MICROCHIP 24C00-IP

24AA00/24LC00/24C00
128 Bit I2C™ Bus Serial EEPROM
Device Selection Table
Package Types
VCC Range
Temp Range
24AA00
1.8 - 5.5
C,I
24LC00
2.5 - 5.5
24C00
4.5 - 5.5
8-PIN PDIP/SOIC
NC
1
C,I
NC
2
C,I,E
NC
3
Vss
4
Features
The Microchip Technology Inc. 24AA00/24LC00/
24C00 (24XX00*) is a 128-bit Electrically Erasable
PROM memory organized as 16 x 8 with a 2-wire serial
interface. Low voltage design permits operation down
to 1.8 volts for the 24XX00 version, and every version
maintains a maximum standby current of only 1 µA and
typical active current of only 500 µA. This device was
designed for where a small amount of EEPROM is
needed for the storage of calibration values, ID
numbers or manufacturing information, etc. The
24XX00 is available in 8-pin PDIP, 8-pin SOIC (150
mil), 8-pin TSSOP and the 5-pin SOT-23 packages.
1
2
3
4
NC
NC
NC
VSS
VCC
7
NC
6
SCL
5
SDA
8
7
6
5
VCC
NC
SCL
SDA
5-PIN SOT-23
SCL
1
VSS
2
SDA
3
24XX00
Description
8
8-PIN TSSOP
24XX00
• Low-power CMOS technology
- 500 µA typical active current
- 250 nA typical standby current
• Organized as 16 bytes x 8 bits
• 2-wire serial interface bus, I2C™ compatible
• 100 kHz (1.8V) and 400 kHz (5V) compatibility
• Self-timed write cycle (including auto-erase)
• 4 ms maximum byte write cycle time
• 1,000,000 erase/write cycles
• ESD protection > 4 kV
• Data retention > 200 years
• 8L DIP, SOIC, TSSOP and 5L SOT-23 packages
• Standard or Pb-free finish available
• Temperature ranges available:
- Commercial (C):
0°C to +70°C
- Industrial (I):
-40°C to +85°C
- Automotive (E):
-40°C to +125°C
24XX00
Device
5
VCC
4
NC
Block Diagram
HV Generator
Memory
Control
Logic
I/O
Control
Logic
SDA
XDEC
EEPROM
Array
SCL
YDEC
VCC
Sense AMP
R/W Control
VSS
Pin Function Table
Name
Function
VSS
Ground
SDA
Serial Data
SCL
Serial Clock
VCC
+1.8V to 5.5V (24AA00)
+2.5V to 5.5V (24LC00)
I2C is a trademark of Philips Corporation.
*24XX00 is used in this document as a generic part number for
the 24AA00/24LC00/24C00 devices.
 2003 Microchip Technology Inc.
+4.5V to 5.5V (24C00)
NC
No Internal Connection
DS21178D-page 1
24AA00/24LC00/24C00
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings(†)
VCC .............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied ................................................................................................-65°C to +125°C
ESD protection on all pins ..........................................................................................................................................4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at those or any other conditions
above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
All Parameters apply across the
recommended operating ranges unless
otherwise noted
Parameter
Commercial (C):
Industrial (I):
Automotive (E)
Symbol
TA = 0°C to +70°C,
TA = -40°C to +85°C,
TA = -40°C to +125°C,
Min.
Max.
VCC = 1.8V to 5.5V
VCC = 1.8V to 5.5V
VCC = 4.5V to 5.5V
Units
Conditions
SCL and SDA pins:
High-level input voltage
VIH
0.7 VCC
Low-level input voltage
VIL
Hysteresis of Schmitt Trigger
inputs
VHYS
Low-level output voltage
VOL
.05 VCC
V
(Note)
0.3 VCC
V
(Note)
—
V
VCC ≥ 2.5V (Note)
0.4
V
IOL = 3.0 mA, VCC = 4.5V
IOL = 2.1 mA, VCC = 2.5V
Input leakage current
ILI
—
±1
µA
VIN = VCC or VSS
Output leakage current
ILO
—
±1
µA
VOUT = VCC or VSS
Pin capacitance (all inputs/outputs)
CIN,
COUT
—
10
pF
VCC = 5.0V (Note)
TA = 25°C, f = 1 MHz
Operating current
ICC Write
—
2
mA
VCC = 5.5V, SCL = 400 kHz
ICC Read
—
1
mA
VCC = 5.5V, SCL = 400 kHz
ICCS
—
1
µA
VCC = 5.5V, SDA = SCL = VCC
Standby current
Note:
This parameter is periodically sampled and not 100% tested.
