INFINEON SAA-XC866L-4FRA

8-Bit
SAA-XC866
8-Bit Single-Chip Microcontroller
Data Sheet
V1.5 2010-09
Microcontrollers
Edition 2010-09
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2010 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
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be endangered.
8-Bit
SAA-XC866
8-Bit Single-Chip Microcontroller
Data Sheet
V1.5 2010-09
Microcontrollers
SAA-XC866
SAA-XC866 Data Sheet
Revision History:
2010-09
V1.5
Previous Version: V1.4 2010-08
Page
Subjects (major changes since last revision)
Changes from V1.4 2010-08 to V1.5 2010-09
All
3.3 V device variant is added to the data sheet. Parameters specific to the
variant are also added.
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Any information within this document that you feel is wrong, unclear or missing at all?
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Data Sheet
V1.5, 2010-09
SAA-XC866
Table of Contents
Page
1
Summary of Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2
2.1
2.2
2.3
2.4
General Device Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3
3.1
3.2
3.2.1
3.2.2
3.2.2.1
3.2.2.2
3.2.3
3.2.4
3.3
3.3.1
3.3.2
3.4
3.4.1
3.4.2
3.4.3
3.5
3.6
3.7
3.7.1
3.7.2
3.8
3.8.1
3.8.2
3.9
3.10
3.11
3.11.1
3.11.2
3.12
3.13
3.13.1
3.14
3.15
3.16
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Processor Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory Protection Strategy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Special Function Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Address Extension by Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Address Extension by Paging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Bit Protection Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SAA-XC866 Register Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Flash Bank Sectorization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Flash Programming Width . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interrupt System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interrupt Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interrupt Source and Vector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interrupt Priority . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Parallel Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Supply System with Embedded Voltage Regulator . . . . . . . . . . . .
Reset Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Module Reset Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Booting Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Clock Generation Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Recommended External Oscillator Circuits . . . . . . . . . . . . . . . . . . . . . .
Clock Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Saving Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Universal Asynchronous Receiver/Transmitter . . . . . . . . . . . . . . . . . . . . .
Baud-Rate Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Baud Rate Generation using Timer 1 . . . . . . . . . . . . . . . . . . . . . . . . . .
Normal Divider Mode (8-bit Auto-reload Timer) . . . . . . . . . . . . . . . . . . . .
LIN Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LIN Header Transmission . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
High-Speed Synchronous Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . .
Timer 0 and Timer 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Timer 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Data Sheet
2
15
15
16
19
21
21
23
27
28
40
42
43
44
44
49
51
52
55
56
58
58
59
61
63
65
66
69
70
73
73
74
74
76
78
79
V1.5, 2010-09
SAA-XC866
3.17
3.18
3.18.1
3.18.2
3.19
3.19.1
3.20
Capture/Compare Unit 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Analog-to-Digital Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ADC Clocking Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ADC Conversion Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
On-Chip Debug Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
JTAG ID Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Identification Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4
4.1
4.1.1
4.1.2
4.1.3
4.2
4.2.1
4.2.2
4.2.3
4.2.3.1
4.2.4
4.3
4.3.1
4.3.2
4.3.3
4.3.4
4.3.5
4.3.6
Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Parameter Interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Absolute Maximum Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Input/Output Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Supply Threshold Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
ADC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
ADC Conversion Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Power Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Testing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Output Rise/Fall Times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Power-on Reset and PLL Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
On-Chip Oscillator Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
JTAG Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
SSC Master Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
5
5.1
5.2
5.3
Package and Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Parameters (PG-TSSOP-38) . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Quality Declaration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Data Sheet
3
80
82
83
84
85
86
87
108
108
109
110
V1.5, 2010-09
8-Bit Single-Chip Microcontroller
XC800 Family
1
SAA-XC866
Summary of Features
• High-performance XC800 Core
– compatible with standard 8051 processor
– two clocks per machine cycle architecture (for memory access without wait state)
– two data pointers
• On-chip memory
– 8 Kbytes of Boot ROM
– 256 bytes of RAM
– 512 bytes of XRAM
– 4/8/16 Kbytes of Flash; or
8/16 Kbytes of ROM, with additional 4 Kbytes of Flash
(includes memory protection strategy)
• I/O port supply at 3.3 V/5.0 V and core logic supply at 2.5 V (generated by embedded
voltage regulator)
(further features are on next page)
4K/ 8K/16K Bytes Flash
or 8K/16K Bytes ROM 1)
On-Chip Debug Support
Boot ROM
8K Bytes
UART
SSC
Port 0
6-bit Digital I/O
Capture/Compare Unit
16-bit
Port 1
5-bit Digital I/O
Compare Unit
16-bit
Port 2
8-bit Digital/Analog Input
Port 3
8-bit Digital I/O
XC800 Core
XRAM
512 Bytes
RAM
256 Bytes
Timer 0
16-bit
Timer 1
16-bit
Timer 2
16-bit
Watchdog
Timer
ADC
10-bit
8-channel
1) All ROM devices include 4K bytes Flash
Figure 1
Data Sheet
SAA-XC866 Functional Units
4
V1.5, 2010-09
SAA-XC866
Summary of Features
Features (continued):
• Reset generation
– Power-On reset
– Hardware reset
– Brownout reset for core logic supply
– Watchdog timer reset
– Power-Down Wake-up reset
• On-chip OSC and PLL for clock generation
– PLL loss-of-lock detection
• Power saving modes
– slow-down mode
– idle mode
– power-down mode with wake-up capability via RXD or EXINT0
– clock gating control to each peripheral
• Programmable 16-bit Watchdog Timer (WDT)
• Four ports
– 19 pins as digital I/O
– 8 pins as digital/analog input
• 8-channel, 10-bit ADC
• Three 16-bit timers
– Timer 0 and Timer 1 (T0 and T1)
– Timer 2
• Capture/compare unit for PWM signal generation (CCU6)
• Full-duplex serial interface (UART)
• Synchronous serial channel (SSC)
• On-chip debug support
– 1 Kbyte of monitor ROM (part of the 8-Kbyte Boot ROM)
– 64 bytes of monitor RAM
• PG-TSSOP-38 pin package
• Temperature range TA:
– SAA (-40 to 140 °C)
Data Sheet
5
V1.5, 2010-09
SAA-XC866
Summary of Features
SAA-XC866 Variant Devices
The SAA-XC866 product family features devices with different configurations and
program memory sizes, offering cost-effective solution for different application
requirements.
The list of SAA-XC866 devices and their differences are summarized in Table 1.
Table 1
Device Summary
Device
Type
Device Name
Flash1)
ROM
1)
Power
Supply
(V)
P-Flash
Size
(Kbytes)
D-Flash
Size
(Kbytes)
ROM
Size
(Kbytes)
LIN BSL
Support
SAA-XC866L-4FRA 5.0
12
4
–
Yes
SAA-XC866-4FRA
12
4
–
No
SAA-XC866L-2FRA 5.0
5.0
4
4
–
Yes
SAA-XC866-2FRA
5.0
4
4
–
No
SAA-XC866L-1FRA 5.0
–
4
–
Yes
SAA-XC866-1FRA
–
4
–
No
SAA-XC866L-4FRA 3.3
12
4
–
Yes
SAA-XC866L-4RRA 5.0
–
4
16
Yes
SAA-XC866-4RRA
5.0
–
4
16
No
SAA-XC866L-2RRA 5.0
–
4
8
Yes
SAA-XC866-2RRA
–
4
8
No
5.0
5.0
The flash memory (P-Flash and D-Flash) can be used for code or data.
Ordering Information
The ordering code for Infineon Technologies microcontrollers provides an exact
reference to the required product. This ordering code identifies:
• The derivative itself, i.e. its function set, the temperature range, and the supply voltage
• the package and the type of delivery
For the available ordering codes for the SAA-XC866, please refer to your responsible
sales representative or your local distributor.
As this document refers to all the derivatives, some descriptions may not apply to a
specific product. For simplicity all versions are referred to by the term SAA-XC866
throughout this document.
Data Sheet
6
V1.5, 2010-09
SAA-XC866
General Device Information
2
General Device Information
2.1
Block Diagram
XC866
XTAL1
XTAL2
UART
Port 0
T0 & T1
P1.0 - P1.1
P1.5-P1.7
P2.0 - P2.7
CCU6
512-byte XRAM
SSC
4/8/16-Kbyte Flash
or
8/16-Kbyte ROM 2)
Timer 2
ADC
Clock Generator
WDT
10 MHz
On-chip OSC
OCDS
PLL
Port 3
TMS
MBC
RESET
VDDP
VSSP
VDDC
VSSC
256-byte RAM
+
64-byte monitor
RAM
P0.0 - P0.5
Port 1
XC800 Core
Port 2
Internal Bus
8-Kbyte
Boot ROM1)
VAREF
VAGND
P3.0 - P3.7
1) Includes 1-Kbyte monitor ROM
2) Includes additional 4-Kbyte Flash
Figure 2
Data Sheet
SAA-XC866 Block Diagram
7
V1.5, 2010-09
SAA-XC866
General Device Information
2.2
Logic Symbol
VDDP
VSSP
VAREF
Port 0 6-Bit
VAGND
Port 1 5-Bit
RESET
XC866
MBC
Port 2 8-Bit
TMS
XTAL1
Port 3 8-Bit
XTAL2
VDDC
Figure 3
Data Sheet
VSSC
SAA-XC866 Logic Symbol
8
V1.5, 2010-09
SAA-XC866
General Device Information
2.3
Pin Configuration
MBC
1
38
RESET
P0.3/SCLK_1/COUT63_1
2
37
P3.5/COUT62_0
P0.4/MTSR_1/CC62_1
3
36
P3.4/CC62_0
P0.5/MRST_1/EXINT0_0/COUT62_1
4
35
P3.3/COUT61_0
XTAL2
5
34
P3.2/CCPOS2_2/CC61_0
XTAL1
6
33
P3.1/CCPOS0_2/CC61_2/COUT60_0
VSSC
7
32
P3.0/CCPOS1_2/CC60_0
VDDC
8
31
P3.7/EXINT4/COUT63_0
P1.6/CCPOS1_1/T12HR_0/EXINT6
9
30
P3.6/CTRAP_0
P1.7/CCPOS2_1/T13HR_0
10
29
P1.5/CCPOS0_1/EXINT5/EXF2_0/RXDO_0
TMS
11
28
P1.1/EXINT3/TDO_1/TXD_0
P0.0/TCK_0/T12HR_1/CC61_1/CLKOUT/RXDO_1
12
27
P1.0/RXD_0/T2EX
P0.2/CTRAP_2/TDO_0/TXD_1
13
26
P2.7/AN7
XC866
P0.1/TDI_0/T13HR_1/RXD_1/EXF2_1/COUT61_1
14
25
VAREF
P2.0/CCPOS0_0/EXINT1/T12HR_2/TCK_1/CC61_3/AN0
15
24
VAGND
P2.1/CCPOS1_0/EXINT2/T13HR_2/TDI_1/CC62_3/AN1
16
23
P2.6/AN6
P2.2/CCPOS2_0/CTRAP_1/CC60_3/AN2
17
22
P2.5/AN5
VDDP
18
21
P2.4/AN4
VSSP
19
20
P2.3/AN3
Figure 4
Data Sheet
SAA-XC866 Pin Configuration, PG-TSSOP-38 Package (top view)
9
V1.5, 2010-09
SAA-XC866
General Device Information
2.4
Pin Definitions and Functions
Table 2
Pin Definitions and Functions
Symbol Pin
Type Reset Function
Number
State
P0
P0.0
I/O
12
Port 0
Port 0 is a 6-bit bidirectional general purpose I/O
port. It can be used as alternate functions for the
JTAG, CCU6, UART, and the SSC.
Hi-Z
TCK_0
T12HR_1
CC61_1
CLKOUT
RXDO_1
JTAG Clock Input
CCU6 Timer 12 Hardware Run
Input
Input/Output of Capture/Compare
channel 1
Clock Output
UART Transmit Data Output
P0.1
14
Hi-Z
TDI_0
T13HR_1
JTAG Serial Data Input
CCU6 Timer 13 Hardware Run
Input
RXD_1
UART Receive Data Input
COUT61_1 Output of Capture/Compare
channel 1
EXF2_1
Timer 2 External Flag Output
P0.2
13
PU
CTRAP_2
TDO_0
TXD_1
P0.3
2
Hi-Z
SCK_1
SSC Clock Input/Output
COUT63_1 Output of Capture/Compare
channel 3
P0.4
3
Hi-Z
MTSR_1
CC62_1
P0.5
Data Sheet
4
Hi-Z
CCU6 Trap Input
JTAG Serial Data Output
UART Transmit Data Output/
Clock Output
SSC Master Transmit Output/
Slave Receive Input
Input/Output of Capture/Compare
channel 2
MRST_1
SSC Master Receive Input/
Slave Transmit Output
EXINT0_0 External Interrupt Input 0
COUT62_1 Output of Capture/Compare
channel 2
10
V1.5, 2010-09
SAA-XC866
General Device Information
Table 2
Pin Definitions and Functions (cont’d)
Symbol Pin
Type Reset Function
Number
State
P1
I/O
Port 1
Port 1 is a 5-bit bidirectional general purpose I/O
port. It can be used as alternate functions for the
JTAG, CCU6, UART, and the SSC.
P1.0
27
PU
RXD_0
T2EX
UART Receive Data Input
Timer 2 External Trigger Input
P1.1
28
PU
EXINT3
TDO_1
TXD_0
External Interrupt Input 3
JTAG Serial Data Output
UART Transmit Data Output/
Clock Output
P1.5
29
PU
CCPOS0_1
EXINT5
EXF2_0
RXDO_0
CCU6 Hall Input 0
External Interrupt Input 5
TImer 2 External Flag Output
UART Transmit Data Output
P1.6
9
PU
CCPOS1_1 CCU6 Hall Input 1
T12HR_0
CCU6 Timer 12 Hardware Run
Input
EXINT6
External Interrupt Input 6
P1.7
10
PU
CCPOS2_1 CCU6 Hall Input 2
T13HR_0
CCU6 Timer 13 Hardware Run
Input
P1.5 and P1.6 can be used as a software chip
select output for the SSC.
Data Sheet
11
V1.5, 2010-09
SAA-XC866
General Device Information
Table 2
Pin Definitions and Functions (cont’d)
Symbol Pin
Type Reset Function
Number
State
P2
I
Port 2
Port 2 is an 8-bit general purpose input-only port. It
can be used as alternate functions for the digital
inputs of the JTAG and CCU6. It is also used as the
analog inputs for the ADC.
P2.0
15
Hi-Z
CCPOS0_0 CCU6 Hall Input 0
EXINT1
External Interrupt Input 1
T12HR_2
CCU6 Timer 12 Hardware Run
Input
TCK_1
JTAG Clock Input
CC61_3
Input of Capture/Compare channel 1
AN0
Analog Input 0
P2.1
16
Hi-Z
CCPOS1_0 CCU6 Hall Input 1
EXINT2
External Interrupt Input 2
T13HR_2
CCU6 Timer 13 Hardware Run
Input
TDI_1
JTAG Serial Data Input
CC62_3
Input of Capture/Compare channel 2
AN1
Analog Input 1
P2.2
17
Hi-Z
CCPOS2_0
CTRAP_1
CC60_3
AN2
CCU6 Hall Input 2
CCU6 Trap Input
Input of Capture/Compare channel 0
Analog Input 2
P2.3
20
Hi-Z
AN3
Analog Input 3
P2.4
21
Hi-Z
AN4
Analog Input 4
P2.5
22
Hi-Z
AN5
Analog Input 5
P2.6
23
Hi-Z
AN6
Analog Input 6
P2.7
26
Hi-Z
AN7
Analog Input 7
Data Sheet
12
V1.5, 2010-09
SAA-XC866
General Device Information
Table 2
Pin Definitions and Functions (cont’d)
Symbol Pin
Type Reset Function
Number
State
P3
I
Port 3
Port 3 is a bidirectional general purpose I/O port. It
can be used as alternate functions for the CCU6.
P3.0
32
Hi-Z
CCPOS1_2 CCU6 Hall Input 1
CC60_0
Input/Output of Capture/Compare
channel 0
P3.1
33
Hi-Z
CCPOS0_2 CCU6 Hall Input 0
CC61_2
Input/Output of Capture/Compare
channel 1
COUT60_0 Output of Capture/Compare
channel 0
P3.2
34
Hi-Z
CCPOS2_2 CCU6 Hall Input 2
CC61_0
Input/Output of Capture/Compare
channel 1
P3.3
35
Hi-Z
COUT61_0 Output of Capture/Compare
channel 1
P3.4
36
Hi-Z
CC62_0
P3.5
37
Hi-Z
COUT62_0 Output of Capture/Compare
channel 2
P3.6
30
PD
CTRAP_0
P3.7
31
Hi-Z
EXINT4
External Interrupt Input 4
COUT63_0 Output of Capture/Compare
channel 3
Data Sheet
13
Input/Output of Capture/Compare
channel 2
CCU6 Trap Input
V1.5, 2010-09
SAA-XC866
General Device Information
Table 2
Pin Definitions and Functions (cont’d)
Symbol Pin
Type Reset Function
Number
State
VDDP
18
–
–
I/O Port Supply (3.3 V/5.0 V)
Also used by EVR and analog modules.
VSSP
VDDC
VSSC
VAREF
VAGND
19
–
–
I/O Port Ground
8
–
–
Core Supply Monitor (2.5 V)
7
–
–
Core Supply Ground
25
–
–
ADC Reference Voltage
24
–
–
ADC Reference Ground
XTAL1
6
I
Hi-Z
External Oscillator Input
(NC if not needed)
XTAL2
5
O
Hi-Z
External Oscillator Output
(NC if not needed)
TMS
11
I
PD
Test Mode Select
RESET
38
I
PU
Reset Input
MBC1)
1
I
PU
Monitor & BootStrap Loader Control
1)
An external pull-up device in the range of 4.7 kΩ to 100 kΩ is required to enter user mode. Alternatively MBC
can be tied to high if alternate functions (for debugging) of the pin are not utilized.
Data Sheet
14
V1.5, 2010-09
SAA-XC866
Functional Description
3
Functional Description
3.1
Processor Architecture
The SAA-XC866 is based on a high-performance 8-bit Central Processing Unit (CPU)
that is compatible with the standard 8051 processor. While the standard 8051 processor
is designed around a 12-clock machine cycle, the SAA-XC866 CPU uses a 2-clock
machine cycle. This allows fast access to ROM or RAM memories without wait state.
Access to the Flash memory, however, requires an additional wait state (one machine
cycle). The instruction set consists of 45% one-byte, 41% two-byte and 14% three-byte
instructions.
The SAA-XC866 CPU provides a range of debugging features, including basic stop/start,
single-step execution, breakpoint support and read/write access to the data memory,
program memory and SFRs. Figure 5 shows the CPU functional blocks.
Internal Data
Memory
Core SFRs
Register Interface
External Data
Memory
External SFRs
16-bit Registers &
Memory Interface
ALU
Opcode &
Immediate
Registers
Multiplier / Divider
Opcode Decoder
Timer 0 / Timer 1
State Machine &
Power Saving
UART
Program Memory
fCCLK
Memory Wait
Reset
Legacy External Interrupts (IEN0, IEN1)
External Interrupts
Non-Maskable Interrupt
Figure 5
Data Sheet
Interrupt
Controller
CPU Block Diagram
15
V1.5, 2010-09
SAA-XC866
Functional Description
3.2
Memory Organization
The SAA-XC866 CPU operates in the following five address spaces:
•
•
•
•
•
8 Kbytes of Boot ROM program memory
256 bytes of internal RAM data memory
512 bytes of XRAM memory
a 128-byte Special Function Register area
4/8/16 Kbytes of Flash program memory (Flash devices); or
8/16 Kbytes of ROM program memory, with additional 4 Kbytes of Flash
(ROM devices)
Data Sheet
16
V1.5, 2010-09
SAA-XC866
Functional Description
Figure 6 illustrates the memory address spaces of the SAA-XC866-4FR devices.
FFFF H
F200H
XRAM
512 bytes
F000H
FFFF H
F200H
XRAM
512 bytes
F000H
E000H
Boot ROM
8 Kbytes
C000H
B000H
D-Flash Bank
4 Kbytes 1)
A000H
3000H
Indirect
Address
2000H
Internal RAM
P-Flash Bank 2
4 Kbytes2)
Direct
Address
FFH
Special Function
Registers
80H
P-Flash Bank 1
4 Kbytes2)
1000H
7FH
P-Flash Bank 0
4 Kbytes 1)
Internal RAM
0000H
0000H
00H
Program Space
External Data Space
Internal Data Space
1) For SAA -XC866-1FR device, physically one 4KByte D-Flash bank is mapped to both address range 0000H - 0FFFH and A000H AFFFH, and the shaded banks are not available.
2) For SAA -XC866-2FR device, the shaded banks are not available.
