TPS54429 SLVSAS1 – FEBRUARY 2011 www.ti.com 7V to 18V Input, 4.5-A Synchronous Step-Down ( SWIFT™) Converter Check for Samples: TPS54429 FEATURES 1 • 23 • • • • • • • • • • • D-CAP2™ Mode Enables Fast Transient Response Low Output Ripple and Allows Ceramic Output Capacitor Wide VIN Input Voltage Range: 7 V to 18 V Output Voltage Range: 0.76 V to 5.5 V Highly Efficient Integrated FET’s Optimized for Lower Duty Cycle Applications – 63 mΩ (High Side) and 55 mΩ (Low Side) High Efficiency, less than 10 μA at shutdown High Initial Bandgap Reference Accuracy Adjustable Soft Start Pre-Biased Soft Start 700-kHz Switching Frequency (fSW) Cycle By Cycle Over Current Limit Power Good Output APPLICATIONS • DESCRIPTION The TPS54429 is an adaptive on-time D-CAP2™ mode synchronous buck converter. The TPS54429 enables system designers to complete the suite of various end equipment’s power bus regulators with a cost effective, low component count, low standby current solution. The main control loop for the TPS54429 uses the D-CAP2™ mode control which provides a very fast transient response with no external compensation components. The TPS54429 also has a proprietary circuit that enables the device to adopt to both low equivalent series resistance (ESR) output capacitors, such as POSCAP or SP-CAP, and ultra-low ESR ceramic capacitors. The device operates from 7-V to 18-V VIN input. The output voltage can be programmed between 0.76 V and 5.5 V. The device also features an adjustable soft start time and a power good function. The TPS54429 is available in the 14-pin HTSSOP package, and designed to operate from –20°C to 85°C. Wide Range of Applications for Low Voltage System – Digital TV Power Supply – High Definition Blu-ray Disc™ Players – Networking Home Terminal – Digital Set Top Box (STB) U1 TPS54429PWP Vout (50 mV/div) Iout (2A/div) 100 ms/div 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. SWIFT, D-CAP2, PowerPAD are trademarks of Texas Instruments. Blu-ray Disc is a trademark of Blu-ray Disc Association. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. © 2011, Texas Instruments Incorporated TPS54429 SLVSAS1 – FEBRUARY 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) PACKAGE (2) TA –20°C to 85°C (1) (2) (3) ORDERABLE PART NUMBER (3) PIN TPS54429PWP PowerPAD™ (HTSSOP) – PWP 14 TPS54429PWPR TRANSPORT MEDIA ECO PLAN Tube Green (RoHS & no Sb/Br) Tape and Reel For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. All package options have Cu NIPDAU lead/ball finish. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE Input voltage range VI UNIT MIN MAX VIN1, VIN2 EN –0.3 20 VBST –0.3 26 VBST (10 ns transient) –0.3 28 VFB VO, SS, PG –0.3 6.5 SW1, SW2 –2 20 SW1, SW2 (10 ns transient) –3 22 VREG5 –0.3 6.5 PGND1, PGND2 –0.3 0.3 –0.2 0.2 VO Output voltage range Vdiff Voltage from GND to POWERPAD ESD rating Electrostatic discharge TJ Operating junction temperature –20 150 Tstg Storage temperature –55 150 (1) Human Body Model (HBM) Charged Device Model (CDM) V 2 kV 500 V °C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. THERMAL INFORMATION TPS54429 THERMAL METRIC (1) PWP UNITS 14 PINS θJA Junction-to-ambient thermal resistance 55.6 θJCtop Junction-to-case (top) thermal resistance 51.3 θJB Junction-to-board thermal resistance 26.4 ψJT Junction-to-top characterization parameter 1.8 ψJB Junction-to-board characterization parameter 20.6 θJCbot Junction-to-case (bottom) thermal resistance 4.3 (1) °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 © 2011, Texas Instruments Incorporated Product Folder Link(s) :TPS54429 TPS54429 SLVSAS1 – FEBRUARY 2011 www.ti.com RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) VIN MIN MAX Supply input voltage range VI Input voltage range 7 18 VBST –0.3 24 VBST(10 ns transient) –0.3 27 SS, PG –0.1 5.7 EN –0.1 18 VO, VFB –0.1 5.5 SW1, SW2 –1.8 18 UNIT V V –3 21 PGND1, PGND2 –0.1 0.1 –0.1 5.7 V SW1, SW2 (10 ns