24AA04/24LC04B

24AA04/24LC04B
4K I2C™ Serial EEPROM
Device Selection Table
Description:
Part
Number
Vcc
Range
Max. Clock
Frequency
Temp.
Ranges
24AA04
1.8-5.5
400 kHz(1)
I
2.5-5.5
400 kHz
I, E
24LC04B
Note 1:
100 kHz for VCC <2.5V
Features:
• Single supply with operation down to 1.8V
• Low-power CMOS technology:
- 1 mA active current, typical
- 1 μA standby current, typical (I-temp)
• Organized as 2 blocks of 256 bytes (2 x 256 x 8)
• 2-wire serial interface bus, I2C™ compatible
• Schmitt Trigger inputs for noise suppression
• Output slope control to eliminate ground bounce
• 100 kHz (24AA04) and 400 kHz (24LC04B)
compatibility
• Self-timed write cycle (including auto-erase)
• Page write buffer for up to 16 bytes
• Hardware write-protect for entire memory
• Can be operated as a serial ROM
• Factory programming (QTP) available
• ESD protection > 4,000V
• 1,000,000 erase/write cycles
• Data retention > 200 years
• 8-lead PDIP, SOIC, TSSOP, DFN and MSOP
packages
• 5-lead SOT-23 package
• Pb-free finish available
• Available for extended temperature ranges:
- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C
The Microchip Technology Inc. 24AA04/24LC04B
(24XX04*) is a 4 Kbit Electrically Erasable PROM. The
device is organized as two blocks of 256 x 8-bit
memory with a 2-wire serial interface. Low-voltage
design permits operation down to 1.8V, with standby
and active currents of only 1 μA and 1 mA,
respectively. The 24XX04 also has a page write
capability for up to 16 bytes of data. The 24XX04 is
available in the standard 8-pin PDIP, surface mount
SOIC, TSSOP, 2x3 DFN and MSOP packages and is
also available in the 5-lead SOT-23 package.
Package Types
SOIC, TSSOP
PDIP, MSOP
A0
1
8
VCC
A0
1
8
VCC
A1
2
7
WP
A1
2
7
WP
A2
3
6
SCL
A2
3
6
SCL
VSS
4
5
SDA VSS
4
5
SDA
SOT-23-5
SCL
1
DFN
5
WP
A0 1
A1 2
Vss
2
SDA
3
Note:
A2 3
VSS 4
4
8 VCC
7 WP
6 SCL
5 SDA
Vcc
Pins A0, A1 and A2 are not used by the 24XX04. (No
internal connections).
Block Diagram
HV
Generator
WP
I/O
Control
Logic
Memory
Control
Logic
XDEC
EEPROM
Array
Page
Latches
I/O
SCL
YDEC
SDA
VCC
VSS
© 2005 Microchip Technology Inc.
Sense Amp.
R/W Control
DS21708E-page 1
24AA04/24LC04B
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings (†)
VCC .............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied ................................................................................................-65°C to +125°C
ESD protection on all pins ......................................................................................................................................................≥ 4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at those or any other conditions
above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
DC CHARACTERISTICS
Param.
No.
Sym.
Characteristic
Industrial (I):
Automotive (E):
TA = -40°C to +85°C, VCC = +1.8V to +5.5V
TA = -40°C to +125°C, VCC = +2.5V to +5.5V
Min.
Typ.
Max.
