TI SN54F283J

SDFS069A − D2932, MARCH 1987 − REVISED OCTOBER 1993
•
•
•
SN54F283 . . . J PACKAGE
SN74F283 . . . D OR N PACKAGE
(TOP VIEW)
Full-Carry Look-Ahead Across the
Four Bits
Systems Achieve Partial Look-Ahead
Performance With the Economy of Ripple
Carry
Package Options Include Plastic
Small-Outline Packages, Ceramic Chip
Carriers, and Standard Plastic and Ceramic
300-mil DIPs
Σ2
B2
A2
Σ1
A1
B1
C0
GND
description
The ′F283 is a full adder that performs the addition
of two 4-bit binary words. The sum (Σ) outputs are
provided for each bit and the resultant carry (C4)
output is obtained from the fourth bit.
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
B3
A3
Σ3
A4
B4
Σ4
C4
B2
Σ2
NC
VCC
B3
SN54F283 . . . FK PACKAGE
(TOP VIEW)
The device features full internal look-ahead
across all four bits generating the carry term C4 in
typically 5.7 ns. This capability provides the
system designer with partial look-ahead
performance at the economy and reduced
package count of a ripple-carry implementation.
A2
Σ1
NC
A1
B1
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
A3
Σ3
NC
A4
B4
C0
GND
NC
C4
Σ4
The adder logic, including the carry, is
implemented in its true form. End-around carry
can be accomplished without the need for logic or
level inversion.
4
The ′F283 can be used with either all-active-high
(positive logic) or all-active-low (negative logic)
operands.
NC − No internal connection
The SN54F283 is characterized for operation over
the full military temperature range of − 55°C to
125°C. The SN74F283 is characterized for
operation from 0°C to 70°C.
logic symbol†
A1
A2
A3
A4
B1
B2
B3
B4
C0
5
Σ
0
3
0
14
12
6
1
P
Σ
13
3
3
0
4
10
2
7
Σ2
Σ3
Σ4
Q
15
11
Σ1
CO
3
9
C4
CI
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Pin numbers shown are for the D, J, and N packages.
Copyright  1993, Texas Instruments Incorporated
!"#$ % &'!!($ #% )'*+&#$ ,#$(!,'&$% &!" $ %)(&&#$% )(! $.( $(!"% (/#% %$!'"($%
%$#,#!, 0#!!#$1- !,'&$ )!&(%%2 ,(% $ (&(%%#!+1 &+',(
$(%$2 #++ )#!#"($(!%-
• DALLAS, TEXAS 75265
• HOUSTON, TEXAS 77251−1443
POST OFFICE BOX 655303
POST OFFICE BOX 1443
2−1
SDFS069A − D2932, MARCH 1987 − REVISED OCTOBER 1993
logic diagram (positive logic)
9
B4
A4
B3
A3
B2
A2
B1
A1
C0
11
12
10
Σ4
15
14
13
Σ3
1
Σ2
4
Σ1
2
3
6
5
7
Pin numbers shown are for the D, J, and N packages.
2−2
C4
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
SDFS069A − D2932, MARCH 1987 − REVISED OCTOBER 1993
FUNCTION TABLE
OUTPUTS
WHEN C0 = L
INPUTS
WHEN C0 = H
WHEN C2 = L
WHEN C2 = H
A1
B1
A2
B2
Σ1
Σ2
C2
Σ1
Σ2
C2
A3
B3
A4
B4
Σ3
Σ4
C4
Σ3
Σ4
C4
L
L
L
L
L
L
L
H
L
L
H
L
L
L
H
L
L
L
H
L
L
H
L
L
H
L
L
L
H
L
H
H
L
L
L
H
L
H
H
L
L
L
H
L
L
H
L
H
H
L
H
L
H
L
H
H
L
L
L
H
L
H
H
L
H
H
L
L
L
H
H
H
H
L
L
L
H
H
L
H
L
L
L
H
L
H
L
H
H
L
H
L
L
H
H
H
L
L
L
H
L
H
L
H
H
H
L
L
L
H
H
H
L
H
L
L
H
H
L
H
L
L
H
H
L
L
H
H
L
H
H
L
H
H
H
L
H
L
H
H
L
H
H
H
H
L
H
L
H
H
H
H
H
H
L
H
H
H
H
H
NOTE: Input conditions at A1, B1, A2, B2, and C0 are used to determine outputs Σ1
and Σ2 and the value of the internal carry C2. The values at C2, A3, B3, A4,
and B4 are then used to determine outputs Σ3, Σ4, and C4.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −1.2 V to 7 V
Input current range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −30 mA to 5 mA
Voltage range applied to any output in the high state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC
Current into any output in the low state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 mA
Operating free-air temperature range: SN54F283 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 125°C
SN74F283 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input voltage ratings may be exceeded provided the input current ratings are observed.
