bq24380 bq24381 www.ti.com .............................................................................................................................................................. SLUS805A – APRIL 2008 – REVISED MAY 2008 Overvoltage and Overcurrent Protection IC and Li+ Charger Front-End Protection IC With LDO Mode FEATURES DESCRIPTION 1 • • • • • • • • • • • 2 Input Overvoltage Protection Accurate Battery Overvoltage Protection Output Short-Circuit Protection Soft-Start to Prevent Inrush Currents Soft-Stop to Prevent Voltage Spikes 30-V Maximum Input Voltage Supports up to 1.7-A Load Current Thermal Shutdown Enable Function Fault Status Indication Small 2 mm × 2 mm 8-Pin SON Package The bq2438x family are charger front-end integrated circuits designed to provide protection to Li-ion batteries from failures of the charging circuitry. The IC continuously monitors the input voltage and the battery voltage. The device operates like a linear regulator, maintaining a 5.5-V (bq24380) or 5-V (bq24381) output with input voltages up to the Input overvoltage threshold. During input overvoltage conditions, the IC immediately turns off the internal pass FET disconnecting the charging circuitry from the damaging input source. Additionally, if the battery voltage rises to unsafe levels while charging, power is removed from the system. The IC checks for short-circuit or overload conditions at its output when turning the pass FET on, and if it finds unsafe conditions, it switches off, and then rechecks the conditions. Additionally, the IC also monitors its die temperature and switches off if it exceeds 140°C. APPLICATIONS • • • • Smart Phones, Mobile Phones PDAs MP3 Players Low-Power Handheld Devices When the IC is controlled by a processor, the IC provides status information about fault conditions to the host. APPLICATION SCHEMATIC AC Adapter OUT 8 1 IN VDC GND Charging Circuit 1 mF 1 mF bq24380 SYSTEM VBAT 6 VSS 2 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008, Texas Instruments Incorporated bq24380 bq24381 SLUS805A – APRIL 2008 – REVISED MAY 2008 .............................................................................................................................................................. www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION (1) DEVICE VOVP VO(REG) PACKAGE (1) bq24380 6.3 V 5.5 V 2x2 SON CFE bq24381 7.1 V 5V 2x2 SON CFW MARKING For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VI Input voltage IOUTmax VALUE UNIT IN (with respect to VSS) –0.3 to 30 V OUT (with respect to VSS) –0.3 to 12 V FAULT, CE, VBAT (with respect to VSS) –0.3 to 7 V Output source current OUT 2 A Output sink current FAULT 15 mA TJ Junction temperature –40 to 150 °C Tstg Storage temperature –65 to 150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to the network ground terminal unless otherwise noted. DISSIPATION RATINGS PACKAGE RθJC RθJA DSG 5°C/W 75°C/W RECOMMENDED OPERATING CONDITIONS VI IN voltage range IO Current, OUT pin TJ Junction temperature 2 Submit Documentation Feedback MIN MAX 3.3 30 UNIT 1.7 A -40 125 °C V Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): bq24380 bq24381 bq24380 bq24381 www.ti.com .............................................................................................................................................................. SLUS805A – APRIL 2008 – REVISED MAY 2008 ELECTRICAL CHARACTERISTICS Over junction temperature range -40°C ≤ TJ ≤ 125°C and recommended supply voltage (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT IN UVLO Undervoltage lock-out, input power detected threshold CE = LO or HI, VIN: 0 V → 3 V 2.5 2.8 Vhys(UVLO) Hysteresis on UVLO CE = LO or HI, VIN: 3 V → 0 V 200 300 tDGL(PGOOD) Deglitch time, input power detected status CE = LO or HI. Time measured from VIN 0 V → 5 V 1-µs rise-time IDD Operating current CE = LO, no load on OUT pin, VIN = 5 V ISTDBY Standby current CE = HI, VIN = 