Units
Conditions
D1
VIH
WP, SCL and SDA pins
—
—
—
—
—
D2
—
High-level input voltage
0.7 VCC
—
—
V
—
D3
VIL
Low-level input voltage
—
—
0.3 VCC
V
—
D4
VHYS
Hysteresis of Schmitt
Trigger inputs
0.05 VCC
—
—
V
(Note)
D5
VOL
Low-level output voltage
—
—
0.40
V
IOL = 3.0 mA, VCC = 2.5V
D6
ILI
Input leakage current
—
—
±1
μA
VIN = VSS or VCC
D7
ILO
Output leakage current
—
—
±1
μA
VOUT = VSS or VCC
D8
CIN,
COUT
Pin capacitance
(all inputs/outputs)
—
—
10
pF
VCC = 5.0V (Note)
TA = 25°C, FCLK = 1 MHz
D9
ICC write Operating current
—
0.1
3
mA
VCC = 5.5V, SCL = 400 kHz
D10
ICC read
D11
ICCS
Note:
Standby current
—
0.05
1
mA
—
—
—
0.01
—
1
5
μA
μA
Industrial
Automotive
SDA = SCL = VCC
WP = VSS
This parameter is periodically sampled and not 100% tested.
DS21708E-page 2
© 2005 Microchip Technology Inc.
24AA04/24LC04B
TABLE 1-2:
AC CHARACTERISTICS
AC CHARACTERISTICS
Param.
No.
Sym.
Characteristic
Industrial (I):
Automotive (E):
TA = -40°C to +85°C, VCC = +1.8V to +5.5V
TA = -40°C to +125°C, VCC = +2.5V to +5.5V
Min.
Typ.
Max.
Units
Conditions
1
FCLK
Clock frequency
—
—
—
—
400
100
kHz
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC < 2.5V (24AA04)
2
THIGH
Clock high time
600
4000
—
—
—
—
ns
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC < 2.5V (24AA04)
3
TLOW
Clock low time
1300
4700
—
—
—
—
ns
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC < 2.5V (24AA04)
4
TR
SDA and SCL rise time
(Note 1)
—
—
—
—
300
1000
ns
2.5V ≤ VCC ≤ 5.5V (Note 1)
1.8V ≤ VCC < 2.5V (24AA04)
(Note 1)
5
TF
SDA and SCL fall time
—
—
—
300
ns
(Note 1)
6
THD:STA
Start condition hold time
600
4000
—
—
—
—
ns
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC < 2.5V (24AA04)
7
TSU:STA
Start condition setup
time
600
4700
—
—
—
—
ns
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC < 2.5V (24AA04)
8
THD:DAT
Data input hold time
0
—
—
—
ns
(Note 2)
9
TSU:DAT
Data input setup time
100
250
—
—
—
—
ns
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC < 2.5V (24AA04)
10
TSU:STO
Stop condition setup
time
600
4000
—
—
—
—
ns
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC < 2.5V (24AA04)
11
TAA
Output valid from clock
(Note 2)
—
—
—
—
900
3500
ns
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC < 2.5V (24AA04)
12
TBUF
Bus free time: Time the
bus must be free before
a new transmission can
start
1300
4700
—
—
—
—
ns
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC < 2.5V (24AA04)
13
TOF
Output fall time from VIH
minimum to VIL
maximum
20+0.1CB
—
—
—
250
250
ns
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC < 2.5V (24AA04)
14
TSP
Input filter spike
suppression
(SDA and SCL pins)
—
—
50
ns
(Notes 1 and 3)
15
TWC
Write cycle time
(byte or page)
—
—
5
ms
—
16
—
Endurance
1M
—
—
Note 1:
2:
3:
4:
cycles 25°C, (Note 4)
Not 100% tested. CB = total capacitance of one bus line in pF.
As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs which provide improved
noise spike suppression. This eliminates the need for a TI specification for standard operation.
This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which can be obtained from Microchip’s web site
at www.microchip.com.
© 2005 Microchip Technology Inc.
DS21708E-page 3
24AA04/24LC04B
FIGURE 1-1:
BUS TIMING DATA
5
4
2
3
SCL
7
SDA
IN
8
10
9
6
14
12
11
SDA
OUT
FIGURE 1-2:
BUS TIMING START/STOP
D4
SCL
6
7
10
SDA
Start
DS21708E-page 4
Stop
© 2005 Microchip Technology Inc.
