APA2308 Class AB Stereo Headphone Driver Features Applications • • Operating Voltage Single Supply 3V to 6V ±1.5V to ± 3.0V Dual Supply • • • • • • • • • Portable Digital Audio High Signal-to-Noise Ratio 100dB Low Distortion -65dB Gereral Description The APA2308 is an integrated class AB stereo headphone driver contained in an SO-8, a DIP-8 or a TSSOP-8 plastic package. The APA2308 is capable of delivering 280mW of max. Output power to an 8Ω load or 110mW to a 32Ω load with less than 10% (THD+N) from a 5V power supply. The device is fabricated in a CMOS process and has been primarily developed for portable digital audio applications . Large Output Voltage Swing Excellent Power Supply Ripple Rejection Low Power Consumption Short-circuit Elimination Wide Temperature Range No Switch ON/OFF Clicks Available in 8 pin SOP ,DIP or TSSOP Package Ordering and Marking Information A PA 2308 P ackage C ode J : P D IP - 8 O : TSSOP - 8 T em p. R ange I : - 4 0 to 8 5 ° C H a n d lin g C o d e TU : Tube H a nd lin g C o d e T em p. R ange P a ck a g e C o d e APA2308 J : APA2308 XXXXX X X X X X - D a te C o d e APA2308 K : APA2308 XXXXX X X X X X - D a te C o d e APA2308 O : APA2308 XXXXX K : SOP - 8 TR : Tape & Reel X X X X X - D a te C o d e ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. B.3 - Jun., 2003 1 www.anpec.com.tw APA2308 Block Diagram Out A 1 Inverting Input A 2 VDD 7 Out B 6 Inverting Input B 5 Non-inverting Input B -+ +- Non-inverting Input A 3 VSS 8 4 APA2308 Absolute Maximum Ratings Symbol VDD TSC(O) TA TJ TSTG TS VESD Parameter Supply Voltage Output Short-circuit Duration,at TA=25°C,PTOT=1W Operating Ambient Temperature range Maximum Junction Temperature Storage Temperature Range Soldering Temperature , 10 seconds Electrostatic Discharge Rating 7 20 -40 to 85 150 -65 to +150 260 -3000 to 3000*1 Unit V S °C °C °C °C V Note : *1. Human body model : C=100pF , R=1500Ω , 3 positive pulses plus 3 negative pulses Thermal Characteristics Symbol Parameter Value Unit RTHJA Thermal Resistance from Junction to Ambient in Free Air DIP-8 109 K/W SO-8 210 K/W Electrical Characteristics VDD=5V , VSS=0V , TA=25°C , fi=1kHz , RL=32Ω ( unless otherwise noted) Symbol Parameter Test Condition Min. APA2308 Typ. Max Unit Supply VDD Supply Voltage Single 3.0 5.0 6.0 Dual ±1.5 ±2.5 ±3.0 -1.5 -2.5 -3.0 V V VSS Negative Supply Voltage IDD Supply Current No Load 2.5 5 MA Total Power Dissipation No Load 12.5 25 mW PTOT Copyright ANPEC Electronics Corp. Rev. B.3 - Jun., 2003 2 www.anpec.com.tw APA2308 Electrical Characteristics Cont. VDD=5V, VSS=0V, TA=25°C, fi=1kHz, RL=32Ω ( unless otherwise noted) Symbol Parameter Test Condition M in. APA2308 Typ. M ax Unit DC Characteristics V I(OS) Input Offset Voltage 5 MV IBIAS Input Bias Current 10 PA V CM Comm on Mode Voltage GV Open-loop Voltage Gain R L =5kΩ 75 dB IO Max. Output Current (THD+N)/S<0.1% 140 MA RO Output Resistance 