transient) VO Output voltage range VREG5 IO Output Current range IVREG5 0 10 mA TA Operating free-air temperature –20 85 °C TJ Operating junction temperature –20 150 °C TYP MAX UNIT ELECTRICAL CHARACTERISTICS over operating free-air temperature range, VIN = 12V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN SUPPLY CURRENT IVIN Operating - non-switching supply current VIN current, TA = 25°C, EN = 5 V, VFB = 0.8 V 850 1300 μA IVINSDN Shutdown supply current VIN current, TA = 25°C, EN = 0 V 1.8 10 μA LOGIC THRESHOLD VENH EN high-level input voltage EN VENL EN low-level input voltage EN 2 V 0.48 V VFB VOLTAGE AND DISCHARGE RESISTANCE VFBTH VFB threshold voltage TA = 25°C, VO = 1.05 V, continuous mode 757 TA = 0°C to 85°C, VO = 1.05 V, continuous mode (1) 753 777 TA = –20°C to 85°C, VO = 1.05 V, continuous mode (1) 751 779 IVFB VFB input current VFB = 0.8 V, TA = 25°C RDischg VO discharge resistance EN = 0 V, VO = 0.5 V, TA = 25°C 765 773 mV 0 ±0.1 μA 50 100 Ω 5.5 5.7 V 20 mV 100 mV VREG5 OUTPUT VVREG5 VREG5 output voltage TA = 25°C, 7.0 V < VIN < 18 V, 0 < IVREG5 < 5 mA VLN5 Line regulation 7.0 V < VIN < 18 V, IVREG5 = 5 mA VLD5 Load regulation 0 mA < IVREG5 < 5 mA IVREG5 Output current VIN = 7 V, VREG5 = 4 V, TA = 25°C 70 mA Rdsonh High side switch resistance 25°C, VBST - SW1,2 = 5.5 V 63 mΩ Rdsonl Low side switch resistance 25°C 55 mΩ 5.3 MOSFET (1) Not production tested. 3 © 2011, Texas Instruments Incorporated Product Folder Link(s) :TPS54429 TPS54429 SLVSAS1 – FEBRUARY 2011 www.ti.com ELECTRICAL CHARACTERISTICS (continued) over operating free-air temperature range, VIN = 12V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX 5.2 5.9 8.0 UNIT CURRENT LIMIT Iocl Current limit LOUT = 1.5 μH (2), TA = -20ºC to 85ºC A THERMAL SHUTDOWN TSDN Thermal shutdown threshold Shutdown temperature Hysteresis (2) 165 (2) °C 30 ON-TIME TIMER CONTROL TON On time VIN = 12 V, VO = 1.05 V 145 ns TOFF(MIN) Minimum off time TA = 25°C, VFB = 0.7 V 260 310 ns 2.6 μA SOFT START ISSC SS charge current VSS = 0 V 1.4 2.0 ISSD SS discharge current VSS = 0.5 V 0.1 0.2 VFB rising (good) 85 90 mA POWER GOOD VTHPG PG threshold IPG PG sink current VFB falling (fault) 95 % 85 % 2.5 5 mA OVP detect 115 120 UVP detect 60 PG = 0.5 V OUTPUT UNDERVOLTAGE AND OVERVOLTAGE PROTECTION VOVP Output OVP trip threshold TOVPDEL Output OVP prop delay VUVP Output UVP trip threshold TUVPDEL Output UVP delay TUVPEN Output UVP enable delay 125 μs 10 Hysteresis Relative to soft-start time 65 % 70 % 10 % 0.25 ms x 1.7 UVLO VUVLO (2) UVLO threshold Wake up VREG5 voltage Hysteresis VREG5 voltage 3.5 3.8 4.1 0.23 0.35 0.47 V Not production tested. 4 © 2011, Texas Instruments Incorporated Product Folder Link(s) :TPS54429 TPS54429 SLVSAS1 – FEBRUARY 2011 www.ti.com DEVICE INFORMATION PWP PACKAGE (TOP VIEW) 1 2 3 VO VFB VREG5 POWER PAD VIN2 14 VIN1 13 VBST 12 SW2 11 SW1 10 TPS54429 4 SS PWP HTSSOP14 5 GND 6 PG PGND2 9 7 EN PGND1 8 PIN FUNCTIONS PIN NAME NO. DESCRIPTION VO 1 Connect to output of converter. This terminal is used for On-Time Adjustment. VFB 2 Converter feedback input. Connect to output voltage with feedback resistor divider. VREG5 3 5.5 V power supply output. A capacitor (typical 1 µF) should be connected to GND. VREG5 is not active when EN is low. SS 4 Soft-start control. A external capacitor should be connected to GND. GND 5 Signal ground pin PG 6 Open drain power good output EN 7 Enable control input. EN is active high and must be pulled up to enable the device. PGND1, PGND2 SW1, SW2 VBST VIN1, VIN2 PowerPAD™ 8, 9 10, 11 12 Ground returns for low-side MOSFET. Also serve as inputs of current comparators. Connect PGND and GND strongly together near the IC. Switch node connection between high-side NFET and low-side NFET. Also serve as inputs to current comparators. Supply input for high-side NFET gate driver (boost terminal). Connect capacitor from this pin to respective SW1, SW2 