SGLS130B − JULY 2002 − REVISED DECEMBER 2003
D Compatible With TMS320 and SPI Serial
features
D Controlled Baseline
D
D
D
D
D
D
D
D
D
− One Assembly/Test Site, One Fabrication
Site
Extended Temperature Performance up to
−55°C to 125°C
Enhanced Diminishing Manufacturing
Sources (DMS) Support
Enhanced Product Change Notification
Qualification Pedigree†
Dual 12-Bit Voltage Output DAC
Programmable Internal Reference
Programmable Settling Time:
1 µs in Fast Mode,
3.5 µs in Slow Mode
Ports
Differential Nonlinearity <0.5 LSB Typ
Monotonic Over Temperature
applications
D
D
D
D
D
Digital Servo Control Loops
Digital Offset and Gain Adjustment
Industrial Process Control
Machine and Motion Control Devices
Mass Storage Devices
D PACKAGE
(TOP VIEW)
DIN
SCLK
CS
OUTA
† Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this component
beyond specified performance and environmental limits.
1
8
2
7
3
6
4
5
VDD
OUTB
REF
AGND
description
The TLV5638 is a dual 12-bit voltage output DAC with a flexible 3-wire serial interface. The serial interface allows
glueless interface to TMS320 and SPI, QSPI, and Microwire serial ports. It is programmed with a 16-bit
serial string containing 4 control and 12 data bits.
The resistor string output voltage is buffered by a x2 gain rail-to-rail output buffer. The buffer features a Class
AB output stage to improve stability and reduce settling time. The programmable settling time of the DAC allows
the designer to optimize speed vs power dissipation. With its on-chip programmable precision voltage
reference, the TLV5638 simplifies overall system design.
Because of its ability to source up to 1 mA, the reference can also be used as a system reference. Implemented
with a CMOS process, the device is designed for single supply operation from 2.7 V to 5.5 V. It is available in
an 8-pin SOIC package to reduce board space.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
PACKAGE‡
TA
−40°C to 125°C
SOIC − D
Tape and reel
TLV5638QDREP
−55°C to 125°C
SOIC − D
Tape and reel
TLV5638MDREP
TOP-SIDE
MARKING
5638QE
5638ME
‡ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SPI and QSPI are trademarks of Motorola, Inc.
Microwire is a trademark of National Semiconductor Corporation.
Copyright 2002 − 2003, Texas Instruments Incorporated
!"#$%! & '("")% $& ! *(+,'$%! -$%)
"!-('%& '!!"# %! &*)''$%!& *)" %.) %)"#& ! )/$& &%"(#)%&
&%$-$"- 0$""$%1 "!-('%! *"!')&&2 -!)& !% )')&&$",1 ',(-)
%)&%2 ! $,, *$"$#)%)"&
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1
SGLS130B − JULY 2002 − REVISED DECEMBER 2003
functional block diagram
REF
AGND
VDD
PGA With
Output Enable
Voltage
Bandgap
Power-On
Reset
Power
and Speed
Control
2
2
2-Bit
Control
Latch
x2
OUTA
x2
OUTB
DIN
12-Bit
DAC A
Latch
12
SCLK
Serial
Interface
and
Control
CS
12
12
Buffer
12
12-Bit
DAC B
Latch
12
Terminal Functions
TERMINAL
NAME
NO.
I/O/P
DESCRIPTION
AGND
5
P
Ground
CS
3
I
Chip select. Digital input active low, used to enable/disable inputs
DIN
1
I
Digital serial data input
OUT A
4
O
DAC A analog voltage output
OUT B
7
O
DAC B analog voltage output
REF
6
I/O
Analog reference voltage input/output
SCLK
2
I
Digital serial clock input
VDD
8
P
Positive power supply
2
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SGLS130B − JULY 2002 − REVISED DECEMBER 2003
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage (VDD to AGND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Reference input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VDD + 0.3 V
Digital input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VDD + 0.3 V
Operating free-air temperature range, TA: TLV5638Q (see Note 1) . . . . . . . . . . . . . . . . . . . . . −40°C to 125°C
TLV5638M (see Note 1) . . . . . . . . . . . . . . . . . . . . . −55°C to 125°C
Storage temperature range, Tstg (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Package thermal impedance, θJA: D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131°C/W
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: Long term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction
of overall device life. See www.ti.com/ep_quality for additional information on enhanced plastic packaging.
