SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
D Auto-powerdown Plus
D Operate With 3-V to 5.5-V VCC Supply
D Always-Active Noninverting Receiver
D
D
D
D
D
D
D
DB, DW, OR PW PACKAGE
(TOP VIEW)
C2 +
GND
C2−
V−
DOUT1
DOUT2
DOUT3
RIN1
RIN2
DOUT4
RIN3
DOUT5
FORCEON
FORCEOFF
Output (ROUT1B)
Support Operation From 250 kbit/s to
1 Mbit/s
Low Standby Current . . . 1 µA Typ
External Capacitors . . . 4 × 0.1 µF
Accept 5-V Logic Input With 3.3-V Supply
Inter-Operable With SN65C3243,
SN75C3243
RS-232 Bus-Pin ESD Protection Exceeds
±15-kV Using Human-Body Model (HBM)
Applications
− Battery-Powered Systems, PDAs,
Notebooks, Sub-Notebooks, Laptops,
Palmtop PCs, Hand-Held Equipment,
Modems, and Printers
1
28
2
27
3
26
4
25
5
24
6
23
7
22
8
21
9
20
10
19
11
18
12
17
13
16
14
15
C1+
V+
VCC
C1−
DIN1
DIN2
DIN3
ROUT1
ROUT2
DIN4
ROUT3
DIN5
ROUT1B
INVALID
description/ordering information
The ’C3238 devices consist of five line drivers, three line receivers, and a dual charge-pump circuit with ±15-kV
ESD protection pin to pin (serial-port connection pins, including GND). The charge pump and four small external
capacitors allow operation from a single 3-V to 5.5-V supply. In addition, these devices include an always-active
noninverting output (ROUT1B), which allows applications using the ring indicator to transmit data while the
device is powered down. These devices operate at data signaling rates up to 1 Mbit/s and at an increased
slew-rate range of 24 V/µs to 150 V/µs.
ORDERING INFORMATION
SOIC (DW)
−0°C
70°C
−0
C to 70
C
SSOP (DB)
TSSOP (PW)
SOIC (DW)
−40°C
85°C
−40
C to 85
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SSOP (DB)
TSSOP (PW)
Tube of 20
SN75C3238DW
Reel of 1000
SN75C3238DWR
Reel of 2000
SN75C3238DBR
Tube of 50
SN75C3238PW
Reel of 2000
SN75C3238PWR
Tube of 20
SN65C3238DW
Reel of 1000
SN65C3238DWR
Reel of 2000
SN65C3238DBR
Tube of 50
SN65C3238PW
Reel of 2000
SN65C3238PWR
TOP-SIDE
MARKING
75C3238
75C3238
CA3238
65C3238
65C3238
CB3238
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2004, Texas Instruments Incorporated
!"#$%! & '("")% $& ! *(+,'$%! -$%)
"!-('%& '!!"# %! &*)''$%!& *)" %.) %)"#& ! )/$& &%"(#)%&
&%$-$"- 0$""$%1 "!-('%! *"!')&&2 -!)& !% )')&&$",1 ',(-)
%)&%2 ! $,, *$"$#)%)"&
POST OFFICE BOX 655303
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1
SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
description/ordering information (continued)
Flexible control options for power management are featured when the serial-port and driver inputs are inactive.
The auto-powerdown plus feature functions when FORCEON is low and FORCEOFF is high. During this mode
of operation, if the device does not sense valid signal transitions on all receiver and driver inputs for 30 s, the
built-in charge-pump and drivers are powered down, reducing the supply current to 1 µA. By disconnecting the
serial port or placing the peripheral drivers off, auto-powerdown plus will occur if there is no activity in the logic
levels for the driver inputs. Auto-powerdown plus can be disabled when FORCEON and FORCEOFF are high.
With auto-powerdown plus enabled, the device automatically activates once a valid signal is applied to any
receiver or driver input. INVALID is high (valid data) if any receiver input voltage is greater than 2.7 V or less
than −2.7 V or has been between −0.3 V and 0.3 V for less than 30 µs. INVALID is low (invalid data) if all receiver
input voltages are between −0.3 V and 0.3 V for more than 30 µs. Refer to Figure 5 for receiver input levels.