Figure 6
Data Sheet
Memory Map of SAA-XC866 Flash Devices
17
V1.5, 2010-09
SAA-XC866
Functional Description
Figure 7 illustrates the memory address spaces of the SAA-XC866-4RR device.
FFFF H
XRAM
512 Bytes
F200H
F000H
F200H
XRAM
512 Bytes
F000H
E000H
Boot ROM
8 KBytes
C000H
B000H
Flash (4K-X bytes)
Total 4 KBytes 2)
User ROM (X bytes)
A000H
3000H
Indirect
Address
Direct
Address
2000H
Internal RAM
User ROM
4 KBytes1)
FF H
Special Function
Registers
80H
User ROM
8 KBytes
7FH
Internal RAM
0000H
Code Space
0000H
00H
External Data Space
Internal Data Space
1) For SAA - XC866-2RR device, the shaded area is not available and Flash is 4 Kbytes.
2) For SAA - XC866-4RR device: ROM = (12+X) KBytes, Flash = (4-X) Kbytes.
Figure 7
Data Sheet
Memory Map User Mode
Memory Map of SAA-XC866 ROM Devices
18
V1.5, 2010-09
SAA-XC866
Functional Description
3.2.1
Memory Protection Strategy
The SAA-XC866 memory protection strategy includes:
• Read-out protection: The Flash Memory can be enabled for read-out protection and
ROM memory is always protected.
• Program and erase protection: The Flash memory in all devices can be enabled for
program and erase protection.
Flash memory protection is available in two modes:
• Mode 0: Only the P-Flash is protected; the D-Flash is unprotected
• Mode 1: Both the P-Flash and D-Flash are protected
The selection of each protection mode and the restrictions imposed are summarized in
Table 3.
Table 3
Flash Protection Modes
Mode
0
1
Activation
Program a valid password via BSL mode 6
Selection
MSB of password = 0
MSB of password = 1
P-Flash contents Read instructions in the
can be read by
P-Flash
Read instructions in the
P-Flash or D-Flash
P-Flash program Not possible
and erase
Not possible
D-Flash contents Read instructions in any program
can be read by
memory
Read instructions in the
P-Flash or D-Flash
D-Flash program Possible
Not possible
D-Flash erase
Not possible
Possible, on the condition that bit
DFLASHEN in register MISC_CON
is set to 1 prior to each erase
operation
BSL mode 6, which is used for enabling Flash protection, can also be used for disabling
Flash protection. Here, the programmed password must be provided by the user. A
password match triggers an automatic erase of the read-protected Flash contents, see
Table 4 and Table 5, and the programmed password is erased. The Flash protection is
then disabled upon the next reset.
For XC866-2FR and XC866-4FR devices:
The selection of protection type is summarized in Table 4.
Data Sheet
19
V1.5, 2010-09
SAA-XC866
Functional Description
Table 4
Flash Protection Type for XC866-2FR and XC866-4FR devices
PASSWORD
Type of Protection
Flash Banks to Erase when
Unprotected
1XXXXXXXB
Flash Protection Mode 1
All Banks
0XXXXXXXB
Flash Protection Mode 0
P-Flash Bank
For XC866-1FR device and ROM devices:
The selection of protection type is summarized in Table 5.
Table 5
Flash Protection Type for XC866-1FR device and ROM devices
PASSWORD
Type of Protection
(Applicable to the
whole Flash)
Sectors to Erase
when Unprotected
1XXXXXXXB
Read/Program/Erase All Sectors
00001XXXB
Erase
Sector 0
00010XXXB
Erase
Sector 0 and 1
00011XXXB
Erase
Sector 0 to 2
00100XXXB
Erase
Sector 0 to 3
00101XXXB
Erase
Sector 0 to 4
00110XXXB
Erase
Sector 0 to 5
00111XXXB
Erase
Sector 0 to 6
01000XXXB
Erase
Sector 0 to 7
01001XXXB
Erase
Sector 0 to 8
01010XXXB
Erase
All Sectors
Others
Erase
None
Comments
Compatible to
Protection mode 1
Although no protection scheme can be considered infallible, the SAA-XC866 memory
protection strategy provides a very high level of protection for a general purpose
microcontroller.
Data Sheet
20
V1.5, 2010-09
SAA-XC866
Functional Description
3.2.2
Special Function Register
The Special Function Registers (SFRs) occupy direct internal data memory space in the
range 80H to FFH. All registers, except the program counter, reside in the SFR area. The
SFRs include pointers and registers that provide an interface between the CPU and the
on-chip peripherals. As the 128-SFR range is less than the total number of registers
required, address extension mechanisms are required to increase the number of
addressable SFRs. The address extension mechanisms include:
• Mapping
• Paging
3.2.2.1
Address Extension by Mapping
Address extension is performed at the system level by mapping. The SFR area is
extended into two portions: the standard (non-mapped) SFR area and the mapped SFR
area. Each portion supports the same address range 80H to FFH, bringing the number
of addressable SFRs to 256. The extended address range is not directly controlled by
the CPU instruction itself, but is derived from bit RMAP in the system control register
SYSCON0 at address 8FH. To access SFRs in the mapped area, bit RMAP in SFR
SYSCON0 must be set. Alternatively, the SFRs in the standard area can be accessed
by clearing bit RMAP. The SFR area can be selected as shown in Figure 8.
SYSCON0
System Control Register 0
7
6
Reset Value: 00H
5
4
3
2
1
0
0
1
0
RMAP
r
rw
r
rw
Field
Bits
Type Description
RMAP
0
rw
Special Function Register Map Control
0
The access to the standard SFR area is
enabled.
1
The access to the mapped SFR area is
enabled.
1
2
rw
Reserved
Returns the last value if read; should be written
with 1.
0
1,[7:3]
r
Reserved
Returns 0 if read; should be written with 0.
Data Sheet
21
V1.5, 2010-09
SAA-XC866
Functional Description
Note: The RMAP bit must be cleared/set by ANL or ORL instructions. The rest bits of
SYSCON0 should not be modified.
As long as bit RMAP is set, the mapped SFR area can be accessed. This bit is not
cleared automatically by hardware. Thus, before standard/mapped registers are
accessed, bit RMAP must be cleared/set, respectively, by software.
Standard Area (RMAP = 0)
FFH
Module 1 SFRs
SYSCON0.RMAP
Module 2 SFRs
rw
…...
Module n SFRs
80H
SFR Data
(to/from CPU)
Mapped Area (RMAP = 1)
FFH
Module (n+1) SFRs
Module (n+2) SFRs
…...
Module m SFRs
80H
Direct
Internal Data
Memory Address
Figure 8
Data Sheet
Address Extension by Mapping
22
V1.5, 2010-09
SAA-XC866
Functional Description
3.2.2.2
Address Extension by Paging
Address extension is further performed at the module level by paging. With the address
extension by mapping, the SAA-XC866 has a 256-SFR address range. However, this is
still less than the total number of SFRs needed by the on-chip peripherals. To meet this
requirement, some peripherals have a built-in local address extension mechanism for
increasing the number of addressable SFRs. The extended address range is not directly
controlled by the CPU instruction itself, but is derived from bit field PAGE in the module
page register MOD_PAGE. Hence, the bit field PAGE must be programmed before
accessing the SFR of the target module. Each module may contain a different number
of pages and a different number of SFRs per page, depending on the specific
requirement. Besides setting the correct RMAP bit value to select the SFR area, the user
must also ensure that a valid PAGE is selected to target the desired SFR. A page inside
the extended address range can be selected as shown in Figure 9.
SFR Address
(from CPU)
PAGE 0
MOD_PAGE.PAGE
SFR0
rw
SFR1
…...
SFRx
PAGE 1
SFR0
SFR Data
(to/from CPU)
SFR1
…...
SFRy
…...
PAGE q
SFR0
SFR1
…...
SFRz
Module
Figure 9
Data Sheet
Address Extension by Paging
23
V1.5, 2010-09
SAA-XC866
Functional Description
In order to access a register located in a page different from the actual one, the current
page must be left. This is done by reprogramming the bit field PAGE in the page register.
Only then can the desired access be performed.
If an interrupt routine is initiated between the page register access and the module
register access, and the interrupt needs to access a register located in another page, the
current page setting can be saved, the new one programmed and finally, the old page
setting restored. This is possible with the storage fields STx (x = 0 - 3) for the save and
restore action of the current page setting. By indicating which storage bit field should be
used in parallel with the new page value, a single write operation can:
• Save the contents of PAGE in STx before overwriting with the new value
(this is done in the beginning of the interrupt routine to save the current page setting
and program the new page number); or
• Overwrite the contents of PAGE with the contents of STx, ignoring the value written to
the bit positions of PAGE
(this is done at the end of the interrupt routine to restore the previous page setting
before the interrupt occurred)
ST3
ST2
ST1
ST0
STNR
PAGE
value update
from CPU
Figure 10
Storage Elements for Paging
With this mechanism, a certain number of interrupt routines (or other routines) can
perform page changes without reading and storing the previously used page information.
The use of only write operations makes the system simpler and faster. Consequently,
this mechanism significantly improves the performance of short interrupt routines.
The SAA-XC866 supports local address extension for:
•
•
•
•
Parallel Ports
Analog-to-Digital Converter (ADC)
Capture/Compare Unit 6 (CCU6)
System Control Registers
Data Sheet
24
V1.5, 2010-09
SAA-XC866
Functional Description
The page register has the following definition:
MOD_PAGE
Page Register for module MOD
7
6
Reset Value: 00H
5
4
3
2
1
OP
STNR
0
PAGE
w
w
r
rw
0
Field
Bits
Type Description
PAGE
[2:0]
rw
Page Bits
When written, the value indicates the new page.
When read, the value indicates the currently active
page.
STNR
[5:4]
w
Storage Number
This number indicates which storage bit field is the
target of the operation defined by bit field OP.
If OP = 10B,
the contents of PAGE are saved in STx before being
overwritten with the new value.
If OP = 11B,
the contents of PAGE are overwritten by the
contents of STx. The value written to the bit positions
of PAGE is ignored.
00
01
10
11
Data Sheet
ST0 is selected.
ST1 is selected.
ST2 is selected.
ST3 is selected.
25
V1.5, 2010-09
SAA-XC866
Functional Description
Field
Bits
Type Description
OP
[7:6]
w
Operation
0X Manual page mode. The value of STNR is
ignored and PAGE is directly written.
10
New page programming with automatic page
saving. The value written to the bit positions of
PAGE is stored. In parallel, the previous
contents of PAGE are saved in the storage bit
field STx indicated by STNR.
11
Automatic restore page action. The value
written to the bit positions PAGE is ignored
and instead, PAGE is overwritten by the
contents of the storage bit field STx indicated
by STNR.
0
3
r
Reserved
Returns 0 if read; should be written with 0.
Data Sheet
26
V1.5, 2010-09
SAA-XC866
Functional Description
3.2.3
Bit Protection Scheme
The bit protection scheme prevents direct software writing of selected bits (i.e., protected
bits) using the PASSWD register. When the bit field MODE is 11B, writing 10011B to the
bit field PASS opens access to writing of all protected bits, and writing 10101B to the bit
field PASS closes access to writing of all protected bits. Note that access is opened for
maximum 32 CCLKs if the “close access” password is not written. If “open access”
password is written again before the end of 32 CCLK cycles, there will be a recount of
32 CCLK cycles. The protected bits include NDIV, WDTEN, PD, and SD.
PASSWD
Password Register
7
Reset Value: 07H
6
5
4
3
2
1
0
PASS
PROTECT
_S
MODE
w
rh
rw
Field
Bits
Type Description
MODE
[1:0]
rw
Bit Protection Scheme Control bits
00
Scheme Disabled
11
Scheme Enabled (default)
Others: Scheme Enabled
These two bits cannot be written directly. To change
the value between 11B and 00B, the bit field PASS
must be written with 11000B; only then, will the
MODE[1:0] be registered.
PROTECT_S
2
rh
Bit Protection Signal Status bit
This bit shows the status of the protection.
0
Software is able to write to all protected bits.
1
Software is unable to write to any protected
bits.
PASS
[7:3]
w
Password bits
The Bit Protection Scheme only recognizes three
patterns.
11000B Enables writing of the bit field MODE.
10011B Opens access to writing of all protected bits.
10101B Closes access to writing of all protected bits.
Data Sheet
27
V1.5, 2010-09
SAA-XC866
Functional Description
3.2.4
SAA-XC866 Register Overview
The SFRs of the SAA-XC866 are organized into groups according to their functional
units. The contents (bits) of the SFRs are summarized in Table 6 to Table 14, with the
addresses of the bitaddressable SFRs appearing in bold typeface.
The CPU SFRs can be accessed in both the standard and mapped memory areas
(RMAP = 0 or 1).
Table 6
Addr
CPU Register Overview
Register Name
RMAP = 0 or 1
SP
81H
Stack Pointer Register
Bit
Reset: 07H
Bit Field
Type
82H
DPL
Reset: 00H
Data Pointer Register Low
Bit Field
Type
83H
DPH
Reset: 00H
Data Pointer Register High
Bit Field
Type
87H
PCON
Power Control Register
Reset: 00H
Bit Field
Type
88H
TCON
Timer Control Register
Reset: 00H
Bit Field
Type
89H
TMOD
Timer Mode Register
Reset: 00H
Bit Field
Type
8AH
TL0
Timer 0 Register Low
Reset: 00H
Bit Field
Type
8BH
TL1
Timer 1 Register Low
Reset: 00H
Bit Field
Type
8CH
TH0
Timer 0 Register High
Reset: 00H
Bit Field
Type
8DH
TH1
Timer 1 Register High
Reset: 00H
Bit Field
Type
98H
SCON
Reset: 00H
Serial Channel Control Register
Bit Field
Type
99H
SBUF
Reset: 00H
Serial Data Buffer Register
Bit Field
Type
A2H
EO
Reset: 00H
Extended Operation Register
Bit Field
A8H
IEN0
Reset: 00H
Interrupt Enable Register 0
B8H
IP
Reset: 00H
Interrupt Priority Register
B9H
IPH
Reset: 00H
Interrupt Priority Register High
D0H
PSW
Reset: 00H
Program Status Word Register
E0H
ACC
Accumulator Register
E8H
IEN1
Reset: 00H
Interrupt Enable Register 1
7
6
Reset: 00H
Bit Field
Type
Bit Field
Type
Bit Field
Type
Data Sheet
4
3
2
1
0
SP
rw
DPL7 DPL6
rw
rw
DPH7 DPH6
rw
rw
SMOD
rw
TF1
TR1
rwh
rw
GATE1
0
rw
r
SM0
rw
SM1
rw
0
Type
Bit Field
Type
Bit Field
Type
Bit Field
Type
5
r
EA
rw
0
r
DPL5 DPL4 DPL3 DPL2
rw
rw
rw
rw
DPH5 DPH4 DPH3 DPH2
rw
rw
rw
rw
0
GF1
GF0
r
rw
rw
TF0
TR0
IE1
IT1
rwh
rw
rwh
rw
T1M
GATE0
0
rw
rw
r
VAL
rwh
VAL
rwh
VAL
rwh
VAL
rwh
SM2
REN
TB8
RB8
rw
rw
rw
rwh
VAL
rwh
TRAP_
0
EN
rw
r
DPL1 DPL0
rw
rw
DPH1 DPH0
rw
rw
0
IDLE
r
rw
IE0
IT0
rwh
rw
T0M
rw
ET2
rw
PT2
rw
PT2H
rw
RI
rwh
DPSEL
0
rw
ET1
rw
PT1
rw
PT1H
rw
EX1
rw
PX1
rw
PX1H
rw
ET0
rw
PT0
rw
PT0H
rw
EX0
rw
PX0
rw
PX0H
rw
CY
AC
F0
RS1
RS0
rw
rwh
rwh
rw
rw
ACC7 ACC6 ACC5 ACC4 ACC3
rw
rw
rw
rw
rw
ECCIP ECCIP ECCIP ECCIP EXM
3
2
1
0
rw
rw
rw
rw
rw
OV
rwh
ACC2
rw
EX2
F1
rwh
ACC1
rw
ESSC
P
rh
ACC0
rw
EADC
rw
rw
rw
0
r
0
r
28
ES
rw
PS
rw
PSH
rw
TI
rwh
V1.5, 2010-09
SAA-XC866
Functional Description
Table 6
CPU Register Overview (cont’d)
Addr
Register Name
F0H
B
B Register
Bit
F8H
IP1
Reset: 00H
Interrupt Priority Register 1
F9H
IPH1
Reset: 00H
Interrupt Priority Register 1 High
Reset: 00H
Bit Field
Type
Bit Field
Type
Bit Field
Type
7
6
5
4
3
B7
B6
B5
B4
B3
rw
rw
rw
rw
rw
PCCIP PCCIP PCCIP PCCIP PXM
3
2
1
0
rw
rw
rw
rw
rw
PCCIP PCCIP PCCIP PCCIP PXMH
3H
2H
1H
0H
rw
rw
rw
rw
rw
2
1
0
B2
rw
PX2
B1
rw
PSSC
B0
rw
PADC
rw
rw
rw
PX2H PSSCH PADC
H
rw
rw
rw
The system control SFRs can be accessed in the standard memory area (RMAP = 0).
Table 7
Addr
System Control Register Overview
Register Name
Bit
7
6
RMAP = 0 or 1
SYSCON0
Reset: 00H
8FH
System Control Register 0
Bit Field
Type
RMAP = 0
SCU_PAGE
Reset: 00H
BFH
Page Register for System Control
Bit Field
Type
OP
w
Bit Field
0
RMAP = 0, Page 0
MODPISEL
Reset: 00H
B3H
Peripheral Input Select Register
Type
Bit Field
B4H
IRCON0
Reset: 00H
Interrupt Request Register 0
B5H
IRCON1
Reset: 00H
Interrupt Request Register 1
B7H
EXICON0
Reset: 00H
External Interrupt Control Register 0
BAH
EXICON1
Reset: 00H
External Interrupt Control Register 1
BBH
NMICON
NMI Control Register
Reset: 00H
Bit Field
BCH
NMISR
NMI Status Register
Reset: 00H
Type
Bit Field
BDH
BCON
Reset: 00H
Baud Rate Control Register
Type
Bit Field
Type
BEH
BG
Reset: 00H
Baud Rate Timer/Reload Register
Bit Field
Type
E9H
FDCON
Reset: 00H
Fractional Divider Control Register
Bit Field
EAH
FDSTEP
Reset: 00H
Fractional Divider Reload Register
EBH
FDRES
Reset: 00H
Fractional Divider Result Register
Type
Bit Field
Type
Bit Field
Type
Bit Field
Type
Type
5
4
3
2
1
0
r
STNR
w
0
RMAP
rw
0
r
PAGE
rwh
JTAG JTAG
0
EXINT URRIS
TDIS TCKS
0IS
r
rw
rw
r
rw
rw
0
EXINT EXINT EXINT EXINT EXINT EXINT EXINT
6
5
4
3
2
1
0
r
rwh
rwh
rwh
rwh
rwh
rwh
rwh
0
ADCS ADCS
RIR
TIR
EIR
RC1
RC0
r
rwh
rwh
rwh
rwh
rwh
EXINT3
EXINT2
EXINT1
EXINT0
rw
rw
rw
rw
0
EXINT6
EXINT5
EXINT4
r
rw
rw
rw
0
NMI
NMI
NMI
NMI
NMI
NMI
NMI
ECC VDDP VDD OCDS FLASH PLL
WDT
r
rw
rw
rw
rw
rw
rw
rw
0
FNMI
ECC
r
rwh
BGSEL
rw
BGS
rw
Bit Field
Type
Bit Field
Type
FNMI
VDDP
rwh
0
r
FNMI FNMI FNMI FNMI
VDD OCDS FLASH PLL
rwh
rwh
rwh
rwh
BREN
BRPRE
rw
rw
BR_VALUE
rw
SYNEN ERRSY EOFSY BRK NDOV FDM
N
N
rw
rwh
rwh
rwh
rwh
rw
STEP
rw
RESULT
rh
FNMI
WDT
rwh
R
rw
FDEN
rw
RMAP = 0, Page 1
Data Sheet
29
V1.5, 2010-09
SAA-XC866
Functional Description
Table 7
System Control Register Overview (cont’d)
Addr
Register Name
B3H
ID
Identity Register
Bit
B4H
PMCON0
Reset: 00H
Power Mode Control Register 0
B5H
PMCON1
Reset: 00H
Power Mode Control Register 1
B6H
OSC_CON
OSC Control Register
Reset: 08H
Bit Field
0
PLL_CON
PLL Control Register
Reset: 20H
Type
Bit Field
r
B7H
BAH
CMCON
Clock Control Register
Reset: 00H
Bit Field
BBH
PASSWD
Password Register
Reset: 07H
Type
Bit Field
BCH
FEAL
Reset: 00H
Flash Error Address Register Low
Bit Field
Type
BDH
FEAH
Reset: 00H
Flash Error Address Register High
Bit Field
Type
BEH
COCON
Reset: 00H
Clock Output Control Register
Bit Field
0
Type
r
E9H
MISC_CON
Reset: 00H
Miscellaneous Control Register
Reset: 01H
7
6
Bit Field
Type
Bit Field
Type
Bit Field
5
4
PRODID
r
WDT WKRS WK
RST
SEL
rwh
rwh
rw
0
0
r
Type
r
OSC
PD
rw
NDIV
Type
rw
VCO
SEL
rw
3
2
1
SD
PD
rw
T2_DIS
rwh
CCU
_DIS
rw
XPD
rw
VCO
BYP
rw
0
0
VERID
r
WS
rw
SSC
_DIS
ADC
_DIS
rw
rw
rw
OSC
ORD OSCR
SS
RES
rw
rwh
rh
OSC RESLD LOCK
DISC
rw
rwh
CLKREL
rh
r
PASS
rw
PROTE
MODE
CT_S
w
rh
rw
ECCERRADDR[7:0]
rh
ECCERRADDR[15:8]
rh
TLEN COUT
COREL
S
rw
rw
rw
Type
Bit Field
0
Type
r
RMAP = 0, Page 3
B3H
XADDRH
Reset: F0H Bit Field
On-Chip XRAM Address Higher Order Type
DFLAS
HEN
rwh
ADDRH
rw
The WDT SFRs can be accessed in the mapped memory area (RMAP = 1).