0.25 Ω 0 3.5 V AC Characteristics VO Output Voltage Swing R L =32Ω* 1 R L =16Ω* PSRR Power Supply Rejection Ratio 1 0.25 4.75 0.5 4.5 F i=100Hz V RIPPLE(P-P) =100m V \ CS CL Channel Separation R L =32Ω R L =32Ω* 2 S/N Signal to Noise Ratio FG Unity Gain Frequency R L =5kΩ PO Max. Output Power (THD+N)/S<0.1% CI Input Capacitance B Power Bandwidth Notes 65 dB 95 dB Load Capacitance (THD+N)/S Total Harm onic Distortion Plus Noise to Signal Ratio 90 Unity Gain Inverting V 200 pF -65 -60 dB 0.05 0.1 100 dB 5 MHz 84 mW 3 pF 20 kHz *1 : Values are proportional to V DD ; (THD+N)/S < 0.1% *2 : V DD =5.0V ; V O(P-P) =3.5V (at 0 dB) Copyright ANPEC Electronics Corp. Rev. B.3 - Jun., 2003 3 www.anpec.com.tw APA2308 Test And Application Circuits VDD 220pF 220µF VOUTA 15kΩ 1 2 15kΩ 3 VREF typ.1/2VDD VINB 2.2µF 15kΩ 5 6 -+ VINA APA2308 7 100µF 4 VOUTB 15kΩ 220µF RL 220pF Copyright ANPEC Electronics Corp. Rev. B.3 - Jun., 2003 RL 8 -+ 2.2µF 4 www.anpec.com.tw APA2308 Typical Characteristics Total Harmonic Distortion Plus Noise-toSignal Ratio as a Function of Input Frequency -80 p o =50mW R L =16 Ω p o =50mW R L =32 Ω p o =50mW R L =5k Ω V o(PP) =3.5V R L =8 Ω 200 R L =16 Ω R L =32 Ω 100 PO (mW) (THD+N) / S (dB) -60 R L =8 Ω Output Power as a Function of Supply Voltage 20 10 5 -100 2 100 1k 10k 2.5 3.5 5.5 4.5 Frequency (Hz) VDD (Vrms) Crosstalk as a Function of Input Frequency Open Loop Gain as a Function of Input Frequency RL=8Ω RL=16Ω +80 RL=32Ω -80 Gv (dB) Xtalk +60 -100 RL=5kΩ No load +40 RL=32Ω +20 -120 100 1k 1k 10k Frequency (Hz) Copyright ANPEC Electronics Corp. Rev. B.3 - Jun., 2003 10k 100k 1M Frequency (Hz) 5 www.anpec.com.tw APA2308 Typical Characteristics Cont. Total Harmonic Distortion Plus Noise-toSignal Ratio as a Function of output Voltage -40 (THD+N) / S (dB) RL=8Ω RL=16Ω -50 -60 -70 RL=32Ω RL=5KΩ -80 -90 100m 500m 1 2 Vo (Vrms) Copyright ANPEC Electronics Corp. Rev. B.3 - Jun., 2003 6 www.anpec.com.tw APA2308 Packaging Information PDIP-8 pin ( Reference JEDEC Registration MS-001) D E1 E 1 1 A2 A E3 A1 L e2 e1 e3 Dim A A1 A2 D e1 e2 e3 E E1 E3 L φ1 Min. 0.38 2.92 9.02 0.36 1.14 6.10 Millimeters 2.54BSC 7.62 BSC 2.92 Max. 5.33 Min. 3.68 10.16 0.015 0.115 0.355 0.56 1.78 0.014 0.045 7.11 10.92 3.81 0.240 0.100BSC 0.300 BSC 0.115 15° Copyright ANPEC Electronics Corp. Rev. B.3 - Jun., 2003 Inches Max. 0.210 0.145 0.400 0.022 0.070 0.280 0.430 0.150 15° 7 www.anpec.com.tw APA2308 Packaging Information E e1 0.015X45 SOP-8 pin ( Reference JEDEC Registration MS-012) H e2 D A1 1 L 0.004max. Dim A Mi ll im et er s Inche s A Min . 1. 35 Max . 1. 75 Min. 0. 053 Max . 0. 069 A1 D E 0. 10 4. 80 3. 80 0. 25 5. 00 4. 00 0. 004 0. 189 0. 150 0. 010 0. 197 0. 157 H L e1 e2 5. 80 0. 40 0. 33 6. 20 1. 27 0. 51 0. 228 0. 016 0. 013 0. 244 0. 050 0. 020 φ 1 Copyright ANPEC Electronics Corp. Rev. B.3 - Jun., 2003 1. 27B S C 0. 