Function Tables
EACH DRIVER
INPUTS
OUTPUT
DRIVER STATUS
DIN
FORCEON
FORCEOFF
TIME ELAPSED SINCE LAST
RIN OR DIN TRANSITION
X
X
L
X
Z
Powered off
Normal operation with
auto-powerdown plus disabled
DOUT
L
H
H
X
H
H
H
H
X
L
L
L
H
<30 s
H
H
L
H
<30 s
L
L
L
H
>30 s
Z
H
L
H
>30 s
Z
Normal operation with
auto-powerdown plus enabled
Powered off by
auto-powerdown plus feature
H = high level, L = low level, X = irrelevant, Z = high impedance
EACH RECEIVER
INPUTS
OUTPUTS
RIN2
RIN1,
RIN3−RIN5
FORCEOFF
TIME ELAPSED SINCE LAST
RIN OR DIN TRANSITION
L
X
L
H
X
L
L
L
L
H
H
L
ROUT1B
ROUT
X
L
Z
X
H
Z
H
<30 s
L
H
H
<30 s
L
L
H
<30 s
H
H
H
H
H
<30 s
H
L
Open
Open
H
>30 s
L
H
RECEIVER STATUS
Powered off while
ROUT1B is active
Normal operation with
auto-powerdown plus
disabled/enabled
H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off
2
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• DALLAS, TEXAS 75265
SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
logic diagram (positive logic)
DIN1
DIN2
DIN3
DIN4
DIN5
FORCEOFF
FORCEON
ROUT1B
ROUT1
ROUT2
ROUT3
24
5
23
6
22
7
19
10
17
12
DOUT1
DOUT2
DOUT3
DOUT4
DOUT5
14
13
Auto-powerdown
Plus
15
INVALID
16
21
8
20
9
18
11
RIN1
RIN2
RIN3
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
Positive output supply voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V
Negative output supply voltage range, V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to −7 V
Supply voltage difference, V+ − V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V
Input voltage range, VI: Driver (FORCEOFF, FORCEON) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −25 V to 25 V
Output voltage range, VO: Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 13.2 V to 13.2 V
Receiver (INVALID) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VCC + 0.3 V
Package thermal impedance, θJA (see Notes 2 and 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . 62°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . 46°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . 62°C/W
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to network GND.
2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 4 and Figure 6)
Supply voltage
VIH
Driver and control high-level input voltage
DIN, FORCEOFF, FORCEON
VIL
VI
Driver and control low-level input voltage
DIN, FORCEOFF, FORCEON
Driver and control input voltage
DIN, FORCEOFF, FORCEON
VI
Receiver input voltage
TA
Operating free-air temperature
MIN
NOM
MAX
VCC = 3.3 V
VCC = 5 V
VCC = 3.3 V
3
3.3
3.6
4.5
5
5.5
VCC = 5 V
2.4
UNIT
V
2
V
0.8
V
0
5.5
V
V
−25
25
SN75C3238
0
70
SN65C3238
−40
85
°C
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER
II
ICC
Input leakage current
Supply current
TEST CONDITIONS
FORCEOFF, FORCEON
MIN
TYP‡
MAX
±0.01
±1
µA
0.5
2
mA
Auto-powerdown plus
disabled
No load,
FORCEOFF and FORCEON at VCC
Powered off
No load, FORCEOFF at GND
1
10
Auto-powerdown plus
enabled
No load, FORCEOFF at VCC,
FORCEON at GND,
All RIN are open or grounded
1
10
UNIT
µA
‡ All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
4
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SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
DRIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER
TEST CONDITIONS
MIN
TYP†
VOH
VOL
High-level output voltage
All DOUT at RL = 3 kΩ to GND
5
5.4
Low-level output voltage
All DOUT at RL = 3 kΩ to GND
−5
−5.4
IIH
IIL
High-level input current
VI = VCC
VI at GND
Low-level input current
±0.01
IOS
Short-circuit output current‡
VCC = 3.6 V,
VCC = 5.5 V,
ro
Output resistance
VCC, V+, and V− = 0 V,
VO = 0 V
VO = 0 V
VO = ±2 V
VO = ±12 V,
300
MAX
UNIT
V
V
±1
µA
±0.01
±1
µA
±35
±60
±40
±90
mA
Ω
10M
±25
VCC = 3 V to 3.6 V
µA
VO = ±10 V,
VCC = 4.5 V to 5.5 V
±25
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
‡ Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one output
should be shorted at a time.