terminals. An internal PN diode is connected between VREG5 to VBST pin. 13, 14 Power input and connected to high side NFET drain. Supply input for 5-V internal linear regulator for the control circuitry. Back side Thermal pad of the package. Must be soldered to achieve appropriate dissipation. Should be connected to PGND. 5 © 2011, Texas Instruments Incorporated Product Folder Link(s) :TPS54429 TPS54429 SLVSAS1 – FEBRUARY 2011 www.ti.com FUNCTIONAL BLOCK DIAGRAM -30% VIN UV VIN2 14 VO VIN1 13 OV 1 +20% VREG5 Control Logic Ref 12 SS SW VFB VO 11 10 2 VREG5 VBST Ceramic Capacitor VREG5 3 GND SS Softstart PGND 9 8 4 SW SS OCP GND PGND PGND PGND 5 GND GND PG Ref VIN 6 -10% UV VREG5 EN 7 EN Logic OV UVLO UVLO Protection Logic TSD REF Ref 6 © 2011, Texas Instruments Incorporated Product Folder Link(s) :TPS54429 TPS54429 SLVSAS1 – FEBRUARY 2011 www.ti.com OVERVIEW The TPS54429 is a 4.5-A synchronous step-down (buck) converter with two integrated N-channel MOSFETs. It operates using D-CAP2™ mode control. The fast transient response of D-CAP2™ control reduces the output capacitance required to meet a specific level of performance. Proprietary internal circuitry allows the use of low ESR output capacitors including ceramic and special polymer types. DETAILED DESCRIPTION PWM Operation The main control loop of the TPS54429 is an adaptive on-time pulse width modulation (PWM) controller that supports a proprietary D-CAP2™ mode control. D-CAP2™ mode control combines constant on-time control with an internal compensation circuit for pseudo-fixed frequency and low external component count configuration with both low ESR and ceramic output capacitors. It is stable even with virtually no ripple at the output. At the beginning of each cycle, the high-side MOSFET is turned on. This MOSFET is turned off after internal one shot timer expires. This one shot is set by the converter input voltage, VIN, and the output voltage, VO, to maintain a pseudo-fixed frequency over the input voltage range, hence it is called adaptive on-time control. The one-shot timer is reset and the high-side MOSFET is turned on again when the feedback voltage falls below the reference voltage. An internal ramp is added to reference voltage to simulate output ripple, eliminating the need for ESR induced output ripple from D-CAP2™ mode control. PWM Frequency and Adaptive On-Time Control TPS54429 uses an adaptive on-time control scheme and does not have a dedicated on board oscillator. The TPS54429 runs with a pseudo-constant frequency of 700 kHz by using the input voltage and output voltage to set the on-time one-shot timer. The on-time is inversely proportional to the input voltage and proportional to the output voltage, therefore, when the duty ratio is VOUT/VIN, the frequency is constant. Soft Start and Pre-Biased Soft Start The soft start function is adjustable. When the EN pin becomes high, 2-μA current begins charging the capacitor which is connected from the SS pin to GND. Smooth control of the output voltage is maintained during start up. The equation for the slow start time is shown in Equation 1. VFB voltage is 0.765 V and SS pin source current is 2 μA. C6(nF) • Vref C6(nF) • 0.765 Tss(ms) = − = − Iss(µA) 2 (1) The TPS54429 contains a unique circuit to prevent current from being pulled from the output during startup if the output is pre-biased. When the soft-start commands a voltage higher than the pre-bias level (internal soft start becomes greater than feedback voltage VFB), the controller slowly activates synchronous rectification by starting the first low side FET gate driver pulses with a narrow on-time. It then increments that on-time on a cycle-by-cycle basis until it coincides with the time dictated by (1-D), where D is the duty cycle of the converter. This scheme prevents the initial sinking of the pre-bias output, and ensure that the out voltage (VO) starts and ramps up smoothly into