TI SN74LV07ADGVR

SCES337I − MAY 2000 − REVISED JUNE 2006
D 2-V to 5.5-V VCC Operation
D Typical VOLP (Output Ground Bounce)
SN54LV07A . . . J OR W PACKAGE
SN74LV07A . . . D, DB, DGV, NS, OR PW PACKAGE
(TOP VIEW)
<0.8 V at VCC = 3.3 V, TA = 25°C
D Typical VOHV (Output VOH Undershoot)
D
D
D
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
6A
6Y
5A
5Y
4A
4Y
SN54LV07A . . . FK PACKAGE
(TOP VIEW)
1Y
1A
NC
VCC
6A
D
1A
1Y
2A
2Y
3A
3Y
GND
>2.3 V at VCC = 3.3 V, TA = 25°C
Outputs Are Disabled During Power Up and
Power Down With Inputs Tied to VCC
Support Mixed-Mode Voltage Operation on
All Ports
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
2A
NC
2Y
NC
3A
description/ordering information
These hex buffers/drivers are designed for 2-V to
5.5-V VCC operation.
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
6Y
NC
5A
NC
5Y
3Y
GND
NC
4Y
4A
The ’LV07A devices perform the Boolean function
Y = A in positive logic.
4
The open-drain outputs require pullup resistors to
perform correctly and can be connected to other
open-drain outputs to implement active-low
wired-OR or active-high wired-AND functions.
NC − No internal connection
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow through the devices when they are powered down.
ORDERING INFORMATION
TOP-SIDE
MARKING
Tube of 50
SN74LV07AD
Reel of 2500
SN74LV07ADR
SOP − NS
Reel of 2000
SN74LV07ANSR
74LV07A
SSOP − DB
Reel of 2000
SN74LV07ADBR
LV07A
Tube of 90
SN74LV07APW
Reel of 2000
SN74LV07APWR
Reel of 250
SN74LV07APWT
TVSOP − DGV
Reel of 2000
SN74LV07ADGVR
LV07A
CDIP − J
Tube of 25
SNJ54LV07AJ
SNJ54LV07AJ
CFP − W
Tube of 150
SNJ54LV07AW
SNJ54LV07AW
SOIC − D
−40°C to 85°C
TSSOP − PW
−55°C
−55
C to 125
125°C
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
LV07A
LV07A
LCCC − FK
Tube of 55
SNJ54LV07AFK
SNJ54LV07AFK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2006, Texas Instruments Incorporated
!"#$% !%&% '
%()#&% !"))$% & ( *"+,!&% &$- )"! !%()# *$!(!&% *$) $ $)# ( $.& %)"#$% &%&) /&))&%0)"!% *)!$%1 $ % %$!$&),0 %!,"$ $%1 ( &,,
*&)&#$$)POST OFFICE BOX 655303
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1
SCES337I − MAY 2000 − REVISED JUNE 2006
FUNCTION TABLE
(each buffer/driver)
INPUT
A
OUTPUT
Y
H
H
L
L
logic diagram, each buffer/driver (positive logic)
A
Y
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high-impedance or power-off state, VO
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −35 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
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SCES337I − MAY 2000 − REVISED JUNE 2006
recommended operating conditions (see Note 3)
VCC
VIH
Supply voltage
High-level input voltage
VIL
Low-level input voltage
VI
VO
Input voltage
IOL
∆t/∆v
SN54LV07A
SN74LV07A
MIN
MAX
MIN
MAX
2
5.5
2
5.5
VCC = 2 V
VCC = 3 V
1.5
1.5
2.1
2.1
VCC = 5 V
VCC = 2.3 V to 5.5 V
3.5
3.5
VCC × 0.7
VCC × 0.7
0.5
0.5
0.9
0.9
VCC = 5 V
VCC = 2.3 V to 5.5 V
1.5
1.5
0
VCC × 0.3
5.5
0
VCC × 0.3
5.5
0
5.5
0
VCC = 2 V
VCC = 2.3 V to 2.7 V
Low-level output current
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
Input transition rise or fall rate
V
V
VCC = 2 V
VCC = 3 V
Output voltage
UNIT
V
V
5.5
V
50
50
µA
2
2
8
8
16
16
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
200
200
100
100
VCC = 4.5 V to 5.5 V
20
20
mA
ns/V
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN54LV07A
PARAMETER
VOL
TEST CONDITIONS
IOL = 50 µA
IOL = 2 mA
IOL = 8 mA
IOL = 16 mA
II
IOH
VI = 5.5 V or GND
VI = VIH,
ICC
Ioff
VI = VCC or GND,
VI or VO= 0 to 5.5 V
Ci
VI = VCC or GND
VCC
MIN
TYP
MAX
MIN
TYP
MAX
2 V to 5.5 V
0.1
0.1
2.3 V
0.4
0.4
3V
0.44
0.44
4.5 V
0.55
0.55
UNIT
V
±1
±1
µA
5.5 V
±2.5
±2.5
µA
5.5 V
20
20
µA
5
µA
0 to 5.5 V
VOH = VCC
IO = 0
SN74LV07A
0
3.3 V
5
1.6
1.6
pF
' %()#&% !%!$)% *)"! % $ ()#&2$ )
$1% *&$ ( $2$,*#$%- '&)&!$)! && &% $)
*$!(!&% &)$ $1% 1&,- $.& %)"#$% )$$)2$ $ )1 !&%1$ ) !%%"$ $$ *)"! /" %!$-
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3