recommended operating conditions
Supply voltage, VDD
VDD = 5 V
VDD = 3 V
Power on reset, POR
VDD = 2.7 V
VDD = 5.5 V
Low-level digital input voltage, VIL
VDD = 2.7 V
VDD = 5.5 V
Reference voltage, Vref to REF terminal
NOM
MAX
4.5
5
5.5
V
2.7
3
3.3
V
2
V
0.55
High-level digital input voltage, VIH
Reference voltage, Vref to REF terminal
MIN
2
V
2.4
0.6
0.8
VDD = 5 V (see Note 1)
VDD = 3 V (see Note 1)
Load resistance, RL
AGND
2.048
AGND
1.024
VDD −1.5
VDD −1.5
2
Load capacitance, CL
Clock frequency, fCLK
Operating free-air temperature, TA
UNIT
V
V
V
kΩ
100
pF
20
MHz
TLV5638Q (see Note 2)
−40
125
TLV5638M (see Note 2)
−55
125
°C
NOTES: 1. Due to the x2 output buffer, a reference input voltage ≥ (VDD−0.4 V)/2 causes clipping of the transfer function. The output buffer of
the internal reference must be disabled, if an external reference is used.
2. Long term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction
of overall device life. See www.ti.com/ep_quality for additional information on enhanced plastic packaging.
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SGLS130B − JULY 2002 − REVISED DECEMBER 2003
electrical characteristics over recommended operating conditions, Vref = 2.048 V, Vref = 1.024 V
(unless otherwise noted)
power supply
PARAMETER
IDD
TEST CONDITIONS
No load,
All inputs = AGND
or VDD,
DAC latch = 0x800
Power supply current
MIN
Power supply rejection ratio
MAX
VDD = 5 V,
Int. ref.
Fast
4.3
7
Slow
2.2
3.6
VDD = 3 V,
Int. ref.
Fast
3.8
6.3
Slow
1.8
3.0
VDD = 5 V,
Ext. ref.
Fast
3.9
6.3
Slow
1.8
3.0
VDD = 3 V,
Ext. ref.
Fast
3.5
5.7
Slow
1.5
2.6
0.01
10
Power-down supply current
PSRR
TYP
Zero scale, See Note 2
−65
Full scale,
−65
See Note 3
UNIT
mA
mA
mA
mA
µA
dB
NOTES: 3. Power supply rejection ratio at zero scale is measured by varying VDD and is given by:
PSRR = 20 log [(EZS(VDDmax) − EZS(VDDmin))/VDDmax]
4. Power supply rejection ratio at full scale is measured by varying VDD and is given by:
PSRR = 20 log [(EG(VDDmax) − EG(VDDmin))/VDDmax]
static DAC specifications
PARAMETER
TEST CONDITIONS
Resolution
MIN
TYP
MAX
UNIT
12
bits
INL
Integral nonlinearity, end point adjusted
See Note 4
±1.7
±6
LSB
DNL
Differential nonlinearity
See Note 5
±0.4
±1
LSB
EZS
EZS TC
Zero-scale error (offset error at zero scale)
See Note 6
Zero-scale-error temperature coefficient
See Note 7
EG
Gain error
See Note 8
±24
10
mV
ppm/°C
±0.6
% full
scale V
EG TC
Gain error temperature coefficient
See Note 9
10
ppm/°C
NOTES: 5. The relative accuracy or integral nonlinearity (INL) sometimes referred to as linearity error, is the maximum deviation of the output
from the line between zero and full scale excluding the effects of zero code and full-scale errors. Tested from code 32 to 4095.
6. The differential nonlinearity (DNL) sometimes referred to as differential error, is the difference between the measured and ideal 1
LSB amplitude change of any two adjacent codes. Monotonic means the output voltage changes in the same direction (or remains
constant) as a change in the digital input code.
7. Zero-scale error is the deviation from zero voltage output when the digital input code is zero.
8. Zero-scale-error temperature coefficient is given by: EZS TC = [EZS (Tmax) − EZS (Tmin)]/Vref × 106/(Tmax − Tmin).
9. Gain error is the deviation from the ideal output (2Vref − 1 LSB) with an output load of 10 kΩ excluding the effects of the zero-error.