regulation and the control loop is given time to transition from pre-biased start-up to normal mode operation. Power Good The TPS54429 has a power-good open drain output. The power good function is activated after soft start has finished. The power good function becomes active after 1.7 times soft-start time. When the output voltage is within -10% of the target value, internal comparators detect power good state and the power good signal becomes high. If the PG output is pulled up to VREG5, the resister value, which is connected between PG and VREG5, must be in the range of 20k ohm to 150k ohm. If the feedback voltage goes under 15% of the target value, the power good signal becomes low after a 5 μs internal delay. 7 © 2011, Texas Instruments Incorporated Product Folder Link(s) :TPS54429 TPS54429 SLVSAS1 – FEBRUARY 2011 www.ti.com VREG5 VREG5 is an internally generated voltage source used by the TPS54429. It is derived directly from the input voltage and is nominally regulated to 5.5 V when the input voltage is above 5.6 V. The output of the VREG5 regulator is the input to the internal UVLO function. VREG5 must be above the UVLO wake up threshold voltage (3.8 V typical) for the TPS54429 to function. Connect a 1.0 µF capacitor between pin 3 of the TPS54429 and power ground for proper regulation of the VREG5 output. The VREG5 output voltage is available for external use and can typically source up to 70 mA. The VREG5 output is disabled when the TPS54429 EN pin is open or pulled low. Output Discharge Control TPS54429 discharges the output when EN is low, or the controller is turned off by the protection functions (OVP, UVP, UVLO and thermal shutdown). The output is discharged by an internal 50-Ω MOSFET which is connected from VO to PGND. The internal low-side MOSFET is not turned on during the output discharge operation to avoid the possibility of causing negative voltage at the output. Current Protection The output over-current protection (OCP) is implemented using a cycle-by-cycle valley detect control circuit. The switch current is monitored by measuring the low-side FET switch voltage between the SW pin and GND. This voltage is proportional to the switch current. To improve accuracy, the voltage sensing is temperature compensated. During the on time of the high-side FET switch, the switch current increases at a linear rate determined by Vin, Vout, the on-time and the output inductor value. During the on time of the low-side FET switch, this current decreases linearly. The average value of the switch current is the load current Iout. If the measured voltage is above the voltage proportional to the current limit, the device constantly monitors the low-side FET switch voltage, which is proportional to the switch current, during the low-side on-time. The converter maintains the low-side switch on until the measured voltage is below the voltage corresponding to the current limit at which time the switching cycle is terminated and a new switching cycle begins. In subsequent switching cycles, the on-time is set to a fixed value and the current is monitored in the same manner. There are some important considerations for this type of over-current protection. The load current is one half of the peak-to-peak inductor current higher than the over-current threshold. Also when the current is being limited, the output voltage tends to fall as the demanded load current may be higher than the current available from the converter. This may cause the output under-voltage protection circuit to be activated. When the over current condition is removed, the output voltage will return to the regulated value. This protection is non-latching. Over/Under Voltage Protection The TPS54429 detects over and undervoltage conditions by monitoring the feedback voltage (VFB). This function is enabled after approximately 1.7 times the soft-start time. When the feedback voltage