voltage range R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Operating conditions (voltage range F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Input parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Cycling performance by groups of four bytes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Memory cell data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
DC characteristics (M24C64-W, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
DC characteristics (M24C64-R, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
DC characteristics (M24C64-F, M24C64-DF, device grade 6) . . . . . . . . . . . . . . . . . . . . . . 28
400 kHz AC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
1 MHz AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
TSSOP8 – 8-lead thin shrink small outline, package mechanical data. . . . . . . . . . . . . . . . 33
SO8N – 8 lead plastic small outline, 150 mils body width, package data . . . . . . . . . . . . . . 34
PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package mechanical data. . . . . . . . . . . . 35
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
WLCSP-R 5-bump wafer-length chip-scale package mechanical data . . . . . . . . . . . . . . . 37
Thin WLCSP 8-bump wafer-length chip-scale package mechanical data . . . . . . . . . . . . . 38
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Doc ID 16891 Rev 27
M24C64-W M24C64-R M24C64-F M24C64-DF
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
8-pin package connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5-bump WLCSP connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
8-bump thin WLCSP connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
I2C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 15
Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 16
Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Maximum Rbus value versus bus parasitic capacitance (Cbus) for
an I2C bus at maximum frequency fC = 400 kHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Maximum Rbus value versus bus parasitic capacitance Cbus) for
an I2C bus at maximum frequency fC = 1MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
TSSOP8 – 8-lead thin shrink small outline, package outline . . . . . . . . . . . . . . . . . . . . . . . 33
SO8N – 8 lead plastic small outline, 150 mils body width, package outline . . . . . . . . . . . . 34
PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package outline . . . . . . . . . . . . . . . . . . . 35
UFDFPN8 (MLP8) - 8-lead ultra thin fine pitch dual flat no lead, package outline . . . . . . . 36
WLCSP-R 5-bump wafer-length chip-scale package outline . . . . . . . . . . . . . . . . . . . . . . . 37
Thin WLCSP 8-bump wafer-length chip-scale package outline . . . . . . . . . . . . . . . . . . . . . 38
Doc ID 16891 Rev 27
5/42
Description
1
M24C64-W M24C64-R M24C64-F M24C64-DF
Description
The M24C64 is a 64-Kbit I2C-compatible EEPROM (Electrically Erasable PROgrammable
Memory) organized as 8 K × 8 bits.
The M24C64-W can operate with a supply voltage from 2.5 V to 5.5 V, the M24C64-R can
operate with a supply voltage from 1.8 V to 5.5 V, and the M24C64-F and M24C64-DF can
operate with a supply voltage from 1.7 V to 5.5 V, over an ambient temperature range of
-40 °C / +85 °C.
The M24C64-D offers an additional page, named the Identification Page (32 bytes). The
Identification Page can be used to store sensitive application parameters which can be
(later) permanently locked in Read-only mode.
Figure 1.
Logic diagram
6##
%%
3$!
-XXX
3#,
7#
633
Table 1.
!)F
Signal names
Signal name
Function
Direction
E2, E1, E0
Chip Enable
Input
SDA
Serial Data
I/O
SCL
Serial Clock
Input
WC
Write Control
Input
VCC
Supply voltage
VSS
Ground
Figure 2.
8-pin package connections
%
%
%
633
6##
7#
3#,
3$!
!)F
1. See Section 9: Package mechanical data for package dimensions, and how to identify pin 1.
6/42
Doc ID 16891 Rev 27
M24C64-W M24C64-R M24C64-F M24C64-DF
Figure 3.
Description
5-bump WLCSP connections (top view)
633
6##
3$!
7#
3#,
-36
Note:
Inputs E2, E1, E0 are internally connected to (001). Please refer to Section 2.3 for further
explanations.
Figure 4.
8-bump thin WLCSP connections (top view)
7#
3$!
3#,
%
6##
%
633
%
-36
Caution:
As EEPROM cells lose their charge (and so their binary value) when exposed to ultra violet
(UV) light, EEPROM dice delivered in wafer form or in WLCSP package by
STMicroelectronics must never be exposed to UV light.
Doc ID 16891 Rev 27
7/42
Signal description
M24C64-W M24C64-R M24C64-F M24C64-DF
2
Signal description
2.1
Serial Clock (SCL)
The signal applied on the SCL input is used to strobe the data available on SDA(in) and to
output the data on SDA(out).
2.2
Serial Data (SDA)
SDA is an input/output used to transfer data in or data out of the device. SDA(out) is an open
drain output that may be wire-OR’ed with other open drain or open collector signals on the
bus. A pull-up resistor must be connected from Serial Data (SDA) to VCC (Figure 13
indicates how to calculate the value of the pull-up resistor).
2.3
Chip Enable (E2, E1, E0)
(E2,E1,E0) input signals are used to set the value that is to be looked for on the three least
significant bits (b3, b2, b1) of the 7-bit device select code (see Table 2). These inputs must
be tied to VCC or VSS, as shown in Figure 5. When not connected (left floating), these inputs
are read as low (0).
For the 5-balls WLCSP package, the (E2,E1,E0) inputs are internally connected to (0,0,1).
Figure 5.
Device select code
VCC
VCC
M24xxx
M24xxx
Ei
Ei
VSS
VSS
Ai12806
2.4
Write Control (WC)
This input signal is useful for protecting the entire contents of the memory from inadvertent
write operations. Write operations are disabled to the entire memory array when Write
Control (WC) is driven high. Write operations are enabled when Write Control (WC) is either
driven low or left floating.
When Write Control (WC) is driven high, device select and address bytes are
acknowledged, Data bytes are not acknowledged.
8/42
Doc ID 16891 Rev 27
M24C64-W M24C64-R M24C64-F M24C64-DF
2.5
Signal description
VSS (ground)
VSS is the reference for the VCC supply voltage.
2.6
Supply voltage (VCC)
2.6.1
Operating supply voltage VCC
Prior to selecting the memory and issuing instructions to it, a valid and stable VCC voltage
within the specified [VCC(min), VCC(max)] range must be applied (see Operating conditions
in Section 8: DC and AC parameters). In order to secure a stable DC supply voltage, it is
recommended to decouple the VCC line with a suitable capacitor (usually of the order of
10 nF to 100 nF) close to the VCC/VSS package pins.
This voltage must remain stable and valid until the end of the transmission of the instruction
and, for a write instruction, until the completion of the internal write cycle (tW).
2.6.2
Power-up conditions
The VCC voltage has to rise continuously from 0 V up to the minimum VCC operating voltage
(see Operating conditions in Section 8: DC and AC parameters) and the rise time must not
vary faster than 1 V/µs.
2.6.3
Device reset
In order to prevent inadvertent write operations during power-up, a power-on-reset (POR)
circuit is included.
