TI CD74HCT688M

[ /Title
(CD74
HC688
,
CD74
HCT68
8)
/Subject
(High
Speed
CMOS
CD54HC688, CD74HC688,
CD54HCT688, CD74HCT688
Data sheet acquired from Harris Semiconductor
SCHS196C
High-Speed CMOS Logic
8-Bit Magnitude Comparator
September 1997 - Revised August 2003
Features
Description
• Cascadable
The ’HC688 and ’HCT688 are 8-bit magnitude comparators
designed for use in computer and logic applications that
require the comparison of two 8-bit binary words. When the
compared words are equal the output (Y) is low and can be
used as the enabling input for the next device in a cascaded
application.
• Fanout (Over Temperature Range)
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
• Wide Operating Temperature Range . . . -55oC to 125oC
Ordering Information
• Balanced Propagation Delay and Transition Times
• Significant Power Reduction Compared to LSTTL
Logic ICs
TEMP. RANGE (oC)
PACKAGE
CD54HC688F3A
-55 to 125
20 Ld CERDIP
CD54HCT688F3A
-55 to 125
20 Ld CERDIP
CD74HC688E
-55 to 125
20 Ld PDIP
CD74HC688M
-55 to 125
20 Ld SOIC
CD74HC688M96
-55 to 125
20 Ld SOIC
CD74HC688NSR
-55 to 125
20 Ld SOP
CD74HC688PWR
-55 to 125
20 Ld TSSOP
CD74HC688PWT
-55 to 125
20 Ld TSSOP
CD74HCT688E
-55 to 125
20 Ld PDIP
CD74HCT688M
-55 to 125
20 Ld SOIC
CD74HCT688M96
-55 to 125
20 Ld SOIC
PART NUMBER
• HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30%of VCC at
VCC = 5V
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
VIL= 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH
NOTE: When ordering, use the entire part number. The suffixes 96
and R denote tape and reel. The suffix T denotes a small-quantity
reel of 250.
Pinout
CD54HC688, CD54HCT688 (CERDIP)
CD74HC688 (PDIP, SOIC, SOP, TSSOP)
CD74HCT688 (PDIP, SOIC)
TOP VIEW
E
1
A0
2
19 Y
B0
3
18 B7
A1
4
17 A7
B1
5
16 B6
A2
6
15 A6
B2
7
14 B5
A3
8
13 A5
B3
9
12 B4
GND 10
11 A4
20 VCC
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
© 2003, Texas Instruments Incorporated
1
CD54HC688, CD74HC688, CD54HCT688, CD74HCT688
Functional Diagram
A0
A1
A2
A3
A4
A5
A6
A7
B0
B1
B2
B3
B4
B5
B6
B7
2
4
6
8
11
13
15
17
Y
3
19
5
7
9
12
14
16
18
1
E
TRUTH TABLE
INPUTS
OUPUTS
A, B
E
Y
A=B
L
L
A≠B
L
H
X
H
H
H = High Voltage Level, L = Low Voltage Level, X = Don’t Care
2
CD54HC688, CD74HC688, CD54HCT688, CD74HCT688
Logic Diagram
A0
B0
A1
B1
A2
B2
A3
B3
A4
B4
A5
B5
A6
B6
A7
B7
2
3
4
5
6
7
8
9
11
12
13
14
15
16
17
18
E
1
10
GND
20
VCC
19
Y
3
CD54HC688, CD74HC688, CD54HCT688, CD74HCT688
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .±50mA
Thermal Resistance (Typical, Note 1)
θJA (oC/W)
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . .
69
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . .
58
NSR (SOP) Package . . . . . . . . . . . . . . . . . . . . . . . .
60
PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . .
83
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
Operating Conditions
Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
TEST
CONDITIONS
PARAMETER
25oC
-40oC TO 85oC -55oC TO 125oC
SYMBOL
VI (V)
IO (mA)
VCC
(V)
VIH
-
-
2
1.5
-
-
1.5
4.5
3.15
-
-
3.15
-
3.15
-
V
6
4.2
-
-
4.2
-
4.2
-
V
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
-
1.5
-
V
HC TYPES
High Level Input
Voltage
Low Level Input
Voltage
High Level Output
Voltage
CMOS Loads
VIL
VOH
-
VIH or VIL
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
Quiescent Device
Current
-
2
-
-
0.5
-
0.5
-
0.5
V
4.5
-
-
1.35
-
1.35
-
1.35
V
6
-
-
1.8
-
1.8
-
1.8
V
-0.02
2
1.9
-
-
1.9
-
1.9
-
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-0.02
6
5.9
-
-
5.9
-
5.9
-
V
-
-
-
-
-
-
-
-
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
-5.2
6
5.48
-
-
5.34
-
5.2
-
V
0.02
2
-
-
0.1
-
0.1
-
0.1
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
0.02
6
-
-
0.1
-
0.1
-
0.1
V
-
-
-
-
-
-
-
-
-
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
5.2
6
-
-
0.26
-
0.33
-
0.4
V
II
VCC or
GND
-
6
-
-
±0.1
-
±1
-
±1
µA
ICC
VCC or
GND
0
6
-
-
8
-
80
-
160
µA
4
CD54HC688, CD74HC688, CD54HCT688, CD74HCT688
DC Electrical Specifications
(Continued)
TEST
CONDITIONS
SYMBOL
VI (V)
IO (mA)
High Level Input
Voltage
VIH
-
-
Low Level Input
Voltage
VIL
-
High Level Output
Voltage
CMOS Loads
VOH
VIH or VIL
PARAMETER
25oC
VCC
(V)
-40oC TO 85oC -55oC TO 125oC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
4.5 to
5.5
2
-
-
2
-
2
-
V
-
4.5 to
5.5
-
-
0.8
-
0.8
-
0.8
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
HCT TYPES
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
Quiescent Device
Current
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
II
VCC and
GND
0
5.5
-
-
±0.1
-
±1
-
±1
µA
ICC
VCC or
GND
0
5.5
-
-
8
-
80
-
160
µA
∆ICC
(Note 2)
VCC
-2.1
-
4.5 to
5.5
-
100
360
-
450
-
490
µA
NOTE:
2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
HCT Input Loading Table
INPUT
UNIT LOADS
Enable
0.7
Data Inputs
0.35
NOTE: Unit Load is ∆ICC limit specified in DC Electrical Table, e.g.,
360µA max at 25oC.