10. Gain temperature coefficient is given by: EG TC = [EG(Tmax) − EG (Tmin)]/Vref × 106/(Tmax − Tmin).
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electrical characteristics over recommended operating conditions, Vref = 2.048 V, Vref = 1.024 V
(unless otherwise noted) (continued)
output specifications
PARAMETER
VO
TEST CONDITIONS
Output voltage
MIN
RL = 10 kΩ
Output load regulation accuracy
TYP
0
VO = 4.096 V, 2.048 V,
MAX
VDD−0.4
UNIT
V
% full
± 0.25
scale V
RL = 2 kΩ
reference pin configured as output (REF)
PARAMETER
Vref(OUTL)
Vref(OUTH)
Low reference voltage
Iref(source)
Iref(sink)
Output source current
TEST CONDITIONS
High reference voltage
VDD > 4.75 V
MIN
TYP
MAX
UNIT
1.003
1.024
1.045
V
2.027
2.048
2.069
V
1
Output sink current
−1
mA
Load capacitance
PSRR
100
Power supply rejection ratio
mA
−65
pF
dB
reference pin configured as input (REF)
PARAMETER
VI
RI
Input voltage
CI
Input capacitance
TEST CONDITIONS
MIN
TYP
0
MAX
VDD−1.5
Input resistance
10
Reference input bandwidth
REF = 0.2 Vpp + 1.024 V dc
Reference feedthrough
REF = 1 Vpp at 1 kHz + 1.024 V dc (see Note 10)
Slow
V
MΩ
5
Fast
UNIT
pF
1.3
MHz
525
kHz
−80
dB
NOTE 11: Reference feedthrough is measured at the DAC output with an input code = 0x000.
digital inputs
PARAMETER
IIH
IIL
High-level digital input current
Ci
Input capacitance
TEST CONDITIONS
VI = VDD
VI = 0 V
Low-level digital input current
MIN
TYP
1
• DALLAS, TEXAS 75265
UNIT
µA
µA
−1
8
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MAX
pF
5
SGLS130B − JULY 2002 − REVISED DECEMBER 2003
electrical characteristics over recommended operating conditions (unless otherwise noted)
(continued)
analog output dynamic performance
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
Fast
1
3
Slow
3.5
7
Fast
0.5
1.5
Slow
1
2
Fast
12
Slow
1.8
ts(FS)
Output settling time, full scale
RL = 10 kΩ,
See Note 11
CL = 100 pF,
ts(CC)
Output settling time, code to code
RL = 10 kΩ,
See Note 12
CL = 100 pF,
SR
Slew rate
RL = 10 kΩ,
See Note 13
CL = 100 pF,
Glitch energy
DIN = 0 to 1,
CS = VDD
FCLK = 100 kHz,
Signal-to-noise ratio
69
74
S/(N+D)
Signal-to-noise + distortion
58
67
THD
Total harmonic distortion
fs = 480 kSPS, fout = 1 kHz,
RL = 10 kkΩ,,
CL = 100 pF
Spurious free dynamic range
−69
57
µss
µss
V/ s
V/µs
5
SNR
UNIT
nV−s
−57
dB
72
NOTES: 12. Settling time is the time for the output signal to remain within ± 0.5 LSB of the final measured value for a digital input code change
of 0x020 to 0xFDF and 0xFDF to 0x020 respectively. Not tested, assured by design.
13. Settling time is the time for the output signal to remain within ± 0.5 LSB of the final measured value for a digital input code change
of one count. Not tested, assured by design.
