UTC-IC LM4863-D16-T

UNISONIC TECHNOLOGIES CO., LTD
LM4863
CMOS IC
DUAL 2.2W AUDIO AMPLIFIER
PLUS STEREO HEADPHONE
FUNCTION
„
DESCRIPTION
The UTC LM4863 is a dual bridge-connected audio power
amplifier. It combines dual bridge speaker amplifiers and stereo
headphone amplifiers on one chip to simplify audio system design.
In addition, the headphone input pin allows the amplifiers to
operate in single-ended mode when driving stereo headphones.
The IC could deliver different power by packages as below (when
connected to a 5V supply with less than 1.0% THD+N.):
HTSSOP-20, 4Ω load: 2.2W
HTSSOP-20, 3Ω load: 2.5W(with forced-air cooled)
SOP/DIP
, 8Ω load: 1.1W.
The UTC LM4863 features an externally controlled, low-power
consumption shutdown mode, a stereo headphone amplifier mode,
and thermal shutdown protection. It also utilizes circuitry to reduce
“clicks and pops” during device turn-on.
„
*Pb-free plating product number: LM4863L
FEATURES
* “Click and pop” suppression circuitry
* Thermal shutdown protection circuitry
* Unity-gain stable
* Stereo headphone amplifier mode
„
ORDERING INFORMATION
Ordering Number
Package
Normal
Lead Free Plating
LM4863-D16-T
LM4863L-D16-T
DIP-16
LM4863-S18-R
LM4863L-S18-R
SOP-18
LM4863-S18-T
LM4863L-S18-T
SOP-18
LM4863-N20-R
LM4863L-N20-R HTSSOP-20
LM4863-N20-T
LM4863L-N20-T HTSSOP-20
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Copyright © 2007 Unisonic Technologies Co., Ltd
Packing
Tube
Tape Reel
Tube
Tape Reel
Tube
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LM4863
CMOS IC
PIN CONFIGURATION
„
SOP-18
DIP-16
SHUTDOWN
1
16
HP-IN
2
15
GND
+OUT A
3
14
+OUT B
GND
SHUTDOWN
1
18
HP-IN
GND
2
17
GND
+OUT A
3
16
+OUT B
VDD
4
15
VDD
-OUT A
5
14
-OUT B
VDD
4
13
VDD
-OUT A
5
12
-OUT B
-IN A
6
11
-IN B
-IN A
6
13
-IN B
GND
7
10
BYPASS
GND
7
12
BYPASS
+IN A
8
9
+IN B
+IN A
8
11
+IN B
GND
9
10
GND
PIN DESCRIPTION
„
PIN NO.
DIP-16 SOP-18 HTSSOP-20
4,13
4,15
PIN NAME
I/O
VDD
-
Supply voltage
Ground
Internal mid-supply bias reference bypassing
Entire IC into the shutdown mode when this pin connected
to the VDD
Output mode select, connected to the VDD for SE mode or
GND for BTL mode
Non-inverting input of channel A, connected to BYPASS pin
inside the IC
Inverting input of channel A
Channel A + output in BTL mode, high impedance in SE
mode
Channel A - output in BTL mode, + output in SE mode
Non-inverting input of channel B, connected to BYPASS pin
inside the IC
Inverting input of channel B
Channel B + output in BTL mode, high impedance in SE
mode
Channel B - output in BTL mode, + output in SE mode
4,17
10
12
14
GND
BYPASS
-
1
1
1
SHUTDOWN
I
16
18
20
HP-IN
I
8
8
8
+INA
I
6
6
6
-INA
I
3
3
3
+OUTA
O
5
5
5
-OUTA
O
9
11
13
+INB
I
11
13
15
-INB
I
14
16
18
+OUTB
O
12
14
16
-OUTB
O
2,7,15 2,7,9,10,17 2,7,9,10,11,12,19
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PIN DESCRIPTION
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„
CMOS IC
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
RATINGS
UNIT
Supply Voltage
VDD
6.0
V
Recommended Supply Voltage Range
VDD
2.0 ~ 5.5
V
Input Voltage
VIN
-0.3 ~ VDD+0.3
V
Power Dissipation
PD
Internally limited
Junction Temperature
TJ
+125
℃
Operating Temperature
TOPR
-40 ~ +85
℃
Storage Temperature
TSTG
-65 ~ +150
℃
Note Absolute maximum ratings are those values beyond which the device could be permanently damaged.
Absolute maximum ratings are stress ratings only and functional device operation is not implied.