50B S C 8° 8° 8 www.anpec.com.tw APA2308 Packaging Information TSSOP-8 e 8 7 2x E/2 E1 ( 2) E GAUGE PLANE S 1 2 e/2 0.25 D L A2 A b Dim A A1 A2 b D e E E1 L L1 R R1 S φ1 φ2 φ3 1 (L1) ( 3) A1 Millimeters Min. 0.00 0.80 0.19 2.9 4.30 0.45 Inches Max. 1.2 0.15 1.05 0.30 3.1 0.65 BSC 6.40 BSC 0.09 0.09 0.2 0° Copyright ANPEC Electronics Corp. Rev. B.3 - Jun., 2003 1.0 REF 12° REF 12° REF Min. Max. 0.047 0.006 0.041 0.012 0.122 0.000 0.031 0.007 0.114 4.50 0.75 0.169 0.018 8° 0.004 0.004 0.008 0° 9 0.026 BSC 0.252 BSC 0.039REF 12° REF 12° REF 0.177 0.030 8° www.anpec.com.tw APA2308 Physical Specifications Terminal Material Lead Solderability Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb) Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3. Reflow Condition (IR/Convection or VPR Reflow) temperature Reference JEDEC Standard J-STD-020A APRIL 1999 Peak temperature 183°C Pre-heat temperature Time Classification Reflow Profiles Convection or IR/ Convection Average ramp-up rate(183°C to Peak) 3°C/second max. 120 seconds max Preheat temperature 125 ± 25°C) 60 – 150 seconds Temperature maintained above 183°C Time within 5°C of actual peak temperature 10 –20 seconds Peak temperature range 220 +5/-0°C or 235 +5/-0°C Ramp-down rate 6 °C /second max. 6 minutes max. Time 25°C to peak temperature VPR 10 °C /second max. 60 seconds 215-219°C or 235 +5/-0°C 10 °C /second max. Package Reflow Conditions pkg. thickness ≥ 2.5mm and all bgas Convection 220 +5/-0 °C VPR 215-219 °C IR/Convection 220 +5/-0 °C pkg. thickness < 2.5mm and pkg. volume ≥ 350 mm³ Copyright ANPEC Electronics Corp. Rev. B.3 - Jun., 2003 10 pkg. thickness < 2.5mm and pkg. volume < 350mm³ Convection 235 +5/-0 °C VPR 235 +5/-0 °C IR/Convection 235 +5/-0 °C www.anpec.com.tw APA2308 Reliability test Program Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B, A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78 Description 245° C , 5 SEC 1000 Hrs Bias @ 125 ° C 168 Hrs, 100 % RH , 121 ° C -65° C ~ 150° C , 200 Cycles VHBM > 2KV, VMM > 200V 10ms , Itr > 100mA Carrier Tape & Reel Dimensions t D P Po E P1 Bo F W Ao D1 Ko T2 J C A B T1 Application SOP- 8 A B C J T1 T2 W P E 330 ± 1 62 +1.5 12.75+ 0.15 2 ± 0.5 12.4 ± 0.2 2 ± 0.2 12± 0. 3 8± 0.1 1.75±0.1 F D D1 Po P1 Ao Bo Ko t 4.0 ± 0.1 2.0 ± 0.1 6.4 ± 0.1 5.2± 0. 1 2.1± 0.1 0.3±0.013 5.5± 1 Application TSSOP-8 A 1.55 +0.1 1.55+ 0.25 B C J T1 T2 W P E 330 ± 1 62 +1.5 12.75+ 0.15 2 + 0.5 12.4 ± 0.2 2 ± 0.2 12± 0. 3 8± 0.1 1.75±0.1 F D D1 Po P1 Ao Bo Ko t 5.5 ± 0. 1 1.5 + 0.1 1.5 + 0.1 4.0 ± 0.1 2.0 ± 0.1 7.0 ± 0.1 3.6 ± 0.3 1.6 ± 0.1 0.3±0.013 (m m ) Copyright ANPEC Electronics Corp. Rev. B.3 - Jun., 2003 11 www.anpec.com.tw APA2308 Cover Tape Dimensions Application SOP- 8 TSSOP- 8 Carrier Width 12 12 Cover Tape Width 9.3 9.3 Devices Per Reel 2500 2500 Customer Service Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369 Copyright ANPEC Electronics Corp. Rev. B.3 - Jun., 2003 12 www.anpec.com.tw