5.5 V 100 µA 280 mV 10 µA 8 V mV ms bq24380 250 bq24381 300 µA INPUT-TO-OUTPUT CHARACTERISTICS VDO Dropout voltage IN to OUT CE = LO, VIN = 5 V, I(OUT) = 1 A IOFF Q1 off-state leakage current CE = HI, VIN = 5.5 V INPUT OVERVOLTAGE PROTECTION VO(REG) Output voltage VOVP Input overvoltage protection threshold CE = LO, VIN = 6 V 5.3 5.5 5.7 bq24381 4.8 5 5.2 CE = LO, VIN: 5 V → 7 V bq24380 6.1 6.3 6.5 CE = LO, VIN: 5 V → 8 V bq24831 6.88 7.10 7.31 CE = LO or HI, VIN: 7 V → 5 V bq24380 25 110 CE = LO or HI, VIN: 8 V → 5 V bq24831 25 120 Vhys(OVP) Hysteresis on OVP tPD(OVP) (1) Input OV propagation delay VIN: 5 V → 10 V Recovery time from input overvoltage condition CE = LO. Time measured from VIN: 7 V → 5 V, 1-µs fall-time tREC(OVP) bq24380 V V mV 200 ns 8 ms OUTPUT SHORT-CIRCUIT PROTECTION (only at start-up) IO(SC) Short-circuit detection threshold tREC(SC) Retry interval if short-circuit detected 3 V < VIN < VOVP - Vhys(OVP) 1.3 1.5 1.7 64 A ms BATTERY OVERVOLTAGE PROTECTION BVOVP Battery overvoltage protection threshold VIN > 4.5 V, CE = LO 4.3 Vhys(BVovp) Hysteresis on BV(OVP) VIN > 4.5 V, CE = LO 200 I(VBAT) Input bias current on VBAT pin TJ = 25°C Deglitch time, battery overvoltage detected VIN > 4.5 V, CE = LO, Time measured from VVSAT rising from 4.1 V to 4.4 V to FAULT going low. tDGL(BVovp) 4.35 4.4 V 320 mV 10 nA µs 176 THERMAL PROTECTION TJ(OFF) Thermal shutdown temperature TJ(OFF-HYS) Thermal shutdown hysteresis 140 150 °C °C 20 LOGIC LEVELS ON CE VIL Logic LOW input voltage 0 VIH Logic HIGH input voltage 1.4 0.4 V 1 µA VCE = 1.8 V 15 µA IIL IIH V LOGIC LEVELS ON FAULT VOL Output LOW voltage ISINK = 5 mA 0.2 V Ilkg Off-state leakage current, HI-Z VFAULT = 5 V 10 µA (1) Not tested. Specified by design Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): bq24380 bq24381 3 bq24380 bq24381 SLUS805A – APRIL 2008 – REVISED MAY 2008 .............................................................................................................................................................. www.ti.com DEVICE INFORMATION IN 1 VSS 2 8 OUT 7 NC bq2438x NC 3 6 VBAT FAULT 4 5 CE TERMINAL FUNCTIONS TERMINAL NAME NO. I/O DESCRIPTION IN 1 I Input power, connected to external DC supply. Bypass IN to VSS with a ceramic capacitor (1 µF minimum) VSS 2 – Ground terminal. Connect to the thermal pad and to the ground rail of the circuit. NC 3, 7 Do not connect to any external circuits. These pins may have internal connections used for test purposes. FAULT 4 O Open-drain device status output. FAULT is pulled to VSS internally when the input pass FET has been turned off due to input overvoltage or output short-circuit conditions, an overtemperature condition, or because the battery voltage is outside safe limits. FAULT is high impedance during normal operation. CE 5 I Active-low chip enable input. Connect CE = HI to turn the input pass FET off. Connect CE = LOW to turn the internal pass FET on and connect the input to the charging circuitry. CE is Internally pulled down, ~200 kΩ. VBAT 6 I Battery voltage sense input. Connected to pack positive terminal through a 100-kΩ resistor. OUT 8 O Output terminal to the charging system. Bypass OUT to VSS with a ceramic capacitor (1 µF minimum) Thermal PAD 4 The thermal pad is electrically connected to VSS internally. The thermal pad must be connected to the same potential as the VSS pin on the printed circuit board. Do not use the thermal pad as the primary ground input for the device. VSS pin must be connected to ground at all times. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): bq24380 bq24381 bq24380 bq24381 www.ti.com .............................................................................................................................................................. SLUS805A – APRIL 2008 – REVISED MAY 2008 TYPICAL CHARACTERISTICS NORMAL POWER-ON SHOWING SOFT-START (bq24380) OVP at POWER-ON ROUT = 6.6 W VIN 5 V/div VIN 2 V/div VOUT 500 mV/div VOUT 2 V/div IOUT 500 mA/div VFAULT 2 V/div t - Time - 2 ms/div Figure 2. t - Time - 2 ms/div Figure 1. OVP RESPONSE for INPUT STEP (bq24380) SLOW INPUT RAMPINTO OVP EVENT (bq24380) VIN = 6 V to 9 V step VFAULT 2 V/div VFAULT 2 V/div VIN 2 V/div VIN 2 V/div VOUT 2 V/div VOUT 2 V/div t - Time - 5 ms/div t - Time - 200 ms/div Figure 4. Figure 3. RECOVERY FROM OVP (bq24380) POWER UP INTO SHORT CIRCUIT VIN = 10 V to 6 V step VIN 5 V/div VIN 5 V/div VOUT 5 V/div VFAULT 2 V/div VOUT 2 V/div IOUT 1 A/div VFAULT 2 V/div t - Time - 2 ms/div t - Time - 5 ms/div Figure 6. Figure 5. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): bq24380 bq24381 5 bq24380 bq24381 SLUS805A – APRIL 2008 – REVISED MAY 2008 .............................................................................................................................................................. www.ti.com TYPICAL CHARACTERISTICS (continued) SOFT-STOP DURING OCP EVENT (bq24380) BATTERY OVP EVENT (bq24380) VBAT 1 V/div VIN 5 V/div VOUT 2 V/div VOUT 500 mV/div VFAULT 2 V/div IOUT 1 A/div VBAT = 3.8 V to 4.5 V step t - Time - 50 ms/div t - Time - 20 ms/div Figure 7. Figure 8. UVLO vs FREE-AIR TEMPERATURE DROPOUT VOLTAGE vs FREE-AIR TEMPERATURE 250 2.75 IOUT = 1 A 210 VIN Rising DROPOUT VOLTAGE - mV UVLO - Undervoltage Lockout - V 2.70 2.65 2.60 2.55 2.50 VIN Falling VIN = 4 V 170 VIN = 5 V 130 90 2.45 2.40 -40 -15 10 35 60 85 TA - Free-Air Temperature - °C 110 50 -40 135 -15 10 35 60 85 110 135 110 135 TA - Free-Air Temperature - °C Figure 9. Figure 10. OUTPUT VOLTAGE REGULATION, VO(REG) vs FREE-AIR TEMPERATURE OVP THRESHOLD vs FREE-AIR TEMPERATURE 5.60 7.4 bq24381 5.40 5.30 5.20 5.10 7.0 VIN Falling 6.8 6.6 VIN Rising 6.4 bq24381 6.2 5.00 4.90 –40 –15 10 35 60 85 110 135 6.0 –40 VIN Falling bq24380 –15 TA – Free-Air Temperature – °C Figure 11. 6 VIN Rising 7.2 bq24380 VOVP – Threshold – V VOUT(REG) – Output Voltage – V 5.50 10 35 60 85 TA – Free-Air Temperature – °C Figure 12. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): bq24380 bq24381 bq24380 bq24381 www.ti.com .............................................................................................................................................................. SLUS805A – APRIL 2008 – REVISED MAY 2008 TYPICAL CHARACTERISTICS (continued) OVP THRESHOLD, VBOVP vs FREE-AIR TEMPERATURE LEAKAGE CURRENT (VBAT PIN) vs FREE-AIR TEMPERATURE 4.40 25 4.35 IIkg - Bat Leakage Current - nA VBOVP - Threshold - V VBAT Rising 4.30 4.25 4.20 4.15 20 15 10 5 VBAT Falling 4.10 4.05 -40 -15 10 35 60 85 TA - Free-Air Temperature - °C 110 0 -40 135 Figure 14. SUPPLY CURRENT vs INPUT VOLTAGE (bq24380) SUPPLY CURRENT vs INPUT VOLTAGE (bq24381) 110 135 1000 900 900 VO(REG) VO(REG) 800 700 ICC – Supply Current – mA 800 ICC – Supply Current – mA 10 35 60 85 TA - Free-Air Temperature - °C Figure 13. 1000 IC Enabled 600 500 400 300 IC Disabled 200 700 IC Enabled 600 500 400 300 IC Disabled 200 100 0 -15 100 0 5 10 15 20 VIN – Input Voltage – V 25 30 0 0 Figure 15. 5 10 15 20 VIN – Input Voltage – V 25 30 Figure 16. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): bq24380 bq24381 7 bq24380 bq24381 SLUS805A – APRIL 2008 – REVISED MAY 2008 .............................................................................................................................................................. www.ti.com AC Adapter OUT 8 1 IN VDC GND Charging Circuit 1 mF 1 mF RBAT VBAT 6 100 kW SYSTEM bq24380 FAULT 4 VSS 2 RPU 47 kW RFAULT 47 kW RCE 47 kW CE 5 Figure 17. Typical Application Circuit tSStart tCHK(SC) t tSStopREC(SC) tSStart tPD(OVP) tDGL(BVOVP) tDGL(PGOOD) tREC(OVP) 5 VOVP VOVP-Vhys(OVP) VO(REG) Input Voltage UVLO 2 4 2 2 4 6 VO(REG) 1 Output Voltage 7 IO(SC) Output Current CE FAULT 3 BV(OVP) BV(OVP)-Vhys(BVOVP) Battery Voltage 1. Short-circuit during start-up 2. Normal start-up condition 3. Battery overvoltage event 4. VUVLO < VIN < VOREG -- VOUT tracks VIN 