BB DAC8801

 DAC8801
SLAS403A – NOVEMBER 2004 – REVISED DECEMBER 2004
14-Bit, Serial Input Multiplying Digital-to-Analog Converter
FEATURES
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
14-Bit Monotonic
±1 LSB INL
±0.5 LSB DNL
Low Noise: 12 nV/√Hz
Low Power: IDD = 2 µA
+2.7 V to +5.5 V Analog Power Supply
2 mA Full-Scale Current ±20%
with VREF = 10 V
0.5 µs Settling Time
4-Quadrant Multiplying Reference-Input
Reference Bandwidth: 10 MHz
±10 V Reference Input
Reference Dynamics: -105 THD
3-Wire 50-MHz Serial Interface
Tiny 8-Lead 3 x 3 mm SON and 3 x 5 mm
MSOP Packages
Industry-Standard Pin Configuration
APPLICATIONS
•
•
•
•
Automatic Test Equipment
Instrumentation
Digitally Controlled Calibration
Industrial Control PLCs
DESCRIPTION
The DAC8801 multiplying digital-to-analog converter
is designed to operate from a single 2.7-V to 5.5-V
supply.
The applied external reference input voltage VREF
determines the full-scale output current. An internal
feedback resistor (RFB) provides temperature tracking
for the full-scale output when combined with an
external I-to-V precision amplifier.
A serial-data interface offers high-speed, three-wire
microcontroller compatible inputs using data-in (SDI),
clock (CLK), and chip select (CS).
The DAC8801 is packaged in space-saving 8-lead
SON and MSOP packages.
DAC8801
VDD
VREF
D/A
Converter
RFB
IOUT
14
CS
DAC
Register
14
CLK
SDI
Shift
Register
GND
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004, Texas Instruments Incorporated
DAC8801
www.ti.com
SLAS403A – NOVEMBER 2004 – REVISED DECEMBER 2004
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
(1)
PRODUCT
MINIMUM
RELATIVE
ACCURACY
(LSB)
DIFFERENTIAL
NONLINEARITY
(LSB)
PACKAGELEAD
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
DAC8801
±1
±0.5
MSOP-8
DGK
-40°C to +85°C
F01
DAC8801IDGKT
Tape and Reel,
250
DAC8801
±1
±0.5
MSOP-8
DGK
-40°C to +85°C
F01
DAC8801IDGKR
Tape and Reel,
2500
DAC8801
±1
±0.5
SON-8
DRB
-40°C to +85°C
E01
DAC8801IDRBT
Tape and Reel,
250
DAC8801
±1
±0.5
SON-8
DRB
-40°C to +85°C
E01
DAC8801IDRBR
Tape and Reel,
2500
(1)
TRANSPORT
MEDIA,
QUANTITY
For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or refer to our
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
DAC8801
UNITS
-0.3 to +7
V
Digital Input voltage to GND
-0.3 to +VDD + 0.3
V
VOUT to GND
-0.3 to +VDD + 0.3
V
Operating temperature range
-40 to +105
°C
Storage temperature range
-65 to +150
°C
+125
°C
VDD to GND
Junction temperature range (TJ max)
Power dissipation
Thermal impedance, RΘJA
(TJ max - TA) / RΘJA
W
+55
°C/W
Lead temperature, soldering
Vapor phase (60s)
+215
°C
Lead temperature, soldering
Infrared (15s)
+220
°C
ESD rating, HBM
1500
V
ESD rating, CDM
1000
V
(1)
2
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
DAC8801
www.ti.com
SLAS403A – NOVEMBER 2004 – REVISED DECEMBER 2004
ELECTRICAL CHARACTERISTICS
VDD = +2.7 V to +5.5 V; IOUT = Virtual GND, GND = 0 V; VREF = 10 V; TA = Full Operating Temperature; all specifications
-40°C to +85°C unless otherwise noted.