24AA04/24LC04B
2.0
FUNCTIONAL DESCRIPTION
The 24XX04 supports a bidirectional, 2-wire bus and
data transmission protocol. A device that sends data
onto the bus is defined as transmitter, while a device
receiving data is defined as a receiver. The bus has to
be controlled by a master device which generates the
Serial Clock (SCL), controls the bus access and
generates the Start and Stop conditions, while the
24XX04 works as slave. Both master and slave can
operate as transmitter or receiver, but the master
device determines which mode is activated.
3.0
BUS CHARACTERISTICS
The following bus protocol has been defined:
• Data transfer may be initiated only when the bus
is not busy.
• During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.
Accordingly, the following bus conditions have been
defined (Figure 3-1).
3.1
Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.
3.3
Stop Data Transfer (C)
A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All
operations must be ended with a Stop condition.
FIGURE 3-1:
(A)
Data Valid (D)
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
The data on the line must be changed during the low
period of the clock signal. There is one clock pulse per
bit of data.
Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of data
bytes transferred between Start and Stop conditions is
determined by the master device and is, theoretically,
unlimited (although only the last sixteen will be stored
when doing a write operation). When an overwrite does
occur, it will replace data in a first-in first-out (FIFO)
fashion.
3.5
Acknowledge
Each receiving device, when addressed, is obliged to
generate an acknowledge after the reception of each
byte. The master device must generate an extra clock
pulse which is associated with this Acknowledge bit.
Note:
Bus Not Busy (A)
Both data and clock lines remain high.
3.2
3.4
The 24XX04 does not generate any
Acknowledge
bits
if
an
internal
programming cycle is in progress.
The device that acknowledges has to pull down the
SDA line during the acknowledge clock pulse in such a
way that the SDA line is stable low during the high
period of the acknowledge related clock pulse. Of
course, setup and hold times must be taken into
account. During reads, a master must signal an end of
data to the slave by not generating an Acknowledge bit
on the last byte that has been clocked out of the slave.
In this case, the slave (24XX04) will leave the data line
high to enable the master to generate the Stop
condition.
DATA TRANSFER SEQUENCE ON THE SERIAL BUS
(B)
(D)
Start
Condition
Address or
Acknowledge
Valid
(D)
(C)
(A)
SCL
SDA
© 2005 Microchip Technology Inc.
Data
Allowed
to Change
Stop
Condition
DS21708E-page 5
24AA04/24LC04B
3.6
FIGURE 3-2:
Device Addressing
A control byte is the first byte received following the
Start condition from the master device. The control byte
consists of a four-bit control code. For the 24XX04, this
is set as ‘1010’ binary for read and write operations.
The next two bits of the control byte are “don’t cares” for
the 24XX04. The last bit, B0, is used by the master
device to select which of the two 256-word blocks of
memory are to be accessed. This bit is, in effect, the
Most Significant bit of the word address.
The last bit of the control byte defines the operation to
be performed. When set to ‘1’, a read operation is
selected. When set to ‘0’, a write operation is selected.
Following the Start condition, the 24XX04 monitors the
SDA bus checking the device type identifier being
transmitted and, upon receiving a ‘1010’ code, the
slave device outputs an Acknowledge signal on the
SDA line. Depending on the state of the R/W bit, the
24XX04 will select a read or write operation.
Operation
Control
Code
Block Select
R/W
Read
1010
Block Address
1
Write
1010
Block Address
0
DS21708E-page 6
CONTROL BYTE
ALLOCATION
Read/Write Bit
Block
Select
Bits
Control Code
S
1
0
1
0
x
x
B0 R/W ACK
Slave Address
Start Bit
Acknowledge Bit
x = “don’t care”
© 2005 Microchip Technology Inc.
24AA04/24LC04B
4.0
WRITE OPERATION
4.1
Byte Write
4.2
The write control byte, word address and the first data
byte are transmitted to the 24XX04 in the same way as
in a byte write. But instead of generating a Stop condition the master transmits up to 16 data bytes to the
24XX04, which are temporarily stored in the on-chip
page buffer and will be written into memory once the
master has transmitted a Stop condition. Upon receipt
of each word, the four lower-order Address Pointer bits
are internally incremented by ‘1’. The higher-order 7
bits of the word address remain constant. If the master
should transmit more than 16 words prior to generating
the Stop condition, the address counter will roll over
and the previously received data will be overwritten. As
with the byte write operation, once the Stop condition is
received an internal write cycle will begin (Figure 4-2).