Table 8
Addr
WDT Register Overview
Register Name
RMAP = 1
WDTCON
Reset: 00H
BBH
Watchdog Timer Control Register
Bit
7
6
Bit Field
0
Type
r
5
4
3
2
1
0
WINB
EN
rw
WDT
PR
rh
0
WDT
EN
WDT
RS
WDT
IN
rw
rwh
rw
Bit Field
Type
Bit Field
r
WDTREL
rw
WDTWINB
WDTL
Reset: 00H
Watchdog Timer Register Low
Type
Bit Field
Type
rw
WDT[7:0]
rh
WDTH
Reset: 00H
Watchdog Timer Register High
Bit Field
Type
WDT[15:8]
rh
BCH
WDTREL
Reset: 00H
Watchdog Timer Reload Register
BDH
WDTWINB
Reset: 00H
Watchdog Window-Boundary Count
Register
BEH
BFH
Data Sheet
30
V1.5, 2010-09
SAA-XC866
Functional Description
The Port SFRs can be accessed in the standard memory area (RMAP = 0).
Table 9
Addr
Port Register Overview
Register Name
Bit
RMAP = 0
PORT_PAGE
Reset: 00H
B2H
Page Register for PORT
7
6
Bit Field
Type
OP
w
0
r
0
r
5
4
STNR
w
3
2
0
r
1
0
PAGE
rwh
RMAP = 0, Page 0
80H
P0_DATA
P0 Data Register
Reset: 00H
Bit Field
Type
86H
P0_DIR
P0 Direction Register
Reset: 00H
Bit Field
Type
90H
P1_DATA
P1 Data Register
Reset: 00H
Bit Field
Type
P7
rwh
P6
rwh
P5
rwh
P5
rw
P5
rwh
91H
P1_DIR
P1 Direction Register
Reset: 00H
A0H
P2_DATA
P2 Data Register
Reset: 00H
A1H
P2_DIR
P2 Direction Register
Reset: 00H
B0H
P3_DATA
P3 Data Register
Reset: 00H
B1H
P3_DIR
P3 Direction Register
Reset: 00H
Bit Field
Type
Bit Field
Type
Bit Field
Type
Bit Field
Type
Bit Field
Type
P7
rw
P7
rwh
P7
rw
P7
rwh
P7
rw
P6
rw
P6
rwh
P6
rw
P6
rwh
P6
rw
P5
rw
P5
rwh
P5
rw
P5
rwh
P5
rw
P4
rw
P4
rw
P6
rw
P6
rw
P6
rw
P6
rw
P6
rw
P6
rw
P5
rw
P5
rw
P5
rw
P5
rw
P5
rw
P5
rw
P5
rw
P5
rw
P4
rw
P4
rw
P6
rw
P6
rw
P6
rw
P5
rw
P5
rw
P5
rw
P5
rw
P5
rw
RMAP = 0, Page 1
P0_PUDSEL
Reset: FFH
80H
P0 Pull-Up/Pull-Down Select Register
86H
90H
91H
A0H
A1H
B0H
B1H
Bit Field
Type
P0_PUDEN
Reset: C4H Bit Field
P0 Pull-Up/Pull-Down Enable Register Type
P1_PUDSEL
Reset: FFH Bit Field
P1 Pull-Up/Pull-Down Select Register Type
P1_PUDEN
Reset: FFH Bit Field
P1 Pull-Up/Pull-Down Enable Register Type
P2_PUDSEL
Reset: FFH Bit Field
P2 Pull-Up/Pull-Down Select Register Type
P2_PUDEN
Reset: 00H Bit Field
P2 Pull-Up/Pull-Down Enable Register Type
P3_PUDSEL
Reset: BFH Bit Field
P3 Pull-Up/Pull-Down Select Register Type
P3_PUDEN
Reset: 40H Bit Field
P3 Pull-Up/Pull-Down Enable Register Type
0
r
0
r
P7
rw
P7
rw
P7
rw
P7
rw
P7
rw
P7
rw
P4
rwh
P4
rw
P4
rwh
P4
rw
P4
rwh
P4
rw
P4
rw
P4
rw
P4
rw
P4
rw
P3
rwh
P3
rw
0
r
0
r
P3
rwh
P3
rw
P3
rwh
P3
rw
P2
rwh
P2
rw
P2
rwh
P2
rw
P2
rwh
P2
rw
P3
rw
P3
rw
0
r
0
r
P3
rw
P3
rw
P3
rw
P3
rw
P2
rw
P2
rw
P3
rw
P3
rw
0
r
0
r
P3
rw
P2
rw
P2
rw
P2
rw
P2
rw
P2
rw
P2
rw
P1
rwh
P1
rw
P1
rwh
P0
rwh
P0
rw
P0
rwh
P1
rw
P1
rwh
P1
rw
P1
rwh
P1
rw
P0
rw
P0
rwh
P0
rw
P0
rwh
P0
rw
P1
rw
P1
rw
P1
rw
P1
rw
P1
rw
P1
rw
P1
rw
P1
rw
P0
rw
P0
rw
P0
rw
P0
rw
P0
rw
P0
rw
P0
rw
P0
rw
P1
rw
P1
rw
P1
rw
P1
rw
P1
rw
P0
rw
P0
rw
P0
rw
P0
rw
P0
rw
RMAP = 0, Page 2
80H
P0_ALTSEL0
Reset: 00H
P0 Alternate Select 0 Register
86H
P0_ALTSEL1
Reset: 00H
P0 Alternate Select 1 Register
90H
P1_ALTSEL0
Reset: 00H
P1 Alternate Select 0 Register
91H
P1_ALTSEL1
Reset: 00H
P1 Alternate Select 1 Register
B0H
P3_ALTSEL0
Reset: 00H
P3 Alternate Select 0 Register
Data Sheet
Bit Field
Type
Bit Field
Type
Bit Field
Type
Bit Field
Type
Bit Field
Type
0
r
0
r
P7
rw
P7
rw
P7
rw
31
P4
rw
P2
rw
V1.5, 2010-09
SAA-XC866
Functional Description
Table 9
Port Register Overview (cont’d)
Addr
Register Name
Bit
7
6
5
4
3
2
1
0
B1H
P3_ALTSEL1
Reset: 00H
P3 Alternate Select 1 Register
Bit Field
P7
rw
P6
rw
P5
rw
P4
rw
P3
rw
P2
rw
P1
rw
P0
rw
P4
rw
P3
rw
0
r
P3
rw
P2
rw
P6
rw
P6
rw
P5
rw
P5
rw
P5
rw
P1
rw
P1
rw
P1
rw
P0
rw
P0
rw
P0
rw
1
0
Type
RMAP = 0, Page 3
P0_OD
Reset: 00H
80H
P0 Open Drain Control Register
Bit Field
Type
90H
P1_OD
Reset: 00H
P1 Open Drain Control Register
Bit Field
Type
B0H
P3_OD
Reset: 00H
P3 Open Drain Control Register
Bit Field
Type
0
r
P7
rw
P7
rw
P4
rw
P2
rw
The ADC SFRs can be accessed in the standard memory area (RMAP = 0).
Table 10
Addr
ADC Register Overview
Register Name
Bit
7
6
5
RMAP = 0
ADC_PAGE
D1H
Page Register for ADC
Reset: 00H
Bit Field
Type
RMAP = 0, Page 0
CAH
ADC_GLOBCTR
Global Control Register
Reset: 30H
ANON
rw
CBH
ADC_GLOBSTR
Global Status Register
Reset: 00H
Bit Field
Type
Bit Field
Type
CCH
ADC_PRAR
Reset: 00H
Priority and Arbitration Register
Bit Field
Type
CDH
ADC_LCBR
Reset: B7H
Limit Check Boundary Register
Bit Field
Type
r
ASEN1 ASEN0
0
rw
rw
r
BOUND1
rw
CEH
ADC_INPCR0
Input Class Register 0
CFH
ADC_ETRCR
Reset: 00H
External Trigger Control Register
Bit Field
Type
Bit Field
Reset: 00H
Type
RMAP = 0, Page 1
ADC_CHCTR0
Reset: 00H
CAH
Channel Control Register 0
Bit Field
Type
CBH
ADC_CHCTR1
Reset: 00H
Channel Control Register 1
Bit Field
Type
CCH
ADC_CHCTR2
Reset: 00H
Channel Control Register 2
Bit Field
Type
CDH
ADC_CHCTR3
Reset: 00H
Channel Control Register 3
CEH
ADC_CHCTR4
Reset: 00H
Channel Control Register 4
CFH
ADC_CHCTR5
Reset: 00H
Channel Control Register 5
D2H
ADC_CHCTR6
Reset: 00H
Channel Control Register 6
D3H
ADC_CHCTR7
Reset: 00H
Channel Control Register 7
OP
w
4
STNR
w
DW
rw
3
2
0
r
PAGE
rwh
CTC
rw
CHNR
0
SYNEN SYNEN
1
0
rw
rw
0
r
0
SAM BUSY
PLE
rh
r
rh
rh
ARBM CSM1 PRIO1 CSM0 PRIO0
rw
rw
rw
rw
rw
BOUND0
rw
STC
rw
ETRSEL1
ETRSEL0
rw
Bit Field
Type
0
r
0
r
0
r
0
r
LCC
rw
LCC
rw
LCC
rw
LCC
rw
Bit Field
Type
Bit Field
Type
Bit Field
Type
Bit Field
Type
0
r
0
r
0
r
0
r
LCC
rw
LCC
rw
LCC
rw
LCC
rw
rw
0
r
0
r
0
r
0
RESRSEL
rw
RESRSEL
rw
RESRSEL
rw
RESRSEL
r
0
r
0
r
0
r
0
r
rw
RESRSEL
rw
RESRSEL
rw
RESRSEL
rw
RESRSEL
rw
RMAP = 0, Page 2
Data Sheet
32
V1.5, 2010-09
SAA-XC866
Functional Description
Table 10
ADC Register Overview (cont’d)
Addr
Register Name
CAH
ADC_RESR0L
Result Register 0 Low
Reset: 00H
Bit
Bit Field
CBH
ADC_RESR0H
Result Register 0 High
Reset: 00H
Type
Bit Field
CCH
ADC_RESR1L
Result Register 1 Low
Reset: 00H
Type
Bit Field
CDH
ADC_RESR1H
Result Register 1 High
Reset: 00H
Type
Bit Field
CEH
ADC_RESR2L
Result Register 2 Low
Reset: 00H
Type
Bit Field
CFH
ADC_RESR2H
Result Register 2 High
Reset: 00H
Type
Bit Field
D2H
ADC_RESR3L
Result Register 3 Low
Reset: 00H
Bit Field
Type
D3H
ADC_RESR3H
Result Register 3 High
Reset: 00H
Bit Field
Type
7
6
5
RESULT[1:0]
rh
0
r
RESULT[1:0]
rh
0
r
RESULT[1:0]
rh
0
r
RESULT[1:0]
rh
0
r
Type
RMAP = 0, Page 3
ADC_RESRA0L
Reset: 00H
CAH
Result Register 0, View A Low
Bit Field
Type
CBH
ADC_RESRA0H
Reset: 00H
Result Register 0, View A High
Bit Field
Type
CCH
ADC_RESRA1L
Reset: 00H
Result Register 1, View A Low
Bit Field
Type
CDH
ADC_RESRA1H
Reset: 00H
Result Register 1, View A High
Bit Field
Type
CEH
ADC_RESRA2L
Reset: 00H
Result Register 2, View A Low
Bit Field
Type
CFH
ADC_RESRA2H
Reset: 00H
Result Register 2, View A High
Bit Field
Type
D2H
ADC_RESRA3L
Reset: 00H
Result Register 3, View A Low
Bit Field
Type
D3H
ADC_RESRA3H
Reset: 00H
Result Register 3, View A High
Bit Field
Type
RMAP = 0, Page 4
ADC_RCR0
Reset: 00H
CAH
Result Control Register 0
Bit Field
Type
CBH
ADC_RCR1
Reset: 00H
Result Control Register 1
CCH
ADC_RCR2
Reset: 00H
Result Control Register 2
CDH
ADC_RCR3
Reset: 00H
Result Control Register 3
CEH
ADC_VFCR
Reset: 00H
Valid Flag Clear Register
RESULT[2:0]
rh
RESULT[2:0]
rh
RESULT[2:0]
rh
RESULT[2:0]
rh
VFCTR WFR
2
VF
DRC
rh
rh
RESULT[10:3]
rh
VF
DRC
rh
rh
RESULT[10:3]
rh
VF
DRC
rh
rh
RESULT[10:3]
rh
VF
DRC
rh
rh
RESULT[10:3]
rh
CHNR
rh
CHNR
rh
CHNR
rh
CHNR
rh
CHNR
rh
CHNR
rh
IEN
0
DRCT
R
rw
DRCT
R
rw
DRCT
R
rw
DRCT
R
rw
VFC0
w
r
rw
IEN
r
0
Type
Bit Field
rw
rw
VFCTR WFR
r
0
rw
IEN
r
0
Type
Bit Field
rw
rw
VFCTR WFR
r
0
rw
IEN
r
0
r
rw
0
r
0
CHNR
rh
0
rw
1
CHNR
rh
VFCTR WFR
rw
rw
3
Bit Field
Type
Bit Field
Type
rw
0
4
VF
DRC
rh
rh
RESULT[9:2]
rh
VF
DRC
rh
rh
RESULT[9:2]
rh
VF
DRC
rh
rh
RESULT[9:2]
rh
VF
DRC
rh
rh
RESULT[9:2]
rh
VFC3
w
r
VFC2
w
VFC1
w
RMAP = 0, Page 5
Data Sheet
33
V1.5, 2010-09
SAA-XC866
Functional Description
Table 10
ADC Register Overview (cont’d)
Addr
Register Name
Bit
CAH
ADC_CHINFR
Reset: 00H
Channel Interrupt Flag Register
Bit Field
CBH
ADC_CHINCR
Reset: 00H
Channel Interrupt Clear Register
CCH
ADC_CHINSR
Reset: 00H
Channel Interrupt Set Register
CDH
ADC_CHINPR
Reset: 00H
Channel Interrupt Node Pointer
Register
CEH
ADC_EVINFR
Reset: 00H
Event Interrupt Flag Register
CFH
ADC_EVINCR
Reset: 00H
Event Interrupt Clear Flag Register
D2H
ADC_EVINSR
Reset: 00H
Event Interrupt Set Flag Register
D3H
ADC_EVINPR
Reset: 00H
Event Interrupt Node Pointer Register
Type
Bit Field
Type
Bit Field
Type
Bit Field
Type
Bit Field
Type
Bit Field
Type
Bit Field
Type
Bit Field
Type
RMAP = 0, Page 6
CAH
ADC_CRCR1
Reset: 00H Bit Field
Conversion Request Control Register 1
Type
ADC_CRPR1
Reset: 00H Bit Field
CBH
Conversion Request Pending
Register 1
Type
CCH
ADC_CRMR1
Reset: 00H
Conversion Request Mode Register 1
CDH
ADC_QMR0
Reset: 00H
Queue Mode Register 0
CEH
ADC_QSR0
Reset: 20H
Queue Status Register 0
CFH
ADC_Q0R0
Queue 0 Register 0
D2H
ADC_QBUR0
Reset: 00H
Queue Backup Register 0
D2H
ADC_QINR0
Queue Input Register 0
Reset: 00H
Reset: 00H
7
6
1
0
EVINF EVINF
1
0
rh
rh
EVINC EVINC
1
0
w
w
EVINS EVINS
1
0
r
0
r
0
r
0
w
w
EVINP EVINP
1
0
rw
rw
r
CH5
CH4
0
rwh
CHP7
rwh
CHP6
rwh
CHP5
rwh
CHP4
r
0
rwh
Type
Bit Field
r
CEV
w
Rsv
r
EXTR
rh
EXTR
rh
EXTR
w
w
TREV
w
0
r
ENSI
rh
ENSI
rh
ENSI
w
0
w
w
w
CHINS CHINS CHINS
2
1
0
w
w
w
CHINP CHINP CHINP
2
1
0
rw
rw
rw
CH6
LDEV
Type
Bit Field
Type
2
CHINF CHINF CHINF
2
1
0
rh
rh
rh
CHINC CHINC CHINC
2
1
0
CH7
rwh
Type
Bit Field
3
EVINP EVINP EVINP EVINP
7
6
5
4
rw
rw
rw
rw
Rsv
Type
Bit Field
4
EVINF EVINF EVINF EVINF
7
6
5
4
rh
rh
rh
rh
EVINC EVINC EVINC EVINC
7
6
5
4
w
w
w
w
EVINS EVINS EVINS EVINS
7
6
5
4
w
w
w
w
Bit Field
Type
Bit Field
5
CHINF CHINF CHINF CHINF CHINF
7
6
5
4
3
rh
rh
rh
rh
rh
CHINC CHINC CHINC CHINC CHINC
7
6
5
4
3
w
w
w
w
w
CHINS CHINS CHINS CHINS CHINS
7
6
5
4
3
w
w
w
w
w
CHINP CHINP CHINP CHINP CHINP
7
6
5
4
3
rw
rw
rw
rw
rw
rwh
rwh
r
CLR SCAN ENSI ENTR
ENGT
PND
w
rw
rw
rw
rw
FLUSH CLRV TRMD ENTR
ENGT
w
w
rw
rw
rw
EMPTY EV
0
rh
rh
r
RF
V
0
REQCHNR
rh
rh
r
rh
RF
V
0
REQCHNR
rh
rh
r
rh
RF
0
REQCHNR
w
r
w
The Timer 2 SFRs can be accessed in the standard memory area (RMAP = 0).
Table 11
Timer 2 Register Overview
Addr
Register Name
Bit
7
6
3
2
1
0
C0H
T2_T2CON
Reset: 00H
Timer 2 Control Register
Bit Field
TF2
EXF2
0
EXEN2
TR2
0
Type
rwh
rwh
r
rw
rwh
r
CP/
RL2
rw
Data Sheet
34
5
4
V1.5, 2010-09
SAA-XC866
Functional Description
Table 11
Timer 2 Register Overview (cont’d)
C1H
T2_T2MOD
Timer 2 Mode Register
Reset: 00H
C2H
T2_RC2L
Reset: 00H
Timer 2 Reload/Capture Register Low
Bit Field
Type
C3H
C4H
C5H
T2
T2
EDGE PREN
REGS RHEN SEL
rw
rw
rw
rw
Bit Field
Type
T2_RC2H
Reset: 00H Bit Field
Timer 2 Reload/Capture Register High Type
T2_T2L
Reset: 00H Bit Field
Timer 2 Register Low
Type
T2_T2H
Reset: 00H Bit Field
Timer 2 Register High
Type
T2PRE
DCEN
rw
rw
RC2[7:0]
rwh
RC2[15:8]
rwh
THL2[7:0]
rwh
THL2[15:8]
rwh
The CCU6 SFRs can be accessed in the standard memory area (RMAP = 0).