DAC8801
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
STATIC PERFORMANCE
Resolution
14
Bits
Relative accuracy
Differential nonlinearity
Output leakage current
Data = 0000h, TA = 25°C
Output leakage current
Data = 0000h, TA = TMAX
Full-scale gain error
All ones loaded to DAC register
±1
Full-scale tempco
OUTPUT
±1
LSB
±0.5
LSB
10
nA
10
nA
±4
mV
±3
ppm of FSR/°C
2
mA
50
pF
CHARACTERISTICS (1)
Output current
Output capacitance
Code dependent
REFERENCE INPUT
VREF Range
-15
Input resistance
Input capacitance
LOGIC INPUTS AND
15
V
5
kΩ
5
pF
OUTPUT (1)
Input low voltage
VIL VDD = +2.7V
0.6
V
Input low voltage
VIL VDD = +5V
0.8
V
Input high voltage
VIH VDD = +2.7V
2.1
Input high voltage
VIH VDD = +5V
2.4
Input leakage current
Input capacitance
V
V
IIL
10
µA
CIL
10
pF
50
MHz
INTERFACE TIMING
Clock input frequency
fCLK
Clock pulse width high
10
ns
Clock pulse width low
10
ns
CS to Clock setup time
0
ns
Clock to CS hold time
10
ns
Data setup time
5
ns
Data hold time
10
ns
POWER REQUIREMENTS
VDD
2.7
5.5
V
IDD (normal operation)
Logic inputs = 0 V
5
µA
VDD = +4.5V to +5.5V
VIH = VDD and VIL = GND
3
5
µA
VDD = +2.7V to +3.6V
VIH = VDD and VIL = GND
1
2.5
µA
AC CHARACTERISTICS
Output voltage settling time
Reference multiplying BW
VREF = 5 VPP, Data = 3FFFh
DAC glitch impulse
VREF = 0 V, Data = 3FFFh to 2000h
Feedthrough error
VREF = 100 mVRMS, 100kHz, Data = 0000h
Digital feedthrough
Total harmonic distortion
100Hz to 20kHz
Output spot noise voltage
f = 1 kHz, BW = 1 Hz
(1)
0.5
µs
10
MHz
2
nV/s
-70
dB
2
nV/s
-105
dB
12
nV/√Hz
Specified by design and characterization, not production tested.
3
DAC8801
www.ti.com
SLAS403A – NOVEMBER 2004 – REVISED DECEMBER 2004
PIN ASSIGNMENTS
DGK PACKAGE
(TOP VIEW)
DRB PACKAGE
(TOP VIEW)
CLK
1
8
CS
CLK
1
8
CS
SDI
2
7
VDD
SDI
2
7
RFB
3
6
GND
VDD
VREF
4
5
IOUT
RFB
3
6
GND
VREF
4
5
IOUT
TERMINAL FUNCTIONS
4
PIN
NAME
1
CLK
Clock input, positive edge triggered clocks data into shift register
DESCRIPTION
2
SDI
Serial register input, data loads directly into the shift register MSB first. Extra leading
bits are ignored.
3
RFB
Internal matching feedback resistor. Connect to external op amp output.
4
VREF
DAC reference input pin. Establishes DAC full-scale voltage. Constant input resistance
versus code.
5
IOUT
DAC current output. Connects to inverting terminal of external precision I to V op amp.
6
GND
Analog and digital ground
7
VDD
Posiitve power supply input. Specified range of operation 2.7 V to 5.5 V.
8
CS
Chip select, active low digital input. Transfers shift register data to DAC register on
rising edge. See Table 1 for operation.
DAC8801
www.ti.com
SLAS403A – NOVEMBER 2004 – REVISED DECEMBER 2004
TYPICAL CHARACTERISTICS: VDD = +5 V
At TA = +25°C, +VDD = +5 V, unless otherwise noted.
LINEARITY ERROR
vs DIGITAL INPUT CODE
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
1.0
TA = +25 C
0.6
0.6
0.4
0.4
0.2
0
−0.2
0.2
0
−0.2
−0.4
−0.4
−0.6
−0.6
−0.8
−0.8
−1.0
−1.0
0
1.0
2048
4096
0
6144 8192 10240 12288 14336 16384
Digital Input Code
2048
4096
Figure 2.
LINEARITY ERROR
vs DIGITAL INPUT CODE
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
TA = −40C
0.8
0.6
0.4
0.4
DNL (LSB)
0.6
0.2
0
−0.2
0.2
0
−0.2
−0.4
−0.4
−0.6
−0.6
−0.8
−0.8
−1.0
−1.0
0
2048
4096
6144
8192 10240 12288 14336 16384
0
2048
4096
Digital Input Code
Figure 4.