FIGURE 1-1:
BUS TIMING DATA
THIGH
TF
SCL
TSU:STA
TLOW
SDA
IN
TR
TSP
TSU:DAT
THD:DAT
TSU:STO
THD:STA
TBUF
TAA
SDA
OUT
DS21178D-page 2
 2003 Microchip Technology Inc.
24AA00/24LC00/24C00
TABLE 1-2:
AC CHARACTERISTICS
All Parameters apply across all
recommended operating ranges
unless otherwise noted
Parameter
Commercial (C):
Industrial (I):
Automotive (E):
Symbol
TA = 0°C to +70°C, VCC = 1.8V to 5.5V
TA = -40°C to +85°C, VCC = 1.8V to 5.5V
TA = -40°C to +125°C, VCC = 4.5V to 5.5V
Min
Max
Units
Conditions
Clock frequency
FCLK
—
—
—
100
100
400
kHz
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.8V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
Clock high time
THIGH
4000
4000
600
—
—
—
ns
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.8V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
Clock low time
TLOW
4700
4700
1300
—
—
—
ns
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.8V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
SDA and SCL rise time
(Note 1)
TR
—
—
—
1000
1000
300
ns
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.8V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
SDA and SCL fall time
TF
—
300
ns
(Note 1)
Start condition hold time
THD:STA
4000
4000
600
—
—
—
ns
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.8V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
Start condition setup time
TSU:STA
4700
4700
600
—
—
—
ns
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.8V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
Data input hold time
THD:DAT
0
—
ns
(Note 2)
Data input setup time
TSU:DAT
250
250
100
—
—
—
ns
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.8V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
Stop condition setup time
TSU:STO
4000
4000
600
—
—
—
ns
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.8V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
Output valid from clock
(Note 2)
TAA
—
—
—
3500
3500
900
ns
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.8V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
4700
4700
1300
—
—
—
ns
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.8V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
Bus free time: Time the bus must TBUF
be free before a new transmission can start
Output fall time from VIH
minimum to VIL maximum
TOF
20+0.1
CB
250
ns
(Note 1), CB ≤ 100 pF
Input filter spike suppression
(SDA and SCL pins)
TSP
—
50
ns
(Notes 1, 3)
Write cycle time
TWC
—
4
ms
1M
—
cycles
Endurance
Note 1:
2:
3:
4:
(Note 4)
Not 100% tested. CB = total capacitance of one bus line in pF.
As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs which provide improved
noise spike suppression. This eliminates the need for a TI specification for standard operation.
This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which can be obtained on www.microchip.com.
 2003 Microchip Technology Inc.
DS21178D-page 3
24AA00/24LC00/24C00
2.0
PIN DESCRIPTIONS
2.1
SDA Serial Data
4.0
BUS CHARACTERISTICS
The following bus protocol has been defined:
This is a bidirectional pin used to transfer addresses
and data into and data out of the device. It is an open
drain terminal, therefore the SDA bus requires a pull-up
resistor to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for
400 kHz).
• Data transfer may be initiated only when the bus
is not busy.
• During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.
For normal data transfer SDA is allowed to change only
during SCL low. Changes during SCL high are
reserved for indicating the Start and Stop conditions.
Accordingly, the following bus conditions have been
defined (Figure 4-1).
2.2
SCL Serial Clock
This input is used to synchronize the data transfer from
and to the device.
2.3
Noise Protection
The SCL and SDA inputs have Schmitt Trigger and
filter circuits which suppress noise spikes to assure
proper device operation even on a noisy bus.
3.0
FUNCTIONAL DESCRIPTION
The 24XX00 supports a bidirectional 2-wire bus and
data transmission protocol. A device that sends data
onto the bus is defined as a transmitter, and a device
receiving data as a receiver. The bus has to be
controlled by a master device which generates the
serial clock (SCL), controls the bus access, and
generates the Start and Stop conditions, while the
24XX00 works as slave. Both master and slave can
operate as transmitter or receiver, but the master
device determines which mode is activated.
4.1
Bus Not Busy (A)
Both data and clock lines remain high.
4.2
Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.
4.3
Stop Data Transfer (C)
A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All
operations must be ended with a Stop condition.
4.4
Data Valid (D)
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
The data on the line must be changed during the low
period of the clock signal. There is one bit of data per
clock pulse.
Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of the
data bytes transferred between the Start and Stop
conditions is determined by the master device and is
theoretically unlimited.
DS21178D-page 4
 2003 Microchip Technology Inc.
24AA00/24LC00/24C00
4.5
Acknowledge
The device that acknowledges has to pull down the
SDA line during the Acknowledge clock pulse in such a
way that the SDA line is stable low during the high
period of the acknowledge related clock pulse. Of
course, setup and hold times must be taken into
account. A master must signal an end of data to the
slave by not generating an Acknowledge bit on the last
byte that has been clocked out of the slave. In this
case, the slave must leave the data line high to enable
the master to generate the Stop condition (Figure 4-2).
Each receiving device, when addressed, is obliged to
generate an acknowledge after the reception of each
byte. The master device must generate an extra clock
pulse which is associated with this Acknowledge bit.
Note:
The 24XX00 does not generate any
Acknowledge bits if an internal programming cycle is in progress.
FIGURE 4-1:
SCL
(A)
DATA TRANSFER SEQUENCE ON THE SERIAL BUS
(B)
(C)
(D)
START
CONDITION
ADDRESS OR
ACKNOWLEDGE
VALID
(C)
(A)
SDA
FIGURE 4-2:
STOP
CONDITION
DATA
ALLOWED
TO CHANGE
ACKNOWLEDGE TIMING
Acknowledge
Bit
SCL
1
2
SDA
3
4
5
6
7
Data from transmitter
Transmitter must release the SDA line at this point
allowing the Receiver to pull the SDA line low to
acknowledge the previous eight bits of data.
 2003 Microchip Technology Inc.
8
9
1
2
3
Data from transmitter
Receiver must release the SDA line at this point
so the Transmitter can continue sending data.
DS21178D-page 5
24AA00/24LC00/24C00
5.0
DEVICE ADDRESSING
After generating a Start condition, the bus master
transmits a control byte consisting of a slave address
and a Read/Write bit that indicates what type of
operation is to be performed. The slave address for the
24XX00 consists of a 4-bit device code ‘1010’ followed
by three don't care bits.
The last bit of the control byte determines the operation
to be performed. When set to a one a read operation is
selected, and when set to a zero a write operation is
selected. (Figure 5-1). The 24XX00 monitors the bus
for its corresponding slave address all the time. It
generates an Acknowledge bit if the slave address was
true and it is not in a Programming mode.
FIGURE 5-1:
CONTROL BYTE FORMAT
Read/Write Bit
Don’t Care
Bits
Device Select
Bits
S
1
0
1
0
X
X
X R/W ACK
Slave Address
Start Bit
DS21178D-page 6
Acknowledge Bit
6.0
WRITE OPERATIONS
6.1
Byte Write
Following the Start signal from the master, the device
code (4 bits), the don't care bits (3 bits), and the R/W bit
(which is a logic low) are placed onto the bus by the
master transmitter. This indicates to the addressed
slave receiver that a byte with a word address will
follow after it has generated an Acknowledge bit during
the ninth clock cycle. Therefore, the next byte transmitted by the master is the word address and will be
written into the address pointer of the 24XX00. Only the
lower four address bits are used by the device, and the
upper four bits are don’t cares. The 24XX00 will
acknowledge the address byte and the master device
will then transmit the data word to be written into the
addressed memory location. The 24XX00 acknowledges again and the master generates a Stop
condition. This initiates the internal write cycle, and
during this time the 24XX00 will not generate Acknowledge signals (Figure 7-2). After a byte Write command,
the internal address counter will not be incremented
and will point to the same address location that was just
written. If a Stop bit is transmitted to the device at any
point in the Write command sequence before the entire
sequence is complete, then the command will abort
and no data will be written. If more than 8 data bits are
transmitted before the Stop bit is sent, then the device
will clear the previously loaded byte and begin loading
the data buffer again. If more than one data byte is
transmitted to the device and a Stop bit is sent before a
full eight data bits have been transmitted, then the
Write command will abort and no data will be written.
The 24XX00 employs a VCC threshold detector circuit
which disables the internal erase/write logic if the VCC
is below 1.5V (24AA00 and 24LC00) or 3.8V (24C00)
at nominal conditions.
 2003 Microchip Technology Inc.
24AA00/24LC00/24C00
7.0
ACKNOWLEDGE POLLING
FIGURE 7-1:
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a Write
command has been issued from the master, the device
initiates the internally timed write cycle. ACK polling
can be initiated immediately. This involves the master
sending a Start condition followed by the control byte
for a Write command (R/W = 0). If the device is still
busy with the write cycle, then no ACK will be returned.