Table 12
Addr
CCU6 Register Overview
Register Name
RMAP = 0
CCU6_PAGE
Reset: 00H
A3H
Page Register for CCU6
Bit
7
6
OP
w
Bit Field
Type
5
4
STNR
w
RMAP = 0, Page 0
CCU6_CC63SRL
Reset: 00H Bit Field
9AH
Capture/Compare Shadow Register for
Channel CC63 Low
Type
CCU6_CC63SRH
Reset: 00H Bit Field
9BH
Capture/Compare Shadow Register for
Channel CC63 High
Type
9CH
CCU6_TCTR4L
Reset: 00H
Timer Control Register 4 Low
9DH
CCU6_TCTR4H
Reset: 00H
Timer Control Register 4 High
9EH
CCU6_MCMOUTSL
Reset: 00H
Multi-Channel Mode Output Shadow
Register Low
9FH
CCU6_MCMOUTSH
Reset: 00H
Multi-Channel Mode Output Shadow
Register High
Bit Field
Type
Bit Field
Type
A4H
CCU6_ISRL
Reset: 00H
Capture/Compare Interrupt Status
Reset Register Low
A5H
CCU6_ISRH
Reset: 00H
Capture/Compare Interrupt Status
Reset Register High
A6H
CCU6_CMPMODIFL
Reset: 00H
Compare State Modification Register
Low
A7H
CCU6_CMPMODIFH
Reset: 00H
Compare State Modification Register
High
FAH
Bit Field
Type
Bit Field
Type
Bit Field
Type
Bit Field
Type
Bit Field
Type
Bit Field
Type
CCU6_CC60SRL
Reset: 00H Bit Field
Capture/Compare Shadow Register for
Channel CC60 Low
Type
Data Sheet
3
2
1
0
r
0
PAGE
rwh
CC63SL
rw
CC63SH
rw
T12
STD
w
T13
STD
w
STRM
CM
w
STRHP
w
T12
STR
w
T13
STR
w
0
r
0
r
0
DTRES
T12
RES
w
w
T13
RES
w
MCMPS
r
0
r
T12RS T12RR
w
w
T13RS T13RR
w
w
rw
CURHS
rw
EXPHS
rw
RT12P RT12O RCC62 RCC62 RCC61 RCC61 RCC60 RCC60
M
M
F
R
F
R
F
R
w
w
w
w
w
w
w
w
RSTR RIDLE RWHE RCHE
0
RTRPF RT13 RT13
PM
CM
w
w
w
w
r
w
w
w
0
MCC63
0
MCC62 MCC61 MCC60
S
S
S
S
r
w
r
w
w
w
0
MCC63
0
MCC62 MCC61 MCC60
R
R
R
R
w
w
w
r
w
r
CC60SL
rwh
35
V1.5, 2010-09
SAA-XC866
Functional Description
Table 12
CCU6 Register Overview (cont’d)
Addr
Register Name
FBH
CCU6_CC60SRH
Reset: 00H Bit Field
Capture/Compare Shadow Register for
Channel CC60 High
Type
CCU6_CC61SRL
Reset: 00H Bit Field
Capture/Compare Shadow Register for
Channel CC61 Low
Type
CC60SH
CCU6_CC61SRH
Reset: 00H Bit Field
Capture/Compare Shadow Register for
Channel CC61 High
Type
CCU6_CC62SRL
Reset: 00H Bit Field
Capture/Compare Shadow Register for
Channel CC62 Low
Type
CC61SH
CCU6_CC62SRH
Reset: 00H Bit Field
Capture/Compare Shadow Register for
Channel CC62 High
Type
RMAP = 0, Page 1
CCU6_CC63RL
Reset: 00H Bit Field
9AH
Capture/Compare Register for Channel
CC63 Low
Type
CCU6_CC63RH
Reset: 00H Bit Field
9BH
Capture/Compare Register for Channel
CC63 High
Type
CC62SH
9CH
CCU6_T12PRL
Reset: 00H
Timer T12 Period Register Low
9DH
CCU6_T12PRH
Reset: 00H
Timer T12 Period Register High
9EH
CCU6_T13PRL
Reset: 00H
Timer T13 Period Register Low
9FH
CCU6_T13PRH
Reset: 00H
Timer T13 Period Register High
A4H
CCU6_T12DTCL
Reset: 00H
Dead-Time Control Register for Timer
T12 Low
CCU6_T12DTCH
Reset: 00H
Dead-Time Control Register for Timer
T12 High
T12PVL
rwh
T12PVH
rwh
T13PVL
rwh
T13PVH
rwh
DTM
rw
FCH
FDH
FEH
Bit
7
6
5
Type
FBH
FCH
0
DTR2
DTR1
rh
Type
Bit Field
rw
rh
0
rh
STE13
r
rh
DTR0
0
rh
r
T12
PRE
rh
rw
T13R
T13
PRE
rw
rh
CC60VL
T12R
rw
T12CLK
rw
rw
T13CLK
rw
rh
CCU6_CC60RH
Reset: 00H Bit Field
Capture/Compare Register for Channel
CC60 High
Type
CCU6_CC61RL
Reset: 00H Bit Field
Capture/Compare Register for Channel
CC61 Low
Type
Data Sheet
rw
rh
STE12
Type
CCU6_CC60RL
Reset: 00H Bit Field
Capture/Compare Register for Channel
CC60 Low
Type
DTE0
rh
CC63VH
rh
FAH
DTE1
CC63VL
CDIR
CCU6_TCTR0H
Reset: 00H
Timer Control Register 0 High
DTE2
rwh
r
A7H
0
rwh
CTM
CCU6_TCTR0L
Reset: 00H
Timer Control Register 0 Low
1
rwh
CC62SL
Bit Field
A6H
2
rwh
Bit Field
Type
Bit Field
Type
Bit Field
Type
Bit Field
Type
Bit Field
Type
Bit Field
3
rwh
CC61SL
FFH
A5H
4
CC60VH
rh
CC61VL
rh
36
V1.5, 2010-09
SAA-XC866
Functional Description
Table 12
CCU6 Register Overview (cont’d)
Addr
Register Name
FDH
CCU6_CC61RH
Reset: 00H Bit Field
Capture/Compare Register for Channel
CC61 High
Type
CCU6_CC62RL
Reset: 00H Bit Field
Capture/Compare Register for Channel
CC62 Low
Type
CC61VH
CCU6_CC62RH
Reset: 00H Bit Field
Capture/Compare Register for Channel
CC62 High
Type
CC62VH
FEH
FFH
RMAP = 0, Page 2
CCU6_T12MSELL
Reset: 00H
9AH
T12 Capture/Compare Mode Select
Register Low
Bit
9CH
CCU6_IENL
Reset: 00H
Capture/Compare Interrupt Enable
Register Low
9DH
CCU6_IENH
Reset: 00H
Capture/Compare Interrupt Enable
Register High
Bit Field
9EH
CCU6_INPL
Reset: 40H
Capture/Compare Interrupt Node
Pointer Register Low
Bit Field
9FH
CCU6_INPH
Reset: 39H
Capture/Compare Interrupt Node
Pointer Register High
A6H
A7H
Bit Field
Type
Bit Field
Type
Type
CCU6_ISSH
Reset: 00H Bit Field
Capture/Compare Interrupt Status Set
Register High
Type
CCU6_PSLR
Reset: 00H Bit Field
Passive State Level Register
Type
CCU6_MCMCTR
Reset: 00H
Multi-Channel Mode Control Register
FAH
CCU6_TCTR2L
Reset: 00H
Timer Control Register 2 Low
FBH
CCU6_TCTR2H
Reset: 00H
Timer Control Register 2 High
FCH
CCU6_MODCTRL
Reset: 00H
Modulation Control Register Low
FDH
CCU6_MODCTRH
Reset: 00H
Modulation Control Register High
FEH
CCU6_TRPCTRL
Reset: 00H
Trap Control Register Low
Data Sheet
Bit Field
Type
Bit Field
Type
Bit Field
Type
Bit Field
Type
Bit Field
Type
Bit Field
Type
4
3
2
1
0
rh
rh
MSEL61
MSEL60
rw
rw
MSEL62
DBYP
HSYNC
rw
rw
rw
ENT12 ENT12 ENCC ENCC ENCC ENCC ENCC ENCC
PM
OM
62F
62R
61F
61R
60F
60R
rw
rw
rw
rw
rw
rw
rw
rw
ENSTR EN
EN
EN
0
EN
ENT13 ENT13
IDLE
WHE
CHE
TRPF
PM
CM
rw
rw
rw
rw
r
rw
rw
rw
INPCHE
INPCC62
INPCC61
INPCC60
Type
Bit Field
Type
CCU6_ISSL
Reset: 00H Bit Field
Capture/Compare Interrupt Status Set
Register Low
Type
5
rh
CC62VL
Type
CCU6_T12MSELH
Reset: 00H
T12 Capture/Compare Mode Select
Register High
A5H
6
Bit Field
9BH
A4H
7
rw
0
rw
INPT13
rw
INPT12
rw
INPERR
r
rw
rw
rw
ST12P ST12O SCC62 SCC62 SCC61 SCC61 SCC60 SCC60
M
M
F
R
F
R
F
R
w
w
w
w
w
w
w
w
SSTR SIDLE SWHE SCHE SWHC STRPF ST13 ST13
PM
CM
w
w
w
w
w
w
w
w
PSL63
0
PSL
rwh
r
rwh
0
SWSYN
0
SWSEL
r
rw
r
rw
0
T13TED
T13TEC
T13
T12
SSC
SSC
rw
rw
r
rw
rw
0
T13RSEL
T12RSEL
r
rw
rw
MC
MEN
rw
ECT13
O
rw
0
T12MODEN
r
0
rw
T13MODEN
r
0
r
37
rw
TRPM2 TRPM1 TRPM0
rw
rw
rw
V1.5, 2010-09
SAA-XC866
Functional Description
Table 12
CCU6 Register Overview (cont’d)
Addr
Register Name
Bit
FFH
CCU6_TRPCTRH
Reset: 00H
Trap Control Register High
Bit Field
Type
RMAP = 0, Page 3
CCU6_MCMOUTL
Reset: 00H
9AH
Multi-Channel Mode Output Register
Low
7
Bit Field
0
Type
Bit Field
r
9BH
CCU6_MCMOUTH
Reset: 00H
Multi-Channel Mode Output Register
High
9CH
CCU6_ISL
Reset: 00H
Capture/Compare Interrupt Status
Register Low
9DH
CCU6_ISH
Reset: 00H
Capture/Compare Interrupt Status
Register High
9EH
CCU6_PISEL0L
Reset: 00H
Port Input Select Register 0 Low
9FH
CCU6_PISEL0H
Reset: 00H
Port Input Select Register 0 High
A4H
CCU6_PISEL2
Reset: 00H
Port Input Select Register 2
Bit Field
Type
FAH
CCU6_T12L
Reset: 00H
Timer T12 Counter Register Low
Bit Field
Type
FBH
CCU6_T12H
Reset: 00H
Timer T12 Counter Register High
Bit Field
Type
FCH
CCU6_T13L
Reset: 00H
Timer T13 Counter Register Low
Bit Field
Type
FDH
CCU6_T13H
Reset: 00H
Timer T13 Counter Register High
Bit Field
Type
FEH
CCU6_CMPSTATL
Reset: 00H
Compare State Register Low
Bit Field
FFH
CCU6_CMPSTATH
Reset: 00H
Compare State Register High
Type
Bit Field
Type
Bit Field
6
5
4
TRPPE TRPEN
N
13
rw
rw
3
2
1
0
TRPEN
rw
R
MCMP
rh
rh
0
CURH
EXPH
rh
r
rh
T12PM T12OM ICC62F ICC62 ICC61F ICC61 ICC60F ICC60
R
R
R
rh
rh
rh
rh
rh
rh
rh
rh
STR
IDLE
WHE
CHE TRPS TRPF T13PM T13CM
Type
Bit Field
rh
rh
ISTRP
rh
rh
ISCC62
rh
rh
ISCC61
rh
rh
ISCC60
Type
Bit Field
rw
IST12HR
rw
ISPOS2
rw
ISPOS1
rw
ISPOS0
rw
rw
0
r
rw
rw
IST13HR
rw
Type
Type
Bit Field
Type
0
r
T12CVL
rwh
T12CVH
rwh
T13CVL
rwh
T13CVH
rwh
CCPO CCPO CCPO
S2
S1
S0
rh
rh
rh
CC63
ST
rh
T13IM COUT COUT
63PS 62PS
rwh
rwh
rwh
CC62
PS
rwh
COUT
61PS
rwh
CC62
ST
CC61
ST
CC60
ST
rh
CC61
PS
rwh
rh
COUT
60PS
rwh
rh
CC60
PS
rwh
2
1
0
CIS
rw
SIS
rw
MIS
rw
The SSC SFRs can be accessed in the standard memory area (RMAP = 0).
Table 13
Addr
SSC Register Overview
Register Name
Bit
RMAP = 0
SSC_PISEL
Reset: 00H
A9H
Port Input Select Register
AAH
SSC_CONL
Control Register Low
Programming Mode
Operating Mode
Data Sheet
Reset: 00H
Bit Field
Type
Bit Field
Type
7
LB
rw
Bit Field
Type
6
5
PO
rw
0
r
PH
rw
0
r
38
4
HB
rw
3
BM
rw
BC
rh
V1.5, 2010-09
SAA-XC866
Functional Description
Table 13
ABH
SSC Register Overview
SSC_CONH
Control Register High
Programming Mode
Reset: 00H
Operating Mode
ACH
SSC_TBL
Reset: 00H
Transmitter Buffer Register Low
ADH
SSC_RBL
Reset: 00H
Receiver Buffer Register Low
AEH
SSC_BRL
Reset: 00H
Baudrate Timer Reload Register Low
AFH
SSC_BRH
Reset: 00H
Baudrate Timer Reload Register High
Bit Field
EN
MS
0
Type
rw
rw
r
Bit Field
Type
Bit Field
Type
Bit Field
Type
Bit Field
Type
Bit Field
Type
EN
rw
MS
rw
0
r
AREN
BEN
rw
rw
BSY
BE
rh
rwh
TB_VALUE
rw
RB_VALUE
rh
BR_VALUE[7:0]
rw
BR_VALUE[15:8]
rw
PEN
REN
TEN
rw
PE
rwh
rw
RE
rwh
rw
TE
rwh
1
0
The OCDS SFRs can be accessed in the mapped memory area (RMAP = 1).
Table 14
Addr
OCDS Register Overview
Register Name
RMAP = 1
MMCR2
Reset: 0UH
E9H
Monitor Mode Control Register 2
Bit
Bit Field
Type
F1H
MMCR
Reset: 00H
Monitor Mode Control Register
Bit Field
F2H
MMSR
Reset: 00H
Monitor Mode Status Register
F3H
MMBPCR
Reset: 00H
BreakPoints Control Register
F4H
MMICR
Reset: 00H Bit Field
Monitor Mode Interrupt Control Register
Type
MMDR
Reset: 00H Bit Field
Monitor Mode Data Register
Receive
Type
Type
Bit Field
Type
Bit Field
Type
F5H
Transmit
6
HWBPSR
Reset: 00H Bit Field
Hardware Breakpoints Select Register
Type
F7H
HWBPDR
Reset: 00H
Hardware Breakpoints Data Register
5
4
3
EXBC_ EXBC MBCO MBCO MMEP
P
N_P
N
_P
w
rw
w
rwh
w
MEXIT MEXIT MSTEP MSTEP MRAM
_P
_P
S_P
w
rwh
w
rw
w
MBCA MBCIN EXBF SWBF HWB3
M
F
rw
rh
rwh
rwh
rwh
SWBC
HWB3C
HWB2C
rw
rw
DVECT DRETR
rwh
rwh
Bit Field
Type
F6H
Data Sheet
7
0
r
Bit Field
Type
2
MMEP MMOD JENA
E
rwh
rh
rh
MRAM TRF
RRF
S
rwh
rh
rh
HWB2 HWB1 HWB0
F
F
F
rwh
rwh
rwh
HWB1
HWB0C
C
rw
0
r
rw
rw
MMUIE MMUIE RRIE_ RRIE
_P
P
w
rw
w
rw
MMRR
rh
MMTR
w
BPSEL
_P
w
BPSEL
rw
HWBPxx
rw
39
V1.5, 2010-09
SAA-XC866
Functional Description
3.3
Flash Memory
The Flash memory provides an embedded user-programmable non-volatile memory,
allowing fast and reliable storage of user code and data. It is operated from a single 2.5 V
supply from the Embedded Voltage Regulator (EVR) and does not require additional
programming or erasing voltage. The sectorization of the Flash memory allows each
sector to be erased independently.
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
In-System Programming (ISP) via UART
In-Application Programming (IAP)
Error Correction Code (ECC) for dynamic correction of single-bit errors
Background program and erase operations for CPU load minimization
Support for aborting erase operation
Minimum program width1) of 32-byte for D-Flash and 32-byte for P-Flash
1-sector minimum erase width
1-byte read access
Flash is delivered in erased state (read all zeros)
Operating supply voltage: 2.5 V ± 7.5 %
Read access time: 3 × tCCLK = 112.5 ns2)
Program time: 209440 / fSYS = 2.6 ms3)
Erase time: 8175360 / fSYS = 102 ms3)
1)
P-Flash: 32-byte wordline can only be programmed once, i.e., one gate disturb allowed.
D-Flash: 32-byte wordline can be programmed twice, i.e., two gate disturbs allowed.
2)
fsys = 80 MHz ± 7.5% (fCCLK = 26.7 MHz ± 7.5 %) is the maximum frequency range for Flash read access.
fsys = 80 MHz ± 7.5% is the only frequency range for Flash programming and erasing. fsysmin is used for
3)
obtaining the worst case timing.
Data Sheet
40
V1.5, 2010-09
SAA-XC866
Functional Description
Table 15 shows the Flash data retention and endurance targets.
Table 15
Flash Data Retention and Endurance
Retention
Endurance1)
Size
TA=- 40 to
125 °C
Remarks
TA= 125 to
140 °C
Program Flash
20 years
1,000 cycles
up to 16 Kbytes2)
for 16-Kbyte
Variant
20 years
1,000 cycles
up to 8 Kbytes2)
for 8-Kbyte
Variant
20 years
1,000 cycles
up to 4 Kbytes2)
for 4-Kbyte
Variant
20 years
1,000 cycles3)
4 Kbytes
1 Kbytes
5 years
10,000 cycles3)
1 Kbyte
256 bytes
2 years
70,000 cycles3)
512 bytes
128 bytes
2 years
100,000 cycles3) 128 bytes
Data Flash
32 bytes
1)
One cycle refers to the programming of all wordlines in a sector and erasing of sector. The Flash endurance
data specified in Table 15 is valid only if the following conditions are fulfilled:
- the maximum number of erase cycles per Flash sector must not exceed 100,000 cycles.
- the maximum number of erase cycles per Flash bank must not exceed 300,000 cycles.
- the maximum number of program cycles per Flash bank must not exceed 2,500,000 cycles.
2)
If no Flash is used for data, the Program Flash size can be up to the maximum Flash size available in the
device variant. Having more Data Flash will mean less Flash is available for Program Flash.
3)
For TA=125 to 140°C, refers to programming of second 8 bytes (bytes 8 to 15) per WL
Data Sheet
41
V1.5, 2010-09
SAA-XC866
Functional Description
3.3.1
Flash Bank Sectorization
The SAA-XC866 product family offers four Flash devices with either 8 Kbytes or
16 Kbytes of embedded Flash memory. These Flash memory sizes are made up of two
or four 4-Kbyte Flash banks, respectively. Each Flash device consists of Program Flash
(P-Flash) bank(s) and a single Data Flash (D-Flash) bank with different sectorization
shown in Figure 11. Both types can be used for code and data storage. The label “Data”
neither implies that the D-Flash is mapped to the data memory region, nor that it can only
be used for data storage. It is used to distinguish the different Flash bank sectorizations.
Sector 2: 128-byte
Sector 1: 128-byte
Sector 9:
Sector 8:
Sector 7:
Sector 6:
128-byte
128-byte
128-byte
128-byte
Sector 5: 256-byte
Sector 4: 256-byte
Sector 3: 512-byte
Sector 0: 3.75-Kbyte
Sector 2: 512-byte
Sector 1: 1-Kbyte
Sector 0: 1-Kbyte
P-Flash
Figure 11
D-Flash
Flash Bank Sectorization
The internal structure of each Flash bank represents a sector architecture for flexible
erase capability. The minimum erase width is always a complete sector, and sectors can
be erased separately or in parallel. Contrary to standard EPROMs, erased Flash
memory cells contain 0s.
The D-Flash bank is divided into more physical sectors for extended erasing and
reprogramming capability; even numbers for each sector size are provided to allow
greater flexibility and the ability to adapt to a wide range of application requirements.
Data Sheet
42
V1.5, 2010-09
SAA-XC866
Functional Description
3.3.2
Flash Programming Width
For the P-Flash banks, a programmed wordline (WL) must be erased before it can be
reprogrammed as the Flash cells can only withstand one gate disturb. This means that
the entire sector containing the WL must be erased since it is impossible to erase a
single WL.
For the D-Flash bank, the same WL can be programmed twice before erasing is required
as the Flash cells are able to withstand two gate disturbs. Hence, it is possible to
program the same WL, for example, with 16 bytes of data in two times (see Figure 12).