„
THERMAL DATA
PARAMETER
SYMBOL
SOP-18
DIP-16
HTSSOP-20
SOP-18
DIP-16
HTSSOP-20
Thermal resistance (Junction to Ambient)
Thermal resistance (Junction to Case)
„
RATINGS
90
63
90
2
20
2
θJA
θJC
UNIT
℃/W
℃/W
℃/W
℃/W
℃/W
℃/W
ELECTRICAL CHARACTERISTICS (Notes 1)(VDD=5V, Ta =25℃, unless otherwise specified)
PARAMETER
FOR ENTIRE IC
Supply Voltage
SYMBOL
High
Headphone Input Voltage
Low
Quiescent Power Supply Current
(Note 2)
Shutdown Current
FOR BRIDGED-MODE OPERATION
Output Offset Voltage
TEST CONDITIONS
VDD
VIH
VIL
IDD
ISD
2
4
VIN=0V, IOUT=0A, HP-IN=0V
VIN=0V, IOUT=0A, HP-IN=4V
VDD applied to the SHUTDOWN pin
HTSSOP-20
POUT
THD+N=10%, f=1kHz
RL=3Ω
RL=4Ω
RL=3Ω
RL=4Ω
RL=8Ω
RL=8Ω
THD=1%, f=1kHz
THD+N=10%, f=1kHz
THD+N=1%, f=1kHz, RL=32Ω
20Hz≤f≤20kHz,
Total Harmonic
HTSSOP-20
RL=4Ω, POUT=2W
THD+N
AVD=2
Distortion + Noise
SOP/DIP
RL=8Ω, POUT=1W
VDD=5V, VRIPPLE=200mVRMS, RL=8Ω,
Power Supply Rejection Ratio
PSRR
CB=1.0µF
Channel Separation
XTALK f=1kHz, CB=1.0µF
Signal To Noise Ratio
SNR VDD=5V, POUT=1.1W, RL=8Ω
SOP/DIP
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6
2
VO(OFF) VIN=0V
THD=1%, f=1kHz
Output Power
(measured at the device
terminals)
MIM TYP MAX UNIT
1.0
5.5
11.5
5.8
0.7
5
2.5
2.2
3.2
2.7
1.1
1.5
0.34
0.3
0.3
0.8
20
V
V
V
mA
µA
50
mV
W
W
W
%
67
dB
90
98
dB
dB
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„
CMOS IC
ELECTRICAL CHARACTERISTICS(Cont.)
PARAMETER
FOR SINGLE-ENDED OPERATION
Output Offset Voltage
SYMBOL
TEST CONDITIONS
MIM TYP MAX UNIT
VO(OFF)
VIN=0V
5
50
mV
THD=0.5%, f=1kHz, RL=32Ω
75
85
Output Power
POUT THD+N=1%, f=1kHz, RL=8Ω
mW
340
THD+N=10%, f=1kHz, RL=8Ω
440
AV=-1, POUT=75mW,20Hz≤f≤20kHz,
Total Harmonic Distortion + Noise
THD+N
0.2
%
RL=32Ω
Power Supply Rejection Ratio
PSRR CB=1.0µF, VRIPPLE=200mVRMS, f=1kHz
52
dB
Channel Separation
XTALK f=1kHz, CB=1.0µF
60
dB
Signal To Noise Ratio
SNR VDD=5V, POUT=340mW, RL=8Ω
95
dB
Note:1. All voltages are measured with respect to the ground (GND) pins, unless otherwise specified.
2. Depends on the offset voltage when a practical load is connected to the amplifier.
3. When driving 3Ω or 4Ω and operating on a 5V supply, the HTSSOP-20 package must be mounted to the
circuit board that has a minimum of 2.5 in2 of exposed, uninterrupted copper area connected to the
exposed-DAP.
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LM4863
CMOS IC
TYPICAL APPLICATION CIRCUIT
„
VDD
CI
RF
1µF 20KΩ
Audio
Input
+
6
RI 8
20KΩ
CB
CI (CB size)
0.33µF
1µF
RI
Audio
Input
10
4,13
- IN A
+IN A
Bypass
11 -IN B
9 +IN B
CS
0.1µF
TANT
50KΩ
AMP 1A
+
20KΩ
-OUT A 5
20KΩ
20KΩ
AMP 2A
+
+OUT A
VDD/2
CONTROL PIN
RL 1kΩ
RING
8Ω
3 To HP-IN Circuit
50KΩ
20KΩ
VDD
RF
20KΩ
100kΩ
1 Shutdown
To Control Pin on
16 HP-IN
Headphone jack
100KΩ
AMP 1B
+
20KΩ
CO
100µF
+
-OUT B 12
20KΩ
20KΩ
14
AMP 2B
+
+OUT B
CO
100µF
+
RL
8Ω
SLEEVE
TIP
HEADPHONE JACK
1kΩ
GND 2,7,15
Note: Pin out shown for DIP-16. Refer to the PIN CONFIGURATION for the pin out of other packages.