SCES337I − MAY 2000 − REVISED JUNE 2006
switching characteristics over recommended operating free-air temperature range,
VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)
PARAMETER
tPLH
FROM
(INPUT)
TO
(OUTPUT)
A
Y
tPHL
A
Y
tPLH
A
Y
tPHL
A
LOAD
CAPACITANCE
MIN
TA = 25°C
TYP
MAX
CL = 15 pF
CL = 50 pF
Y
SN54LV07A
SN74LV07A
MIN
MAX
MIN
MAX
6.6∗
10.4∗
1∗
13∗
1
13
7.5∗
10.4∗
1∗
13∗
1
13
11.1
15.2
1
18
1
18
9.6
15.2
1
18
1
18
UNIT
ns
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating free-air temperature range,
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
tPLH
FROM
(INPUT)
TO
(OUTPUT)
A
Y
tPHL
A
Y
tPLH
A
Y
tPHL
A
LOAD
CAPACITANCE
TA = 25°C
MIN
TYP
MAX
CL = 15 pF
CL = 50 pF
Y
SN54LV07A
SN74LV07A
MIN
MAX
MIN
MAX
5∗
7.1∗
1∗
8.5∗
1
8.5
5∗
7.1∗
1∗
8.5∗
1
8.5
8.2
10.6
1
12
1
12
6.6
10.6
1
12
1
12
UNIT
ns
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
tPLH
FROM
(INPUT)
TO
(OUTPUT)
A
Y
tPHL
A
Y
tPLH
A
Y
tPHL
A
LOAD
CAPACITANCE
TA = 25°C
MIN
TYP
MAX
CL = 15 pF
CL = 50 pF
Y
SN54LV07A
SN74LV07A
MIN
MAX
MIN
MAX
3.8∗
5.5∗
1∗
6.5∗
1
6.5
3.4∗
5.5∗
1∗
6.5∗
1
6.5
5.7
7.5
1
8.5
1
8.5
4.5
7.5
1
8.5
1
8.5
UNIT
ns
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
noise characteristics, VCC = 3.3 V, CL = 50 pF, TA = 25°C (see Note 4)
SN74LV07A
PARAMETER
MIN
TYP
MAX
UNIT
VOL(P)
Quiet output, maximum dynamic VOL
0.4
0.8
V
VOL(V)
Quiet output, minimum dynamic VOL
−0.1
−0.8
V
VOH(V)
Quiet output, minimum dynamic VOH
3.2
VIH(D)
High-level dynamic input voltage
VIL(D)
Low-level dynamic input voltage
V
2.31
V
0.99
V
VCC
3.3 V
TYP
UNIT
5V
5.3
NOTE 4: Characteristics are for surface-mount packages only.
operating characteristics, TA = 25°C
PARAMETER
Cpd
Power dissipation capacitance
TEST CONDITIONS
CL = 50 pF,
' %()#&% !%!$)% *)"! % $ ()#&2$ )
$1% *&$ ( $2$,*#$%- '&)&!$)! && &% $)
*$!(!&% &)$ $1% 1&,- $.& %)"#$% )$$)2$ $ )1 !&%1$ ) !%%"$ $$ *)"! /" %!$-
4
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f = 10 MHz
2.9
pF
SCES337I − MAY 2000 − REVISED JUNE 2006
PARAMETER MEASUREMENT INFORMATION
VCC
VCC
RL = 1 kΩ
From Output
Under Test
50% VCC
Input
Test
Point
50% VCC
tPHL
0V
tPLH
≈VCC
CL
(see Note A)
50% VCC
Output
VOL + 0.3 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
LOAD CIRCUIT FOR
OPEN-DRAIN OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
C. The outputs are measured one at a time, with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
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5
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LV07AD
ACTIVE
SOIC
D
14
SN74LV07ADBR
ACTIVE
SSOP
DB
SN74LV07ADBRE4
ACTIVE
SSOP
SN74LV07ADE4
ACTIVE
SN74LV07ADG4
50
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV07ADGVR
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV07ADGVRE4
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV07ADR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV07ADRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV07ADRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV07ANSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV07ANSRG4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV07APW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV07APWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV07APWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV07APWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV07APWRE4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV07APWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV07APWT
ACTIVE
TSSOP
PW
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV07APWTE4
ACTIVE
TSSOP
PW
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
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MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
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MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
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