16 bytes
16 bytes
0000 ….. 0000 H
32 bytes (1 WL)
0000 ….. 0000 H
Program 1
0000 ….. 0000 H
1111 ….. 1111 H
0000 ….. 0000 H
1111 ….. 1111 H
Program 2
1111 ….. 0000 H
0000 ….. 0000 H
1111 ….. 0000 H
1111 ….. 1111 H
Note: A Flash memory cell can be programmed
from 0 to 1, but not from 1 to 0.
Flash memory cells
Figure 12
32-byte write buffers
D-Flash Programming
Note: When programming a D-Flash WL the second time, the previously programmed
Flash memory cells (whether 0s or 1s) should be reprogrammed with 0s to retain
its original contents and to prevent “over-programming”.
Data Sheet
43
V1.5, 2010-09
SAA-XC866
Functional Description
3.4
Interrupt System
The XC800 Core supports one non-maskable interrupt (NMI) and 14 maskable interrupt
requests. In addition to the standard interrupt functions supported by the core, e.g.,
configurable interrupt priority and interrupt masking, the XC866 interrupt system
provides extended interrupt support capabilities such as the mapping of each interrupt
vector to several interrupt sources to increase the number of interrupt sources
supported, and additional status registers for detecting and determining the interrupt
source.
3.4.1
Interrupt Source
Figure 13 to Figure 17 give a general overview of the interrupt sources and illustrates
the request and control flags.
WDT Overflow
FNMIWDT
NMIISR.0
NMIWDT
NMICON.0
PLL Loss of Lock
FNMIPLL
NMIISR.1
NMIPLL
NMICON.1
Flash Operation
Complete
FNMIFLASH
NMIISR.2
NMIFLASH
>=1
VDD Pre-Warning
0073
FNMIVDD
NMIISR.4
H
Non
Maskable
Interrupt
NMIVDD
NMICON.4
VDDP Pre-Warning
FNMIVDDP
NMIISR.5
NMIVDDP
NMICON.5
Flash ECC Error
FNMIECC
NMIISR.6
NMIECC
NMICON.6
Figure 13
Data Sheet
Non-Maskable Interrupt Request Sources
44
V1.5, 2010-09
SAA-XC866
Functional Description
Highest
Timer 0
Overflow
TF0
TCON.5
ET0
000B
H
IEN0.1
Timer 1
Overflow
IP.1/
IPH.1
TF1
TCON.7
ET1
001B
H
IEN0.3
UART
Receive
IP.3/
IPH.3
RI
SCON.0
UART
Transmit
EINT0
Lowest
Priority Level
P
o
l
l
i
n
g
>=1
TI
ES
SCON.1
IEN0.4
EXINT0
IE0
IRCON0.0
TCON.1
IT0
EX0
0023
H
0003
H
IEN0.0
TCON.0
IP.4/
IPH.4
S
e
q
u
e
n
c
e
IP.0/
IPH.0
EXINT0
EXICON0.0/1
EINT1
EXINT1
IE1
IRCON0.1
TCON.3
IT1
EX1
0013
H
IEN0.2
TCON.2
IP.2/
IPH.2
EXINT1
EA
EXICON0.2/3
IEN0.7
Bit-addressable
Request flag is cleared by hardware
Figure 14
Data Sheet
Interrupt Request Sources (Part 1)
45
V1.5, 2010-09
SAA-XC866
Functional Description
Timer 2
Overflow
Highest
TF2
T2_T2CON.7
T2EX
EXF2
ET2
EXEN2 T2_T2CON.6
EDGES
EL
T2MOD.5
002B
Lowest
Priority Level
H
IEN0.5
T2_T2CON.3
IP.5/
IPH.5
>=1
Normal Divider
Overflow
NDOV
FDCON.2
End of
Synch Byte
EOFSYN
Synch Byte
Error
ERRSYN
FDCON.6
SYNEN
FDCON.5
FDCON.6
>=1
FDCON.4
EINT2
EXINT2
IRCON0.2
EX2
0043
H
IP1.2/
IPH1.2
IEN1.2
EXINT2
S
e
q
u
e
n
c
e
EXICON0.4/5
EXINT3
EINT3
P
o
l
l
i
n
g
IRCON0.3
EXINT3
EXICON0.6/7
EXINT4
EINT4
IRCON0.4
EXM
EXINT4
>=1
EXICON1.0/1
004B
H
IEN1.3
IP1.3/
IPH1.3
EXINT5
EINT5
IRCON0.5
EXINT5
EXICON1.2/3
EA
IEN0.7
EXINT6
EINT6
Bit-addressable
IRCON0.6
EXINT6
Request flag is cleared by hardware
EXICON1.4/5
Bit-addressable
Request flag is cleared by hardware
Figure 15
Data Sheet
Interrupt Request Sources (Part 2)
46
V1.5, 2010-09
SAA-XC866
Functional Description
Highest
ADC Service
Request 0
ADCSRC0
IRCON1.3
ADC Service
Request 1
EADC
0033
H
IEN1.0
IRCON1.4
SSC Error
Lowest
Priority Level
>=1
ADCSRC1
IP1.0/
IPH1.0
EIR
IRCON1.0
SSC Transmit
TIR
>=1
IRCON1.1
SSC Receive
RIR
ESSC
003B
H
IEN1.1
IP1.1/
IPH1.1
IRCON1.2
CCU6 Node 0
CCU6SR0
IRCON3.0
ECCIP0
0053
H
IEN1.4
CCU6 Node 1
CCU6SR1
IRCON3.4
ECCIP1
005B
H
IEN1.5
CCU6 Node 2
IP1.5/
IPH1.5
S
e
q
u
e
n
c
e
CCU6SR2
IRCON4.0
ECCIP2
0063
H
IEN1.6
CCU6 Node 3
IP1.4/
IPH1.4
P
o
l
l
i
n
g
IP1.6/
IPH1.6
CCU6SR3
IRCON4.4
ECCIP3
006B
H
IEN1.7
IP1.7/
IPH1.7
EA
IEN0.7
Bit-addressable
Request flag is cleared by hardware
Figure 16
Data Sheet
Interrupt Request Sources (Part 3)
47
V1.5, 2010-09
SAA-XC866
Functional Description
ICC60R
CC60
ISL.0
ENCC60R
IENL.0
>=1
ICC60F
ISL.1
ENCC60F
IENL.1
INPL.1
INPL.0
INPL.3
INPL.2
INPL.5
INPL.4
INPH.3
INPH.2
INPH.5
INPH.4
INPH.1
INPH.0
INPL.7
INPL.6
ICC61R
CC61
ISL.2
ENCC61R
IENL.2
>=1
ICC61F
ISL.3
ENCC61F
IENL.3
ICC62R
CC62
ISL.4
ENCC62R
IENL.4
>=1
ICC62F
ISL.5
T12
One match
T12OM
T12
Period match
T12PM
ISL.6
ISL.7
T13
Compare match
T13CM
T13
Period match
T13PM
ISH.0
ISH.1
CTRAP
Correct Hall
Event
>=1
ENT12PM
IENL.7
ENT13CM
IENH.0
>=1
ENT13PM
IENH.1
ENTRPF
IENH.2
>=1
WHE
ISH.5
ENWHE
IENH.5
CHE
ISH.4
Multi-Channel
Shadow
Transfer
ENT12OM
IENL.6
TRPF
ISH.2
Wrong Hall
Event
ENCC62F
IENL.5
ENCHE
IENH.4
>=1
STR
ISH.7
ENSTR
IENH.7
CCU6 Interrupt node 0
CCU6 Interrupt node 1
CCU6 Interrupt node 2
CCU6 Interrupt node 3
Figure 17
Data Sheet
Interrupt Request Sources (Part 4)
48
V1.5, 2010-09
SAA-XC866
Functional Description
3.4.2
Interrupt Source and Vector
Each interrupt source has an associated interrupt vector address. This vector is
accessed to service the corresponding interrupt source request. The interrupt service of
each interrupt source can be individually enabled or disabled via an enable bit. The
assignment of the SAA-XC866 interrupt sources to the interrupt vector addresses and
the corresponding interrupt source enable bits are summarized in Table 16.
Table 16
Interrupt
Source
NMI
Interrupt Vector Addresses
Vector
Address
Assignment for SAAXC866
Enable Bit
SFR
0073H
Watchdog Timer NMI
NMIWDT
NMICON
PLL NMI
NMIPLL
Flash NMI
NMIFLASH
VDDC Prewarning NMI
NMIVDD
VDDP Prewarning NMI
NMIVDDP
Flash ECC NMI
NMIECC
XINTR0
0003H
External Interrupt 0
EX0
XINTR1
000BH
Timer 0
ET0
XINTR2
0013H
External Interrupt 1
EX1
XINTR3
001BH
Timer 1
ET1
XINTR4
0023H
UART
ES
XINTR5
002BH
T2
ET2
IEN0
Fractional Divider
(Normal Divider Overflow)
LIN
Data Sheet
49
V1.5, 2010-09
SAA-XC866
Functional Description
Table 16
Interrupt Vector Addresses (cont’d)
XINTR6
0033H
ADC
EADC
XINTR7
003BH
SSC
ESSC
XINTR8
0043H
External Interrupt 2
EX2
XINTR9
004BH
External Interrupt 3
EXM
IEN1
External Interrupt 4
External Interrupt 5
External Interrupt 6
XINTR10
0053H
CCU6 INP0
ECCIP0
XINTR11
005BH
CCU6 INP1
ECCIP1
XINTR12
0063H
CCU6 INP2
ECCIP2
XINTR13
006BH
CCU6 INP3
ECCIP3
Data Sheet
50
V1.5, 2010-09
SAA-XC866
Functional Description
3.4.3
Interrupt Priority
Each interrupt source, except for NMI, can be individually programmed to one of the four
possible priority levels. The NMI has the highest priority and supersedes all other
interrupts. Two pairs of interrupt priority registers (IP and IPH, IP1 and IPH1) are
available to program the priority level of each non-NMI interrupt vector.
A low-priority interrupt can be interrupted by a high-priority interrupt, but not by another
interrupt of the same or lower priority. Further, an interrupt of the highest priority cannot
be interrupted by any other interrupt source.
If two or more requests of different priority levels are received simultaneously, the
request of the highest priority is serviced first. If requests of the same priority are
received simultaneously, then an internal polling sequence determines which request is
serviced first. Thus, within each priority level, there is a second priority structure
determined by the polling sequence shown in Table 17.
Table 17
Priority Structure within Interrupt Level
Source
Level
Non-Maskable Interrupt (NMI)
(highest)
External Interrupt 0
1
Timer 0 Interrupt
2
External Interrupt 1
3
Timer 1 Interrupt
4
UART Interrupt
5
Timer 2,Fractional Divider, LIN Interrupts 6
ADC Interrupt
7
SSC Interrupt
8
External Interrupt 2
9
External Interrupt [6:3]
10
CCU6 Interrupt Node Pointer 0
11
CCU6 Interrupt Node Pointer 1
12
CCU6 Interrupt Node Pointer 2
13
CCU6 Interrupt Node Pointer 3
14
Data Sheet
51
V1.5, 2010-09
SAA-XC866
Functional Description
3.5
Parallel Ports
The SAA-XC866 has 27 port pins organized into four parallel ports, Port 0 (P0) to Port 3
(P3). Each pin has a pair of internal pull-up and pull-down devices that can be individually
enabled or disabled. Ports P0, P1 and P3 are bidirectional and can be used as general
purpose input/output (GPIO) or to perform alternate input/output functions for the on-chip
peripherals. When configured as an output, the open drain mode can be selected. Port
P2 is an input-only port, providing general purpose input functions, alternate input
functions for the on-chip peripherals, and also analog inputs for the Analog-to-Digital
Converter (ADC).
Bidirectional Port Features:
•
•
•
•
•
Configurable pin direction
Configurable pull-up/pull-down devices
Configurable open drain mode
Transfer of data through digital inputs and outputs (general purpose I/O)
Alternate input/output for on-chip peripherals
Input Port Features:
•
•
•
•
•
Configurable input driver
Configurable pull-up/pull-down devices
Receive of data through digital input (general purpose input)
Alternate input for on-chip peripherals
Analog input for ADC module
Data Sheet
52
V1.5, 2010-09
SAA-XC866
Functional Description
Internal Bus
Px_PUDSEL
Pull-up/Pull-down
Select Register
Px_PUDEN
Pull-up/Pull-down
Enable Register
Px_OD
Open Drain
Control Register
Px_DIR
Direction Register
Px_ALTSEL0
Alternate Select
Register 0
VDDP
Px_ALTSEL1
Alternate Select
Register 1
enable
AltDataOut 3
AltDataOut 2
AltDataOut1
enable
11
10
Pull
Up
Device
Output
Driver
Pin
01
00
Px_Data
Data Register
enable
Out
In
Input
Driver
Schmitt Trigger
AltDataIn
enable
Pull
Down
Device
Pad
Figure 18
Data Sheet
General Structure of Bidirectional Port
53
V1.5, 2010-09
SAA-XC866
Functional Description
Internal Bus
Px_PUDSEL
Pull-up/Pull-down
Select Register
Px_PUDEN
Pull-up/Pull-down
Enable Register
Px_DIR
Direction Register
VDDP
enable
enable
Px_DATA
Data Register
In
Input
Driver
Pull
Up
Device
Pin
Schmitt Trigger
AltDataIn
AnalogIn
enable
Pull
Down
Device
Pad
Figure 19
Data Sheet
General Structure of Input Port
54
V1.5, 2010-09
SAA-XC866
Functional Description
3.6
Power Supply System with Embedded Voltage Regulator
The SAA-XC866 microcontroller requires two different levels of power supply:
• 3.3 V or 5.0 V for the Embedded Voltage Regulator (EVR) and Ports
• 2.5 V for the core, memory, on-chip oscillator, and peripherals
Figure 20 shows the SAA-XC866 power supply system. A power supply of 3.3 V or
5.0 V must be provided from the external power supply pin. The 2.5 V power supply for
the logic is generated by the EVR. The EVR helps to reduce the power consumption of
the whole chip and the complexity of the application board design.
The EVR consists of a main voltage regulator and a low power voltage regulator. In
active mode, both voltage regulators are enabled. In power-down mode, the main
voltage regulator is switched off, while the low power voltage regulator continues to
function and provide power supply to the system with low power consumption.
CPU &
Memory
On-chip
OSC
Peripheral
logic
ADC
V D D C (2.5V)
FLASH
PLL
GPIO
Ports
(P0-P3)
XTAL1&
XTAL2
EVR
VD D P
VSSP
Figure 20
SAA-XC866 Power Supply System
EVR Features:
•
•
•
•
•
Input voltage (VDDP): 3.3 V/5.0 V
Output voltage (VDDC): 2.5 V ± 7.5%
Low power voltage regulator provided in power-down mode
VDDC and VDDP prewarning detection
VDDC brownout detection
Data Sheet
55
V1.5, 2010-09
SAA-XC866
Functional Description
3.7
Reset Control
The SAA-XC866 has five types of reset: power-on reset, hardware reset, watchdog timer
reset, power-down wake-up reset, and brownout reset.
When the SAA-XC866 is first powered up, the status of certain pins (see Table 19) must
be defined to ensure proper start operation of the device. At the end of a reset sequence,
the sampled values are latched to select the desired boot option, which cannot be
modified until the next power-on reset or hardware reset. This guarantees stable
conditions during the normal operation of the device.
In order to power up the system properly, the external reset pin RESET must be asserted
until VDDC reaches 0.9*VDDC. The delay of external reset can be realized by an external
capacitor at RESET pin. This capacitor value must be selected so that VRESET reaches
0.4 V, but not before VDDC reaches 0.9* VDDC.
A typical application example is shown in Figure 21. VDDP capacitor value is 300 nF.
VDDC capacitor value is 220 nF. The capacitor connected to RESET pin is 100 nF.
Typically, the time taken for VDDC to reach 0.9*VDDC is less than 50 μs once VDDP
reaches 2.3V. Hence, based on the condition that 10% to 90% VDDP (slew rate) is less
than 500 μs, the RESET pin should be held low for 500 μs typically. See Figure 22.
3.3/5V
e.g. 300nF
VSSP
typ.
100nF
VDDP
220nF
VDDC
VSSC
RESET
EVR
30k
XC866
Figure 21
Data Sheet
Reset Circuitry
56
V1.5, 2010-09
SAA-XC866
Functional Description
Voltage
5V
VDDP
2.5V
2.3V
0.9*VDDC
VDDC
Time
Voltage
RESET with
capacitor
5V
< 0.4V
0V
Time
typ. < 50 us
Figure 22
VDDP, VDDC and VRESET during Power-on Reset
The second type of reset in SAA-XC866 is the hardware reset. This reset function can
be used during normal operation or when the chip is in power-down mode. A reset input
pin RESET is provided for the hardware reset. To ensure the recognition of the hardware
reset, pin RESET must be held low for at least 100 ns.
The Watchdog Timer (WDT) module is also capable of resetting the device if it detects
a malfunction in the system.
Another type of reset that needs to be detected is a reset while the device is in
power-down mode (wake-up reset). While the contents of the static RAM are undefined
after a power-on reset, they are well defined after a wake-up reset from power-down
mode.
Data Sheet
57
V1.5, 2010-09
SAA-XC866
Functional Description
3.7.1
Module Reset Behavior
Table 18 shows how the functions of the SAA-XC866 are affected by the various reset
types. A “ ” means that this function is reset to its default state.
Table 18
Effect of Reset on Device Functions
Module/
Function
Wake-Up
Reset
Watchdog
Reset
Hardware
Reset
Power-On
Reset
Brownout
Reset
CPU Core
Peripherals
On-Chip
Static RAM
Not affected, Not affected, Not affected, Affected, un- Affected, unreliable
reliable
reliable
reliable
reliable
Oscillator,
PLL
Not affected
Port Pins
EVR
The voltage Not affected
regulator is
switched on
FLASH
NMI
Disabled
3.7.2
Disabled
Booting Scheme
When the SAA-XC866 is reset, it must identify the type of configuration with which to
start the different modes once the reset sequence is complete. Thus, boot configuration
information that is required for activation of special modes and conditions needs to be
applied by the external world through input pins. After power-on reset or hardware reset,
the pins MBC, TMS and P0.0 collectively select the different boot options. Table 19
shows the available boot options in the SAA-XC866.
Table 19
MBC
SAA-XC866 Boot Selection
TMS
P0.0
Type of Mode
PC Start Value
1
0
x
User Mode; on-chip OSC/PLL non-bypassed
0000H
0
0
x
BSL Mode; on-chip OSC/PLL non-bypassed
0000H
0
1
0
OCDS Mode1); on-chip OSC/PLL nonbypassed
0000H
1
1
0
Standalone User (JTAG) Mode2); on-chip
OSC/PLL non-bypassed (normal)
0000H
1)
2)
The OCDS mode is not accessible if Flash is protected.
Normal user mode with standard JTAG (TCK,TDI,TDO) pins for hot-attach purpose.
Data Sheet
58
V1.5, 2010-09
SAA-XC866
Functional Description
3.8
Clock Generation Unit
The Clock Generation Unit (CGU) allows great flexibility in the clock generation for the
SAA-XC866. The power consumption is indirectly proportional to the frequency,
whereas the performance of the microcontroller is directly proportional to the frequency.
During user program execution, the frequency can be programmed for an optimal ratio
between performance and power consumption. Therefore the power consumption can
be adapted to the actual application state.
Features:
•
•
•
•
•
Phase-Locked Loop (PLL) for multiplying clock source by different factors
PLL Base Mode
Prescaler Mode
PLL Mode
Power-down mode support
The CGU consists of an oscillator circuit and a PLL.In the SAA-XC866, the oscillator can
be from either of these two sources: the on-chip oscillator (10 MHz) or the external
oscillator (4 MHz to 12 MHz). The term “oscillator” is used to refer to both on-chip
oscillator and external oscillator, unless otherwise stated. After the reset, the on-chip
oscillator will be used by default.The external oscillator can be selected via software. In
addition, the PLL provides a fail-safe logic to perform oscillator run and loss-of-lock
detection. This allows emergency routines to be executed for system recovery or to
perform system shut down.
OSC
fosc
P:1
fp
fn
osc fail
detect
OSCR
lock
detect
LOCK
PLL
core
fvco
1
0
K:1
fsys
N:1
OSCDISC
Figure 23
Data Sheet
NDIV
VCOBYP
CGU Block Diagram
59
V1.5, 2010-09
SAA-XC866
Functional Description
The clock system provides three ways to generate the system clock:
PLL Base Mode
The system clock is derived from the VCO base (free running) frequency clock divided
by the K factor.
1
f SYS = f VCObase × ---K
Prescaler Mode (VCO Bypass Operation)
In VCO bypass operation, the system clock is derived from the oscillator clock, divided
by the P and K factors.