At power-up, the device does not respond to any instruction until VCC has reached the
internal reset threshold voltage. This threshold is lower than the minimum VCC operating
voltage (see Operating conditions in Section 8: DC and AC parameters). When VCC passes
over the POR threshold, the device is reset and enters the Standby Power mode; however,
the device must not be accessed until VCC reaches a valid and stable DC voltage within the
specified [VCC(min), VCC(max)] range (see Operating conditions in Section 8: DC and AC
parameters).
In a similar way, during power-down (continuous decrease in VCC), the device must not be
accessed when VCC drops below VCC(min). When VCC drops below the power-on-reset
threshold voltage, the device stops responding to any instruction sent to it.
2.6.4
Power-down conditions
During power-down (continuous decrease in VCC), the device must be in the Standby Power
mode (mode reached after decoding a Stop condition, assuming that there is no internal
write cycle in progress).
Doc ID 16891 Rev 27
9/42
Memory organization
3
M24C64-W M24C64-R M24C64-F M24C64-DF
Memory organization
The memory is organized as shown below.
Figure 6.
Block diagram
7#
%
%
%
(IGHVOLTAGE
GENERATOR
#ONTROLLOGIC
3#,
3$!
)/SHIFTREGISTER
$ATA
REGISTER
9DECODER
!DDRESSREGISTER
ANDCOUNTER
PAGE
)DENTIFICATIONPAGE
8DECODER
-36
10/42
Doc ID 16891 Rev 27
M24C64-W M24C64-R M24C64-F M24C64-DF
4
Device operation
Device operation
The device supports the I2C protocol. This is summarized in Figure 7. Any device that sends
data on to the bus is defined to be a transmitter, and any device that reads the data to be a
receiver. The device that controls the data transfer is known as the bus master, and the
other as the slave device. A data transfer can only be initiated by the bus master, which will
also provide the serial clock for synchronization. The device is always a slave in all
communications.
Figure 7.
I2C bus protocol
SCL
SDA
SDA
Input
START
Condition
SCL
1
SDA
MSB
2
SDA
Change
STOP
Condition
3
7
8
9
ACK
START
Condition
SCL
1
SDA
MSB
2
3
7
8
9
ACK
STOP
Condition
AI00792B
Doc ID 16891 Rev 27
11/42
Device operation
4.1
M24C64-W M24C64-R M24C64-F M24C64-DF
Start condition
Start is identified by a falling edge of Serial Data (SDA) while Serial Clock (SCL) is stable in
the high state. A Start condition must precede any data transfer instruction. The device
continuously monitors (except during a Write cycle) Serial Data (SDA) and Serial Clock
(SCL) for a Start condition.
4.2
Stop condition
Stop is identified by a rising edge of Serial Data (SDA) while Serial Clock (SCL) is stable
and driven high. A Stop condition terminates communication between the device and the
bus master. A Read instruction that is followed by NoAck can be followed by a Stop
condition to force the device into the Standby mode.
A Stop condition at the end of a Write instruction triggers the internal Write cycle.
4.3
Data input
During data input, the device samples Serial Data (SDA) on the rising edge of Serial Clock
(SCL). For correct device operation, Serial Data (SDA) must be stable during the rising edge
of Serial Clock (SCL), and the Serial Data (SDA) signal must change only when Serial Clock
(SCL) is driven low.
4.4
Acknowledge bit (ACK)
The acknowledge bit is used to indicate a successful byte transfer. The bus transmitter,
whether it be bus master or slave device, releases Serial Data (SDA) after sending eight bits
of data. During the 9th clock pulse period, the receiver pulls Serial Data (SDA) low to
acknowledge the receipt of the eight data bits.
12/42
Doc ID 16891 Rev 27
M24C64-W M24C64-R M24C64-F M24C64-DF
4.5
Device operation
Device addressing
To start communication between the bus master and the slave device, the bus master must
initiate a Start condition. Following this, the bus master sends the device select code, shown
in Table 2(on Serial Data (SDA), most significant bit first).
Table 2.
Device select code
Device type identifier(1)
Chip Enable address(2)(3)
RW
b7
b6
b5
b4
b3
b2
b1
b0
Device select code
when addressing the
memory array
1
0
1
0
E2
E1
E0
RW
Device select code
when accessing the
Identification page
1
0
1
1
E2
E1
E0
RW
1. The most significant bit, b7, is sent first.
2.
E0, E1 and E2 are compared with the value read on input pins E0,E1,and E2.
3. For the 5-bump WLCSP package, (E0,E1,E2) inputs are internally connected to (0,0,1)
When the device select code is received, the device only responds if the Chip Enable
address is the same as the value on its Chip Enable E2,E1,E0 inputs.
The 8th bit is the Read/Write bit (RW). This bit is set to 1 for Read and 0 for Write operations.
If a match occurs on the device select code, the corresponding device gives an
acknowledgment on Serial Data (SDA) during the 9th bit time. If the device does not match
the device select code, the device deselects itself from the bus, and goes into Standby
mode.
Doc ID 16891 Rev 27
13/42
Instructions
M24C64-W M24C64-R M24C64-F M24C64-DF
5
Instructions
5.1
Write operations
Following a Start condition the bus master sends a device select code with the R/W bit (RW)
reset to 0. The device acknowledges this, as shown in Figure 8, and waits for two address
bytes. The device responds to each address byte with an acknowledge bit, and then waits
for the data byte.
Table 3.
A15
Table 4.
A7
Most significant address byte
A14
A13
A12
A11
A10
A9
A8
A3
A2
A1
A0
Least significant address byte
A6
A5
A4
When the bus master generates a Stop condition immediately after a data byte Ack bit (in
the “10th bit” time slot), either at the end of a Byte Write or a Page Write, the internal Write
cycle tW is triggered. A Stop condition at any other time slot does not trigger the internal
Write cycle.
After the Stop condition and the successful completion of an internal Write cycle (tW), the
device internal address counter is automatically incremented to point to the next byte after
the last modified byte.
During the internal Write cycle, Serial Data (SDA) is disabled internally, and the device does
not respond to any requests.
If the Write Control input (WC) is driven High, the Write instruction is not executed and the
accompanying data bytes are not acknowledged, as shown in Figure 9.
14/42
Doc ID 16891 Rev 27
M24C64-W M24C64-R M24C64-F M24C64-DF
Byte Write
After the device select code and the address bytes, the bus master sends one data byte. If
the addressed location is Write-protected, by Write Control (WC) being driven high, the
device replies with NoAck, and the location is not modified. If, instead, the addressed
location is not Write-protected, the device replies with Ack. The bus master terminates the
transfer by generating a Stop condition, as shown in Figure 8.
Figure 8.