14. Slew rate determines the time it takes for a change of the DAC output from 10% to 90% full-scale voltage.
digital input timing requirements
MIN
NOM
MAX
UNIT
tsu(CS−CK)
tsu(C16-CS)
Setup time, CS low before first negative SCLK edge
Setup time, 16th negative SCLK edge (when D0 is sampled) before CS rising edge
10
ns
10
ns
twH
twL
SCLK pulse width high
25
ns
SCLK pulse width low
25
ns
tsu(D)
th(D)
Setup time, data ready before SCLK falling edge
10
ns
Hold time, data held valid after SCLK falling edge
5
ns
6
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PARAMETER MEASUREMENT INFORMATION
twL
SCLK
X
1
2
tsu(D)
DIN
X
twH
3
4
5 15
X
16
th(D)
D15
D14
D13
D12
D1
D0
X
tsu(C16-CS)
tsu(CS-CK)
CS
Figure 1. Timing Diagram
TYPICAL CHARACTERISTICS
SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
POWER DOWN SUPPLY CURRENT
vs
TIME
4.5
2.4
4
2.2
I DD − Supply Current − mA
I DD − Power Down Supply Current − mA
2.6
2
1.8
1.6
1.4
1.2
1
0.8
Fast Mode
3.5
3
2.5
2
Slow Mode
1.5
0.6
0.4
1
0.2
0
0
10
20
30
40
50
60
70
80
t − Time − µs
VDD = 5 V
Vref = Int. 2 V
Input Code = Full Scale (Both DACs)
0.5
−40 −30 −20 −10 0 10 20 30 40 50 60 70 80 90
TA − Free-Air Temperature − °C
Figure 2
Figure 3
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SGLS130B − JULY 2002 − REVISED DECEMBER 2003
TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE
vs
LOAD CURRENT
SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
2.064
4.5
2.062
3.5
Fast Mode
3
2.5
2
Slow Mode
1.5
2.06
Slow Mode
2.058
2.056
2.054
2.052
1
2.05
0.5
−40 −30 −20 −10 0 10 20 30 40 50 60 70 80 90
TA − Free-Air Temperature − °C
0
0.5
1
1.5
2
2.5
3
3.5
4
3.5
4
Source Current − mA
Figure 4
Figure 5
OUTPUT VOLTAGE
vs
LOAD CURRENT
OUTPUT VOLTAGE
vs
LOAD CURRENT
3
4.128
VDD = 5 V
Vref = Int. 2 V
Input Code = 4095
Fast Mode
VDD = 3 V
Vref = Int. 1 V
Input Code = 0
2.5
VO − Output Voltage − V
4.126
VO − Output Voltage − V
VDD = 3 V
Vref = Int. 1 V
Input Code = 4095
Fast Mode
VO − Output Voltage − V
I DD − Supply Current − mA
4
VDD = 3 V
Vref = Int. 1 V
Input Code = Full Scale (Both DACs)
4.124
Slow Mode
4.122
4.12
4.118
Fast Mode
2
1.5
1
0.5
4.116
Slow Mode
0
4.114
0
0.5
1
1.5
2
2.5
3
3.5
4
0
0.5
1.5
2
2.5
Sink Current − mA
Source Current − mA
Figure 6
8
1
Figure 7
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SGLS130B − JULY 2002 − REVISED DECEMBER 2003
TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE
vs
LOAD CURRENT
TOTAL HARMONIC DISTORTION AND NOISE
vs
FREQUENCY
THD+N − Total Harmonic Distortion and Noise − dB
5
VDD = 5 V
Vref = Int. 2 V
Input Code = 0
4.5
3.5
Fast Mode
3
2.5
2
1.5
1
0.5
Slow Mode
0
0
0.5
1
1.5
2
2.5
Sink Current − mA
3
3.5
4
VDD = 5 V
Vref = 1 V dc + 1 V p/p Sinewave
Output Full Scale
−10
−20
−30
−40
−50
−60
Slow Mode
−70
Fast Mode
−80
−90
−100
100
1000
10000
100000
f − Frequency − Hz
Figure 8
Figure 9
TOTAL HARMONIC DISTORTION
vs
FREQUENCY
0
THD − Total Harmonic Distortion − dB
VO − Output Voltage − V
4
0
−10
VDD = 5 V
Vref = 1 V dc + 1 V p/p Sinewave
Output Full Scale
−20
−30
−40
−50
−60
−70
Slow Mode
−80
Fast Mode
−90
−100
100
10000
1000
100000
f − Frequency − Hz
Figure 10
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SGLS130B − JULY 2002 − REVISED DECEMBER 2003
INL − Integral Nonlinearity Error − LSB
TYPICAL CHARACTERISTICS
INTEGRAL NONLINEARITY ERROR
4
3
2
1
0
−1
−2
−3
−4
0
1024
2048
3072
4096
Digital Code
DNL − Differential Nonlinearily Error − LSB
Figure 11
DIFFERENTIAL NONLINEARITY ERROR
1
0.8
0.6
0.4
0.2
0
−0.2
−0.4
−0.6
−0.8
−1
0
1024
2048
Digital Code
3072
4096
Figure 12
APPLICATION INFORMATION
general function
The TLV5638 is a dual 12-bit, single supply DAC, based on a resistor string architecture. It consists of a serial
interface, a speed and power-down control logic, a programmable internal reference, a resistor string, and a
rail-to-rail output buffer.