If no ACK is returned, then the Start bit and control byte
must be re-sent. If the cycle is complete, then the
device will return the ACK and the master can then
proceed with the next Read or Write command. See
Figure 7-1 for flow diagram.
ACKNOWLEDGE
POLLING FLOW
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
NO
YES
Next
Operation
FIGURE 7-2:
BYTE WRITE
BUS ACTIVITY
MASTER
S
T
A
R
T
SDA LINE
S
CONTROL
BYTE
1
0
1
BUS ACTIVITY
0
X
X
WORD
ADDRESS
X
X
0
A
C
K
X
X
S
T
O
P
DATA
P
X
A
C
K
A
C
K
X = Don’t Care Bit
 2003 Microchip Technology Inc.
DS21178D-page 7
24AA00/24LC00/24C00
8.0
READ OPERATIONS
Read operations are initiated in the same way as write
operations with the exception that the R/W bit of the
slave address is set to one. There are three basic types
of read operations: current address read, random read,
and sequential read.
8.1
Current Address Read
The 24XX00 contains an address counter that maintains the address of the last word accessed, internally
incremented by one. Therefore, if the previous read
access was to address n, the next current address read
operation would access data from address n + 1. Upon
receipt of the slave address with the R/W bit set to one,
the device issues an acknowledge and transmits the
eight-bit data word. The master will not acknowledge
the transfer but does generate a Stop condition and the
device discontinues transmission (Figure 8-1).
8.2
Random Read
Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, first the word address must
be set. This is done by sending the word address to the
device as part of a write operation.
FIGURE 8-1:
8.3
Sequential Read
Sequential reads are initiated in the same way as a
random read except that after the device transmits the
first data byte, the master issues an acknowledge as
opposed to a Stop condition in a random read. This
directs the device to transmit the next sequentially
addressed 8-bit word (Figure 8-3).
To provide sequential reads the 24XX00 contains an
internal address pointer which is incremented by one at
the completion of each read operation. This address
pointer allows the entire memory contents to be serially
read during one operation.
CURRENT ADDRESS READ
BUS ACTIVITY
MASTER
S
T
A
R
T
SDA LINE
S 1 0 1 0 X XX 1
BUS ACTIVITY
X = Don’t Care Bit
DS21178D-page 8
After the word address is sent, the master generates a
Start condition following the acknowledge. This terminates the write operation, but not before the internal
address pointer is set. Then the master issues the
control byte again but with the R/W bit set to a one. The
24XX00 will then issue an acknowledge and transmits
the eight bit data word. The master will not acknowledge the transfer but does generate a Stop condition
and the device discontinues transmission (Figure 8-2).
After this command, the internal address counter will
point to the address location following the one that was
just read.
CONTROL
BYTE
S
T
O
P
DATA
P
A
C
K
N
O
A
C
K
 2003 Microchip Technology Inc.
24AA00/24LC00/24C00
FIGURE 8-2:
RANDOM READ
S
T
BUS ACTIVITY A
MASTER
R
T
CONTROL
BYTE
WORD
ADDRESS (n)
X X X X
S 1 0 1 0 X X X 0
SDA LINE
CONTROL
BYTE
P
A
C
K
BUS ACTIVITY
MASTER
N
O
A
C
K
X = Don’t Care Bit
FIGURE 8-3:
S
T
O
P
DATA (n)
S 1 0 1 0 X X X 1
A
C
K
A
C
K
BUS ACTIVITY
S
T
A
R
T
SEQUENTIAL READ
CONTROL
BYTE
DATA n
DATA n + 1
DATA n + 2
S
T
O
P
DATA n + X
SDA LINE
BUS ACTIVITY
P
A
C
K
 2003 Microchip Technology Inc.
A
C
K
A
C
K
A
C
K
N
O
A
C
K
DS21178D-page 9
24AA00/24LC00/24C00
9.0
PACKAGING INFORMATION
9.1
Package Marking Information
8-Lead PDIP (300 mil)
Example:
XXXXXXXX
T/XXXNNN
YYWW
24LC00
I/P13F
0327
8-Lead SOIC (150 mil)
Example:
XXXXXXXX
T/XXYYWW
NNN
24LC00
I/SN0327
13F
Example:
8-Lead TSSOP
XXXX
4L00
TYWW
I327
NNN
13F
TSSOP Marking
Code
Part
Number
STD
Pb-Free
24AA00
4A00
G4A0
24LC00
4L00
G4L0
Part Number
24AA00
24LC00
24C00
Note:
XXNN
Legend:
Note:
*
XX...X
T
YY
Y
WW
NNN
Example:
SOT-23 Marking Code
5-Lead SOT-23
C
I
E
A0
B0
—
L0
M0
N0
C0
D0
E0
Pb-free parts are marked same as
standard finish. Pb-free part number using
“G” suffix is marked on carton..