5. Input overvoltage event 6. Input below UVLO 7. High-current event during normal operation Figure 18. Timing Diagram 8 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): bq24380 bq24381 bq24380 bq24381 www.ti.com .............................................................................................................................................................. SLUS805A – APRIL 2008 – REVISED MAY 2008 DETAILED FUNCTIONAL DESCRIPTION The bq2438x is a highly integrated circuit designed to provide protection to Li-ion batteries from failures of the charging circuit and the input source. The IC continuously monitors the input voltage and the battery voltage. The device operates like a linear regulator, maintaining a 5.5-V (bq24380) or 5-V (bq24381) output with input voltages up to the input overvoltage threshold (VOVP). If the input voltage exceeds VOVP, the IC shuts off the pass FET and disconnects the system from input power. Additionally, if the battery voltage rises above 4.35 V, the IC switches off the pass FET, removing the power from the system until the battery voltage falls to safe levels. The IC also monitors its die temperature and switches the pass FET off if it exceeds 140°C. The IC can be controlled by a processor, and also provides status information about fault conditions to the host. POWER DOWN The device remains in power-down mode when the input voltage at the IN pin is below the undervoltage threshold (UVLO) of 2.8 V. The FET connected between the IN and OUT pins is off, and the status output, FAULT, is set to HI-Z. POWER ON RESET The device resets when the input voltage at the IN pin exceeds the UVLO threshold. During power-on reset, the IC waits for duration tDGL(PGOOD) for the input voltage to stabilize. If, after tDGL(PGOOD), the input voltage and battery voltage are within operation limits, the pass FET is turned ON. The IC has a soft-start feature to control the inrush current. The soft-start minimizes the ringing at the input due to the resonant circuit formed by the parasitic inductance of the adapter cable and the input bypass capacitor. During the soft-start time, tSStart, the current limit is stepped up in 8 equal steps every 625µs. Each step is 1/8 of the IO(SC). After the soft-start sequence is over, the IC samples the load current. If the load current exceeds IO(SC), the IC initiates short circuit protection. See the Startup Short-Circuit Protection section for details. If no overcurrent event is measured, the current monitoring circuitry is disabled for normal operation. In the event a short-circuit is detected at power-on, to prevent the input voltage from spiking up when the pass FET is switched off (due to the inductance of the input cable), The pass FET is turned off by gradually reducing its gate-drive, resulting in a soft-stop (tSStop). DETAILED FUNCTIONAL DESCRIPTION The device continuously monitors the input voltage and the battery voltage as described in detail below: Input Overvoltage Protection The OUT output of the bq2438x operates similar to a linear regulator. While the input voltage is less than VO(REG), and above the UVLO, the output voltage tracks the input voltage (less the drop caused by RDS(on) of the pass FET). When the input voltage is greater than VO(REG) (plus the RDS(on) drop) and less than VOVP, the output voltage is regulated to VO(REG). VO(REG) is 5.5 V for the BQ24380 and 5 V for the BQ24381. If the input voltage is increased above VOVP, the internal pass FET is turned off, removing power from the charging circuitry connected to OUT. The FAULT output is then asserted low. When the input voltage drops below VOVP – Vhys(OVP) (but is still above UVLO), the pass FET is turned on after a deglitch time of tREC(OVP). The deglitch time ensures that the input supply has stabilized. The condition 5 in Figure 18 illustrates an input overvoltage event. Battery Overvoltage Protection The battery overvoltage threshold