LINEARITY ERROR
vs DIGITAL INPUT CODE
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
TA = +85 C
0.8
6144 8192 10240 12288 14336 16384
Digital Input Code
Figure 3.
1.0
TA = +85 C
0.8
0.6
0.6
0.4
0.4
DNL (LSB)
INL (LSB)
6144 8192 10240 12288 14336 16384
Digital Input Code
Figure 1.
TA = −40C
0.8
INL (LSB)
TA = +25 C
0.8
DNL (LSB)
INL (LSB)
0.8
0.2
0
−0.2
0.2
0
−0.2
−0.4
−0.4
−0.6
−0.6
−0.8
−0.8
−1.0
−1.0
0
2048
4096
6144
8192 10240 12288 14336 16384
Digital Input Code
Figure 5.
0
2048
4096
6144 8192 10240 12288 14336 16384
Digital Input Code
Figure 6.
5
DAC8801
www.ti.com
SLAS403A – NOVEMBER 2004 – REVISED DECEMBER 2004
TYPICAL CHARACTERISTICS: VDD = +5 V (continued)
At TA = +25°C, +VDD = +5 V, unless otherwise noted.
SUPPLY CURRENT
vs LOGIC INPUT VOLTAGE
REFERENCE BANDWIDTH
1.6
6
0
−6
−12
−18
−24
−30
−36
−42
−48
−54
−60
−66
−72
−78
−84
−90
−96
−102
−108
−114
VDD = +5.0V
1.2
Attenuation (dB)
Supply Current, IDD (mA)
1.4
1.0
0.8
0.6
0.4
0.2
VDD = +2.7V
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
10
1k
10k
100k
Figure 7.
Figure 8.
DAC SETTLING TIME
DAC GLITCH
Voltage Output Settling
Trigger Pulse
Time (0.1µs/div)
Figure 9.
6
100
1M
10M
Bandwidth (Hz)
Output Voltage (50mV/div)
Output Voltage (5V/div)
Logic Input Voltage (V)
Code: 3FFFh to 2000h
Trigger Pulse
Time (0.2µs/div)
Figure 10.
100M
DAC8801
www.ti.com
SLAS403A – NOVEMBER 2004 – REVISED DECEMBER 2004
TYPICAL CHARACTERISTICS: VDD = +2.7V
At TA = +25°C, +VDD = +2.7V, unless otherwise noted.
LINEARITY ERROR
vs DIGITAL INPUT CODE
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
TA = +25 C
0.8
0.6
0.6
0.4
0.4
DNL (LSB)
INL (LSB)
1.0
TA = +25 C
0.8
0.2
0
−0.2
0.2
0
−0.2
−0.4
−0.4
−0.6
−0.6
−0.8
−0.8
−1.0
−1.0
0
2048
4096
6144
8192 10240 12288 14336 16384
0
2048
4096
Digital Input Code
1.0
Figure 12.
LINEARITY ERROR
vs DIGITAL INPUT CODE
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
0.6
0.6
0.4
0.4
0.2
0
−0.2
0.2
0
−0.2
−0.4
−0.4
−0.6
−0.6
−0.8
−0.8
−1.0
−1.0
0
2048
4096
0
6144 8192 10240 12288 14336 16384
Digital Input Code
2048
4096
6144
8192 10240 12288 14336 16384
Digital Input Code
Figure 13.
Figure 14.
LINEARITY ERROR
vs DIGITAL INPUT CODE
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
1.0
TA = +85 C
0.8
TA = +85 C
0.8
0.6
0.6
0.4
0.4
DNL (LSB)
INL (LSB)
TA = −40C
0.8
DNL (LSB)
INL (LSB)
Figure 11.
TA = −40C
0.8
6144 8192 10240 12288 14336 16384
Digital Input Code
0.2
0
−0.2
0.2
0
−0.2
−0.4
−0.4
−0.6
−0.6
−0.8
−0.8
−1.0
−1.0
0
2048
4096
6144
8192 10240 12288 14336 16384
0
2048
4096
6144
8192 10240 12288 14336 16384
Digital Input Code
Digital Input Code
Figure 15.
Figure 16.