becomes higher than 120% of the target voltage, the OVP comparator output goes high and the circuit latches the high-side MOSFET driver turns off and the low-side MOSFET turns on. When the feedback voltage becomes lower than 65% of the target voltage, the UVP comparator output goes high and an internal UVP delay counter begins. After 250 µs, the device latches off both internal top and bottom MOSFET. UVLO Protection Undervoltage lock out protection (UVLO) monitors the voltage of the VREG5 pin. When the VREG5 voltage is lower than UVLO threshold voltage, the TPS54429 is shut off. This is protection is non-latching. Thermal Shutdown Thermal protection is self-activating. If the junction temperature exceeds the threshold value (typically 165°C), the TPS54429 shuts off. This protection is non-latching. 8 © 2011, Texas Instruments Incorporated Product Folder Link(s) :TPS54429 TPS54429 SLVSAS1 – FEBRUARY 2011 www.ti.com TYPICAL CHARACTERISTICS VIN CURRENT vs JUNCTION TEMPERATURE VIN SHUTDOWN CURRENT vs JUNCTION TEMPERATURE 1200 8 IVINSDN - Shutdown Current - mA IVIN - Supply Current - mA 1000 800 600 400 6 4 2 200 0 -50 0 50 100 TJ - Junction Temperature - °C 0 -50 150 0 50 100 TJ - Junction Temperature - °C Figure 1. Figure 2. EN CURRENT vs EN VOLTAGE 1.05-V OUTPUT VOLTAGE vs OUTPUT CURRENT 100 150 1.08 1.07 VO - Output Voltage - V EN - Input Current - mA 80 60 40 VI = 18 V VI = 12 V 1.06 VI = 7 V 1.05 20 0 0 5 10 15 EN - Input Voltage - V 20 1.04 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 IO - Output Current - A Figure 3. Figure 4. 9 © 2011, Texas Instruments Incorporated Product Folder Link(s) :TPS54429 TPS54429 SLVSAS1 – FEBRUARY 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) 1.05-V OUTPUT VOLTAGE vs INPUT VOLTAGE 1.05-V, 50-mA to 2-A LOAD TRANSIENT RESPONSE 1.08 Vout (50 mV/div) VO - Output Voltage - V 1.07 IO = 0 A 1.06 IO = 1 A 1.05 Iout (2 A/div) 1.04 6 8 10 12 14 VI - Input Voltage - V 16 18 100 ms/div Figure 5. Figure 6. START-UP WAVE FORM EFFICIENCY vs OUTPUT CURRENT 100 VO = 3.3 V 90 EN (10 V/div) Vout (0.5 V/div) Efficiency - % 80 VO = 2.5 V VO = 1.8 V 70 60 PG (5 V/div) 50 40 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 IO - Output Current - A 400 ms/div Figure 7. Figure 8. 10 © 2011, Texas Instruments Incorporated Product Folder Link(s) :TPS54429 TPS54429 SLVSAS1 – FEBRUARY 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) SWITCHING FREQUENCY vs INPUT VOLTAGE (IO = 1 A) SWITCHING FREQUENCY vs OUTPUT CURRENT 800 VO = 1.8 V VO = 2.5 V 700 600 fsw - Switching Frequency - kHz fsw - Switching Frequency - kHz 800 VO = 3.3 V 500 400 6 700 10 12 14 VI - Input Voltage - V 16 18 VO = 3.3 V 600 500 400 8 VO = 1.8 V VO = 2.5 V 0 1 2 3 IO - Output Current - A Figure 9. Figure 10. VOLTAGE RIPPLE AT OUTPUT (IO = 2 A) VOLTAGE RIPPLE AT INPUT (IO = 2 A) VO = 1.05 V VO = 1.05 V VO (10 mV/div) SW (5 V/div) 4 VI (50 mV/div) SW (5 V/div) Figure 11. Figure 12. 11 © 2011, Texas Instruments Incorporated Product Folder Link(s) :TPS54429 TPS54429 SLVSAS1 – FEBRUARY 2011 www.ti.com DESIGN GUIDE Step By Step Design Procedure To • • • • • begin the design process, you must know a few application parameters: Input voltage range Output voltage Output current Output voltage ripple Input voltage ripple U1 TPS54429PWP Figure 13. Shows the schematic diagram for this design example. Output Voltage Resistors Selection The output voltage is set with a resistor divider from the output node to the VFB pin. It is recommended to use 1% tolerance or better divider resistors. Start by using Equation 2 and Equation 3 to calculate VOUT. To improve efficiency at very light loads consider using larger value resistors, too high of resistance will be more susceptible to noise and voltage errors from the VFB input current will be more noticeable. For output voltage from 0.76 V to 2.5 V: R1 VOUT = 0.765 • 1 + − R2 ( ) (2) For output voltage over 2.5 V: ( R1 ¾ VOUT = (0.763 + 0.0017 · VOUT_SET) · 1 + R2 ) (3) Where: VOUT_SET = Target VOUT voltage. Output Filter Selection The output filter used with the TPS54429 is an LC circuit. This LC filter has double pole at: FP = 1 2p LOUT ´ COUT (4) 12 © 2011, Texas Instruments Incorporated Product Folder Link(s) :TPS54429 TPS54429 SLVSAS1 – FEBRUARY 2011 www.ti.com At low frequencies, the overall loop gain is set by the output set-point resistor divider network and the internal gain of the TPS54429. The low frequency phase is 180 degrees. At the output filter pole frequency, the gain rolls off at a -40 dB per decade rate and the phase drops rapidly. D-CAP2™ introduces a high frequency zero that reduces the gain roll off to -20 dB per decade and increases the phase to 90 degrees one decade above the zero frequency. The inductor and capacitor selected for the output filter must be selected so that the double pole of Equation 4 is located below the high frequency zero but close enough that the phase boost provided be the high frequency zero provides adequate phase margin for a stable circuit. To meet this requirement use the values recommended in Table 1 Table 1. Recommended Component Values C4 (pF) (1) Output Voltage (V) R1 (kΩ) R2 (kΩ) L1 (µH) C8 + C9 (µF) 1 6.81 22.1 1.5 22 - 68 1.05 8.25 22.1 1.5 22 - 68 1.2 12.7 22.1 1.5 22 - 68 1.5 23.2 22.1 1.5 22 - 68 1.8 30.1 22.1 10 - 22 2.2 22 - 68 2.5 49.9 22.1 10 - 22 2.2 22 - 68 3.3 73.2 22.1 10 - 22 2.2 22 - 68 5 121 22.1 10 - 22 3.3 22 - 68 (1) Optional For higher output voltages at or above 1.8 V, additional phase boost can be achieved by adding a feed forward capacitor (C4) in parallel with R1 The inductor peak-to-peak ripple current, peak current and RMS current are calculated using Equation 5, Equation 6 and Equation 7. The inductor saturation current rating must be greater than the calculated peak current and the RMS or heating current rating must be greater than the calculated RMS current. Use 700 kHz for fSW. Use 700 kHz for fSW. Make sure the chosen inductor is rated for the peak current of Equation 6 and the RMS current of Equation 7. VOUT VIN (max) - VOUT • Ilp - p = V L •f IN (max) O (5) SW Ilp - p Ilpeak = IO + 2 − 1 Ilp - p2 ILo(RMS) = IO2 + − 12 (6) √ (7) For this design example, the calculated peak current is 4.97A and the calculated RMS current is 4.508 A. The inductor used is a TDK SPM6530-1R5M100 with a peak current rating of 11.5 A and an RMS current rating of 11 A. The capacitor value and ESR determines the amount of output voltage ripple. The TPS54429 is intended for use with ceramic or other low ESR capacitors. Recommended values range from 22uF to 68uF. Use Equation 8 to determine the required RMS current rating for the output capacitor. VOUT • (VIN - VOUT) ICO(RMS) =− − √12 • VIN • LO • fSW (8) For this design two TDK C3216X5R0J226M 22uF output capacitors are used. The typical ESR is 2 mΩ each. The calculated RMS current is 0.271A and each output capacitor is rated for 4A. Input Capacitor Selection The TPS54429 requires an input decoupling capacitor and a bulk capacitor is needed depending on the application. A ceramic capacitor over 10 μF is recommended for the decoupling capacitor. An additional 0.1 µF capacitor from pin 14 to ground is recommended to improve the stability of the over-current limit function. The capacitor voltage rating needs to be greater than the maximum input voltage. 