M03F
Customer specific information*
Temperature grade (I,E)
Year code (last 2 digits of calendar year)
Year code (last digit of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
Standard QTP marking consists of Microchip part number, year code, week code, and traceability code.
DS21178D-page 10
 2003 Microchip Technology Inc.
24AA00/24LC00/24C00
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
p
eB
B
Units
Dimension Limits
n
p
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
L
c
§
B1
B
eB
α
β
MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
MAX
8
.100
.155
.130
.170
.145
.313
.250
.373
.130
.012
.058
.018
.370
10
10
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MILLIMETERS
NOM
8
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
9.14
9.46
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MIN
MAX
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
 2003 Microchip Technology Inc.
DS21178D-page 11
24AA00/24LC00/24C00
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
n
1
α
h
45°
c
A2
A
φ
β
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
h
L
φ
c
B
α
β
MIN
.053
.052
.004
.228
.146
.189
.010
.019
0
.008
.013
0
0
A1
INCHES*
NOM
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
.009
.017
12
12
MAX
.069
.061
.010
.244
.157
.197
.020
.030
8
.010
.020
15
15
MILLIMETERS
NOM
8
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
6.02
3.71
3.91
4.80
4.90
0.25
0.38
0.48
0.62
0
4
0.20
0.23
0.33
0.42
0
12
0
12
MIN
MAX
1.75
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
0.25
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
DS21178D-page 12
 2003 Microchip Technology Inc.
24AA00/24LC00/24C00
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
E
E1
p
D
2
1
n
B
α
A
c
φ
β
A1
A2
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
L
φ
c
B
α
β
MIN
INCHES
NOM
MAX
8
.026
.033
.002
.246
.169
.114
.020
0
.004
.007
0
0
.035
.004
.251
.173
.118
.024
4
.006
.010
5
5
.043
.037
.006
.256
.177
.122
.028
8
.008
.012
10
10
MILLIMETERS*
NOM
MAX
8
0.65
1.10
0.85
0.90
0.95
0.05
0.10
0.15
6.25
6.38
6.50
4.30
4.40
4.50
2.90
3.00
3.10
0.50
0.60
0.70
0
4
8
0.09
0.15
0.20
0.19
0.25
0.30
0
5
10
0
5
10
MIN
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-086
 2003 Microchip Technology Inc.
DS21178D-page 13
24AA00/24LC00/24C00
5-Lead Plastic Small Outline Transistor (OT) (SOT-23)
E
E1
p
B
p1
n
D
1
α
c
A
Units
Dimension Limits
n
Number of Pins
p
Pitch
p1
Outside lead pitch (basic)
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
φ
L
β
A
A2
A1
E
E1
D
L
φ
c
B
α
β
MIN
.035
.035
.000
.102
.059
.110
.014
0
.004
.014
0
0
A2
A1
INCHES*
NOM
5
.038
.075
.046
.043
.003
.110
.064
.116
.018
5
.006
.017
5
5
MAX
.057
.051
.006
.118
.069
.122
.022
10
.008
.020
10
10
MILLIMETERS
NOM
5
0.95
1.90
0.90
1.18
0.90
1.10
0.00
0.08
2.60
2.80
1.50
1.63
2.80
2.95
0.35
0.45
0
5
0.09
0.15
0.35
0.43
0
5
0
5
MIN
MAX
1.45
1.30
0.15
3.00
1.75
3.10
0.55
10
0.20
0.50
10
10
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-178
Drawing No. C04-091
DS21178D-page 14
 2003 Microchip Technology Inc.
24AA00/24LC00/24C00
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
X
PART NO.