Following the Start condition from the master, the
device code (4 bits), the block address (3 bits) and the
R/W bit, which is a logic low, is placed onto the bus by
the master transmitter. This indicates to the addressed
slave receiver that a byte with a word address will
follow once it has generated an Acknowledge bit during
the ninth clock cycle. Therefore, the next byte transmitted by the master is the word address and will be
written into the Address Pointer of the 24XX04. After
receiving another Acknowledge signal from the
24XX04, the master device will transmit the data word
to be written into the addressed memory location. The
24XX04 acknowledges again and the master
generates a Stop condition. This initiates the internal
write cycle and, during this time, the 24XX04 will not
generate Acknowledge signals (Figure 4-1).
FIGURE 4-1:
Note:
Page write operations are limited to writing
bytes within a single physical page
regardless of the number of bytes
actually being written. Physical page
boundaries start at addresses that are
integer multiples of the page buffer size (or
‘page size’) and end at addresses that are
integer multiples of [page size – 1]. If a
Page Write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page as might be
expected. It is therefore necessary for the
application software to prevent page write
operations that would attempt to cross a
page boundary.
BYTE WRITE
Bus Activity
Master
S
T
A
R
T
SDA Line
S 1
Control
Byte
0
1
0
x
Bus Activity
x = “don’t care”
FIGURE 4-2:
Page Write
Word
Address
S
T
O
P
Data
x B0 0
Block
Select
Bits
P
A
C
K
A
C
K
A
C
K
PAGE WRITE
Bus Activity
Master
S
T
A
R
T
SDA Line
S 1 0 1 0 x x B0 0
Control
Byte
Bus Activity
x = “don’t care”
© 2005 Microchip Technology Inc.
Block
Select
Bits
Word
Address (n)
Data (n + 1)
Data (n)
S
T
O
P
Data (n + 15)
P
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
DS21708E-page 7
24AA04/24LC04B
5.0
ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a Write
command has been issued from the master, the device
initiates the internally-timed write cycle and ACK polling
can then be initiated immediately. This involves the
master sending a Start condition followed by the control
byte for a Write command (R/W = 0). If the device is still
busy with the write cycle, no ACK will be returned. If the
cycle is complete, the device will return the ACK and
the master can then proceed with the next Read or
Write command. See Figure 5-1 for a flow diagram of
this operation.
FIGURE 5-1:
6.0
WRITE PROTECTION
The WP pin allows the user to write-protect the entire
array (000-1FF) when the pin is tied to VCC. If tied to
VSS the write protection is disabled.
ACKNOWLEDGE POLLING
FLOW
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
No
Yes
Next
Operation
DS21708E-page 8
© 2005 Microchip Technology Inc.
24AA04/24LC04B
7.0
READ OPERATION
7.3
Sequential Read
Read operations are initiated in the same way as write
operations, with the exception that the R/W bit of the
slave address is set to ‘1’. There are three basic types
of read operations: current address read, random read
and sequential read.
Sequential reads are initiated in the same way as a
random read, except that once the 24XX04 transmits
the first data byte, the master issues an acknowledge
as opposed to a Stop condition in a random read. This
directs the 24XX04 to transmit the next sequentiallyaddressed 8-bit word (Figure 7-3).
7.1
To provide sequential reads, the 24XX04 contains an
internal Address Pointer that is incremented by one
upon completion of each operation. This Address
Pointer allows the entire memory contents to be serially
read during one operation.