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
2−3
SDFS069A − D2932, MARCH 1987 − REVISED OCTOBER 1993
recommended operating conditions
SN54F283
SN74F283
MIN
NOM
MAX
MIN
NOM
MAX
4.5
5
5.5
4.5
5
5.5
UNIT
VCC
VIH
Supply voltage
VIL
IIK
Low-level input voltage
0.8
0.8
V
Input clamp current
−18
−18
mA
IOH
IOL
High-level output current
−1
−1
mA
20
mA
TA
Operating free-air temperature
70
°C
High-level input voltage
2
2
Low-level output current
V
20
−55
125
V
0
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
VOL
II
IIH
SN54F283
TYP†
MAX
TEST CONDITIONS
VCC = 4.5 V,
VCC = 4.5 V
II = − 18 mA
IOH = − 1 mA
VCC = 4.75 V,
VCC = 4.5 V
IOH = − 1 mA
IOL = 20 mA
VCC = 5.5 V,
VCC = 5.5 V,
VI = 7 V
VI = 2.7 V
MIN
−1.2
2.5
3.4
C0
VCC = 5.5 V,
−1.2
2.5
0.3
0.5
V
V
0.3
0.1
VI = 0.5 V
UNIT
3.4
2.7
Any A or B
IIL
SN74F283
TYP†
MAX
MIN
0.5
V
0.1
mA
µA
20
20
− 1.2
− 1.2
− 0.6
− 0.6
IOS‡
VCC = 5.5 V,
VO = 0
−60
−150
−60
ICC
VCC = 5.5 V,
VI = 4.5 V
36
55
36
† All typical values are at VCC = 5 V, TA = 25°C.
‡ Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second.
mA
−150
mA
55
mA
switching characteristics (see Note 2)
PARAMETER
FROM
(INPUT)
VCC = 5 V,
CL = 50 pF,
RL = 500 Ω,
TA = 25°C
TO
(OUTPUT)
VCC = 4.5 V to 5.5 V,
CL = 50 pF,
RL = 500 Ω,
TA = MIN to MAX§
′F283
tPLH
tPHL
C0
Σ
tPLH
tPHL
A or B
Σ
tPLH
tPHL
C0
C4
tPLH
tPHL
A or B
C4
SN54F283
SN74F283
MIN
TYP
MAX
MIN
MAX
MIN
MAX
2.7
6.6
9.5
2.7
14
2.7
10.5
3.2
6.6
9.5
3.2
14
3.2
10.5
3.2
6.6
9.5
3.2
14
3.2
10.5
2.7
6.6
9.5
2.7
14
2.7
10.5
2.7
5.3
7.5
2.7
10.5
2.7
8.5
2.2
5
7
2.2
10
2.2
8
2.7
5.3
7.5
2.7
10.5
2.7
8.5
2.2
4.9
7
2.2
10
2.2
8
§ For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
NOTE 2: Load circuits and waveforms are shown in Section 1.
2−4
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
UNIT
ns
ns
ns
ns
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-9758701Q2A
ACTIVE
LCCC
FK
20
1
TBD
5962-9758701QEA
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
5962-9758701QEA
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
5962-9758701QFA
OBSOLETE
CFP
W
16
TBD
Call TI
Call TI
5962-9758701QFA
OBSOLETE
CFP
W
16
TBD
Call TI
Call TI
JM38510/34201B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
JM38510/34201B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
JM38510/34201BEA
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
JM38510/34201BEA
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
JM38510/34201BFA
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
JM38510/34201BFA
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
SN54F283J
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
SN54F283J
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
SN74F283D
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F283D
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F283DE4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F283DE4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F283DG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F283DG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F283DR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F283DR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F283DRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F283DRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F283DRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F283DRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F283N
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74F283N
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74F283N3
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
Call TI
Lead/Ball Finish
MSL Peak Temp (3)
POST-PLATE N / A for Pkg Type
SN74F283N3
OBSOLETE
PDIP
N
16
TBD
Call TI
SN74F283NE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74F283NE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74F283NSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F283NSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F283NSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F283NSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F283NSRG4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F283NSRG4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SNJ54F283FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
SNJ54F283FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
SNJ54F283J
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54F283J
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54F283W
OBSOLETE
CFP
W
16
TBD
Call TI
Call TI
SNJ54F283W
OBSOLETE
CFP
W
16
TBD
Call TI
Call TI
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74F283DR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
SN74F283NSR
SO
NS
16
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74F283DR
SN74F283NSR
SOIC
D
16
2500
333.2
345.9
28.6
SO
NS
16
2000
346.0
346.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
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Amplifiers
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amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
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Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
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Wireless
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www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
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www.ti.com/opticalnetwork
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www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
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