Device
/XX
Temperature Package
Range
X
Lead Finish
Examples:
a)
b)
Device:
24AA00:
24AA00T:
24LC00:
24LC00T:
24C00:
24C00T:
= 1.8V, 128 bit I2C™ Serial EEPROM
= 1.8V, 128 bit I2C Serial EEPROM
(Tape and Reel)
= 2.5V, 128 bit I2C Serial EEPROM
= 2.5V, 128 bit I2C Serial EEPROM
(Tape and Reel)
= 5V, 128 bit I2C™ Serial EEPROM
= 5V, 128 bit I2C™ Serial EEPROM
(Tape and Reel)
Temperature Blank = 0°C to 70°C
Range:
I
= -40°C to +85°C
E
= -40°C to +125°C
Package:
P
SN
ST
OT
=
=
=
=
Lead finish
Blank = Standard 63/37 SnPb
G
= Matte Tin (pure Sn)
c)
d)
e)
f)
24AA00-I/P: Industrial Temperature,1.8V
PDIP package
24AA00-I/SN: Industrial Temperature,
1.8V, SOIC package
24AA00T-I/OT: Industrial Temperature,
1.8V, SOT-23 package, tape and reel
24LC00-I/P: Industrial Temperature,
2.5V, PDIP package
24C00-E/SN: Extended Temperature,
5V, SOIC package
24LC00T-I/OT: Industrial Temperature,
2.5V, SOT-23 package, tape and reel
g)
24LC00-I/PG: Industrial Temperature, 2.5V
PDIP package, Pb-free
h)
24LC00T-I/OTG: Industrial Temperature,
2.5V, SOT-23 package, tape and reel,
Pb-free
Plastic DIP (300 mil body), 8-lead
Plastic SOIC (150 mil body), 8-lead
Plastic TSSOP (4.4 mm), 8-lead
SOT-23, 5-lead (Tape and Reel only)
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 2003 Microchip Technology Inc.
DS21178D-page15
24AA00/24LC00/24C00
NOTES:
DS21178D-page 16
 2003 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with
express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE and PowerSmart are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER,
SEEVAL and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Application Maestro, dsPICDEM, dsPICDEM.net, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo,
PowerMate, PowerTool, rfLAB, rfPIC, Select Mode,
SmartSensor, SmartShunt, SmartTel and Total Endurance are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2003, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
 2003 Microchip Technology Inc.
DS21178D-page 17
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
Korea
Corporate Office
Australia
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: 82-2-554-7200 Fax: 82-2-558-5932 or
82-2-558-5934
Atlanta
Unit 915
Bei Hai Wan Tai Bldg.
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100
Fax: 86-10-85282104
3780 Mansell Road, Suite 130
Alpharetta, GA 30022
Tel: 770-640-0034
Fax: 770-640-0307
Boston
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848
Fax: 978-692-3821
Chicago
333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250
Fax: 248-538-2260
Kokomo
2767 S. Albright Road
Kokomo, IN 46902
Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
China - Beijing
China - Chengdu
Rm. 2401-2402, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-86766200
Fax: 86-28-86766599
China - Fuzhou
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506
Fax: 86-591-7503521
China - Hong Kong SAR
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
China - Shanghai
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700
Fax: 86-21-6275-5060
China - Shenzhen
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888
Fax: 949-263-1338
Rm. 1812, 18/F, Building A, United Plaza
No. 5022 Binhe Road, Futian District
Shenzhen 518033, China
Tel: 86-755-82901380
Fax: 86-755-8295-1393
Phoenix
China - Shunde
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966
Fax: 480-792-4338
Room 401, Hongjian Building
No. 2 Fengxiangnan Road, Ronggui Town
Shunde City, Guangdong 528303, China
Tel: 86-765-8395507 Fax: 86-765-8395571
San Jose
China - Qingdao
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950
Fax: 408-436-7955
Rm. B505A, Fullhope Plaza,
No. 12 Hong Kong Central Rd.
Qingdao 266071, China
Tel: 86-532-5027355 Fax: 86-532-5027205
Toronto
India
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699
Fax: 905-673-6509
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Japan
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
DS21178D-page 18
Singapore
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Kaohsiung Branch
30F - 1 No. 8
Min Chuan 2nd Road
Kaohsiung 806, Taiwan
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Taiwan
Taiwan Branch
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
Austria
Durisolstrasse 2
A-4600 Wels
Austria
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45-4420-9895 Fax: 45-4420-9910
France
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany
Steinheilstrasse 10
D-85737 Ismaning, Germany
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy
Via Quasimodo, 12
20025 Legnano (MI)
Milan, Italy
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands
P. A. De Biesbosch 14
NL-5152 SC Drunen, Netherlands
Tel: 31-416-690399
Fax: 31-416-690340
United Kingdom
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44-118-921-5869
Fax: 44-118-921-5820
07/28/03
 2003 Microchip Technology Inc.