APLUS INTEGRATED CIRCUITS INC. APR9301-V2 Single-Chip Voice Recording & Playback Device for Single 20 to 30 Second Message Features • Single-chip, high quality voice recording & playback solution - No external ICs required - Minimum external components • Non-volatile Flash memory technology - No battery backup required - 100K record cycles (typical) - 100-year message retention (typical) • Single message of 20 to 30 seconds, with external resistor selection • User-friendly, easy-to-use operation - Programming & development systems not required - Level-activated recording & edge-activated playback switches • Low power consumption - Operating current: 25 mA (typical, no load) - Standby current: 1uA (typical, no load) • Automatic power-down feature for longer battery life • Chip enable pin for simple message expansion • Single 5 6 V power supply General Description The APR9301 de vice offers true single-chip solid-state storage capability and requires no software or microcontroller support. It provides high-quality recording and playback with a single 20- to 30-second message. It is ideal for portable voice recorders, toys, and many other consumer and industrial applications. . APLUS integrated analog/multi-level storage technology is implemented in advanced Flash non-volatile memory cells, each of which can typically store more than 256 voltage levels. The APR9301 -V2 stores and reproduces voice signals in their natural forms, eliminating the distortion that is often introduced by encoding and compression. The device combines a small size with low power consumption, nonvolatility, and ease-of-use for a cost effective solution to voice recording and playback. Page 1 APLUS APR9301-V2 Functional Block Diagram Figure 2 shows the functional block diagram for the APR9301-V2 Figure 2 APR9301 -V2 Functional Block Diagram VCCD VCCA VSSD VSSA Power Supplies Internal O scillator OscR AnaIn S w itched C apacitor Filter Amp AnaOut MicIn MicRef S am ple & H old C ircuit A nalog W rite & R ead C ircuits S w itched C apacitor Filter PreAmp N on-Volatile A nalog Storage M em ory A rray AGC A utom atic G ain C ontrol (A G C ) Amp Device Control /RecL /PlayE Sample Application Figure 3 shows the diagram for a single, 20-second message recording and playback application using theAPR9301 device. When pins are connected as shown in this example, the operating modes are as follows: Record Mode (Level-Activated) A single voice message of up to 20 seconds can be recorded. The /LED pin will go low during the actual recording process to provide a visual indication if an LED light is connected to this pin. The chip is in record mode as long as the /RecL pin stays low (level-activated). If the message lasts longer than 20 seconds, recording will terminate automatically after the last available memory cell is written. If the message is shorter than 20 seconds, the recording operation will stop when the the /RecL pin goes high. The speaker driver is automatically tristated during the recording operation. Messages of up to 30 seconds can be recorded by using different OscR resistor values (see Table 1). Pag ge 2 SP+ SP- /LED Playback Mode (Edge-Activated) Playback always starts from the beginning of the message. The chip is in playback mode after the /PlayE pin pulses low (edge-activated). Playback will stop immediately when the /PlayE pin pulses low a second time. If the newly recorded message is shorter than the previously recorded message, the remaining portion of the previous message will not be played after the new message is played back. The input preamplifier, AGC, and main amplifier circuits are disabled during playback. Standby Mode (/CE = "0") The chip will automatically return to the standby state after recording or playback operation is completed. Power Down Mode (/CE = "1") The chip is always in standby state. No recording or playback is allowed. Current consumption is typically less than 1 uA. APLUS Figure 3 APR9301-V2 Sample Application for the APR9301-V2 VC C(6VDC) NC 1 28 V CCD NC 2 27 NC 3 26 /RecL V SSD NC 4 25 /LED NC 5 24 NC /C E 6 23 /P layE O scR 7 22 NC NC 8 21 A naO ut NC 9 20 A naIn 52K NC 10 19 AGC NU1 11 18 M icRef V SS 12 17 M icIn SP+ 13 16 VccA_R SP- 14 15 VccA_L For low power applications use double pole switch. V CC VCC 1K 150K 0.1µF 220K 4.7µ F V CC 0.1uF 1K 47u 22µF 4.7K 0.1µ F 8 Ohm Speaker E lectret M icrophone 0.1µ F 4.7K Notes: NC = No Connect (must be floating). Pins 23 and 27 have internal pull-up resistors. The typical sampling frequency is 6.4 kHz with OscR = 52 kW. Table 1 Substrate should be connected to GND. Typical Dependence of Sampling Frequency and Total Voice Duration on OscR Resistor Value (VCCA = VCCD = 6V; VSSA = VSSD = 0V; TA = 25oC) Pin 7 - OscR Typical Sampling Frequency Cutoff Frequency (3 dB Point) Typical Total Voice Duration 38 kW 8 kHz 