Write mode sequences with WC = 0 (data write enabled)
WC
ACK
ACK
ACK
Byte addr
Byte addr
ACK
Data in
Stop
Dev sel
Start
Byte Write
R/W
WC
ACK
Page Write
Dev sel
Start
ACK
Byte addr
ACK
Byte addr
ACK
Data in 1
Data in 2
R/W
WC (cont'd)
ACK
Page Write (cont'd)
ACK
Data in N
Stop
5.1.1
Instructions
Doc ID 16891 Rev 27
AI01106d
15/42
Instructions
5.1.2
M24C64-W M24C64-R M24C64-F M24C64-DF
Page Write
The Page Write mode allows up to 32 bytes to be written in a single Write cycle, provided
that they are all located in the same page in the memory: that is, the most significant
memory address bits, A15/A5, are the same. If more bytes are sent than will fit up to the end
of the page, a “roll-over” occurs, i.e. the bytes exceeding the page end are written on the
same page, from location 0.
The bus master sends from 1 to 32 bytes of data, each of which is acknowledged by the
device if Write Control (WC) is low. If Write Control (WC) is high, the contents of the
addressed memory location are not modified, and each data byte is followed by a NoAck, as
shown in Figure 9. After each transferred byte, the internal page address counter is
incremented.
The transfer is terminated by the bus master generating a Stop condition.
Figure 9.
Write mode sequences with WC = 1 (data write inhibited)
WC
ACK
Byte addr
ACK
Byte addr
NO ACK
Data in
Stop
Dev sel
Start
Byte Write
ACK
R/W
WC
ACK
Dev sel
Start
Page Write
ACK
Byte addr
ACK
Byte addr
NO ACK
Data in 1
Data in 2
R/W
WC (cont'd)
NO ACK
Data in N
Stop
Page Write (cont'd)
NO ACK
16/42
Doc ID 16891 Rev 27
AI01120d
M24C64-W M24C64-R M24C64-F M24C64-DF
5.1.3
Instructions
Write Identification Page (M24C64-D only)
The Identification Page (32 bytes) is an additional page which can be written and (later)
permanently locked in Read-only mode. It is written by issuing the Write Identification Page
instruction. This instruction uses the same protocol and format as Page Write (into memory
array), except for the following differences:
●
Device type identifier = 1011b
●
MSB address bits A15/A5 are don't care except for address bit A10 which must be ‘0’.
LSB address bits A4/A0 define the byte address inside the Identification page.
If the Identification page is locked, the data bytes transferred during the Write Identification
Page instruction are not acknowledged (NoAck).
5.1.4
Lock Identification Page (M24C64-D only)
The Lock Identification Page instruction (Lock ID) permanently locks the Identification page
in Read-only mode. The Lock ID instruction is similar to Byte Write (into memory array) with
the following specific conditions:
●
Device type identifier = 1011b
●
Address bit A10 must be ‘1’; all other address bits are don't care
●
The data byte must be equal to the binary value xxxx xx1x, where x is don't care
Doc ID 16891 Rev 27
17/42
Instructions
5.1.5
M24C64-W M24C64-R M24C64-F M24C64-DF
ECC (Error Correction Code) and Write cycling
The Error Correction Code (ECC) is an internal logic function which is transparent for the
I2C communication protocol.
The ECC logic is implemented on each group of four EEPROM bytes(a). Inside a group, if a
single bit out of the four bytes happens to be erroneous during a Read operation, the ECC
detects this bit and replaces it with the correct value. The read reliability is therefore much
improved.
Even if the ECC function is performed on groups of four bytes, a single byte can be
written/cycled independently. In this case, the ECC function also writes/cycles the three
other bytes located in the same group(a). As a consequence, the maximum cycling budget is
defined at group level and the cycling can be distributed over the 4 bytes of the group: the
sum of the cycles seen by byte0, byte1, byte2 and byte3 of the same group must remain
below the maximum value defined Table 11: Cycling performance by groups of four bytes.
a. A group of four bytes is located at addresses [4*N, 4*N+1, 4*N+2, 4*N+3], where N is an
integer.
18/42
Doc ID 16891 Rev 27
M24C64-W M24C64-R M24C64-F M24C64-DF
5.1.6
Instructions
Minimizing Write delays by polling on ACK
During the internal Write cycle, the device disconnects itself from the bus, and writes a copy
of the data from its internal latches to the memory cells. The maximum Write time (tw) is
shown in AC characteristics tables in Section 8: DC and AC parameters, but the typical time
is shorter. To make use of this, a polling sequence can be used by the bus master.
The sequence, as shown in Figure 10, is:
●
Initial condition: a Write cycle is in progress.
●
Step 1: the bus master issues a Start condition followed by a device select code (the
first byte of the new instruction).
●
Step 2: if the device is busy with the internal Write cycle, no Ack will be returned and
the bus master goes back to Step 1. If the device has terminated the internal Write
cycle, it responds with an Ack, indicating that the device is ready to receive the second
part of the instruction (the first byte of this instruction having been sent during Step 1).
Figure 10. Write cycle polling flowchart using ACK
Write cycle
in progress
Start condition
Device select
with RW = 0
NO
First byte of instruction
with RW = 0 already
decoded by the device
ACK
returned
YES
NO
Next
Operation is
addressing the
memory
YES
Send Address
and Receive ACK
ReStart
Stop
NO
StartCondition
YES
Data for the
Write cperation
Device select
with RW = 1
Continue the
Write operation
Continue the
Random Read operation
AI01847e
AI01847d
1. The seven most significant bits of the Device Select code of a Random Read (bottom right box in the
figure) must be identical to the seven most significant bits of the Device Select code of the Write (polling
instruction in the figure).
Doc ID 16891 Rev 27
19/42
Instructions
5.2
M24C64-W M24C64-R M24C64-F M24C64-DF
Read operations
Read operations are performed independently of the state of the Write Control (WC) signal.
After the successful completion of a Read operation, the device internal address counter is
incremented by one, to point to the next byte address.
For the Read instructions, after each byte read (data out), the device waits for an
acknowledgment (data in) during the 9th bit time. If the bus master does not acknowledge
during this 9th time, the device terminates the data transfer and switches to its Standby
mode.