Figure 1.Typical Audio Amplifier Application Circuit
„
EXTERNAL COMPONENTS DESCRIPTION
Components
RI
CI
RF
CS
CB
Functional Description
The inverting input resistance, along with RF, set the closed-loop gain. RI, along with CI form a high
pass filter with fc=1/(2πRICI)
The input coupling capacitor blocks DC voltage at the amplifier’s input terminals. CI, along with RI,
create a high pass filter with fc=1/(2πRICI). Refer to the section. Selecting Proper External
Components, for an explanation of determine the value of CI.
The feedback resistance, along with RI, set the closed-Ioop gain.
The supply bypass capacitor. Refer to the Power Supply Bypassing section for information about
properly placing and selecting the value of, this capacitor.
The capacitor, CB, filters the half-supply voltage present on the Bypass pin. Refer to the Selecting
Proper External Components section for information concerning proper placement and selecting
CB’S value.
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TYPICAL CHARACTERISTICS
THD+N (%)
THD+N (%)
(For HTSSOP-20)
10
THD+N vs Output Power
10
VDD=5V, RL=4Ω
POUT=2.0W, BW<80kHz
THD+N (%)
THD+N (%)
VDD=5V, RL=4Ω
BW<80kHz
1
20Hz
20KHz
1
0.1
0.1
1KHz
0.01
0 10m
THD+N vs Frequency
0.1
Level (W)
1
3
0.01
0 20
100
1k
Frequency (Hz)
10k 20k
Power Dissipation (W)
„
CMOS IC
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TYPICAL CHARACTERISTICS(Cont.)
THD+N (%)
THD+N (%)
THD+N (%)
THD+N (%)
THD+N(%)
(For DIP-16 and SOP-18)
THD+N
(%)
„
CMOS IC
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TYPICAL CHARACTERISTICS(Cont.)
THD+N vs Output Power
10
VDD=3.3V, AVD=-2
POUT=750mW, RL=4Ω
f=20kHz
THD+N (%)
THD+N (%)
VDD=-3.3V, AVD= -2
RL=4Ω
1
f=20Hz
0.1
1
0.1
f=1kHz
0.1
Level (W)
1
0.01
20
2
100
1k
Frequency (Hz)
10k 20k
THD+N (%)
0.01
10m
THD+N vs Frequency
10
THD+N (%)
„
CMOS IC
Output Power vs Load Resistance
1000
VDD=3.3V, AV= -1
800 f=1kHz, BW<80kHz
800
Power Dissipation vs Supply Voltage
VDD=3.3V
Single-ended
600
600
4Ω
THD+N=10%
400
400
8Ω
200
THD+N=1%
200
0
0
20
30
10
Load Resistance (Ω)
40
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16Ω
0
0
250
500
750
Power Out (mW)
1000
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Output Power (W)
Output Power (W)
Output Power (W)
TYPICAL CHARACTERISTICS(Cont.)
Output Power (W)
„
CMOS IC
Output Power vs Load resistance
1
VDD=5V
f=1kHz
AV=-1
Single Ended
BW<80kHz
0.8
0.6
RL=8Ω
0.6
0.5
0.4
RL=16Ω
0.3
0.4
0.2
10% THD+N
0.2
0
Output Power vs Supply Voltage
0.7
0.1
1% THD+N
0
10
20 30 40 50 60
Load Resistance (Ω)
70
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0
2
RL=32Ω
2.5
VDD=5V
f=1kHz
THD+N∞1.0%
Bridged Load
BW<80kHz
0.5 0.75
1
Output Power (W)
1.25
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CMOS IC
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Phase (o)
PSRR (dB)
GAIN (dB)
Output Level (dB)
Output Level (dB)
Power Dissipation (W)
Output Noise Voltage (µv)
TYPICAL CHARACTERISTICS(Cont.)
„
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TYPICAL CHARACTERISTICS(Cont.)
Supply Current vs Supply Voltage
15
VIN=0V
No Load
12
Dropout Voltage ( V )
Supply Current (mA)
„
CMOS IC
BRIDGED
(HP-IN=GND)
9
6
3
0
SINGLE-ENDED
(HP-IN=VDD)
2
2.5
3 3.5 4 4.5
Supply Voltage (V)
5
5.5
UTC assumes no responsibility for equipment failures that result from using products at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specifications of any and all UTC products described or contained
herein. UTC products are not designed for use in life support appliances, devices or systems where
malfunction of these products can be reasonably expected to result in personal injury. Reproduction in
whole or in part is prohibited without the prior written consent of the copyright owner. The information
presented in this document does not form part of any quotation or contract, is believed to be accurate
and reliable and may be changed without notice.
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