BVOVP is internally set to 4.35 V for the bq2438x. Condition 3 in Figure 18 illustrates a battery overvoltage event. If the battery voltage exceeds the BVOVP threshold for longer than tDGL(BVovp), the pass FET is turned off (using soft-stop), and FAULT is asserted low. The pass FET is turned on (using the soft-start sequence) once the battery voltage drops to BVOVP – Vhys(BVovp). Thermal Protection If the junction temperature of the device exceeds TJ(OFF), the pass FET is turned off, and the FAULT output is asserted low. The FET is turned on when the junction temperature falls below TJ(OFF) – TJ(OFF-HYS). Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): bq24380 bq24381 9 bq24380 bq24381 SLUS805A – APRIL 2008 – REVISED MAY 2008 .............................................................................................................................................................. www.ti.com Start-Up Short-Circuit Protection The bq2438x features overload current protection during start-up. The condition 1 in Figure 18 illustrates start-up into an overload condition. If after the eight soft-start steps are complete, and the current limit is exceeded, the IC initiates a short-circuit check timer (tCHK(SC)). During this check, the current is clamped to IO(SC). If the 5-ms tCHK(SC) timer expires and the current remains clamped by the current limit, the internal pass FET is turned off using the soft-stop method, FAULT is pulled low and the tREC(SC) timer begins. Once the tREC(SC) timer expires, FAULT becomes high impedance and the soft-start sequence restarts. The device repeats the start/fail sequence until the overload condition is removed. Once the overload condition is removed, the current limit circuitry is disabled and the device enters normal operation. Additionally, if the current is not limited after the completion of the soft-start sequence, the tCHK(SC) timer does not start and the current limit circuitry is disabled for normal operation. Enable Function The IC has an enable pin which is used to enable and disable the device. Connect the CE pin high to turn off the internal pass FET. Connect the CE pin low to turn on the internal pass FET and enter the start-up routine. The CE pin has an internal pulldown resistor and can be left unconnected. The FAULT pin is high impedance when the CE pin is high. Fault Indication The FAULT pin is an active-low, open-drain output. It is in a high-impedance state when operating conditions are safe, or when the device is disabled by setting CE high. With CE low, the FAULT pin goes low whenever any of these events occurs: 1. Output short-circuit at power-on 2. Input overvoltage 3. Battery overvoltage 4. IC overtemperature See Figure 18 for an example of FAULT conditions during these events. Connect the FAULT pin to the desired logic level voltage rail through a resistor between 1 kΩ and 50 kΩ. 10 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): bq24380 bq24381 bq24380 bq24381 www.ti.com .............................................................................................................................................................. SLUS805A – APRIL 2008 – REVISED MAY 2008 APPLICATION INFORMATION Selection of R(BAT) It is recommended that the battery not be tied directly to the VBAT pin of the device, as under some failure modes of the IC, the voltage at the IN pin may appear on the VBAT pin. This voltage can be as high as 30 V, and applying 30 V to the battery may cause failure of the device and can be hazardous. Connecting the VBAT pin through R(BAT) prevents a large current from flowing into the battery in the event of failure. For safety, R(BAT) must have a high value. The problem with a large R(BAT) is that the voltage drops across the resistor because of the VBAT bias current, I(VBAT), which causes an error in the BVOVP threshold. This error is over and above the tolerance on the nominal 4.35-V BVOVP