The output voltage (full scale determined by reference) is given by:
2 REF CODE [V]
0x1000
Where REF is the reference voltage and CODE is the digital input value in the range 0x000 to 0xFFF. A power
on reset initially puts the internal latches to a defined state (all bits zero).
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APPLICATION INFORMATION
serial interface
A falling edge of CS starts shifting the data bit-per-bit (starting with the MSB) to the internal register on the falling
edges of SCLK. After 16 bits have been transferred or CS rises, the content of the shift register is moved to the
target latches (DAC A, DAC B, BUFFER, CONTROL), depending on the control bits within the data word.
Figure 13 shows examples of how to connect the TLV5638 to TMS320, SPI, and Microwire.
TMS320
DSP FSX
DX
CLKX
TLV5638
CS
DIN
SCLK
SPI
I/O
MOSI
SCK
TLV5638
CS
DIN
SCLK
Microwire
I/O
SO
SK
TLV5638
CS
DIN
SCLK
Figure 13. Three-Wire Interface
Notes on SPI and Microwire: Before the controller starts the data transfer, the software has to generate a
falling edge on the pin connected to CS. If the word width is 8 bits (SPI and Microwire), two write operations
must be performed to program the TLV5638. After the write operation(s), the holding registers or the control
register are updated automatically on the 16th positive clock edge.
serial clock frequency and update rate
The maximum serial clock frequency is given by:
f sclkmax +
1
+ 20 MHz
t whmin ) t wlmin
The maximum update rate is:
f updatemax +
1
+ 1.25 MHz
16 ǒt whmin ) t wlminǓ
Note, that the maximum update rate is just a theoretical value for the serial interface, as the settling time of the
TLV5638 has to be considered, too.
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APPLICATION INFORMATION
data format
The 16-bit data word for the TLV5638 consists of two parts:
D Program bits
D New data
(D15..D12)
(D11..D0)
D15
D14
D13
D12
R1
SPD
PWR
R0
SPD: Speed control bit
PWR: Power control bit
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
12 Data bits
1 → fast mode
1 → power down
0 → slow mode
0 → normal operation
The following table lists the possible combination of the register select bits:
register select bits
R1
R0
REGISTER
0
0
Write data to DAC B and BUFFER
0
1
Write data to BUFFER
1
0
Write data to DAC A and update DAC B with BUFFER content
1
1
Write data to control register
The meaning of the 12 data bits depends on the register. If one of the DAC registers or the BUFFER is selected,
then the 12 data bits determine the new DAC value:
data bits: DAC A, DAC B and BUFFER
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
New DAC Value
If control is selected, then D1, D0 of the 12 data bits are used to program the reference voltage:
data bits: CONTROL
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
X
X
X
X
X
X
X
X
X
X
REF1
REF0
X: don’t care
REF1 and REF0 determine the reference source and, if internal reference is selected, the reference voltage.
reference bits
REF1
REF0
REFERENCE
0
0
External
0
1
1.024 V
1
0
2.048 V
1
1
External
CAUTION:
If external reference voltage is applied to the REF pin, external reference MUST be selected.
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APPLICATION INFORMATION
Examples of operation:
D Set DAC A output, select fast mode, select internal reference at 2.048 V:
1. Set reference voltage to 2.048 V (CONTROL register):
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
1
1
0
1
0
0
0
0
0
0
0
0
0
0
1
0
D6
D5
D4
D3
D2
D1
D0
2. Write new DAC A value and update DAC A output:
D15
D14
D13
D12
1
1
0
0
D11
D10
D9
D8
D7
New DAC A output value
The DAC A output is updated on the rising clock edge after D0 is sampled.
To output data consecutively using the same DAC configuration, it is not necessary to program the CONTROL
register again.
D Set DAC B output, select fast mode, select external reference:
3. Select external reference (CONTROL register):
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
1
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
D4
D3
D2
D1
D0
4. Write new DAC B value to BUFFER and update DAC B output:
D15
D14
D13
D12
0
1
0
0
D11
D10
D9
D8
D7
D6
D5
New BUFFER content and DAC B output value
The DAC A output is updated on the rising clock edge after D0 is sampled.