Current Address Read
The 24XX04 contains an address counter that maintains the address of the last word accessed, internally
incremented by ‘1’. Therefore, if the previous access
(either a read or write operation) was to address n, the
next current address read operation would access data
from address n + 1. Upon receipt of the slave address
with R/W bit set to ‘1’, the 24XX04 issues an acknowledge and transmits the 8-bit data word. The master will
not acknowledge the transfer, but does generate a Stop
condition and the 24XX04 discontinues transmission
(Figure 7-1).
7.2
7.4
Noise Protection
The 24XX04 employs a VCC threshold detector circuit
which disables the internal erase/write logic if the VCC
is below 1.5V at nominal conditions.
The SCL and SDA inputs have Schmitt Trigger and
filter circuits which suppress noise spikes to assure
proper device operation, even on a noisy bus.
Random Read
Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, the word address must first
be set. This is accomplished by sending the word
address to the 24XX04 as part of a write operation.
Once the word address is sent, the master generates a
Start condition following the acknowledge. This terminates the write operation, but not before the internal
Address Pointer is set. The master then issues the
control byte again, but with the R/W bit set to a ‘1’. The
24XX04 will then issue an acknowledge and transmit
the 8-bit data word. The master will not acknowledge
the transfer, but does generate a Stop condition and the
24XX04, will discontinue transmission (Figure 7-2).
FIGURE 7-1:
CURRENT ADDRESS READ
Bus Activity
Master
S
T
A
R
T
SDA Line
S 1
Bus Activity
x = “don’t care”
© 2005 Microchip Technology Inc.
Control
Byte
0
1
0
S
T
O
P
Data (n)
x x B0 1
Block
Select
Bits
P
A
C
K
N
o
A
C
K
DS21708E-page 9
24AA04/24LC04B
FIGURE 7-2:
RANDOM READ
S
T
A
R
T
Bus Activity
Master
Control
Byte
S
T
A
R
T
Word
Address (n)
Block
Select
Bits
Bus Activity
A
C
K
A
C
K
Bus Activity
Master
SDA Line
Bus Activity
P
A
C
K
Block
Select
Bits
N
o
A
C
K
x = “don’t care”
FIGURE 7-3:
S
T
O
P
Data (n)
S 1 0 1 0 x x B0 1
S 1 0 1 0 x x B0 0
SDA Line
Control
Byte
SEQUENTIAL READ
Control
Byte
Data (n)
Data (n + 1)
Data (n + 2)
S
T
O
P
Data (n + x)
P
1
A
C
K
A
C
K
A
C
K
A
C
K
N
o
A
C
K
DS21708E-page 10
© 2005 Microchip Technology Inc.
24AA04/24LC04B
8.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 8-1.
TABLE 8-1:
PIN FUNCTION TABLE
Name
PDIP
SOIC
TSSOP
DFN
MSOP
SOT23
A0
1
1
1
1
1
—
Not Connected
A1
2
2
2
2
2
—
Not Connected
8.1
A2
3
3
3
3
3
—
Not Connected
VSS
4
4
4
4
4
2
Ground
SDA
5
5
5
5
5
3
Serial Address/Data I/O
SCL
6
6
6
6
6
1
Serial Clock
WP
7
7
7
7
7
5
Write-Protect Input
VCC
8
8
8
8
8
4
+1.8V to 5.5V Power Supply
Serial Address/Data Input/Output
(SDA)
SDA is a bidirectional pin used to transfer addresses
and data into and out of the device. Since it is an opendrain terminal, the SDA bus requires a pull-up resistor
to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for 400 kHz).
For normal data transfer, SDA is allowed to change
only during SCL low. Changes during SCL high are
reserved for indicating Start and Stop conditions.
8.2
Description
Serial Clock (SCL)
The SCL input is used to synchronize the data transfer
to and from the device.
© 2005 Microchip Technology Inc.
8.3
Write-Protect (WP)
The WP pin must be connected to either VSS or VCC.
If tied to VSS, normal memory operation is enabled
(read/write the entire memory 000-1FF).
If tied to VCC, write operations are inhibited. The entire
memory will be write-protected. Read operations are
not affected.