Figure 11. Read mode sequences
ACK
Data out
Stop
Start
Dev sel
NO ACK
R/W
ACK
Random
Address
Read
Byte addr
Dev sel *
ACK
ACK
Data out 1
ACK
NO ACK
Data out N
ACK
Byte addr
ACK
Byte addr
R/W
ACK
Dev sel *
Start
Dev sel *
Start
Data out
R/W
R/W
ACK
NO ACK
Stop
Start
Dev sel
Sequention
Random
Read
ACK
Byte addr
R/W
ACK
Sequential
Current
Read
ACK
Start
Start
Dev sel *
ACK
Stop
Current
Address
Read
ACK
Data out1
R/W
NO ACK
Stop
Data out N
5.2.1
AI01105d
Random Address Read
A dummy Write is first performed to load the address into this address counter (as shown in
Figure 11) but without sending a Stop condition. Then, the bus master sends another Start
condition, and repeats the device select code, with the RW bit set to 1. The device
acknowledges this, and outputs the contents of the addressed byte. The bus master must
not acknowledge the byte, and terminates the transfer with a Stop condition.
20/42
Doc ID 16891 Rev 27
M24C64-W M24C64-R M24C64-F M24C64-DF
5.2.2
Instructions
Current Address Read
For the Current Address Read operation, following a Start condition, the bus master only
sends a device select code with the R/W bit set to 1. The device acknowledges this, and
outputs the byte addressed by the internal address counter. The counter is then
incremented. The bus master terminates the transfer with a Stop condition, as shown in
Figure 11, without acknowledging the byte.
5.2.3
Sequential Read
This operation can be used after a Current Address Read or a Random Address Read. The
bus master does acknowledge the data byte output, and sends additional clock pulses so
that the device continues to output the next byte in sequence. To terminate the stream of
bytes, the bus master must not acknowledge the last byte, and must generate a Stop
condition, as shown in Figure 11.
The output data comes from consecutive addresses, with the internal address counter
automatically incremented after each byte output. After the last memory address, the
address counter “rolls-over”, and the device continues to output data from memory address
00h.
5.3
Read Identification Page (M24C64-D only)
The Identification Page (32 bytes) is an additional page which can be written and (later)
permanently locked in Read-only mode.
The Identification Page can be read by issuing an Read Identification Page instruction. This
instruction uses the same protocol and format as the Random Address Read (from memory
array) with device type identifier defined as 1011b. The MSB address bits A15/A5 are don't
care, the LSB address bits A4/A0 define the byte address inside the Identification Page. The
number of bytes to read in the ID page must not exceed the page boundary (e.g.: when
reading the Identification Page from location 10d, the number of bytes should be less than
or equal to 22, as the ID page boundary is 32 bytes).
5.4
Read the lock status (M24C64-D only)
The locked/unlocked status of the Identification page can be checked by transmitting a
specific truncated command [Identification Page Write instruction + one data byte] to the
device. The device returns an acknowledge bit if the Identification page is unlocked,
otherwise a NoAck bit if the Identification page is locked.
Right after this, it is recommended to transmit to the device a Start condition followed by a
Stop condition, so that:
●
Start: the truncated command is not executed because the Start condition resets the
device internal logic,
●
Stop: the device is then set back into Standby mode by the Stop condition.
Doc ID 16891 Rev 27
21/42
Initial delivery state
6
M24C64-W M24C64-R M24C64-F M24C64-DF
Initial delivery state
The device is delivered with all the memory array bits set to 1 (each byte contains FFh).
22/42
Doc ID 16891 Rev 27
M24C64-W M24C64-R M24C64-F M24C64-DF
7
Maximum rating
Maximum rating
Stressing the device outside the ratings listed in Table 5 may cause permanent damage to
the device. These are stress ratings only, and operation of the device at these, or any other
conditions outside those indicated in the operating sections of this specification, is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 5.
Absolute maximum ratings
Symbol
TSTG
Parameter
Min.
Max.
Unit
Ambient operating temperature
–40
130
°C
Storage temperature
–65
150
°C
Lead temperature during soldering
TLEAD
PDIP-specific lead temperature during soldering
VIO
Input or output range
IOL
DC output current (SDA = 0)
VCC
Supply voltage
VESD
see
Electrostatic pulse (Human Body
model)(3)
note(1)
260
°C
(2)
°C
–0.50
6.5
V
-
5
mA
–0.50
6.5
V
-
4000
V
1. Compliant with JEDEC Std J-STD-020D (for small body, Sn-Pb or Pb assembly), the ST ECOPACK®
7191395 specification, and the European directive on Restrictions on Hazardous Substances (RoHS)
2002/95/EU.
2. TLEAD max must not be applied for more than 10 s.
3. Positive and negative pulses applied on different combinations of pin connections, according to AECQ100-002 (compliant with JEDEC Std JESD22-A114, C1=100 pF, R1=1500 Ω).
Doc ID 16891 Rev 27
23/42
DC and AC parameters
8
M24C64-W M24C64-R M24C64-F M24C64-DF
DC and AC parameters
This section summarizes the operating and measurement conditions, and the DC and AC
characteristics of the device.
Table 6.
Operating conditions (voltage range W)
Symbol
VCC
TA
fC
Parameter
Min.
Max.
Unit
Supply voltage
2.5
5.5
V
Ambient operating temperature
–40
85
°C
Operating clock frequency
-
1
(1)
MHz
1. fCmax is 1 MHz devices identified by process letter K.
Table 7.
Operating conditions (voltage range R)
Symbol
VCC
TA
fC
Parameter
Min.
Max.
Unit
Supply voltage
1.8
5.5
V
Ambient operating temperature
–40
85
°C
-
1(1)
MHz
Min.
Max.
Unit
Supply voltage
1.7
5.5
V
Ambient operating temperature
–40
85
°C
-
1(1)
MHz
Min.
Max.
Unit
Operating clock frequency
1. fCmax is 1 MHz devices identified by process letter K.
Table 8.
Operating conditions (voltage range F)
Symbol
VCC
TA
fC
Parameter
Operating clock frequency
1. fCmax is 1 MHz devices identified by process letter K.
Table 9.
AC measurement conditions
Symbol
Cbus
Parameter
Load capacitance
100
SCL input rise/fall time, SDA input fall time
24/42
pF
50
ns
Input levels
0.2 VCC to 0.8 VCC
V
Input and output timing reference levels
0.3 VCC to 0.7 VCC
V
Doc ID 16891 Rev 27
M24C64-W M24C64-R M24C64-F M24C64-DF
DC and AC parameters
Figure 12. AC measurement I/O waveform
)NPUTVOLTAGELEVELS
)NPUTANDOUTPUT
4IMINGREFERENCELEVELS
6##
6##
6##
6##
-36
Table 10.
Input parameters
Parameter(1)
Symbol
Test condition
Min.
Max.
Unit
CIN
Input capacitance (SDA)
8
pF
CIN
Input capacitance (other pins)
6
pF
ZL
ZH
Input impedance (E2, E1, E0, WC)(2)
VIN < 0.3 VCC
30
kΩ
VIN > 0.7 VCC
500
kΩ
1. Characterized only, not tested in production.
2. E2, E1, E0 input impedance when the memory is selected (after a Start condition).
Table 11.
