SG1316 Semiconductor Chip LED Lamp Features • • • • 1.6mm(L)×0.8mm small size surface mount type Thin package of 0.55mm(H) thickness Transparent clear lens optic Low power consumption type chip LED Applications • • • • LCD backlighting Keypad backlighting Symbol backlighting Front panel indicator lamp Outline Dimensions unit : KLG-0002-000 mm 1 SG1316 Absolute maximum ratings Characteristic Symbol Ratings Unit Power Dissipation PD 70 mW Forward Current IF 25 mA IFP 50 mA Reverse Voltage VR 4 V Operating Temperature Topr -25∼80 ℃ Storage Temperature Tstg -30∼100 ℃ 1 * Peak Forward Current 2 240℃ for 5 seconds * Soldering Temperature Tsol *1.Duty ratio = 1/16, Pulse width = 0.1ms *2.Recommended soldering Temperature Profile 2-1) Preheating 100℃ to 150℃ within 2 minutes Soldering 240℃ within 5 seconds Gradual cooling (Avoid quenching) Electrical Characteristics Characteristic Symbol Test Condition Min Typ Max Forward Voltage VF IF= 20mA - 2.1 2.8 V Luminous Intensity IV IF= 20mA - 3 - mcd λP Δλ IR IF= 20mA - 557 - nm IF= 20mA - 30 - nm VR=4V - - 10 uA - ±65 - - ±70 - Peak Wavelength Spectrum Bandwidth Reverse Current Half angle θ1/2 X Y IF= 20mA KLG-0002-000 Unit deg 2 SG1316 Characteristic Diagrams Fig. 2 IV - IF Forward Current IF [mA] Luminous Intensity Iv [mcd] Fig. 1 IF - VF Forward Voltage VF [V] Forward Fig.4 Spectrum Distribution Fig. 3 IF – Ta Forward Relative Intensity [%] Current IF [mA] Current IF [mA] Ambient Temperature Ta [℃] Fig. 5-1 Radiation Diagram(X) Wavelength λ [nm] Fig. 5-2 Radiation Diagram(Y) Relative Luminous Intensity Iv [%] Relative Luminous Intensity Iv [%] KLG-0002-000 3