This feature allows the user to use the 24XX04 as a
serial ROM when WP is enabled (tied to VCC).
8.4
A0, A1, A2
The A0, A1 and A2 pins are not used by the 24XX04.
They may be left floating or tied to either VSS or VCC.
DS21708E-page 11
24AA04/24LC04B
9.0
PACKAGING INFORMATION
9.1
Package Marking Information
8-Lead PDIP (300 mil)
XXXXXXXX
T/XXXNNN
YYWW
8-Lead SOIC (150 mil)
XXXXXXXT
XXXXYYWW
NNN
8-Lead TSSOP
24LC04B
I/P e3 13F
0527
Example:
24LC04BI
SN e3 0527
13F
Example:
XXXX
4L04
TYWW
I527
NNN
13F
8-Lead MSOP
Example:
XXXXXT
4L4BI
YWWNNN
52713
5-Lead SOT-23
XXNN
8-Lead 2x3 DFN
XXX
YWW
NN
DS21708E-page 12
Example:
Example:
M33F
Example:
234
527
13
© 2005 Microchip Technology Inc.
24AA04/24LC04B
1st Line Marking Codes
Part Number
SOT-23
TSSOP
DFN
MSOP
I Temp.
E Temp.
I Temp.
E Temp.
24AA04
4A04
4A04T
B3NN
—
231
—
24LC04B
4L04
4L4BT
M3NN
N3NN
234
235
Note:
T = Temperature grade (I, E)
NN = Alphanumeric traceability code
Legend: XX...X
T
Y
YY
WW
NNN
e3
Note:
Part number or part number code
Temperature (I, E)
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
Note:
For very small packages with no room for the Pb-free JEDEC designator
e3 , the marking will only appear on the outer carton or reel label.
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion.
*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
© 2005 Microchip Technology Inc.
DS21708E-page 13
24AA04/24LC04B
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
p
eB
B
Units
Dimension Limits
n
p
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
L
c
§
B1
B
eB
α
β
MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
MAX
8
.100
.155
.130
.170
.145
.313
.250
.373
.130
.012
.058
.018
.370
10
10
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MILLIMETERS
NOM
8
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
9.14
9.46
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MIN
MAX
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
DS21708E-page 14
© 2005 Microchip Technology Inc.
24AA04/24LC04B
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
n
1
h
α
45°
c
A2
A
φ
β
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
h
L
φ
c
B
α
β
MIN
.053
.052
.004
.228
.146
.189
.010
.019
0
.008
.013
0
0
A1
INCHES*
NOM
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
.009
.017
12
12
MAX
.069
.061
.010
.244
.157
.197
.020
.030
8
.010
.020
15
15
MILLIMETERS
NOM
8
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
6.02
3.71
3.91
4.80
4.90
0.25
0.38
0.48
0.62
0
4
0.20
0.23
0.33
0.42
0
12
0
12
MIN
MAX
1.75
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
0.25
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
© 2005 Microchip Technology Inc.
DS21708E-page 15
24AA04/24LC04B
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
E
E1
p
D
2
1
n
B
α
A
c
φ
β
A1
A2
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
L
φ
c
B
α
β
MIN
INCHES
NOM
MAX
8
.026
.033
.002
.246
.169
.114
.020
0
.004
.007
0
0
.035
.004
.251
.173
.118
.024
4
.006
.010
5
5
.043
.037
.006
.256
.177
.122
.028
8
.008
.012
10
10
MILLIMETERS*
NOM
MAX
8
0.65
1.10
0.85
0.90
0.95
0.05
0.10
0.15
6.25
6.38
6.50
4.30
4.40
4.50
2.90
3.00
3.10
0.50
0.60
0.70
0
4
8
0.09
0.15
0.20
0.19
0.25
0.30
0
5
10
0
5
10
MIN
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-086
DS21708E-page 16
© 2005 Microchip Technology Inc.