Symbol
Ncycle
Cycling performance by groups of four bytes
Parameter
Write cycle
endurance(2)
Test condition(1)
Max.
TA ≤ 25 °C, VCC(min) < VCC < VCC(max)
4,000,000
TA = 85 °C, VCC(min) < VCC < VCC(max)
1,200,000
Unit
Write cycle(3)
1. Cycling performance for products identified by process letter K.
2. The Write cycle endurance is defined for groups of four data bytes located at addresses [4*N, 4*N+1,
4*N+2, 4*N+3] where N is an integer. The Write cycle endurance is defined by characterization and
qualification.
3. A Write cycle is executed when either a Page Write, a Byte Write, a Write Identification Page or a Lock
Identification Page instruction is decoded. When using the Byte Write, the Page Write or the Write
Identification Page, refer also to Section 5.1.5: ECC (Error Correction Code) and Write cycling.
Table 12.
Memory cell data retention
Parameter
Data retention(1)
Test condition
TA = 55 °C
Min.
Unit
200
Year
1. For products identified by process letter K. The data retention behavior is checked in production. The 200year limit is defined from characterization and qualification results.
Doc ID 16891 Rev 27
25/42
DC and AC parameters
Table 13.
M24C64-W M24C64-R M24C64-F M24C64-DF
DC characteristics (M24C64-W, device grade 6)
Symbol
Parameter
ILI
Input leakage current
(SCL, SDA, E2, E1,
E0)
ILO
Output leakage
current
ICC
ICC0
ICC1
VIL
VIH
VOL
Supply current (Read)
Test conditions (see Table 6)
Min.
Max.
Unit
VIN = VSS or VCC
device in Standby mode
±2
µA
SDA in Hi-Z, external voltage applied
on SDA: VSS or VCC
±2
µA
2.5 V < VCC < 5.5 V, fc = 400 kHz
(rise/fall time < 50 ns)
2
mA
2.5 V < VCC < 5.5 V, fc = 1 MHz(1)
(rise/fall time < 50 ns)
2.5
mA
5(2)
mA
Device not selected(3), VIN = VSS or
VCC, VCC = 2.5 V
2
µA
Device not selected(3), VIN = VSS or
VCC, VCC = 5.5 V
5(4)
µA
Supply current (Write) During tW, 2.5 V < VCC < 5.5 V
Standby supply
current
Input low voltage
(SCL, SDA, WC)
–0.45
0.3 VCC
V
Input high voltage
(SCL, SDA)
0.7 VCC
6.5
V
Input high voltage
(WC, E2, E1, E0)
0.7 VCC VCC+0.6
Output low voltage
IOL = 2.1 mA, VCC = 2.5 V or
IOL = 3 mA, VCC = 5.5 V
0.4
1. Only for devices identified with process letter K.
2. Characterized value, not tested in production.
3. The device is not selected after power-up, after a Read instruction (after the Stop condition), or after the
completion of the internal write cycle tW (tW is triggered by the correct decoding of a Write instruction).
4. The new M24C64-W devices (identified by the process letter K) offer ICC1 = 3µA (max)
26/42
Doc ID 16891 Rev 27
V
V
M24C64-W M24C64-R M24C64-F M24C64-DF
Table 14.
Symbol
DC and AC parameters
DC characteristics (M24C64-R, device grade 6)
Test conditions(1) (in addition
to those in Table 7)
Parameter
Min.
Max.
Unit
ILI
Input leakage current
(SCL, SDA)
VIN = VSS or VCC
device in Standby mode
±2
µA
ILO
Output leakage current
SDA in Hi-Z, external voltage
applied on SDA: VSS or VCC
±2
µA
VCC = 1.8 V, fc= 400 kHz
0.8
mA
fc= 1 MHz(2)
2.5
mA
During tW 1.8 V < VCC < 2.5 V
3(3)
mA
1
µA
ICC
ICC0
Supply current (Read)
Supply current (Write)
(4),
ICC1
Standby supply current
Device not selected
VIN = VSS or VCC, VCC = 1.8 V
VIL
Input low voltage
(SCL, SDA, WC)
1.8 V ≤ VCC < 2.5 V
–0.45
0.25 VCC
V
Input high voltage
(SCL, SDA)
1.8 V ≤ VCC < 2.5 V
0.75 VCC
6.5
V
Input high voltage
(WC)
1.8 V ≤ VCC < 2.5 V
0.75 VCC VCC+0.6
Output low voltage
IOL = 1 mA, VCC = 1.8 V
VIH
VOL
0.2
V
V
1. If the application uses the voltage range R device with 2.5 V < Vcc < 5.5 V and -40 °C < TA < +85 °C,
please refer to Table 13 instead of this table.
2. Only for devices identified with process letter K.
3. Characterized value, not tested in production.
4. The device is not selected after power-up, after a Read instruction (after the Stop condition), or after the
completion of the internal write cycle tW (tW is triggered by the correct decoding of a Write instruction).
Doc ID 16891 Rev 27
27/42
DC and AC parameters
.
Table 15.
Symbol
M24C64-W M24C64-R M24C64-F M24C64-DF
DC characteristics (M24C64-F, M24C64-DF, device grade 6)
Test conditions(1) (in addition
to those in Table 8)
Parameter
Min.
Max.
Unit
ILI
Input leakage current
(E1, E2, SCL, SDA)
VIN = VSS or VCC
device in Standby mode
±2
µA
ILO
Output leakage current
SDA in Hi-Z, external voltage
applied on SDA: VSS or VCC
±2
µA
VCC = 1.7 V, fc= 400 kHz
0.8
mA
fc= 1 MHz(2)
2.5
mA
During tW 1.7 V < VCC < 2.5 V
3(3)
mA
1
µA
ICC
ICC0
Supply current (Read)
Supply current (Write)
(4),
ICC1
Standby supply current
Device not selected
VIN = VSS or VCC, VCC = 1.7 V
VIL
Input low voltage
(SCL, SDA, WC)
1.7 V ≤ VCC < 2.5 V
–0.45
0.25 VCC
V
Input high voltage
(SCL, SDA)
1.7 V ≤ VCC < 2.5 V
0.75 VCC
6.5
V
Input high voltage
(WC, E2, E1, E0)
1.7 V ≤ VCC < 2.5 V
0.75 VCC VCC+0.6
Output low voltage
IOL = 1 mA, VCC = 1.7 V
VIH
VOL
0.2
1. If the application uses the voltage range F device with 2.5 V < VCC < 5.5 V and -40 °C < TA < +85 °C,
please refer to Table 13 instead of this table.
2. Only for devices identified with process letter K.
3. Characterized value, not tested in production.
4. The device is not selected after power-up, after a Read instruction (after the Stop condition), or after the
completion of the internal write cycle tW (tW is triggered by the correct decoding of a Write instruction).