7
DAC8801
www.ti.com
SLAS403A – NOVEMBER 2004 – REVISED DECEMBER 2004
THEORY OF OPERATION
The DAC8801 is a single channel current output, 16-bit digital-to-analog converter (DAC). The architecture,
illustrated in Figure 17, is an R-2R ladder configuration with the three MSBs segmented. Each 2R leg of the
ladder is either switched to GND or the IOUT terminal. The IOUT terminal of the DAC is held at a virtual GND
potential by the use of an external I/V converter op amp. The R-2R ladder is connected to an external reference
input VREF that determines the DAC full-scale current. The R-2R ladder presents a code independent load
impedance to the external reference of 5 kΩ± 25%. The external reference voltage can vary in a range of -10 V
to 10 V, thus providing bipolar IOUT current operation. By using an external I/V converter and the DAC8801 RFB
resistor, output voltage ranges of -VREF to VREF can be generated.
When using an external I/V converter and the DAC8801 RFB resistor, the DAC output voltage is given by
Equation 1:
V OUT −VREF CODE
16384
(1)
R
R
R
VREF
2R
2R
2R
2R
2R
2R
2R
2R
2R
2R
2R
2R
RFB
IOUT
GND
Figure 17. Equivalent R-2R DAC Circuit
Each DAC code determines the 2R leg switch position to either GND or IOUT. Because the DAC output
impedance as seen looking into the IOUT terminal changes versus code, the external I/V converter noise gain will
also change. Because of this, the external I/V converter op amp must have a sufficiently low offset voltage such
that the amplifier offset is not modulated by the DAC IOUT terminal impedance change. External op amps with
large offset voltages can produce INL errors in the transfer function of the DAC8801 due to offset modulation
versus DAC code. For best linearity performance of the DAC8801, an op amp (OPA277) as shown in Figure 18
is recommended. This circuit allows VREF to swing from -10V to +10V.
VDD
U1
VDD
VREF
DAC8801
RFB
U2 15 V
IOUT
_
V+
OPA277
GND
+
V−
−15 V
Figure 18. Voltage Output Configuration
8
VO
DAC8801
www.ti.com
SDI
SLAS403A – NOVEMBER 2004 – REVISED DECEMBER 2004
D13
D12
D11
D10
D9
D8
D7
D6
D1
D0
CLK
t(DS)
t(CH)
t(CL)
t(DH)
t(CSS)
t(CSH)
CS
Figure 19. DAC8801 Timing Diagram
Table 1. Control Logic Truth Table (1)
(1)
CLK
CS
Serial Shift Register
DAC Register
X
H
No effect
Latched
↑+
L
Shift register data advanced one bit
Latched
X
H
No effect
Latched
X
↑+
Shift register data transferred to DAC register
New data loaded from serial register
↑+ Positive logic transition; X = Don't care
Table 2. Serial Input Register Data Format, Data Loaded MSB First
Bit
B13
(MSB)
B12
B11
B10
B9
B8
B7
B6
B5
B4
B3
B2
B1
B0
(LSB)
Data (1)
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
(1)
A full 16-bit data word can be loaded into the serial register, but only the last 14 bits are transferred to the DAC register when CS goes
high.
9
DAC8801
www.ti.com
SLAS403A – NOVEMBER 2004 – REVISED DECEMBER 2004
APPLICATION INFORMATION
Stability Circuit
For a current-to-voltage design as shown in Figure 20, the DAC8801 current output (IOUT) and the connection
with the inverting node of the op amp should be as short as possible and according to correct PCB layout design.
For each code change there is a step function. If the GBP of the op amp is limited and parasitic capacitance is
excessive at the inverting node then gain peaking is possible. Therefore, for circuit stability, a compensation
capacitor C1 (4 pF to 20 pF typ) can be added to the design as shown in Figure 20.
VDD
VDD
VREF
RFB
_
IOUT
U1
VREF
C1
U2
VOUT
+
GND
Figure 20. Gain Peaking Prevention Circuit With Compensation Capacitor
Positive Voltage Output Circuit
As shown in Figure 21, in order to generate a positive voltage output, a negative reference is input to the
DAC8801. This design is suggested instead of using an inverting amp to invert the output due to tolerance errors
of the resistor. For a negative reference, VOUT and GND of the reference are level-shifted to a virtual ground and
a -2.5 V input to the DAC8801 with an op amp.