24AA04/24LC04B
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
E
E1
p
D
2
B
n
1
α
A2
A
c
φ
A1
(F)
L
β
Units
Dimension Limits
n
p
MIN
INCHES
NOM
MAX
MILLIMETERS*
NOM
8
0.65 BSC
0.75
0.85
0.00
4.90 BSC
3.00 BSC
3.00 BSC
0.40
0.60
0.95 REF
0°
0.08
0.22
5°
5°
-
MIN
8
Number of Pins
Pitch
.026 BSC
A
.043
Overall Height
A2
Molded Package Thickness
.030
.033
.037
A1
.000
.006
Standoff
E
Overall Width
.193 TYP.
E1
.118 BSC
Molded Package Width
D
.118 BSC
Overall Length
L
.016
.024
.031
Foot Length
Footprint (Reference)
F
.037 REF
φ
0°
8°
Foot Angle
c
.003
.006
.009
Lead Thickness
B
.009
.012
.016
Lead Width
α
5°
15°
Mold Draft Angle Top
β
5°
15°
Mold Draft Angle Bottom
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
MAX
1.10
0.95
0.15
0.80
8°
0.23
0.40
15°
15°
JEDEC Equivalent: MO-187
Drawing No. C04-111
© 2005 Microchip Technology Inc.
DS21708E-page 17
24AA04/24LC04B
5-Lead Plastic Small Outline Transistor (OT) (SOT-23)
E
E1
p
B
p1
n
D
1
α
c
A
Units
Dimension Limits
n
Number of Pins
p
Pitch
p1
Outside lead pitch (basic)
Overall Height
A
Molded Package Thickness
A2
Standoff §
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Foot Length
L
φ
Foot Angle
c
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
φ
L
β
B
α
β
MIN
.035
.035
.000
.102
.059
.110
.014
0
.004
.014
0
0
A2
A1
INCHES*
NOM
5
.038
.075
.046
.043
.003
.110
.064
.116
.018
5
.006
.017
5
5
MAX
.057
.051
.006
.118
.069
.122
.022
10
.008
.020
10
10
MILLIMETERS
NOM
5
0.95
1.90
0.90
1.18
0.90
1.10
0.00
0.08
2.60
2.80
1.50
1.63
2.80
2.95
0.35
0.45
0
5
0.09
0.15
0.35
0.43
0
5
0
5
MIN
MAX
1.45
1.30
0.15
3.00
1.75
3.10
0.55
10
0.20
0.50
10
10
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-178
Drawing No. C04-091
DS21708E-page 18
© 2005 Microchip Technology Inc.
24AA04/24LC04B
8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated
p
D
b
n
L
E
PIN 1
ID INDEX
AREA
(NOTE 2)
E2
EXPOSED
METAL
PAD
2
1
D2
BOTTOM VIEW
TOP VIEW
A
A1
A3
EXPOSED
TIE BAR
(NOTE 1)
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Exposed Pad Length
Overall Width
Exposed Pad Width
Contact Width
Contact Length
Units
Dimension Limits
n
p
(Note 3)
(Note 3)
A
A1
A3
D
D2
E
E2
b
L
MIN
.031
.000
.055
.047
.008
.012
INCHES
NOM
8
.020 BSC
.035
.001
.008 REF.
.079 BSC
-.118 BSC
-.010
.016
MAX
MIN
.039
.002
0.80
0.00
.064
1.39
.071
.012
.020
1.20
0.20
0.30
MILLIMETERS*
NOM
8
0.50 BSC
0.90
0.02
0.20 REF.
2.00 BSC
-3.00 BSC
-0.25
0.40
MAX
1.00
0.05
1.62
1.80
0.30
0.50
*Controlling Parameter
Notes:
1. Package may have one or more exposed tie bars at ends.
2. Pin 1 visual index feature may vary, but must be located within the hatched area.
3. Exposed pad dimensions vary with paddle size.
4. JEDEC equivalent: MO-229
Drawing No. C04-123
© 2005 Microchip Technology Inc.