1
f SYS = f OSC × ------------P×K
PLL Mode
The system clock is derived from the oscillator clock, multiplied by the N factor, and
divided by the P and K factors. Both VCO bypass and PLL bypass must be inactive for
this PLL mode. The PLL mode is used during normal system operation.
N
f SYS = f OSC × ------------P×K
Table 20 shows the settings of bits OSCDISC and VCOBYP for different clock mode
selection.
Table 20
Clock Mode Selection
OSCDISC
VCOBYP
Clock Working Modes
0
0
PLL Mode
0
1
Prescaler Mode
1
0
PLL Base Mode
1
1
PLL Base Mode
Note: When oscillator clock is disconnected from PLL, the clock mode is PLL Base mode
regardless of the setting of VCOBYP bit.
System Frequency Selection
For the SAA-XC866, the values of P and K are fixed to “1” and “2”, respectively. In order
to obtain the required system frequency, fsys, the value of N can be selected by bit NDIV
for different oscillator inputs. Table 21 provides examples on how fsys = 80 MHz can be
obtained for the different oscillator sources.
Data Sheet
60
V1.5, 2010-09
SAA-XC866
Functional Description
Table 21
System frequency (fsys = 80 MHz)
Oscillator
fosc
N
P
K
fsys
On-chip
10 MHz
16
1
2
80 MHz
External
10 MHz
16
1
2
80 MHz
8 MHz
20
1
2
80 MHz
5 MHz
32
1
2
80 MHz
Table 22 shows the VCO range for the SAA-XC866.
Table 22
VCO Range
fVCOmin
fVCOmax
fVCOFREEmin
fVCOFREEmax
Unit
150
200
20
80
MHz
100
150
10
80
MHz
3.8.1
Recommended External Oscillator Circuits
The oscillator circuit, a Pierce oscillator, is designed to work with both, an external crystal
oscillator or an external stable clock source. It basically consists of an inverting amplifier
and a feedback element with XTAL1 as input, and XTAL2 as output.
When using a crystal, a proper external oscillator circuitry must be connected to both
pins, XTAL1 and XTAL2. The crystal frequency can be within the range of 4 MHz
to 12 MHz. Additionally, it is necessary to have two load capacitances CX1 and CX2, and
depending on the crystal type, a series resistor RX2, to limit the current. A test resistor
RQ may be temporarily inserted to measure the oscillation allowance (negative
resistance) of the oscillator circuitry. RQ values are typically specified by the crystal
vendor. The CX1 and CX2 values shown in Figure 24 can be used as starting points for
the negative resistance evaluation and for non-productive systems. The exact values
and related operating range are dependent on the crystal frequency and have to be
determined and optimized together with the crystal vendor using the negative resistance
method. Oscillation measurement with the final target system is strongly recommended
to verify the input amplitude at XTAL1 and to determine the actual oscillation allowance
(margin negative resistance) for the oscillator-crystal system.
When using an external clock signal, the signal must be connected to XTAL1. XTAL2 is
left open (unconnected).
The oscillator can also be used in combination with a ceramic resonator. The final
circuitry must also be verified by the resonator vendor.
Figure 24 shows the recommended external oscillator circuitries for both operating
modes, external crystal mode and external input clock mode.
Data Sheet
61
V1.5, 2010-09
SAA-XC866
Functional Description
fO SC
XTAL1
4 - 12
MHz
RQ
Ex ternal Cloc k
Signal
XC866
Oscillator
XC866
Oscillator
RX2
XTAL2
CX1
VSS
VSS
Cry s tal Frequenc y C X1 , C X2
12 MHz
XTAL2
CX2
Fundamental
Mode Cry s tal
4 MHz
8 MHz
10 MHz
33
18
15
12
1)
pF
pF
pF
pF
RX2
1)
0
0
0
0
Clock_EXOSC
1) Note that these are evaluation start values!
Figure 24
fO SC
XTAL1
External Oscillator Circuitries
Note: For crystal operation, it is strongly recommended to measure the negative
resistance in the final target system (layout) to determine the optimum parameters
for the oscillator operation. Please refer to the minimum and maximum values of
the negative resistance specified by the crystal supplier.
Data Sheet
62
V1.5, 2010-09
SAA-XC866
Functional Description
3.8.2
Clock Management
The CGU generates all clock signals required within the microcontroller from a single
clock, fsys. During normal system operation, the typical frequencies of the different
modules are as follow:
•
•
•
•
CPU clock: CCLK, SCLK = 26.7 MHz
CCU6 clock: FCLK = 26.7 MHz
Other peripherals: PCLK = 26.7 MHz
Flash Interface clock: CCLK3 = 80 MHz and CCLK = 26.7 MHz
In addition, different clock frequency can output to pin CLKOUT(P0.0). The clock output
frequency can further be divided by 2 using toggle latch (bit TLEN is set to 1), the
resulting output frequency has 50% duty cycle. Figure 25 shows the clock distribution of
the SAA-XC866.
CLKREL
FCLK
OSC
fosc
PLL
CCU6
PCLK
fsys
/3
Peripherals
SCLK
CCLK
N,P,K
CCLK3
CORE
FLASH
Interface
COREL
COUTS
TLEN
Toggle
Latch
CLKOUT
Figure 25
Data Sheet
Clock Generation from fsys
63
V1.5, 2010-09
SAA-XC866
Functional Description
For power saving purposes, the clocks may be disabled or slowed down according to
Table 23.
Table 23
System frequency (fsys = 80 MHz)
Power Saving Mode
Action
Idle
Clock to the CPU is disabled.
Slow-down
Clocks to the CPU and all the peripherals, including CCU6, are
divided by a common programmable factor defined by bit field
CMCON.CLKREL.
Power-down
Oscillator and PLL are switched off.
Data Sheet
64
V1.5, 2010-09
SAA-XC866
Functional Description
3.9
Power Saving Modes
The power saving modes of the SAA-XC866 provide flexible power consumption through
a combination of techniques, including:
•
•
•
•
Stopping the CPU clock
Stopping the clocks of individual system components
Reducing clock speed of some peripheral components
Power-down of the entire system with fast restart capability
After a reset, the active mode (normal operating mode) is selected by default (see
Figure 26) and the system runs in the main system clock frequency. From active mode,
different power saving modes can be selected by software. They are:
• Idle mode
• Slow-down mode
• Power-down mode
ACTIVE
any interrupt
& SD=0
set PD
bit
set IDLE
bit
set SD
bit
IDLE
clear SD
bit
set IDLE
bit
any interrupt
& SD=1
Figure 26
Data Sheet
EXINT0/RXD pin
& SD=0
POWER-DOWN
set PD
bit
SLOW-DOWN
EXINT0/RXD pin
& SD=1
Transition between Power Saving Modes
65
V1.5, 2010-09
SAA-XC866
Functional Description
3.10
Watchdog Timer
The Watchdog Timer (WDT) provides a highly reliable and secure way to detect and
recover from software or hardware failures. The WDT is reset at a regular interval that is
predefined by the user. The CPU must service the WDT within this interval to prevent the
WDT from causing an SAA-XC866 system reset. Hence, routine service of the WDT
confirms that the system is functioning properly. This ensures that an accidental
malfunction of the SAA-XC866 will be aborted in a user-specified time period. In debug
mode, the WDT is suspended and stops counting. Therefore, there is no need to refresh
the WDT during debugging.
Features:
•
•
•
•
•
16-bit Watchdog Timer
Programmable reload value for upper 8 bits of timer
Programmable window boundary
Selectable input frequency of fPCLK/2 or fPCLK/128
Time-out detection with NMI generation and reset prewarning activation (after which
a system reset will be performed)
The WDT is a 16-bit timer incremented by a count rate of fPCLK/2 or fPCLK/128. This
16-bit timer is realized as two concatenated 8-bit timers. The upper 8 bits of the WDT
can be preset to a user-programmable value via a watchdog service access in order to
modify the watchdog expire time period. The lower 8 bits are reset on each service
access. Figure 27 shows the block diagram of the WDT unit.
WDT
Control
Clear
1:2
MUX
f PCLK
WDTREL
WDT Low Byte
WDT High Byte
1:128
Overflow/Time-out Control &
Window-boundary control
WDTTO
WDTRST
WDTIN
ENWDT
Logic
ENWDT_P
Figure 27
Data Sheet
WDTWINB
WDT Block Diagram
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Functional Description
If the WDT is not serviced before the timer overflow, a system malfunction is assumed.
As a result, the WDT NMI is triggered (assert WDTTO) and the reset prewarning is
entered. The prewarning period lasts for 30H count, after which the system is reset
(assert WDTRST).
The WDT has a “programmable window boundary” which disallows any refresh during
the WDT’s count-up. A refresh during this window boundary constitutes an invalid
access to the WDT, causing the reset prewarning to be entered but without triggering the
WDT NMI. The system will still be reset after the prewarning period is over. The window
boundary is from 0000H to the value obtained from the concatenation of WDTWINB and
00H.
After being serviced, the WDT continues counting up from the value (<WDTREL> * 28).
The time period for an overflow of the WDT is programmable in two ways:
• the input frequency to the WDT can be selected to be either fPCLK/2 or fPCLK/128
• the reload value WDTREL for the high byte of WDT can be programmed in register
WDTREL
The period, PWDT, between servicing the WDT and the next overflow can be determined
by the following formula:
( 1 + WDTIN × 6 ) × ( 2 16 – WDTREL × 2 8 )
P WDT = 2----------------------------------------------------------------------------------------------------f PCLK
If the Window-Boundary Refresh feature of the WDT is enabled, the period PWDT
between servicing the WDT and the next overflow is shortened if WDTWINB is greater
than WDTREL, see Figure 28. This period can be calculated using the same formula by
replacing WDTREL with WDTWINB. For this feature to be useful, WDTWINB should not
be smaller than WDTREL.
Count
FFFF H
WDTWINB
WDTREL
time
No refresh
allowed
Figure 28
Data Sheet
Refresh allowed
WDT Timing Diagram
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Functional Description
Table 24 lists the possible watchdog time range that can be achieved for different
module clock frequencies. Some numbers are rounded to 3 significant digits.
Table 24
Reload value
in WDTREL
Watchdog Time Ranges
Prescaler for fPCLK
2 (WDTIN = 0)
128 (WDTIN = 1)
26.7 MHz
26.7 MHz
FFH
19.2 μs
1.23 ms
7FH
2.48 ms
159 ms
00H
4.92 ms
315 ms
Data Sheet
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V1.5, 2010-09
SAA-XC866
Functional Description
3.11
Universal Asynchronous Receiver/Transmitter
The Universal Asynchronous Receiver/Transmitter (UART) provides a full-duplex
asynchronous receiver/transmitter, i.e., it can transmit and receive simultaneously. It is
also receive-buffered, i.e., it can commence reception of a second byte before a
previously received byte has been read from the receive register. However, if the first
byte still has not been read by the time reception of the second byte is complete, one of
the bytes will be lost.
Features:
• Full-duplex asynchronous modes
– 8-bit or 9-bit data frames, LSB first
– fixed or variable baud rate
• Receive buffered
• Multiprocessor communication
• Interrupt generation on the completion of a data transmission or reception
The UART can operate in four asynchronous modes as shown in Table 25. Data is
transmitted on TXD and received on RXD.
Table 25
UART Modes
Operating Mode
Mode 0: 8-bit shift register
Baud Rate
fPCLK/2
Mode 1: 8-bit shift UART
Variable
Mode 2: 9-bit shift UART
fPCLK/32 or fPCLK/64
Mode 3: 9-bit shift UART
Variable
There are several ways to generate the baud rate clock for the serial port, depending on
the mode in which it is operating. In mode 0, the baud rate for the transfer is fixed at
fPCLK/2. In mode 2, the baud rate is generated internally based on the UART input clock
and can be configured to either fPCLK/32 or fPCLK/64. The variable baud rate is set by
either the underflow rate on the dedicated baud-rate generator, or by the overflow rate
on Timer 1.
Data Sheet
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V1.5, 2010-09
SAA-XC866
Functional Description
3.11.1
Baud-Rate Generator
The baud-rate generator is based on a programmable 8-bit reload value, and includes
divider stages (i.e., prescaler and fractional divider) for generating a wide range of baud
rates based on its input clock fPCLK, see Figure 29.
Fractional Divider
8-Bit Reload Value
FDSTEP
1
FDM
1
FDEN&FDM
0
Adder
fDIV
00
01
FDRES
FDEN
0
1
0
11
fMOD (overflow)
10
8-Bit Baud Rate Timer
fBR
R
fPCLK
Prescaler
fDIV
clk
11
10
NDOV
01
‘0’
Figure 29
00
Baud-rate Generator Circuitry
The baud rate timer is a count-down timer and is clocked by either the output of the
fractional divider (fMOD) if the fractional divider is enabled (FDCON.FDEN = 1), or the
output of the prescaler (fDIV) if the fractional divider is disabled (FDEN = 0). For baud rate
generation, the fractional divider must be configured to fractional divider mode
(FDCON.FDM = 0). This allows the baud rate control run bit BCON.R to be used to start
or stop the baud rate timer. At each timer underflow, the timer is reloaded with the 8-bit
reload value in register BG and one clock pulse is generated for the serial channel.
Enabling the fractional divider in normal divider mode (FDEN = 1 and FDM = 1) stops the
baud rate timer and nullifies the effect of bit BCON.R. See Section 3.12.
The baud rate (fBR) value is dependent on the following parameters:
• Input clock fPCLK
• Prescaling factor (2BRPRE) defined by bit field BRPRE in register BCON
• Fractional divider (STEP/256) defined by register FDSTEP
(to be considered only if fractional divider is enabled and operating in fractional divider
mode)
Data Sheet
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V1.5, 2010-09
SAA-XC866
Functional Description
• 8-bit reload value (BR_VALUE) for the baud rate timer defined by register BG
The following formulas calculate the final baud rate without and with the fractional divider
respectively:
f PCLK
BRPRE
- where 2
baud rate = ---------------------------------------------------------------------------------× ( BR_VALUE + 1 ) > 1
BRPRE
16 × 2
× ( BR_VALUE + 1 )
f PCLK
- × STEP
--------------baud rate = ---------------------------------------------------------------------------------BRPRE
256
16 × 2
× ( BR_VALUE + 1 )
The maximum baud rate that can be generated is limited to fPCLK/32. Hence, for a module
clock of 26.7 MHz, the maximum achievable baud rate is 0.83 MBaud.
Standard LIN protocol can support a maximum baud rate of 20kHz, the baud rate
accuracy is not critical and the fractional divider can be disabled. Only the prescaler is
used for auto baud rate calculation. For LIN fast mode, which supports the baud rate of
20kHz to 115.2kHz, the higher baud rates require the use of the fractional divider for
greater accuracy.
Table 26 lists the various commonly used baud rates with their corresponding parameter
settings and deviation errors. The fractional divider is disabled and a module clock of
26.7 MHz is used.
Table 26
Typical Baud rates for UART with Fractional Divider disabled
Baud rate
Prescaling Factor
(2BRPRE)
Reload Value
(BR_VALUE + 1)
Deviation Error
19.2 kBaud
1 (BRPRE=000B)
87 (57H)
-0.22 %
9600 Baud
1 (BRPRE=000B)
174 (AEH)
-0.22 %
4800 Baud
2 (BRPRE=001B)
174 (AEH)
-0.22 %
2400 Baud
4 (BRPRE=010B)
174 (AEH)
-0.22 %
The fractional divider allows baud rates of higher accuracy (lower deviation error) to be
generated. Table 27 lists the resulting deviation errors from generating a baud rate of
115.2 kHz, using different module clock frequencies. The fractional divider is enabled
(fractional divider mode) and the corresponding parameter settings are shown.
Data Sheet
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V1.5, 2010-09
SAA-XC866
Functional Description
Table 27
fPCLK
Deviation Error for UART with Fractional Divider enabled
STEP
Prescaling Factor Reload Value
(BR_VALUE + 1)
(2BRPRE)
Deviation
Error
26.67 MHz
1
10 (AH)
177 (B1H)
+0.03 %
13.33 MHz
1
7 (7H)
248 (F8H)
+0.11 %
6.67 MHz
1
3 (3H)
212 (D4H)
-0.16 %
Data Sheet
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V1.5, 2010-09
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Functional Description
3.11.2
Baud Rate Generation using Timer 1
In UART modes 1 and 3, Timer 1 can be used for generating the variable baud rates. In
theory, this timer could be used in any of its modes. But in practice, it should be set into
auto-reload mode (Timer 1 mode 2), with its high byte set to the appropriate value for the
required baud rate. The baud rate is determined by the Timer 1 overflow rate and the
value of SMOD as follows:
[3.1]
SMOD
2
× f PCLK
Mode 1, 3 baud rate = ---------------------------------------------------32 × 2 × ( 256 – TH1 )
3.12
Normal Divider Mode (8-bit Auto-reload Timer)
Setting bit FDM in register FDCON to 1 configures the fractional divider to normal divider
mode, while at the same time disables baud rate generation (see Figure 29). Once the
fractional divider is enabled (FDEN = 1), it functions as an 8-bit auto-reload timer (with
no relation to baud rate generation) and counts up from the reload value with each input
clock pulse. Bit field RESULT in register FDRES represents the timer value, while bit
field STEP in register FDSTEP defines the reload value. At each timer overflow, an
overflow flag (FDCON.NDOV) will be set and an interrupt request generated. This gives
an output clock fMOD that is 1/n of the input clock fDIV, where n is defined by 256 - STEP.
The output frequency in normal divider mode is derived as follows:
[3.2]
1
f MOD = f DIV × -----------------------------256 – STEP
Data Sheet
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V1.5, 2010-09
SAA-XC866
Functional Description
3.13
LIN Protocol
The UART can be used to support the Local Interconnect Network (LIN) protocol for both
master and slave operations. The LIN baud rate detection feature provides the capability
to detect the baud rate within LIN protocol using Timer 2. This allows the UART to be
synchronized to the LIN baud rate for data transmission and reception.
LIN is a holistic communication concept for local interconnected networks in vehicles.
The communication is based on the SCI (UART) data format, a single-master/multipleslave concept, a clock synchronization for nodes without stabilized time base. An
attractive feature of LIN is self-synchronization of the slave nodes without a crystal or
ceramic resonator, which significantly reduces the cost of hardware platform. Hence, the
baud rate must be calculated and returned with every message frame.
The structure of a LIN frame is shown in Figure 30. The frame consists of the:
•
•
•
•
header, which comprises a Break (13-bit time low), Synch Byte (55H), and ID field
response time
data bytes (according to UART protocol)
checksum
Frame slot
Frame
Header
Synch
Figure 30
3.13.1
Response
space
Protected
identifier
Interframe
space
Response
Data 1
Data 2
Data N
Checksum
Structure of LIN Frame
LIN Header Transmission
LIN header transmission is only applicable in master mode. In the LIN communication,
a master task decides when and which frame is to be transferred on the bus. It also
identifies a slave task to provide the data transported by each frame. The information
needed for the handshaking between the master and slave tasks is provided by the
master task through the header portion of the frame.
The header consists of a break and synch pattern followed by an identifier. Among these
three fields, only the break pattern cannot be transmitted as a normal 8-bit UART data.
Data Sheet
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V1.5, 2010-09
SAA-XC866
Functional Description
The break must contain a dominant value of 13 bits or more to ensure proper
synchronization of slave nodes.
In the LIN communication, a slave task is required to be synchronized at the beginning
of the protected identifier field of frame. For this purpose, every frame starts with a
sequence consisting of a break field followed by a synch byte field. This sequence is
unique and provides enough information for any slave task to detect the beginning of a
new frame and be synchronized at the start of the identifier field.
Upon entering LIN communication, a connection is established and the transfer speed
(baud rate) of the serial communication partner (host) is automatically synchronized in
the following steps:
STEP 1: Initialize interface for reception and timer for baud rate measurement
STEP 2: Wait for an incoming LIN frame from host
STEP 3: Synchronize the baud rate to the host
STEP 4: Enter for Master Request Frame or for Slave Response Frame
Note: Re-synchronization and setup of baud rate are always done for every Master
Request Header or Slave Response Header LIN frame.
Data Sheet
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V1.5, 2010-09
SAA-XC866
Functional Description
3.14
High-Speed Synchronous Serial Interface
The High-Speed Synchronous Serial Interface (SSC) supports full-duplex and
half-duplex synchronous communication. The serial clock signal can be generated by
the SSC internally (master mode), using its own 16-bit baud-rate generator, or can be
received from an external master (slave mode). Data width, shift direction, clock polarity
and phase are programmable. This allows communication with SPI-compatible devices
or devices using other synchronous serial interfaces.