28/42
Doc ID 16891 Rev 27
V
V
M24C64-W M24C64-R M24C64-F M24C64-DF
Table 16.
400 kHz AC characteristics
Symbol
Alt.
fC
fSCL
Clock frequency
tCHCL
tHIGH
tCLCH
tLOW
tQL1QL2(1)
tF
tXH1XH2
DC and AC parameters
tR
Parameter
Min.
Max.
Unit
-
400
kHz
Clock pulse width high
600
-
ns
Clock pulse width low
1300
-
ns
SDA (out) fall time
20(2)
300
ns
Input signal rise time
(3)
(3)
ns
(3)
ns
tXL1XL2
tF
Input signal fall time
(3)
tDXCH
tSU:DAT
Data in set up time
100
-
ns
tCLDX
tHD:DAT
Data in hold time
0
-
ns
100(5)
-
ns
-
900
ns
tCLQX
(4)
tDH
Data out hold time
tCLQV
(6)
tAA
Clock low to next data valid (access time)
tCHDL
tSU:STA
Start condition setup time
600
-
ns
tDLCL
tHD:STA
Start condition hold time
600
-
ns
tCHDH
tSU:STO
Stop condition set up time
600
-
ns
tDHDL
tBUF
Time between Stop condition and next Start
condition
1300
-
ns
tWLDL(7)(1)
tSU:WC
WC set up time (before the Start condition)
0
-
µs
tDHWH(8)(1)
tHD:WC
WC hold time (after the Stop condition)
1
-
µs
tW
tWR
Internal Write cycle duration
-
5
ms
Pulse width ignored (input filter on SCL and
SDA) - single glitch
-
80(9)
ns
tNS(1)
1. Characterized only, not tested in production.
2. With CL = 10 pF.
3. There is no min. or max. values for the input signal rise and fall times. It is however recommended by the
I²C specification that the input signal rise and fall times be more than 20 ns and less than 300 ns when
fC < 400 kHz.
4. To avoid spurious Start and Stop conditions, a minimum delay is placed between SCL=1 and the falling or
rising edge of SDA.
5. The previous product identified by process letter P was specified with tCLQX = 200 ns (min). Both values
offer a safe margin compared to the I2C specification recommendations.
6. tCLQV is the time (from the falling edge of SCL) required by the SDA bus line to reach either 0.3VCC or
0.7VCC, assuming that Rbus × Cbus time constant is within the values specified in Figure 13.
7. WC=0 set up time condition to enable the execution of a WRITE command.
8. WC=0 hold time condition to enable the execution of a WRITE command.
9. The previous M24C64 device (identified by process letter P) offers tNS = 100 ns (max), while the current
M24C64 device offers tNS = 80 ns (max). Both products offer a safe margin compared to the 50 ns
minimum value recommended by the I2C specification.
Doc ID 16891 Rev 27
29/42
DC and AC parameters
Table 17.
M24C64-W M24C64-R M24C64-F M24C64-DF
1 MHz AC characteristics
Parameter(1)
Symbol
Alt.
fC
fSCL
Clock frequency
tCHCL
tHIGH
tCLCH
tXH1XH2
tXL1XL2
tQL1QL2
(3)
Min.
Max.
Unit
0
1
MHz
Clock pulse width high
260
-
ns
tLOW
Clock pulse width low
500
-
ns
tR
Input signal rise time
(2)
(2)
ns
Input signal fall time
(2)
(2)
ns
120
ns
tF
tF
SDA (out) fall time
20
(4)
tDXCX
tSU:DAT Data in setup time
50
-
ns
tCLDX
tHD:DAT Data in hold time
0
-
ns
100
-
ns
450
ns
tCLQX(5)
tDH
Data out hold time
tCLQV(6)
tAA
Clock low to next data valid (access time)
tCHDL
tSU:STA Start condition setup time
250
-
ns
tDLCL
tHD:STA Start condition hold time
250
-
ns
tCHDH
tSU:STO Stop condition setup time
250
-
ns
500
-
ns
tSU:WC WC set up time (before the Start condition)
0
-
µs
tHD:WC WC hold time (after the Stop condition)
1
-
µs
Write time
-
5
ms
Pulse width ignored (input filter on SCL and
SDA)
-
80
ns
tDHDL
tWLDL(7)(3)
tDHWH
(8)(3)
tW
tBUF
tWR
tNS(3)
Time between Stop condition and next Start
condition
1. Only for M24C64 devices identified by the process letter K.
2. There is no min. or max. values for the input signal rise and fall times. It is however recommended by the
I²C specification that the input signal rise and fall times be less than 120 ns when fC < 1 MHz.
3. Characterized only, not tested in production.
4. With CL = 10 pF.
5. To avoid spurious Start and Stop conditions, a minimum delay is placed between SCL=1 and the falling or
rising edge of SDA.
6. tCLQV is the time (from the falling edge of SCL) required by the SDA bus line to reach either 0.3 VCC or
0.7 VCC, assuming that the Rbus × Cbus time constant is within the values specified in Figure 14.
7. WC=0 set up time condition to enable the execution of a WRITE command.
8. WC=0 hold time condition to enable the execution of a WRITE command.
30/42
Doc ID 16891 Rev 27
M24C64-W M24C64-R M24C64-F M24C64-DF
DC and AC parameters
"USLINEPULLUPRESISTOR
K Figure 13. Maximum Rbus value versus bus parasitic capacitance (Cbus) for
an I2C bus at maximum frequency fC = 400 kHz
2
BU
S §
(ERE2BUS §#BUSNS
4HE2X#TIMECONSTANT
BUS
BUS
MUSTBEBELOWTHENS
TIMECONSTANTLINEREPRESENTED
ONTHELEFT
6##
#
BU
S 2BUS
N
K
S
)£#BUS
MASTER
3#,
-XXX
3$!
P&
"USLINECAPACITORP&
#BUS
AIB
Figure 14. Maximum Rbus value versus bus parasitic capacitance Cbus) for
an I2C bus at maximum frequency fC = 1MHz
"USLINEPULLUPRESISTORK 6##
4HE2BUS§#BUSTIMECONSTANT
MUSTBEBELOWTHENS
TIMECONSTANTLINEREPRESENTED
ONTHELEFT
2
BUS §
#
BUS NS
2BUS
)£#BUS
MASTER
3#,
-XXX
3$!
(ERE
2 BUS § #BUSNS
#BUS
"USLINECAPACITORP&
-36
Doc ID 16891 Rev 27
31/42
DC and AC parameters
M24C64-W M24C64-R M24C64-F M24C64-DF
Figure 15. AC waveforms
3TART
CONDITION
3TART
3TOP
CONDITION CONDITION
T8,8,
T8(8(
T#(#,
T#,#(
3#,
T$,#,
T8,8,
3$!)N
T#($,
T8(8(
3$!