Revised 05/24/04
DS21708E-page 19
24AA04/24LC04B
APPENDIX A:
REVISION HISTORY
Revision C
Corrections to Section 1.0, Electrical Characteristics.
Revision D
Added DFN package.
Revision E
Revised Figure 3-2 Control Byte Allocation; Figure 4-1
Byte Write; Figure 4-2 Page Write; Section 6.0 Write
Protection; Figure 7-1 Current Address Read; Figure 72 Random Read; Figure 7-3 Sequential Read.
DS21708E-page 20
© 2005 Microchip Technology Inc.
24AA04/24LC04B
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Development Systems Information Line
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://support.microchip.com
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com, click on Customer Change
Notification and follow the registration instructions.
© 2005 Microchip Technology Inc.
DS21708E-page 21
24AA04/24LC04B
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To:
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Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Device: 24AA04/24LC04B
Y
N
Literature Number: DS21708E
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21708E-page 22
© 2005 Microchip Technology Inc.
24AA04/24LC04B
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
/XX
Temperature Package
Range
X
Lead Finish
Examples:
a)
b)
Device:
= 1.8V, 4 Kbit I2C Serial EEPROM
= 1.8V, 4 Kbit I2C Serial EEPROM
(Tape and Reel)
24LC04B: = 2.5V, 4 Kbit I2C Serial EEPROM
24LC04BT: = 2.5V, 4 Kbit I2C Serial EEPROM
(Tape and Reel)
24AA04:
24AA04T:
Temperature I
Range:
E
= -40°C to +85°C
= -40°C to +125°C
Package:
=
=
=
=
=
=
MC
P
SN
ST
MS
OT
Lead Finish: Blank =
G
=
c)
d)
e)
f)
24AA04-I/P: Industrial Temperature,
1.8V, PDIP package
24AA04-I/SN: Industrial Temperature,
1.8V, SOIC package
24AA04T-I/OT: Industrial Temperature,
1.8V, SOT-23 package, tape and reel
24LC04B-I/P: Industrial Temperature,
2.5V, PDIP package
24LC04B-E/SN: Extended Temperature,
2.5V, SOIC package
24LC04BT-I/OT: Industrial Temperature,
2.5V, SOT-23 package, tape and reel
2x3 DFN, 8-lead
Plastic DIP (300 mil body), 8-lead
Plastic SOIC (150 mil body), 8-lead
Plastic TSSOP (4.4 mm), 8-lead
Plastic Micro Small Outline (MSOP), 8-lead
SOT-23, 5-lead (Tape and Reel only)
Pb-free – Matte Tin (see Note 1)
Pb-free – Matte Tin only
Note 1: Most products manufactured after January 2005 will have a Matte Tin (Pb-free) finish. Most products manufactured
before January 2005 will have a finish of approximately 63% Sn and 37% Pb (Sn/Pb). Please visit www.microchip.com
for the latest information on Pb-free conversion, including conversion date codes.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
© 2005 Microchip Technology Inc.
DS21708E-page23
24AA04/24LC04B
NOTES:
DS21708E-page 24
© 2005 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION, INCLUDING BUT NOT
LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE.
Microchip disclaims all liability arising from this information and
its use. Use of Microchip’s products as critical components in
life support systems is not authorized except with express
written approval by Microchip. No licenses are conveyed,
implicitly or otherwise, under any Microchip intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
PICMASTER, SEEVAL, SmartSensor and The Embedded
Control Solutions Company are registered trademarks of
Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Linear Active Thermistor,
MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM,
PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo,
PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode,
Smart Serial, SmartTel, Total Endurance and WiperLock are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2005, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2005 Microchip Technology Inc.
DS21708E-page 25
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
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Technical Support:
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Web Address:
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Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
Malaysia - Penang
Tel: 604-646-8870
Fax: 604-646-5086
Philippines - Manila
Tel: 632-634-9065
Fax: 632-634-9069
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-352-30-52
Fax: 34-91-352-11-47
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
08/24/05
DS21708E-page 26
© 2005 Microchip Technology Inc.