Features:
• Master and slave mode operation
– Full-duplex or half-duplex operation
• Transmit and receive buffered
• Flexible data format
– Programmable number of data bits: 2 to 8 bits
– Programmable shift direction: LSB or MSB shift first
– Programmable clock polarity: idle low or high state for the shift clock
– Programmable clock/data phase: data shift with leading or trailing edge of the shift
clock
• Variable baud rate
• Compatible with Serial Peripheral Interface (SPI)
• Interrupt generation
– On a transmitter empty condition
– On a receiver full condition
– On an error condition (receive, phase, baud rate, transmit error)
Data Sheet
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V1.5, 2010-09
SAA-XC866
Functional Description
Data is transmitted or received on lines TXD and RXD, which are normally connected to
the pins MTSR (Master Transmit/Slave Receive) and MRST (Master Receive/Slave
Transmit). The clock signal is output via line MS_CLK (Master Serial Shift Clock) or input
via line SS_CLK (Slave Serial Shift Clock). Both lines are normally connected to the pin
SCLK. Transmission and reception of data are double-buffered.
Figure 31 shows the block diagram of the SSC.
PCLK
Baud-rate
Generator
SS_CLK
Clock
Control
MS_CLK
Shift
Clock
RIR
SSC Control Block
Register CON
Status
Receive Int. Request
TIR
Transmit Int. Request
EIR
Error Int. Request
Control
TXD(Master)
RXD(Slave)
Pin
Control
16-Bit Shift
Register
TXD(Slave)
RXD(Master)
Transmit Buffer
Register TB
Receive Buffer
Register RB
Internal Bus
Figure 31
Data Sheet
SSC Block Diagram
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Functional Description
3.15
Timer 0 and Timer 1
Timers 0 and 1 are count-up timers which are incremented every machine cycle, or in
terms of the input clock, every 2 PCLK cycles. They are fully compatible and can be
configured in four different operating modes for use in a variety of applications, see
Table 28. In modes 0, 1 and 2, the two timers operate independently, but in mode 3, their
functions are specialized.
Table 28
Timer 0 and Timer 1 Modes
Mode
Operation
0
13-bit timer
The timer is essentially an 8-bit counter with a divide-by-32 prescaler.
This mode is included solely for compatibility with Intel 8048 devices.
1
16-bit timer
The timer registers, TLx and THx, are concatenated to form a 16-bit
counter.
2
8-bit timer with auto-reload
The timer register TLx is reloaded with a user-defined 8-bit value in THx
upon overflow.
3
Timer 0 operates as two 8-bit timers
The timer registers, TL0 and TH0, operate as two separate 8-bit counters.
Timer 1 is halted and retains its count even if enabled.
Data Sheet
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V1.5, 2010-09
SAA-XC866
Functional Description
3.16
Timer 2
Timer 2 is a 16-bit general purpose timer (THL2) that has two modes of operation, a
16-bit auto-reload mode and a 16-bit one channel capture mode. If the prescalar is
disabled, Timer 2 counts with an input clock of PCLK/12. Timer 2 continues counting as
long as it is enabled.
Table 29
Timer 2 Modes
Mode
Description
Auto-reload Up/Down Count Disabled
• Count up only
• Start counting from 16-bit reload value, overflow at FFFFH
• Reload event configurable for trigger by overflow condition only, or by
negative/positive edge at input pin T2EX as well
• Programmble reload value in register RC2
• Interrupt is generated with reload event
Up/Down Count Enabled
• Count up or down, direction determined by level at input pin T2EX
• No interrupt is generated
• Count up
– Start counting from 16-bit reload value, overflow at FFFFH
– Reload event triggered by overflow condition
– Programmble reload value in register RC2
• Count down
– Start counting from FFFFH, underflow at value defined in register
RC2
– Reload event triggered by underflow condition
– Reload value fixed at FFFFH
Channel
capture
Data Sheet
•
•
•
•
•
•
•
Count up only
Start counting from 0000H, overflow at FFFFH
Reload event triggered by overflow condition
Reload value fixed at 0000H
Capture event triggered by falling/rising edge at pin T2EX
Captured timer value stored in register RC2
Interrupt is generated with reload or capture event
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Functional Description
3.17
Capture/Compare Unit 6
The Capture/Compare Unit 6 (CCU6) provides two independent timers (T12, T13), which
can be used for Pulse Width Modulation (PWM) generation, especially for AC-motor
control. The CCU6 also supports special control modes for block commutation and
multi-phase machines.
The timer T12 can function in capture and/or compare mode for its three channels. The
timer T13 can work in compare mode only.
The multi-channel control unit generates output patterns, which can be modulated by
T12 and/or T13. The modulation sources can be selected and combined for the signal
modulation.
Timer T12 Features:
• Three capture/compare channels, each channel can be used either as a capture or as
a compare channel
• Supports generation of a three-phase PWM (six outputs, individual signals for
highside and lowside switches)
• 16-bit resolution, maximum count frequency = peripheral clock frequency
• Dead-time control for each channel to avoid short-circuits in the power stage
• Concurrent update of the required T12/13 registers
• Generation of center-aligned and edge-aligned PWM
• Supports single-shot mode
• Supports many interrupt request sources
• Hysteresis-like control mode
Timer T13 Features:
•
•
•
•
•
One independent compare channel with one output
16-bit resolution, maximum count frequency = peripheral clock frequency
Can be synchronized to T12
Interrupt generation at period-match and compare-match
Supports single-shot mode
Additional Features:
•
•
•
•
•
•
•
Implements block commutation for Brushless DC-drives
Position detection via Hall-sensor pattern
Automatic rotational speed measurement for block commutation
Integrated error handling
Fast emergency stop without CPU load via external signal (CTRAP)
Control modes for multi-channel AC-drives
Output levels can be selected and adapted to the power stage
Data Sheet
80
V1.5, 2010-09
SAA-XC866
Functional Description
The block diagram of the CCU6 module is shown in Figure 32.
module kernel
channel 1
1
channel 2
1
deadtime
control
compare
channel 3
compare
capture
T13
compare
start
multichannel
control
trap
control
trap input
clock
control
1
output select
T12
channel 0
Hall input
address
decoder
output select
compare
compare
interrupt
control
1
2
3
2
2
3
1
CTRAP
CCPOS2
CCPOS1
CCPOS0
CC62
COUT62
CC61
COUT61
CC60
COUT60
COUT63
T13HR
T12HR
input / output control
port control
CCU6_block_diagram
Figure 32
Data Sheet
CCU6 Block Diagram
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V1.5, 2010-09
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Functional Description
3.18
Analog-to-Digital Converter
The SAA-XC866 includes a high-performance 10-bit Analog-to-Digital Converter (ADC)
with eight multiplexed analog input channels. The ADC uses a successive approximation
technique to convert the analog voltage levels from up to eight different sources. The
analog input channels of the ADC are available at Port 2.
Features:
• Successive approximation
• 8-bit or 10-bit resolution
(TUE of ± 1 LSB and ± 2 LSB, respectively)
• Eight analog channels
• Four independent result registers
• Result data protection for slow CPU access
(wait-for-read mode)
• Single conversion mode
• Autoscan functionality
• Limit checking for conversion results
• Data reduction filter
(accumulation of up to 2 conversion results)
• Two independent conversion request sources with programmable priority
• Selectable conversion request trigger
• Flexible interrupt generation with configurable service nodes
• Programmable sample time
• Programmable clock divider
• Cancel/restart feature for running conversions
• Integrated sample and hold circuitry
• Compensation of offset errors
• Low power modes
Data Sheet
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SAA-XC866
Functional Description
3.18.1
ADC Clocking Scheme
A common module clock fADC generates the various clock signals used by the analog
and digital parts of the ADC module:
• fADCA is input clock for the analog part.
• fADCI is internal clock for the analog part (defines the time base for conversion length
and the sample time). This clock is generated internally in the analog part, based on
the input clock fADCA to generate a correct duty cycle for the analog components.
• fADCD is input clock for the digital part.
The internal clock for the analog part fADCI is limited to a maximum frequency of 10 MHz.
Therefore, the ADC clock prescaler must be programmed to a value that ensures fADCI
does not exceed 10 MHz. The prescaler ratio is selected by bit field CTC in register
GLOBCTR. A prescaling ratio of 32 can be selected when the maximum performance of
the ADC is not required.
fADCD
fADC = fPCLK
arbiter
registers
interrupts
digital part
fADCA
CTC
÷ 32
f ADCI
÷4
MUX
÷3
÷2
clock prescaler
analog
components
analog part
Condition: f ADCI ≤ 10 MHz, where t ADCI =
Figure 33
Data Sheet
1
fADCI
ADC Clocking Scheme
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Functional Description
For module clock fADC = 26.7 MHz, the analog clock fADCI frequency can be selected as
shown in Table 30.
Table 30
fADCI Frequency Selection
Module Clock fADC
CTC
Prescaling Ratio
Analog Clock fADCI
26.7 MHz
00B
÷2
13.3 MHz (N.A)
01B
÷3
8.9 MHz
10B
÷4
6.7 MHz
11B (default)
÷ 32
833.3 kHz
As fADCI cannot exceed 10 MHz, bit field CTC should not be set to 00B when fADC is
26.7 MHz. During slow-down mode where fADC may be reduced to 13.3 MHz, 6.7 MHz
etc., CTC can be set to 00B as long as the divided analog clock fADCI does not exceed
10 MHz. However, it is important to note that the conversion error could increase due to
loss of charges on the capacitors, if fADC becomes too low during slow-down mode.
3.18.2
ADC Conversion Sequence
The analog-to-digital conversion procedure consists of the following phases:
•
•
•
•
Synchronization phase (tSYN)
Sample phase (tS)
Conversion phase
Write result phase (tWR)
conversion start
trigger
Source
interrupt
Sample Phase
Channel
interrupt
Result
interrupt
Conversion Phase
fADCI
BUSY Bit
SAMPLE Bit
tSYN
tS
Write Result Phase
tCONV
Figure 34
Data Sheet
tWR
ADC Conversion Timing
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Functional Description
3.19
On-Chip Debug Support
The On-Chip Debug Support (OCDS) provides the basic functionality required for the
software development and debugging of XC800-based systems.
The OCDS design is based on these principles:
•
•
•
•
use the built-in debug functionality of the XC800 Core
add a minimum of hardware overhead
provide support for most of the operations by a Monitor Program
use standard interfaces to communicate with the Host (a Debugger)
Features:
•
•
•
•
•
Set breakpoints on instruction address and within a specified address range
Set breakpoints on internal RAM address
Support unlimited software breakpoints in Flash/RAM code region
Process external breaks
Step through the program code
The OCDS functional blocks are shown in Figure 35. The Monitor Mode Control (MMC)
block at the center of OCDS system brings together control signals and supports the
overall functionality. The MMC communicates with the XC800 Core, primarily via the
Debug Interface, and also receives reset and clock signals. After processing memory
address and control signals from the core, the MMC provides proper access to the
dedicated extra-memories: a Monitor ROM (holding the code) and a Monitor RAM (for
work-data and Monitor-stack). The OCDS system is accessed through the JTAG1),
which is an interface dedicated exclusively for testing and debugging activities and is not
normally used in an application. The dedicated MBC pin is used for external
configuration and debugging control.
Note: All the debug functionality described here can normally be used only after SAAXC866 has been started in OCDS mode.
1)
The pins of the JTAG port can be assigned to either Port 0 (primary) or Ports 1 and 2 (secondary).
User must set the JTAG pins (TCK and TDI) as input during connection with the OCDS system.
Data Sheet
85
V1.5, 2010-09
SAA-XC866
Functional Description
Memory
Control
Unit
JTAG Module
Primary
Debug
Interface
TMS
TCK
TDI
TDO
JTAG
TCK
TDI
TDO
Control
Reset
Monitor &
Bootstrap loader
Control line
User
Program
Memory
Boot/
Monitor
ROM
User
Internal
RAM
Monitor
RAM
Monitor Mode Control
MBC
WDT
Suspend
System
Control
Unit
Reset
Clock
- parts of
OCDS
Reset Clock Debug PROG PROG Memory
Interface & IRAM Data Control
Addresses
XC800
OCDS_XC800-Block_Diagram-UM-v0.2
Figure 35
3.19.1
OCDS Block Diagram
JTAG ID Register
This is a read-only register located inside the JTAG module, and is used to recognize the
device(s) connected to the JTAG interface. Its content is shifted out when
INSTRUCTION register contains the IDCODE command (opcode 04H), and the same is
also true immediately after reset.
The JTAG ID register contents for the SAA-XC866 devices are given in Table 31.
Table 31
Device Type
Flash
Data Sheet
JTAG ID Summary
Device Name
JTAG ID
SAA-XC866L-4FRA
1010 0083H
SAA-XC866-4FRA
100F 5083H
SAA-XC866L-2FRA
1010 2083H
SAA-XC866-2FRA
1010 1083H
SAA-XC866L-1FRA
1013 8083H
SAA-XC866-1FRA
1013 8083H
86
V1.5, 2010-09
SAA-XC866
Functional Description
Table 31
JTAG ID Summary
ROM
3.20
SAA-XC866L-4RRA
1013 9083H
SAA-XC866-4RRA
1013 9083H
SAA-XC866L-2RRA
1013 9083H
SAA-XC866-2RRA
1013 9083H
Identification Register
The SAA-XC866 identity register is located at Page 1 of address B3H.
ID
Identity Register
7
Reset Value: 0000 0010B
6
5
4
3
1
PRODID
VERID
r
r
Field
Bits
Type Description
VERID
[2:0]
r
Version ID
010B
PRODID
[7:3]
r
Product ID
00000B
Data Sheet
2
87
0
V1.5, 2010-09
SAA-XC866
Electrical Parameters
4
Electrical Parameters
Chapter 4 provides the characteristics of the electrical parameters which are
implementation-specific for the SAA-XC866.
4.1
General Parameters
The general parameters are described here to aid the users in interpreting the parameters mainly in Section 4.2 and Section 4.3.
4.1.1
Parameter Interpretation
The parameters listed in this section represent partly the characteristics of the SAAXC866 and partly its requirements on the system. To aid interpreting the parameters
easily when evaluating them for a design, they are indicated by the abbreviations in the
“Symbol” column:
• CC
These parameters indicate Controller Characteristics, which are distinctive features of
the SAA-XC866 and must be regarded for a system design.
• SR
These parameters indicate System Requirements, which must be provided by the
microcontroller system in which the SAA-XC866 is designed in.
Data Sheet
88
V1.5, 2010-09
SAA-XC866
Electrical Parameters
4.1.2
Absolute Maximum Rating
Maximum ratings are the extreme limits to which the SAA-XC866 can be subjected to
without permanent damage.
Table 32
Absolute Maximum Rating Parameters
Parameter
Symbol
TA
Storage temperature
TST
Junction temperature
TJ
Voltage on power supply pin with VDDP
respect to VSS
Voltage on core supply pin with VDDC
respect to VSS
Voltage on any pin with respect VIN
to VSS
Ambient temperature
Input current on any pin during
overload condition
IIN
Absolute sum of all input currents Σ|IIN|
during overload condition
1)
Limit Values
Unit Notes
min.
max.
-40
140
°C
under bias
-65
150
°C
1)
-40
150
°C
under bias1)
-0.5
6
V
1)
-0.5
3.25
V
1)
-0.5
VDDP +
V
Whichever
is lower1)
0.5 or
max. 6
-10
10
mA
1)
–
50
mA
1)
Not subjected to production test, verified by design/characterization.
Note: Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in
the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
During absolute maximum rating overload conditions (VIN > VDDP or VIN < VSS)
the voltage on VDDP pin with respect to ground (VSS) must not exceed the values
defined by the absolute maximum ratings.
Data Sheet
89
V1.5, 2010-09
SAA-XC866
Electrical Parameters
4.1.3
Operating Conditions
The following operating conditions must not be exceeded in order to ensure correct
operation of the SAA-XC866. All parameters mentioned in the following table refer to
these operating conditions, unless otherwise noted.
Table 33
Operating Condition Parameters
Parameter
Digital power supply voltage
Digital power supply voltage
Digital ground voltage
Digital core supply voltage
System Clock Frequency1)
Ambient temperature
1)
Symbol
VDDP
VDDP
VSS
VDDC
fSYS
TA
min.
Limit Values
max.
Unit Notes/
Conditions
4.5
5.5
V
5V Device
3.6
V
3.3V Device
3.0
0
V
2.3
2.7
V
74
86
MHz
-40
140
°C
SAA-XC866...
fSYS is the PLL output clock. During normal operating mode, CPU clock is fSYS / 3. Please refer to Figure 25
for detailed description.
Data Sheet
90
V1.5, 2010-09
SAA-XC866
Electrical Parameters
4.2
DC Parameters
4.2.1
Input/Output Characteristics
Table 34
Input/Output Characteristics (Operating Conditions apply)
Parameter
Symbol
Limit Values
Unit Test Conditions
min.
max.
–
1.0
V
–
0.4
V
VDDP = 5V Range
Output low voltage
Output high voltage
VOL CC
VOH CC
V
IOL = 15 mA
IOL = 5 mA
IOH = -15 mA
V
IOH = -5 mA
V
CMOS Mode
V
CMOS Mode
V
CMOS Mode
V
CMOS Mode
–
V
CMOS Mode
VDDP
V
CMOS Mode
–
V
CMOS Mode
0.75 × –
V
CMOS Mode
V
CMOS Mode
VDDP - –
1.0
VDDP - –
0.4
Input low voltage on
VILP SR
port pins
(all except P0.0 & P0.1)
Input low voltage on
P0.0 & P0.1
VILP0 SR
Input low voltage on
RESET pin
VILR SR
Input low voltage on
TMS pin
VILT SR
VDDP
0.3 ×
-0.2
VDDP
0.3 ×
–
VDDP
0.3 ×
–
VDDP
Input high voltage on
VIHP SR
port pins
(all except P0.0 & P0.1)
Input high voltage on
P0.0 & P0.1
VIHP0 SR
Input high voltage on
RESET pin
VIHR SR
Input high voltage on
TMS pin
VIHT SR
Input Hysteresis1) on
Port Pins
HYS CC
Input Hysteresis1) on
XTAL1
HYSX CC
Data Sheet
0.3 ×
–
0.7 ×
VDDP
0.7 ×
VDDP
0.7 ×
VDDP
VDDP
0.08 × –
VDDP
0.07 × –
V
VDDC
91
V1.5, 2010-09
SAA-XC866
Electrical Parameters
Table 34
Input/Output Characteristics (Operating Conditions apply)
Parameter
Symbol
Input low voltage at
XTAL1
VILX SR
Input high voltage at
XTAL1
VIHX SR
Pull-up current
IPU
Limit Values
Unit Test Conditions
min.
max.
VSS -
0.3 ×
V
0.5
V
0.7 ×
VDDC
VDDC
VDDC
+ 0.5
–
-10
µA
-150
–
µA
–
10
µA
150
–
µA
-2
2
µA
-10
10
µA
5
mA
3)
–
25
mA
3)
SR –
0.3
V
4)
SR –
15
mA
Maximum current for all Σ|IM|
–
pins (excluding VDDP
SR
and VSS)
60
mA
–
80
mA
3)
–
80
mA
3)
Pull-down current
Input leakage
current2)
IPD
SR
SR
IOZ1 CC
IILX
Overload current on any IOV
Input current at XTAL1
CC
VIH,min
VIL,max
VIL,max
VIH,min
0 < VIN < VDDP,
TA ≤ 140°C
SR -5
pin
Absolute sum of
overload currents
Σ|IOV|
Voltage on any pin
during VDDP power off
VPO
SR
Maximum current per
IM
pin (excluding VDDP and
VSS)
Maximum current into
IMVDDP
VDDP
SR
Maximum current out of IMVSS
VSS
Data Sheet
SR
92
V1.5, 2010-09
SAA-XC866
Electrical Parameters
Table 34
Input/Output Characteristics (Operating Conditions apply)
Parameter
Symbol
Limit Values
Unit Test Conditions
min.
max.
–
1.0
V
–
0.4
V
VDDP = 3.3V Range
Output low voltage
Output high voltage
VOL CC
VOH CC
V
IOL = 8 mA
IOL = 2.5 mA
IOH = -8 mA
V
IOH = -2.5 mA
V
CMOS Mode
V
CMOS Mode
V
CMOS Mode
V
CMOS Mode
–
V
CMOS Mode
VDDP
V
CMOS Mode
–
V
CMOS Mode
0.75 × –
V
CMOS Mode
V
CMOS Mode
VDDP - –
1.0
VDDP - –
0.4
Input low voltage on
VILP SR
port pins
(all except P0.0 & P0.1)
Input low voltage on
P0.0 & P0.1
VILP0 SR
Input low voltage on
RESET pin
VILR SR
Input low voltage on
TMS pin
VILT SR
VDDP
0.3 ×
-0.2
VDDP
0.3 ×
–
VDDP
0.3 ×
–
VDDP
Input high voltage on
VIHP SR
port pins
(all except P0.0 & P0.1)
Input high voltage on
P0.0 & P0.1
VIHP0 SR
Input high voltage on
RESET pin
VIHR SR
Input high voltage on
TMS pin
VIHT SR
Input Hysteresis1) on
Port Pins
HYS CC
Input Hysteresis1) on
XTAL1
HYSX CC
Input low voltage at
XTAL1
VILX SR
Input high voltage at
XTAL1
VIHX SR
Data Sheet
0.3 ×
–
0.7 ×
VDDP
0.7 ×
VDDP
0.7 ×
VDDP
VDDP
0.03 × –
VDDP
0.07 × –
VDDC
VSS - 0.3 ×
0.5
VDDC
0.7 × VDDC
VDDC + 0.5
93
V
V
V
V1.5, 2010-09
SAA-XC866
Electrical Parameters
Table 34
Input/Output Characteristics (Operating Conditions apply)
Parameter
Pull-up current
Symbol
IPU
SR
Limit Values
Unit Test Conditions
min.
max.