+2.5V Reference
VOUT
VIN
GND
VREF
−
+
VDD
VDD
RFB
DAC8801
−2.5 V
OPA277
C1
IOUT
OPA277
−
+
VOUT
GND
0 VOUT +2.5 V
Figure 21. Positive Voltage Output Circuit
10
DAC8801
www.ti.com
SLAS403A – NOVEMBER 2004 – REVISED DECEMBER 2004
Bipolar Output Circuit
The DAC8801, as a 2-quadrant multiplying DAC, can be used to generate a unipolar output. The polarity of the
full-scale output IOUT is the inverse of the input reference voltage at VREF.
Some applications require full 4-quadrant multiplying capabilities or bipolar output swing. As shown in Figure 22,
external op amp U4 is added as a summing amp and has a gain of 2X that widens the output span to 5 V. A
4-quadrant multiplying circuit is implemented by using a 2.5-V offset of the reference voltage to bias U4.
According to the circuit transfer equation given in Equation 2, input data (D) from code 0 to full scale produces
output voltages of VOUT = -2.5 V to VOUT = +2.5 V.
V OUT 16,D384 1 V
REF
(2)
10 k
VDD
5 k
VREF
C2
−
RFB
VDD
+2.5 V
(+10 V)
10 k
+
C1
DAC8801
VOUT
U4
OPA277
−
IOUT
+
GND
U2
OPA277
−2.5 V VOUT +2.5 V
(−10 V VOUT +10 V)
Figure 22. Bipolar Output Circuit
Programmable Current Source Circuit
A DAC8801 can be integrated into the circuit in Figure 23 to implement an improved Howland current pump for
precise voltage to current conversions. Bidirectional current flow and high voltage compliance are two features of
the circuit. A application of this circuit includes a 4-mA to 20-mA current transmitter with up to a 500-Ω load. With
a matched resistor network, the load current of the circuit is shown in Equation 3:
R2 R3 R1
IL VREF D
R3
(3)
R2
15 k
C1
10 pF
R1
150 k
VDD
VDD
VREF
VREF
RFB
U1
DAC8801
U2
OPA277
R3
50 −
U2
OPA277
IOUT
−
VOUT
+
R1
150 k
R2
15 k
R3
50 +
IL
GND
LOAD
Figure 23. Programmable Bidirectional Current Source Circuit
11
DAC8801
www.ti.com
SLAS403A – NOVEMBER 2004 – REVISED DECEMBER 2004
The value of R3 in the previous equation can be reduced to increase the output current drive of U3. U3 can drive
±20 mA in both directions with voltage compliance limited up to 15 V by the U3 voltage supply. Elimination of the
circuit compensation capacitor C1 in the circuit is not suggested because of the change in the output impedance
ZO, according to Equation 4:
R1R3(R1 R2)
ZO R1(R2 R3) R1(R2 R3)
(4)
As shown in Equation 4, with matched resistors, ZO is infinite and the circuit is optimum for use as a current
source. However, if unmatched resistors are used, ZO is positive or negative with negative output impedance
being a potential cause of oscillation. Therefore, by incorporating C1 into the circuit, possible oscillation problems
are eliminated. The value of C1 can be determined for critical applications; however, for most applications a
value of several pF is suggested.
Cross-Reference
The DAC8801 has an industry-standard pinout. Table 3 provides the cross-reference information.
Table 3. Cross Reference
PRODUCT
INL
(LSB)
DNL
(LSB)
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCIPTION
PACKAGE
OPTION
CROSS
REFERENCE
DAC8801IDGK
±1
±1
-40°C to +85°C
8-Lead MicroSOIC
MSOP-8
ADS5553CRM
DAC8801IDRB
±1
±1
-40°C to +85°C
8-Lead Small Outline
SON-8
N/A
12
PACKAGE OPTION ADDENDUM
www.ti.com
30-Mar-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
DAC8801IDGKR
ACTIVE
MSOP
DGK
8
2000
TBD
CU SNPB
Level-1-220C-UNLIM
DAC8801IDGKT
ACTIVE
MSOP
DGK
8
250
TBD
CU SNPB
Level-1-220C-UNLIM
DAC8801IDRBR
ACTIVE
SON
DRB
8
2500
TBD
CU
Level-1-240C-UNLIM
DAC8801IDRBT
ACTIVE
SON
DRB
8
250
TBD
CU
Level-1-240C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright  2005, Texas Instruments Incorporated