)NPUT
T#,$8
3$! T$8#(
#HANGE
T#($(
T$($,
7#
T$(7(
T7,$,
3TOP
CONDITION
3TART
CONDITION
3#,
3$!)N
T7
T#($(
T#($,
7RITECYCLE
3#,
T#,16
3$!/UT
T#,18
$ATAVALID
T1,1,
$ATAVALID
!)G
32/42
Doc ID 16891 Rev 27
M24C64-W M24C64-R M24C64-F M24C64-DF
9
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 16. TSSOP8 – 8-lead thin shrink small outline, package outline
1. Drawing is not to scale.
Table 18.
TSSOP8 – 8-lead thin shrink small outline, package mechanical data
inches(1)
millimeters
Symbol
Typ.
Min.
A
Max.
Min.
1.200
A1
0.050
0.150
0.800
1.050
b
0.190
c
0.090
A2
Typ.
1.000
CP
Max.
0.0472
0.0020
0.0059
0.0315
0.0413
0.300
0.0075
0.0118
0.200
0.0035
0.0079
0.0394
0.100
0.0039
D
3.000
2.900
3.100
0.1181
0.1142
0.1220
e
0.650
–
–
0.0256
–
–
E
6.400
6.200
6.600
0.2520
0.2441
0.2598
E1
4.400
4.300
4.500
0.1732
0.1693
0.1772
L
0.600
0.450
0.750
0.0236
0.0177
0.0295
L1
1.000
0°
8°
α
0.0394
0°
8°
1. Values in inches are converted from mm and rounded to four decimal digits.
Doc ID 16891 Rev 27
33/42
Package mechanical data
M24C64-W M24C64-R M24C64-F M24C64-DF
Figure 17. SO8N – 8 lead plastic small outline, 150 mils body width, package outline
h x 45˚
A2
A
c
ccc
b
e
0.25 mm
GAUGE PLANE
D
k
8
E1
E
1
L
A1
L1
SO-A
1. Drawing is not to scale.
Table 19.
SO8N – 8 lead plastic small outline, 150 mils body width, package data
inches (1)
millimeters
Symbol
Typ
Min
A
Max
Typ
1.750
Max
0.0689
A1
0.100
A2
1.250
b
0.280
0.480
0.0110
0.0189
c
0.170
0.230
0.0067
0.0091
ccc
0.250
0.0039
0.0098
0.0492
0.100
0.0039
D
4.900
4.800
5.000
0.1929
0.1890
0.1969
E
6.000
5.800
6.200
0.2362
0.2283
0.2441
E1
3.900
3.800
4.000
0.1535
0.1496
0.1575
e
1.270
0.0500
h
0.250
0.500
0.0098
0.0197
k
0°
8°
0°
8°
L
0.400
1.270
0.0157
0.0500
L1
1.040
0.0409
1. Values in inches are converted from mm and rounded to four decimal digits.
34/42
Min
Doc ID 16891 Rev 27
M24C64-W M24C64-R M24C64-F M24C64-DF
Package mechanical data
Figure 18. PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package outline
E
b2
A2
A1
b
A
L
c
e
eA
eB
D
8
E1
1
PDIP-B
1. Drawing is not to scale.
Table 20.
PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package mechanical data
inches(1)
millimeters
Symbol
Typ.
Min.
A
Max.
Typ.
Min.
5.33
A1
Max.
0.2098
0.38
0.0150
A2
3.30
2.92
4.95
0.1299
0.1150
0.1949
b
0.46
0.36
0.56
0.0181
0.0142
0.0220
b2
1.52
1.14
1.78
0.0598
0.0449
0.0701
c
0.25
0.20
0.36
0.0098
0.0079
0.0142
D
9.27
9.02
10.16
0.3650
0.3551
0.4000
E
7.87
7.62
8.26
0.3098
0.3000
0.3252
E1
6.35
6.10
7.11
0.2500
0.2402
0.2799
e
2.54
–
–
0.1000
–
–
eA
7.62
–
–
0.3000
–
–
eB
L
10.92
3.30
2.92
3.81
0.4299
0.1299
0.1150
0.1500
1. Values in inches are converted from mm and rounded to four decimal digits.
Doc ID 16891 Rev 27
35/42
Package mechanical data
M24C64-W M24C64-R M24C64-F M24C64-DF
Figure 19. UFDFPN8 (MLP8) - 8-lead ultra thin fine pitch dual flat no lead, package
outline
E
$
,
,
0IN
%
B
%
+
,
!
$
EEE
!
:7?-%E6
1. Drawing is not to scale.
2. The central pad (area E2 by D2 in the above illustration) is internally pulled to VSS. It must not be
connected to any other voltage or signal line on the PCB, for example during the soldering process.
Table 21.
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data
inches(1)
millimeters
Symbol
Typ
Min
Max
Typ
Min
Max
A
0.550
0.450
0.600
0.0217
0.0177
0.0236
A1
0.020
0.000
0.050
0.0008
0.0000
0.0020
b
0.250
0.200
0.300
0.0098
0.0079
0.0118
D
2.000
1.900
2.100
0.0787
0.0748
0.0827
1.200
1.600
0.0472
0.0630
2.900
3.100
0.1142
0.1220
1.200
1.600
0.0472
0.0630
D2 (rev MC)
E
3.000
E2 (rev MC)
e
0.500
0.1181
0.0197
K (rev MC)
0.300
L
0.300
L1
0.0118
0.500
0.0118
0.150
0.0197
0.0059
L3
0.300
0.0118
eee(2)
0.080
0.0031
1. Values in inches are converted from mm and rounded to four decimal digits.
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
measuring.
36/42
Doc ID 16891 Rev 27
M24C64-W M24C64-R M24C64-F M24C64-DF
Package mechanical data
Figure 20. WLCSP-R 5-bump wafer-length chip-scale package outline
E
$
#
E
$ETAIL!
%
E
"
!
)NDEX
!
)NDEX
&
!
3IDEVIEW
7AFERBACKSIDE
'
"UMPSIDE
"UMP
$ETAIL!
ROTATEDBY !
B
-36
1. Drawing is not to scale.
2. The index on the wafer back side (circle) is above the index of the bump side (triangle/arrow).
Table 22.