To output data consecutively using the same DAC configuration, it is not necessary to program the CONTROL
register again.
D Set DAC A value, set DAC B value, update both simultaneously, select slow mode, select internal reference
at 1.024 V:
1. Set reference voltage to 1.024 V (CONTROL register):
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
1
0
0
1
0
0
0
0
0
0
0
0
0
0
0
1
D8
D7
D6
D5
D4
D3
D2
D1
D0
D4
D3
D2
D1
D0
2. Write data for DAC B to BUFFER:
D15
D14
D13
D12
0
0
0
1
D11
D10
D9
New DAC B value
3. Write new DAC A value and update DAC A and B simultaneously:
D15
D14
D13
D12
1
0
0
0
D11
D10
D9
D8
D7
D6
D5
New DAC A value
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
13
SGLS130B − JULY 2002 − REVISED DECEMBER 2003
APPLICATION INFORMATION
Examples of operation: (continued)
Both outputs are updated on the rising clock edge after D0 from the DAC A data word is sampled.
To output data consecutively using the same DAC configuration, it is not necessary to program the CONTROL
register again.
D Set power-down mode:
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
X
X
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X = Don’t care
linearity, offset, and gain error using single ended supplies
When an amplifier is operated from a single supply, the voltage offset can still be either positive or negative. With
a positive offset, the output voltage changes on the first code change. With a negative offset, the output voltage
may not change with the first code, depending on the magnitude of the offset voltage.
The output amplifier attempts to drive the output to a negative voltage. However, because the most negative
supply rail is ground, the output cannot drive below ground and clamps the output at 0 V.
The output voltage then remains at zero until the input code value produces a sufficient positive output voltage
to overcome the negative offset voltage, resulting in the transfer function shown in Figure 14.
Output
Voltage
0V
DAC Code
Negative
Offset
Figure 14. Effect of Negative Offset (Single Supply)
This offset error, not the linearity error, produces this breakpoint. The transfer function would have followed the
dotted line if the output buffer could drive below the ground rail.
For a DAC, linearity is measured between zero-input code (all inputs 0) and full-scale code (all inputs 1) after
offset and full scale are adjusted out or accounted for in some way. However, single supply operation does not
allow for adjustment when the offset is negative due to the breakpoint in the transfer function. So the linearity
is measured between full-scale code and the lowest code that produces a positive output voltage.
14
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SGLS130B − JULY 2002 − REVISED DECEMBER 2003
APPLICATION INFORMATION
definitions of specifications and terminology
integral nonlinearity (INL)
The relative accuracy or integral nonlinearity (INL), sometimes referred to as linearity error, is the maximum
deviation of the output from the line between zero and full scale excluding the effects of zero code and full-scale
errors.
differential nonlinearity (DNL)
The differential nonlinearity (DNL), sometimes referred to as differential error, is the difference between the
measured and ideal 1 LSB amplitude change of any two adjacent codes. Monotonic means the output voltage
changes in the same direction (or remains constant) as a change in the digital input code.
zero-scale error (EZS)
Zero-scale error is defined as the deviation of the output from 0 V at a digital input value of 0.
gain error (EG)
Gain error is the error in slope of the DAC transfer function.
total harmonic distortion (THD)
THD is the ratio of the rms value of the first six harmonic components to the value of the fundamental signal.
The value for THD is expressed in decibels.
signal-to-noise ratio + distortion (S/N+D)
S/N+D is the ratio of the rms value of the output signal to the rms sum of all other spectral components below
the Nyquist frequency, including harmonics but excluding dc. The value for S/N+D is expressed in decibels.
spurious free dynamic range (SFDR)
Spurious free dynamic range is the difference between the rms value of the output signal and the rms value of
the largest spurious signal within a specified bandwidth. The value for SFDR is expressed in decibels.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
15
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TLV5638MDREP
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV5638QDREP
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/03628-01XE
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/03628-02XE
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TLV5638-EP :
TLV5638
• Catalog:
• Military: TLV5638M
NOTE: Qualified Version Definitions:
- TI's standard catalog product
• Catalog
• Military - QML certified for Military and Defense Applications
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TLV5638MDREP
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLV5638QDREP
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TLV5638MDREP
SOIC
D
8
2500
367.0
367.0
35.0
TLV5638QDREP
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 2
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