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
Ioff
Output leakage current
FORCEOFF = GND
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER
Maximum data rate
(see Figure 1)
TEST CONDITIONS
kΩ
RL = 3 kΩ,
One DOUT switching
MIN
CL = 1000 pF
CL = 250 pF,
CL = 1000 pF,
TYP†
MAX
UNIT
250
VCC = 3 V to 4.5 V
VCC = 4.5 V to 5.5 V
tsk(p)
Pulse skew§
CL = 150 pF to 2500 pF,
RL = 3 kΩ to 7 kΩ, See Figure 2
SR(tr)
Slew rate,
transition region
(see Figure 1)
CL = 150 pF to 1000 pF,
RL = 3 kΩ to 7 kΩ,
VCC = 3.3 V
1000
kbit/s
1000
25
18
ns
150
V/µs
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
§ Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
POST OFFICE BOX 655303
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5
SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
RECEIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER
VOH
VOL
MIN
TYP†
VCC − 0.6 V
VCC − 0.1 V
TEST CONDITIONS
High-level output voltage
IOH = −1 mA
IOL = 1.6 mA
Low-level output voltage
VIT+
Positive-going input threshold voltage
VCC = 3.3 V
VCC = 5 V
VIT−
Negative-going input threshold voltage
VCC = 3.3 V
VCC = 5 V
Vhys
Ioff
Input hysteresis (VIT+ − VIT−)
MAX
V
0.4
1.5
2.4
1.8
2.4
0.6
1.2
0.8
1.5
FORCEOFF = 0 V
±0.05
V
V
V
0.3
Output leakage current (except ROUT1B)
UNIT
V
±10
µA
ri
Input resistance
VI = ±3 V to ±25 V
3
5
7
kΩ
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4)
PARAMETER
TEST CONDITIONS
tPLH
tPHL
Propagation delay time, low- to high-level output
ten
tdis
Output enable time
Propagation delay time, high- to low-level output
Output disable time
Pulse skew‡
CL = 150 pF, See Figure 3
CL = 150 pF, RL = 3 kΩ,
kΩ See Figure 4
MIN
TYP†
MAX
UNIT
150
ns
150
ns
200
ns
200
ns
tsk(p)
See Figure 3
50
ns
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
‡ Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1−C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF
and C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
AUTO-POWERDOWN PLUS SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
TYP†
MIN
VT+(valid)
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
VT−(valid)
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
−2.7
VT(invalid)
Receiver input threshold
for INVALID low-level output voltage
FORCEON = GND,
FORCEOFF = VCC
−0.3
VOH
INVALID high-level output voltage
IOH = −1 mA, FORCEON = GND,
FORCEOFF = VCC
VOL
INVALID low-level output voltage
IOL = 1.6 mA, FORCEON = GND,
FORCEOFF = VCC
MAX
2.7
UNIT
V
V
0.3
VCC − 0.6
V
V
0.4
V
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 5)
PARAMETER
tvalid
tinvalid
MIN
TYP†
MAX
UNIT
Propagation delay time, low- to high-level output
0.1
µs
Propagation delay time, high- to low-level output
50
µs
25
µs
ten
Supply enable time
tdis
Receiver or driver edge to auto-powerdown plus
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
POST OFFICE BOX 655303
15
• DALLAS, TEXAS 75265
30
60
s
7
SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
PARAMETER MEASUREMENT INFORMATION
3V
Generator
(see Note B)
Input
RS-232
Output
50 Ω
RL
tTHL
CL
(see Note A)
3V
FORCEOFF
TEST CIRCUIT
0V
Output
6V
SR(tr) +
t THL or t TLH
tTLH
VOH
3V
3V
−3 V
−3 V
VOL
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 1 Mbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 1. Driver Slew Rate
3V
Generator
(see Note B)
RS-232
Output
50 Ω
RL
Input
1.5 V
1.5 V
0V
CL
(see Note A)
tPHL
tPLH
VOH
3V
FORCEOFF
50%
50%
Output
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 1 Mbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
3 V or 0 V
FORCEON
3V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
3V
FORCEOFF
tPHL
CL
(see Note A)
tPLH
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
PARAMETER MEASUREMENT INFORMATION
3V
Input
3 V or 0 V
FORCEON
VCC
S1
1.5 V
GND
1.5 V
0V
tPZH
(S1 at GND)
tPHZ
(S1 at GND)
RL
VOH
Output
RS-232 Input
50%
Output
CL
(see Note A)
FORCEOFF
Generator
(see Note B)
50 Ω
0.3 V
tPZL
(S1 at VCC)
tPLZ
(S1 at VCC)
0.3 V
Output
50%
VOL
TEST CIRCUIT
NOTES: A.