–
-5
µA
-50
–
µA
–
5
µA
Pull-down current
IPD
50
–
µA
Input leakage current2)
IOZ1 CC
-2
2
µA
IILX
- 10
Input current at XTAL1
SR
TA ≤ 140°C
10
µA
5
mA
3)
–
25
mA
3)
SR –
0.3
V
4)
SR –
15
mA
Maximum current for all Σ|IM|
–
pins (excluding VDDP
SR
and VSS)
60
mA
–
80
mA
–
80
mA
Overload current on any IOV
pin
Absolute sum of
overload currents
Σ|IOV|
Voltage on any pin
during VDDP power off
VPO
SR -5
SR
Maximum current per
IM
pin (excluding VDDP and
VSS)
Maximum current into
CC
VIH,min
VIL,max
VIL,max
VIH,min
0 < VIN < VDDP,
IMVDDP
VDDP
SR
Maximum current out of IMVSS
VSS
SR
1)
Not subjected to production test, verified by design/characterization. Hysteresis is implemented to avoid meta
stable states and switching due to internal ground bounce. It cannot be guaranteed that it suppresses switching
due to external system noise.
2)
An additional error current (IINJ) will flow if an overload current flows through an adjacent pin. TMS pin and
RESET pin have internal pull devices and are not included in the input leakage current characteristic.
3)
Not subjected to production test, verified by design/characterization.
4)
Not subjected to production test, verified by design/characterization. However, for applications with strict low
power-down current requirements, it is mandatory that no active voltage source is supplied at any GPIO pin
when VDDP is powered off.
Data Sheet
94
V1.5, 2010-09
SAA-XC866
Electrical Parameters
4.2.2
Supply Threshold Characteristics
5.0V
VDDPPW
VDDP
2.5V
VDDCPW
VDDCBO
VDDC
VDDCRDR
VDDCBOPD
VDDCPOR
Figure 36
Supply Threshold Parameters
Table 35
Supply Threshold Parameters (Operating Conditions apply)
Parameters
Symbol
Limit Values
min.
VDDC prewarning
voltage1)
typ.
max.
Unit
VDDCPW
CC 2.2
2.3
2.4
V
VDDC brownout voltage in
active mode1)
VDDCBO
CC 2.0
2.1
2.2
V
RAM data retention voltage
VDDCRDR CC 0.9
1.0
1.1
V
VDDC brownout voltage in
power-down mode2)
VDDCBOPD CC 1.3
1.5
1.7
V
VDDP prewarning voltage3)
VDDPPW
CC 3.3
4.0
4.65
V
Power-on reset voltage2)4)
VDDCPOR CC 1.3
1.5
1.7
V
1)
Detection is disabled in power-down mode.
2)
Detection is enabled in both active and power-down mode.
3)
Detection is enabled for external power supply of 5.0V
Detection must be disabled for external power supply of 3.3V.
4)
The reset of EVR is extended by 300 µs typically after the VDDC reaches the power-on reset voltage.
Data Sheet
95
V1.5, 2010-09
SAA-XC866
Electrical Parameters
4.2.3
ADC Characteristics
The values in the table below are given for an analog power supply between 4.5 V to
5.5 V. The ADC can be used with an analog power supply down to 3 V. But in this case,
the analog parameters may show a reduced performance. All ground pins (VSS) must be
externally connected to one single star point in the system. The voltage difference
between the ground pins must not exceed 200mV.
Table 36
ADC Characteristics (Operating Conditions apply; VDDP = 5V Range)
Parameter
Symbol
Limit Values
min.
typ .
Unit
max.
Test Conditions/
Remarks
VDDP V
+ 0.05
1)
VAREF V
-1
1)
Analog reference
voltage
VAREF
Analog reference
ground
VSS
VAGND
SR - 0.05
Analog input
voltage range
VAIN SR VAGND –
VAREF V
ADC clocks
fADC
–
20
40
MHz
module clock1)
fADCI
–
–
10
MHz
internal analog
clock1)
See Figure 33
VAGND VDDP
SR + 1
VSS
Sample time
tS
CC (2 + INPCR0.STC) ×
tADCI
µs
1)
Conversion time
tC
CC See Section 4.2.3.1
µs
1)
Total unadjusted
error
TUE CC –
–
1
LSB
8-bit conversion.2)
–
–
2
LSB
10-bit conversion.2)
Differential
Nonlinearity
|EADNL| –
CC
1
–
LSB
10-bit conversion1)
Integral
Nonlinearity
|EAINL|
–
CC
1
–
LSB
10-bit conversion1)
Offset
|EAOFF| –
CC
1
–
LSB
10-bit conversion1)
Gain
|EAGAIN| –
CC
1
–
LSB
10-bit conversion1)
Overload current
coupling factor for
analog inputs
KOVA CC –
–
1.0 x
10-4
–
IOV > 01)3)
–
–
1.5 x
10-3
–
IOV < 01)3)
Data Sheet
96
V1.5, 2010-09
SAA-XC866
Electrical Parameters
Table 36
ADC Characteristics (Operating Conditions apply; VDDP = 5V Range)
Parameter
Symbol
Limit Values
Unit
Test Conditions/
Remarks
typ .
max.
Overload current
coupling factor for
digital I/O pins
KOVD CC –
–
5.0 x
10-3
–
IOV > 01)3)
–
–
1.0 x
10-2
–
IOV < 01)3)
Switched
capacitance at the
reference voltage
input
CAREFSW –
CC
10
20
pF
1)4)
Switched
capacitance at the
analog voltage
inputs
–
CAINSW
CC
5
7
pF
1)5)
Input resistance of RAREFCC –
the reference input
1
2
kΩ
1)
Input resistance of RAIN CC –
the selected analog
channel
1
1.5
kΩ
1)
min.
1)
Not subject to production test, verified by design/characterization.
2)
TUE is tested at VAREF = 5.0 V, VAGND = 0 V , VDDP = 5.0 V.
3)
An overload current (IOV) through a pin injects a certain error current (IINJ) into the adjacent pins. This error
current adds to the respective pin’s leakage current (IOZ). The amount of error current depends on the
overload current and is defined by the overload coupling factor KOV. The polarity of the injected error current
is inverse compared to the polarity of the overload current that produces it. The total current through a pin is
|ITOT| = |IOZ1| + (|IOV| × KOV). The additional error current may distort the input voltage on analog inputs.
4)
This represents an equivalent switched capacitance. This capacitance is not switched to the reference voltage
at once. Instead of this, smaller capacitances are successively switched to the reference voltage.
5)
The sampling capacity of the conversion C-Network is pre-charged to VAREF/2 before connecting the input to
the C-Network. Because of the parasitic elements, the voltage measured at ANx is lower than VAREF/2.
Data Sheet
97
V1.5, 2010-09
SAA-XC866
Electrical Parameters
Analog Input Circuitry
REXT
VAIN
RAIN, On
ANx
CEXT
C AINSW
VAGNDx
Reference Voltage Input Circuitry
R AREF, On
VAREFx
VAREF
C AREFSW
VAGNDx
Figure 37
4.2.3.1
ADC Input Circuits
ADC Conversion Timing
Conversion time, tC = tADC × ( 1 + r × (3 + n + STC) ) , where
r = CTC + 2 for CTC = 00B, 01B or 10B,
r = 32 for CTC = 11B,
CTC = Conversion Time Control (GLOBCTR.CTC),
STC = Sample Time Control (INPCR0.STC),
n = 8 or 10 (for 8-bit and 10-bit conversion respectively),
tADC = 1 / fADC
Data Sheet
98
V1.5, 2010-09
SAA-XC866
Electrical Parameters
4.2.4
Power Supply Current
Table 37
Power Supply Current Parameters (Operating Conditions apply)
Parameter
Symbol
Limit Values
typ.1)
Active Mode
Idle Mode
Active Mode with slow-down
enabled
Idle Mode with slow-down
enabled
Unit Test Condition
max.2)
IDDP
IDDP
IDDP
22.6
24.5
mA
3)
17.2
19.7
mA
4)
7.2
8.2
mA
5)
IDDP
7.1
8
mA
6)
1)
The typical IDDP values are periodically measured at TA = + 25 °C and VDDP = 5.0 V.
2)
The maximum IDDP values are measured under worst case conditions (TA = + 140 °C and VDDP = 5.5 V).
3)
IDDP (active mode) is measured with: CPU clock and input clock to all peripherals running at 26.7 MHz(set by
on-chip oscillator of 10 MHz and NDIV in PLL_CON to 0010B), RESET = VDDP.
4)
IDDP (idle mode) is measured with: CPU clock disabled, watchdog timer disabled, input clock to all peripherals
enabled and running at 26.7 MHz, RESET = VDDP.
5)
IDDP (active mode with slow-down mode) is measured with: CPU clock and input clock to all peripherals
running at 833 KHz by setting CLKREL in CMCON to 0101B, RESET = VDDP.
6)
IDDP (idle mode with slow-down mode) is measured with: CPU clock disabled, watchdog timer disabled, input
clock to all peripherals enabled and running at 833 KHz by setting CLKREL in CMCON to 0101B,
RESET = VDDP.
Data Sheet
99
V1.5, 2010-09
SAA-XC866
Electrical Parameters
Table 38
Power Down Current (Operating Conditions apply)
Parameter
Symbol
Limit Values
1)
typ.
Power-Down
Mode3)
IPDP
Unit Test Condition
max.2)
1
10
µA
TA = + 25 °C.4)
-
30
µA
TA = + 85 °C.4)5)
1)
The typical IPDP values are measured at VDDP = 5.0 V.
2)
The maximum IPDP values are measured at VDDP = 5.5 V.
3)
IPDP (power-down mode) has a maximum value of 400 µA at TA = + 140 °C.
4)
IPDP (power-down mode) is measured with: RESET = VDDP, VAGND= VSS, RXD/INT0 = VDDP; rest of the ports
are programmed to be input with either internal pull devices enabled or driven externally to ensure no floating
inputs.
5)
Not subject to production test, verified by design/characterization.
Data Sheet
100
V1.5, 2010-09
SAA-XC866
Electrical Parameters
4.3
AC Parameters
4.3.1
Testing Waveforms
The testing waveforms for rise/fall time, output delay and output high impedance are
shown in Figure 38, Figure 39 and Figure 40.
VDDP
90%
90%
10%
10%
VSS
tF
tR
Figure 38
Rise/Fall Time Parameters
VDDP
VDDE / 2
Test Points
VDDE / 2
VSS
Figure 39
Testing Waveform, Output Delay
VLoad + 0.1 V
VLoad - 0.1 V
Figure 40
Data Sheet
Timing
Reference
Points
VOH - 0.1 V
VOL - 0.1 V
Testing Waveform, Output High Impedance
101
V1.5, 2010-09
SAA-XC866
Electrical Parameters
4.3.2
Output Rise/Fall Times
Table 39
Output Rise/Fall Times Parameters (Operating Conditions apply)
Parameter
Symbol
Limit
Values
Unit Test Conditions
min. max.
VDDP = 5V Range
Rise/fall times 1) 2)
tR, tF
–
10
ns
20 pF. 3)
tR, tF
–
10
ns
20 pF. 4)
VDDP = 3.3V Range
Rise/fall times 1) 2)
1)
Rise/Fall time measurements are taken with 10% - 90% of the pad supply.
2)
Not all parameters are 100% tested, but are verified by design/characterization and test correlation.
3)
Additional rise/fall time valid for CL = 20pF - 100pF @ 0.125 ns/pF.
4)
Additional rise/fall time valid for CL = 20pF - 100pF @ 0.225 ns/pF.
VDDP
90%
90%
VSS
10%
10%
tF
tR
Figure 41
Data Sheet
Rise/Fall Times Parameters
102
V1.5, 2010-09
SAA-XC866
Electrical Parameters
4.3.3
Power-on Reset and PLL Timing
Table 40
Power-On Reset and PLL Timing (Operating Conditions apply)
Parameter
Symbol
Limit Values
min. typ.
Unit Test Conditions
max.
–
–
V
1)
–
500
ns
1)
Flash initialization time tFINIT CC –
160
–
µs
1)
tRST SR –
500
–
µs
VDDP rise time
tLOCK CC –
–
200
µs
1)
–
0.7
ns
1)3)
Pad operating voltage
On-Chip Oscillator
start-up time
RESET hold time
PLL lock-in in time
VPAD CC 2.3
–
tOSCST
CC
PLL accumulated jitter DP
(10% – 90%) ≤
500µs1)2)
–
1)
Not all parameters are 100% tested, but are verified by design/characterization and test correlation.
2)
RESET signal has to be active (low) until VDDC has reached 90% of its maximum value (typ. 2.5V).
3)
PLL lock at 80 MHz using a 4 MHz external oscillator. The PLL Divider settings are K = 2, N = 40 and P = 1.
VDDP
VPAD
VDDC
tOSCST
OSC
PLL unlock
PLL
PLL lock
tLOCK
Flash State
Reset
Initialization
tFINIT
tRST
Ready to Read
RESET
Pads
3)
2)
1)
1)Pad state undefined
I)until EVR is stable
Figure 42
Data Sheet
2)ENPS control 3)As Programmed
II)until PLL is locked
III) until Flash go IV) CPU reset is released; Boot
to Ready-to-Read ROM software begin execution
Power-on Reset Timing
103
V1.5, 2010-09
SAA-XC866
Electrical Parameters
4.3.4
Table 41
On-Chip Oscillator Characteristics
On-chip Oscillator Characteristics (Operating Conditions apply)
Parameter
Symbol
Limit Values
Unit Test Conditions
min. typ. max.
Nominal frequency
fNOM CC 9.75 10
Long term frequency ΔfLT CC 0
deviation
10.25 MHz under nominal
conditions1)
–
6.0
%
with respect to fNOM, over
lifetime and temperature
(125°C to 140°C), for one
device after trimming
-5.0
–
5.0
%
with respect to fNOM, over
lifetime and temperature
(−10°C to 125°C), for one
device after trimming
-6.0
–
0
%
with respect to fNOM, over
lifetime and temperature
(−40°C to -10°C), for one
device after trimming
Short term frequency ΔfST CC -1.0
deviation
–
1.0
%
within one LIN message
(<10 ms .... 100 ms)
1)
Nominal condition: VDDC = 2.5 V, TA = + 25°C.
Data Sheet
104
V1.5, 2010-09
SAA-XC866
Electrical Parameters
4.3.5
JTAG Timing
Table 42
TCK Clock Timing (Operating Conditions apply; CL = 50 pF)
Parameter
Symbol
Limits
min
TCK clock
period1)
tTCK SR
t1 SR
t2 SR
t3 SR
t4 SR
TCK high time1)
TCK low
time1)
TCK clock rise
time1)
TCK clock fall time1)
1)
Unit
max
50
−
ns
20
−
ns
20
−
ns
−
4
ns
−
4
ns
Not all parameters are 100% tested, but are verified by design/characterization and test correlation.
0.9 V DDP
0.5 V DDP
0.1 V DDP
TCK
t1
t2
t4
t TCK
Figure 43
Data Sheet
t3
TCK Clock Timing
105
V1.5, 2010-09
SAA-XC866
Electrical Parameters
Table 43
JTAG Timing (Operating Conditions apply; CL = 50 pF)
Parameter
Symbol
Limits
min
TMS setup to
TCK1)
TMS hold to TCK1)
TDI setup to
TDI hold to
TCK1)
TCK1)
TDO valid output from TCK1)
TDO high impedance to valid output from TCK1)
TDO valid output to high impedance from TCK1)
1)
t1
t2
t1
t2
t3
t4
t5
Unit
max
SR 8.0
−
ns
SR 5.0
−
ns
SR 11.0
−
ns
SR 6.0
−
ns
CC −
23
ns
CC −
26
ns
CC −
18
ns
Not all parameters are 100% tested, but are verified by design/characterization and test correlation.
TCK
t1
t2
t1
t2
TMS
TDI
t4
t3
t5
TDO
Figure 44
Data Sheet
JTAG Timing
106
V1.5, 2010-09
SAA-XC866
Electrical Parameters
4.3.6
SSC Master Mode Timing
Table 44
SSC Master Mode Timing (Operating Conditions apply; CL = 50 pF)
Parameter
Symbol
Limit Values
min.
SCLK clock
period1)
t0
t1
t2
t3
MTSR delay from SCLK1)
MRST setup to SCLK1)
MRST hold from
SCLK1)
CC 2*TSSC
Unit
max.
2)
–
ns
CC 0
8
ns
SR 22
–
ns
SR 0
–
ns
1)
Not all parameters are 100% tested, but are verified by design/characterization and test correlation.
2)
TSSCmin = TCPU = 1/fCPU. When fCPU = 26.7MHz, t0 = 74.9ns. TCPU is the CPU clock period.
t0
SCLK1)
t1
t1
MTSR1)
t2
t3
Data
valid
MRST1)
t1
1) This timing is based on the following setup: CON.PH = CON.PO = 0.
SSC_Tmg1
Figure 45
Data Sheet
SSC Master Mode Timing
107
V1.5, 2010-09
SAA-XC866
Package and Reliability
5
Package and Reliability
5.1
Package Parameters (PG-TSSOP-38)
Table 45 provides the thermal characteristics of the package.
Table 45
Thermal Characteristics of the Package
Parameter
Symbol
Limit Values
Unit Notes
Min.
Max.
Thermal resistance junction
case1)2)
RTJC
CC
–
15.7
K/W –
Thermal resistance junction
lead1)2)
RTJL
CC
–
39.2
K/W –
1)
The thermal resistances between the case and the ambient (RTCA), the lead and the ambient (RTLA) are to be
combined with the thermal resistances between the junction and the case (RTJC), the junction and the lead
(RTJL) given above, in order to calculate the total thermal resistance between the junction and the ambient
(RTJA). The thermal resistances between the case and the ambient (RTCA), the lead and the ambient (RTLA)
depend on the external system (PCB, case) characteristics, and are under user responsibility.
The junction temperature can be calculated using the following equation: TJ=TA + RTJA × PD, where the RTJA
is the total thermal resistance between the junction and the ambient. This total junction ambient resistance
RTJA can be obtained from the upper four partial thermal resistances, by
a) simply adding only the two thermal resistances (junction lead and lead ambient), or
b) by taking all four resistances into account, depending on the precision needed.
2)
Not all parameters are 100% tested, but are verified by design/characterization and test correlation.
Data Sheet
108
V1.5, 2010-09
SAA-XC866
Package and Reliability
5.2
Figure 46
Data Sheet
Package Outline
PG-TSSOP-38-4 Package Outline
109
V1.5, 2010-09
SAA-XC866
Package and Reliability
5.3
Quality Declaration
Table 46 shows the characteristics of the quality parameters in the SAA-XC866.
Table 46
Quality Parameters
Parameter
Symbol
Operation Lifetime when
the device is used at the
four stated TA1)2)
tOP
Operation Lifetime when
the device is used at the
two stated TA1)2)
tOP2
Weighted Average
Temperature2)3)
TWA
Limit Values
Unit
Notes
Min.
Typ.
Max.
–
–
1500
hours
TA= 140°C
–
–
2000
hours
TA= 125°C
–
–
10000
hours
TA= 85°C
–
–
1500
hours
TA= -40°C
hours
TA= 108°C
–
–
18000
–
–
130000 hours
TA= 27°C
–
106
–
°C
for 15000 hours
ESD susceptibility
VHBM
according to Human Body
Model (HBM) for all pins
(except VDDC)2)
–
–
2000
V
Conforming to
EIA/JESD22A114-B
ESD susceptibility
VHBMC
according to Human Body
Model (HBM) for VDDC2)
–
–
600
V
Conforming to
EIA/JESD22A114-B
–
–
750
V
Conforming to
JESD22-C101-C
ESD susceptibility
according to Charged
Device Model (CDM)
pins2)
VCDM
1)
This lifetime refers only to the time when the device is powered-on.
2)
Not all parameters are 100% tested, but are verified by design/characterization and test correlation.
3)
This parameter is derived based on the Arrhenius model.
Data Sheet
110
V1.5, 2010-09
w w w . i n f i n e o n . c o m
Published by Infineon Technologies AG