13 © 2011, Texas Instruments Incorporated Product Folder Link(s) :TPS54429 TPS54429 SLVSAS1 – FEBRUARY 2011 www.ti.com Bootstrap Capacitor Selection A 0.1 µF ceramic capacitor must be connected between the VBST to SW pin for proper operation. It is recommended to use a ceramic capacitor. VREG5 Capacitor Selection A 1.0 µF ceramic capacitor must be connected between the VREG5 to GND pin for proper operation. It is recommended to use a ceramic capacitor. THERMAL INFORMATION This PowerPad™ package incorporates an exposed thermal pad that is designed to be directly to an external heartsick. The thermal pad must be soldered directly to the printed board (PCB). After soldering, the PCB can be used as a heartsick. In addition, through the use of thermal vias, the thermal pad can be attached directly to the appropriate copper plane shown in the electrical schematic for the device, or alternatively, can be attached to a special heartsick structure designed into the PCB. This design optimizes the heat transfer from the integrated circuit (IC). For additional information on the PowerPAD™ package and how to use the advantage of its heat dissipating abilities, refer to Technical Brief, PowerPAD™ Thermally Enhanced Package, Texas Instruments Literature No. SLMA002 and Application Brief, PowerPAD™ Made Easy, Texas Instruments Literature No. SLMA004. The exposed thermal pad dimensions for this package are shown in the following illustration. 8 14 Thermal Pad 2.46 ° 7 1 2.31 Figure 14. Thermal Pad Dimensions 14 © 2011, Texas Instruments Incorporated Product Folder Link(s) :TPS54429 TPS54429 SLVSAS1 – FEBRUARY 2011 www.ti.com LAYOUT CONSIDERATIONS 1. Keep the input switching current loop as small as possible. 2. Keep the SW node as physically small and short as possible to minimize parasitic capacitance and inductance and to minimize radiated emissions. Kelvin connections should be brought from the output to the feedback pin of the device. 3. Keep analog and non-switching components away from switching components. 4. Make a single point connection from the signal ground to power ground. 5. Do not allow switching current to flow under the device. 6. Keep the pattern lines for VIN and PGND broad. 7. Exposed pad of device must be connected to PGND with solder. 8. VREG5 capacitor should be placed near the device, and connected PGND. 9. Output capacitor should be connected to a broad pattern of the PGND. 10. Voltage feedback loop should be as short as possible, and preferably with ground shield. 11. Lower resistor of the voltage divider which is connected to the VFB pin should be tied to SGND. 12. Providing sufficient via is preferable for VIN, SW and PGND connection. 13. PCB pattern for VIN, SW, and PGND should be as broad as possible. 14. VIN Capacitor should be placed as near as possible to the device. VIN Additional Thermal Vias FEEDBACK RESISTORS VOUT BIAS CAP Connection to POWER GROUND on internal or bottom layer SLOW START CAP ANALOG GROUND TRACE To Enable Control VIN INPUT BYPASS CAPACITOR VIN OVER CURRENT STABILITY CAPACITOR EXPOSED POWERPAD AREA VIN2 VFB VIN1 VREG5 VBST SS SW1 GND SW2 PG PGND1 EN PGND2 BOOST CAPACITOR OUTPUT INDUCTOR VOUT OUTPUT FILTER CAPACITOR Additional Thermal Vias POWER GROUND VIA to Ground Plane Etch on Bottom Layer or Under Component Figure 15. PCB Layout 15 © 2011, Texas Instruments Incorporated Product Folder Link(s) :TPS54429 PACKAGE OPTION ADDENDUM www.ti.com 17-Jun-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) TPS54429PWP ACTIVE HTSSOP PWP 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TPS54429PWPR ACTIVE HTSSOP PWP 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 15-Jun-2011 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) TPS54429PWPR HTSSOP PWP 14 2000 330.0 12.4 TPS54429PWPR HTSSOP PWP 14 2000 330.0 12.4 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.9 5.6 1.6 8.0 12.0 Q1 6.9 5.6 1.6 8.0 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 15-Jun-2011 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS54429PWPR HTSSOP PWP 14 2000 346.0 346.0 29.0 TPS54429PWPR HTSSOP PWP 14 2000 346.0 346.0 29.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP® Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com Wireless www.ti.com/wireless-apps RF/IF and ZigBee® Solutions www.ti.com/lprf TI E2E Community Home Page e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2011, Texas Instruments Incorporated