B.
C.
D.
VOLTAGE WAVEFORMS
CL includes probe and jig capacitance.
The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
tPLZ and tPHZ are the same as tdis.
tPZL and tPZH are the same as ten.
Figure 4. Receiver Enable and Disable Times
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
PARAMETER MEASUREMENT INFORMATION
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
Valid RS-232 Level, INVALID High
ROUT
Generator
(see Note B)
2.7 V
50 Ω
Indeterminate
0.3 V
0V
−0.3 V
Indeterminate
Autopowerdown
plus
INVALID
−2.7 V
CL = 30 pF
(see Note A)
Valid RS-232 Level, INVALID High
† Auto-powerdown plus disables drivers and reduces
supply current to 1 µA.
FORCEOFF
FORCEON
If Signal Remains Within This Region
For More Than 30 µs, INVALID Is Low†
DIN
DOUT
TEST CIRCUIT
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following
characteristics: PRR = 5 kbit/s, ZO = 50 Ω,
50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Receiver
Input
3V
2.7 V
0V
0V
−2.7 V
−3 V
tinvalid
tvalid
INVALID
Output
Driver
Input
50%
VCC
50%
0V
3 V to 5 V
50%
50%
0V
≈5.5 V
Driver
Output
≈−5.5 V
tdis
ten
tdis
V+
V+
V+ −0.3 V
Supply
Voltages
V− +0.3 V
V−
V−
Voltage Waveforms and Timing Diagrams
Figure 5. INVALID Propagation Delay Times and Supply Enabling Time
10
ten
POST OFFICE BOX 655303
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SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
APPLICATION INFORMATION
CBYPASS = 0.1 µF
+
−
1
2
+
C2
V+
28
27
+
GND
−
−
3
4
+
−
C1+
C2+
C2−
VCC
V−
C1−
C4
DOUT1
DOUT2
DOUT3
RIN1
C3†
+
−
26
C1
25
5
24
6
23
7
22
8
21
9
20
DIN1
DIN2
DIN3
ROUT1
Serial Port
RIN2
ROUT2
Logic I/Os
5 kΩ
DOUT4
RIN3
10
19
11
18
DIN4
ROUT3
5 kΩ
DOUT5
12
17
16
DIN5
ROUT1B
5 kΩ
FORCEON
FORCEOFF
Autopowerdown
Plus
13
14
15
INVALID
† C3 can be connected to VCC or GND.
NOTE A: Resistor values shown are nominal.
VCC vs CAPACITOR VALUES
VCC
3.3 V ± 0.15 V
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
C1
C2, C3, and C4
0.1 µF
0.22 µF
0.047 µ F
0.22 µF
0.1 µF
0.22 µF
0.33 µF
1 µF
Figure 6. Typical Operating Circuit and Capacitor Values
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
11
PACKAGE OPTION ADDENDUM
www.ti.com
4-Mar-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
SN65C3238DB
PREVIEW
SSOP
DB
28
50
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN65C3238DBR
ACTIVE
SSOP
DB
28
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN65C3238DW
ACTIVE
SOIC
DW
28
20
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
SN65C3238DWR
ACTIVE
SOIC
DW
28
1000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
SN65C3238PW
ACTIVE
TSSOP
PW
28
50
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN65C3238PWR
ACTIVE
TSSOP
PW
28
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN75C3238DB
PREVIEW
SSOP
DB
28
50
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN75C3238DBR
ACTIVE
SSOP
DB
28
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN75C3238DW
ACTIVE
SOIC
DW
28
20
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
SN75C3238DWR
ACTIVE
SOIC
DW
28
1000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
SN75C3238PW
ACTIVE
TSSOP
PW
28
50
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN75C3238PWR
ACTIVE
TSSOP
PW
28
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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