3.4 kHz 16 seconds 52 kW 6.4 kHz 2.7 kHz 20 seconds 67 kW 5.3 kHz 2.3 kHz 24 seconds 89 kW 4.0 kHz 1.7 kHz 32 seconds g Page 3 APLUS APR9301-V2 Figure 4 shows the same application using external microphone biasing instead of the microphone amplifier on the APR9301 -V2 , thus bypassing the preamplifier portion of the chip function. Figure 4 Sample Application Using External Microphone Biasing V CC ( 6 V D C ) 1 28 V CCD NC 2 27 NC 3 26 /R ecL V SSD NC 4 NC 5 /CE 6 O scR 7 NC 8 NC 9 APR9301-V2 52K NC 25 24 /LED NC 23 /P layE 22 NC 21 NC 20 A naIn 2K V CC 10 K 10 19 NC 11 18 NC V SS 12 17 NC SP+ 13 16 VccA_R 14 15 VccA_L SP- VCC 1K 0.1µ F NU1 NC VCC 22µF 0.1 µ F 100K R2 47µ F 0.1uF T1 Electret M icrophone 8 Ohm Speaker Notes: NC = No Connect (must be floating). Pins 23 and 27 have internal pull-up resistors. The typical sampling frequency is 6.4 kHz with OscR = 52 kW. NPN bipolar transistor, T1 model #MPS3904 or equivalent. R1 and R2 are recommended to be 30 kW and 10 kW, respectively, for typical applications. Electrical Characteristics Tables 2 through 4 list Absolute Maximum Ratings, Recommended DC Characteristics, and recommended Analog Characteristics for the APR9301-V2 device. Absolute Maximum Ratings Stresses greater than those listed in Table 2 may cause permanent damage to the device. These specifications represent a stress rating only. Operation of the device at these or any other conditions above those specified in the recommended DC Characteristics or recommended Analog Characteristics of this specification is not implied. Operation of the device at maximum conditions for extended periods may affect reliability. Page 4 Substrate should be connected to GND. APLUS Table 2 APR9301-V2 Absolute Maximum Ratings. Item Symbol Condition Min Max Unit o Power Supply Voltage VCC TA = 25 C 5.5 6.5 V Input Voltage VIN1 TA = 25 oC -0.3 VCC +0.3 V Input Voltage VIN2 |IIN| < 20 mA -1.0 VCC +1.0 V Storage Temperature TSTG - -65 150 oC Temperature Under Bias TBS - -65 125 o Lead Temperature TLD 300 oC Table 3 <10s - C DC Characteristics Note 1 Item Symbol Input High Voltage V Input Low Voltage V IH Condition Min Typ - 0.8 V CC Max x - Unit V - - - 0.8 V Output High Voltage V OH IOH = -1.6mA 2.4 - - V Output Low Voltage V OL IOL = 4.0mA - - 0.45 V Input Leakage Current IIH VIH = VCC - - 1.0 uA Input Leakage Current IIL -1.0 - - uA Output Tristate Leakage Current IOZ VOUT = VCC or VOUT = VSS -1.0 - 1.0 uA Operating Current Consumption Standby Current Consumption ICC ICCS Internal Clock, No Load No Load - 25 1.0 - mA Typ Max Unit Table 4 IL VIL = VSS Note 2 uA Analog Characteristics Note 1 Item Symbol Condition Min MicIn Input Voltage V MI - - - 20 mVP-P MicIn Input Resistance RMI - - 10 - kW MicIn Amp Gain (1) GMI1 AGC < 2.2V - 24 - dB MicIn Amp Gain (2) GMI2 AGC > 3.0V - -45 -15 dB AnaIn Input Voltage VANI - - - 50 mVP-P AnaIn Input Resistance RANI - - 10 - kW AnaIn Amp Gain GANI AnaIn to SP+/- 22 - dB AGC Output Resistance RAGC - 1 - kW PSP RSP+/- = 16W - 12.2 - mW - 1.25 - VP-P SP+/- Output Power Voltage Amplitude Across SP+/- VSP RSP+/- > 16W Total Harmonic Distrotion THD @ 1kHz & 20mVp-p input - 1 % Note 1: Typical Values: VCCD = VCCA = 6V; VSSD = VSSA = 0V; T A = 25oC Note 2: Except pins 23 and 27 which have internal pull-up resistors. Page 5 APLUS APR9301-V2 Bonding Pad Diagram & Description of Bonding Pad Coordinates Figure 5 APR9301-V2 Die Bonding Pad Diagram V CC D /R L ec 2 NU /L ED N CC C C C C C C N N N N N V C Notes: E N /C /P D yE C OscR la N Die Dimensions: x = 214 + 1 mils y = 144 + 1 mils APR9301-V2 C AnaOut SP N C N 1 VS SD VS SA A SP + - V CC AnaIn V A CC A M M ic In ic Re AG f C NU S VS Die diagram is with respect to die center (µ m). C Die Thickness: 13.8 + 1.0 mils (350 + 25 µ m Pad Opening: 110 µ m 4.3 mils N Connect substrate to ground. Table 5 APR9301-V2 Bonding Pad Coordinates X Axis(Note) Y Axis(Note) Chip Enable -2496.20 1565.80 OscR Oscillator Frequency-Setting Resistor -2459.55 729.80 NU1 Connect to Ground -1808.45 -1496.10 VSSD Digital Ground Supply -1564.05 -1572.00 VSSA Analog Ground Supply -1384.05 -1548.70 VSSA Analog Ground Supply -1204.35 -1477.10 SP+ Non-Inverting Speaker Output -707.15 -1390.00 SP- Inverting Speaker Output 479.15 -1389.90 VCCA Analog Power Supply 976.45 -1492.00 VCCA Analog Power Supply 1190.40 -1523.70 MicIn Microphone Input 1619.45 -1551.40 Microphone Reference Input 2035.45 -1551.40 AGC Automatic Gain Control 2487.45 -1551.40 AnaIn Analog Signal Input 2487.45 -1049.90 AnaOut Analog Signal Output 2487.45 -648.90 /PlayE Edge-Activated Playback 2493.65 1371.10 /LED LED Output 1430.70 1565.80 NU2 Connect to Ground 865.75 1565.80 /RecL Level-Activated Record 258.15 1565.80 VCCD Digital Power Supply -229.40 1579.05 VCCD Digital Power Supply -510.80 1541.60 Pin /CE MicRef Pin Name Note: With respect to die center (µ m) Page 6