threshold. Choosing R(BAT) in the range of 100 kΩ to 470 kΩ is a good compromise. If the IC fails with R(BAT) equal to 100 kΩ, the maximum current flowing into the battery would be (30 V – 3 V) ÷ 100 kΩ = 246 µA, which is low enough to be absorbed by the bias currents of the system components. R(BAT) equal to 100 kΩ results in a worst-case voltage drop of R(BAT) × I(VBAT) ≈ 1 mV. This is negligible compared to the internal tolerance of 50 mV on the BVOVP threshold. If the Bat-OVP function is not required, the VBAT pin must be connected to VSS. Selection of R(CE) The CE pin can be used to enable and disable the IC. If host control is not required, the CE pin can be tied to ground or left unconnected, permanently enabling the device. In applications where external control is required, the CE pin can be controlled by a host processor. As with the VBAT pin (see previous discussion), the CE pin must be connected to the host GPIO pin through as large a resistor as possible. The limitation on the resistor value is that the minimum VOH of the host GPIO pin less the drop across the resistor must be greater than VIH of the bq2430x CE pin. The drop across the resistor is given by R(CE) × IIH. Selection of Input and Output Bypass Capacitors The input capacitor CIN in Figure 17 is for decoupling and serves an important purpose. Whenever a step change downwards in the system load current occurs, the inductance of the input cable causes the input voltage to spike up. CIN prevents the input voltage from overshooting to dangerous levels. It is recommended that a ceramic capacitor of at least 1 µF be used at the input of the device. It must be located in close proximity to the IN pin. COUT in Figure 17 is also important. During an overvoltage transient, this capacitance limits the output overshoot until the power FET is turned off by the overvoltage protection circuitry. COUT must be a ceramic capacitor of at least 1 µF, located close to the OUT pin. COUT also serves as the input decoupling capacitor for the charging circuit downstream of the protection IC. PCB Layout Guidelines 1. This device is a protection device and is meant to protect down-stream circuitry from hazardous voltages. Potentially, high voltages may be applied to this IC. It has to be ensured that the edge-to-edge clearances of PCB traces satisfy the design rules for the maximum voltages expected to be seen in the system. 2. The device uses SON packages with a PowerPAD™. For good thermal performance, the PowerPAD must be thermally coupled with the PCB ground plane. In most applications, this requires a copper pad directly under the IC. This copper pad should be connected to the ground plane with an array of thermal vias. 3. CIN and COUT should be located close to the IC. Other components like R(BAT) should also be located close to the IC. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): bq24380 bq24381 11 PACKAGE OPTION ADDENDUM www.ti.com 26-May-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty BQ24380DSGR ACTIVE SON DSG 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ24380DSGT ACTIVE SON DSG 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ24381DSGR ACTIVE SON DSG 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ24381DSGT ACTIVE SON DSG 8 250 CU NIPDAU Level-2-260C-1 YEAR Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing BQ24380DSGR SON DSG 8 SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2 BQ24380DSGT SON DSG 8 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2 BQ24381DSGR SON DSG 8 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2 BQ24381DSGT SON DSG 8 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ24380DSGR SON DSG 8 3000 195.0 200.0 45.0 BQ24380DSGT SON DSG 8 250 195.0 200.0 45.0 BQ24381DSGR SON DSG 8 3000 195.0 200.0 45.0 BQ24381DSGT SON DSG 8 250 195.0 200.0 45.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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