WLCSP-R 5-bump wafer-length chip-scale package mechanical data
inches(1)
millimeters
Symbol
Typ
Min
Max
Typ
Min
Max
A
0.545
0.490
0.600
0.0215
0.0193
0.0236
A1
0.190
0.0075
A2
0.355
0.0140
b(2)
0.270
0.0106
D
0.959
1.074
0.0378
0.0423
E
1.073
1.168
0.0422
0.0460
e
0.693
0.0273
e1
0.400
0.0157
e2
0.3465
0.0136
F
0.280
0.0110
G
0.190
0.0075
aaa
0.110
0.0043
eee
0.060
0.0024
1. Values in inches are converted from mm and rounded to four decimal digits.
2. Dimension measured at the maximum bump diameter parallel to primary datum Z.
Doc ID 16891 Rev 27
37/42
Package mechanical data
M24C64-W M24C64-R M24C64-F M24C64-DF
Figure 21. Thin WLCSP 8-bump wafer-length chip-scale package outline
E
(
$
8 9
E
%
E
E
AAA
2EFERENCE
&
$ETAIL!
!
!
8
/RIENTATION '
REFERENCE
"UMPSSIDE
3IDEVIEW
7AFERBACKSIDE
&
"UMP
!
EEE :
:
B
3EATINGPLANE
$ETAIL!
2OTATED #I?-%?6
1. Drawing is not to scale.
2. The index on the wafer back side (circle) is above the index of the bump side (triangle/arrow).
Table 23.
Thin WLCSP 8-bump wafer-length chip-scale package mechanical data(1)
inches(2)
millimeters
Symbol
Typ
Min
Max
Typ
Min
Max
A
0.315
0.300
0.330
0.0124
0.0118
0.0130
A1
0.115
0.0045
A2
0.200
0.0079
(3)
0.160
0.0063
D
1.073
1.093
0.0422
0.0430
E
0.959
0.979
0.0378
0.0385
e
0.693
0.0273
e1
0.800
0.0315
e2
0.400
0.0157
F
0.133
0.0052
G
0.137
0.00524
aaa
0.110
0.0043
eee
0.060
0.0043
b
1. These data are preliminary.
2. Values in inches are converted from mm and rounded to four decimal digits.
3. Dimension measured at the maximum bump diameter parallel to primary datum Z.
38/42
Doc ID 16891 Rev 27
M24C64-W M24C64-R M24C64-F M24C64-DF
10
Part numbering
Part numbering
Table 24.
Ordering information scheme
Example:
M24C64 - D
W MN 6
T
P /P
Device type
M24 = I2C serial access EEPROM
Device function
C64 = 64 Kbit (8192 x 8)
Device family
Blank: Without Identification page
D: With additional Identification page
Operating voltage
W = VCC = 2.5 V to 5.5 V
R = VCC = 1.8 V to 5.5 V
F = VCC = 1.7 V to 5.5 V
Package
BN = PDIP8(1)
MN = SO8 (150 mil width)(2)
DW = TSSOP8 (169 mil width)(2)
MC = UFDFPN8 (MLP8)(2)
CS = 5-bump WLCSP(2)
CT = 8-bump Thin WLCSP(2)
Device grade
6 = Industrial: device tested with standard test flow over –40 to 85 °C
Option
blank = standard packing
T = Tape and reel packing
Plating technology
P or G = ECOPACK® (RoHS compliant)
Process(3)
/P or /K = Manufacturing technology code
1. RoHS-compliant (ECOPACK1®)
2. RoHS-compliant and halogen-free (ECOPACK2®)
3. The process letters appear on the device package (marking) and on the shipment box. Please contact
your nearest ST Sales Office for further information.
Doc ID 16891 Rev 27
39/42
Revision history
11
M24C64-W M24C64-R M24C64-F M24C64-DF
Revision history
Table 25.
Document revision history
Date
Changes
14-Mar-2011
22
Updated information concerning E2, E1, E0 for the WLCSP package:
– note under Figure 3: 5-bump WLCSP connections (top view)
– comment under Figure 5: Device select code
– note 3 under Table 2: Device select code
07-Apr-2011
23
Updated MLP8 package data and Section 10: Part numbering.
Added footnote (a) in Section 4.5: Memory addressing.
24
Updated:
– Figure 3: 5-bump WLCSP connections (top view)
– Table 5: Absolute maximum ratings
– Small text changes
Added:
– Figure 12: Memory cell characteristics
25
Updated:
– Table 21: UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat
package no lead 2 x 3 mm, data
– Figure 14: Maximum Rbus value versus bus parasitic capacitance
Cbus) for an I2C bus at maximum frequency fC = 1MHz
– Figure 6: I2C Fast mode Plus (fC = 1 MHz): maximum Rbus value
versus bus parasitic capacitance (Cbus).
Added tWLDL and tDHWH in:
– Table 16: 400 kHz AC characteristics
– Table 17: 1 MHz AC characteristics
– Figure :
Minor text changes.
18-May-2011
08-Sep-2011
40/42
Revision
Doc ID 16891 Rev 27
M24C64-W M24C64-R M24C64-F M24C64-DF
Table 25.
Revision history
Document revision history (continued)
Date
Revision
Changes
16-Dec-2011
26
Updated A dimension in Table 22: WLCSP-R 5-bump wafer-length chipscale package mechanical data.
27
Datasheet split into:
– M24C64-DF, M24C64-W, M24C64-R,M24C64-F (this datasheet) for
tandard products (range 6),
– M24C64-125 datasheet for automotive products (range 3).
Added 8-bump thin WLCSP.
Updated single supply voltage and number of Write cycles on cover
page.
Updated Section 2.1: Serial Clock (SCL) and Section 2.2: Serial Data
(SDA).
Updated Figure 6: Block diagram.
Added Section 4.5: Device addressing.
Section 5.1: Write operations move to Section 5: Instructions and
updated.
Moved Figure 8: Write mode sequences with WC = 0 (data write
enabled) to Section 5.1.1: Byte Write.
Section 5.1.2: Page Write: changed address bits to A15/A5 and updated
Figure 9.
Case of locked Write identification Page removed from Section 5.1.4:
Lock Identification Page (M24C64-D only).
Updated Section 5.1.5: ECC (Error Correction Code) and Write cycling
and move Figure 10: Write cycle polling flowchart using ACK to
Section 5.1.6: Minimizing Write delays by polling on ACK.
Added note 1 in Table 6: Operating conditions (voltage range W) and
Table 7: Operating conditions (voltage range R).
Added Table 11: Cycling performance by groups of four bytes and
updated Table 12: Memory cell data retention.
Removed note 2 in Table 16: 400 kHz AC characteristics for tQL1QL2,
tWLDL, tDHWH, and tNS.
Table 24: Ordering information scheme: removed ambient operating
temperature for device grade 5 and added Note 2. to MLP8 and WLCSP
packages.
28-Aug-2012
Doc ID 16891 Rev 27
41/42
M24C64-W M24C64-R M24C64-F M24C64-DF
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2012 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
42/42
Doc ID 16891 Rev 27