Switching Specifications Input tr, tf = 6ns
PARAMETER
TEST
SYMBOL CONDITIONS
25oC
-40oC TO 85oC -55oC TO 125oC
VCC
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
2
-
-
170
-
210
-
255
ns
4.5
-
-
34
-
42
-
51
ns
CL =15pF
5
-
14
-
-
-
-
-
ns
CL = 50pF
6
-
-
29
-
36
-
43
ns
CL = 50pF
2
-
-
170
-
210
-
255
ns
4.5
-
-
34
-
42
-
51
ns
CL =15pF
5
-
14
-
-
-
-
-
ns
CL = 50pF
6
-
-
29
-
36
-
43
ns
HC TYPES
Propagation Delay (Figure 1)
An to Output
Bn to Output
tPLH,
tPHL
tPLH,
tPHL
CL = 50pF
5
CD54HC688, CD74HC688, CD54HCT688, CD74HCT688
Switching Specifications Input tr, tf = 6ns
(Continued)
TEST
SYMBOL CONDITIONS
PARAMETER
-40oC TO 85oC -55oC TO 125oC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
2
-
-
120
-
150
-
180
ns
4.5
-
-
24
-
30
-
36
ns
CL =15pF
5
-
9
-
-
-
-
-
ns
CL = 50pF
6
-
-
20
-
26
-
30
ns
tTLH, tTHL CL = 50pF
2
-
-
75
-
95
-
110
ns
4.5
-
-
15
-
19
-
22
ns
6
-
-
13
-
16
-
19
ns
E to Output
tPLH,
tPHL
Output Transition Time
(Figure 1)
25oC
VCC
(V)
CL = 50pF
Input Capacitance
CIN
CL = 50pF
-
-
-
10
-
10
-
10
pF
Power Dissipation Capacitance
(Notes 3, 4)
CPD
CL =15pF
5
-
22
-
-
-
-
-
pF
tPLH,
tPHL
CL = 50pF
4.5
-
-
34
-
42
-
51
ns
CL =15pF
5
-
14
-
-
-
-
-
ns
tPLH,
tPHL
CL = 50pF
4.5
-
-
34
-
42
-
51
ns
CL =15pF
5
-
14
-
-
-
-
-
ns
tPLH,
tPHL
CL = 50pF
4.5
-
-
24
-
30
-
36
ns
CL =15pF
5
-
9
-
-
-
-
-
ns
4.5
-
-
15
-
19
-
22
ns
HCT TYPES
Propagation Delay (Figure 1)
An to Output
Bn to Output
E to Output
Output Transition Time
(Figure 1)
tTLH, tTHL CL = 50pF
Input Capacitance
CIN
CL = 50pF
-
-
-
10
-
10
-
10
pF
Power Dissipation Capacitance
(Notes 3, 4)
CPD
CL =15pF
5
-
22
-
-
-
-
-
pF
NOTES:
3. CPD is used to determine the dynamic power consumption, per gate.
4. PD = VCC2 fi (CPD + CL) where fi = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage.
Test Circuit and Waveform
tr = 6ns
tf = 6ns
ANY INPUT
A OR B
90% INPUT LEVEL
VS
10% GND
tPHL
tPLH
OUTPUT Y
VS
tTLH
tTHL
FIGURE 1. PROPAGATION DELAY AMD TRANSITION TIMES
6
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-8685701RA
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
CD54HC688F3A
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
Lead/Ball Finish
MSL Peak Temp (3)
CD54HCT688F
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
CD54HCT688F3A
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
CD74HC688E
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC688EE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC688M
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC688M96
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC688M96E4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC688M96G4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC688ME4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC688MG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC688NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC688NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC688NSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC688PWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC688PWRE4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC688PWRG4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC688PWT
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC688PWTE4
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC688PWTG4
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT688E
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT688EE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT688M
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT688M96
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT688M96E4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT688M96G4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
CD74HCT688ME4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT688MG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jul-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
16-Jul-2007
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
CD74HC688M96
DW
20
MLA
330
24
10.8
13.0
2.7
12
24
Q1
CD74HC688NSR
NS
20
MLA
330
24
8.2
13.0
2.5
12
24
Q1
CD74HC688PWR
PW
20
MLA
330
16
6.95
7.1
1.6
8
16
Q1
CD74HCT688M96
DW
20
MLA
330
24
10.8
13.0
2.7
12
24
Q1
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
CD74HC688M96
DW
20
MLA
333.2
333.2
31.75
31.75
CD74HC688NSR
NS
20
MLA
333.2
333.2
CD74HC688PWR
PW
20
MLA
346.0
346.0
33.0
CD74HCT688M96
DW
20
MLA
333.2
333.2
31.75
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jul-2007
Pack Materials-Page 3
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
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