PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN5401J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type SN54LS01J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type SN54LS01J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type SN7401N OBSOLETE PDIP N 14 TBD Call TI Call TI SN7401N OBSOLETE PDIP N 14 TBD Call TI Call TI SN7401N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN7401N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74LS01D OBSOLETE SOIC D 14 TBD Call TI Call TI Lead/Ball Finish MSL Peak Temp (3) SN74LS01D OBSOLETE SOIC D 14 TBD Call TI Call TI SN74LS01DR OBSOLETE SOIC D 14 TBD Call TI Call TI SN74LS01DR OBSOLETE SOIC D 14 TBD Call TI Call TI SN74LS01N OBSOLETE PDIP N 14 TBD Call TI Call TI SN74LS01N OBSOLETE PDIP N 14 TBD Call TI Call TI SN74LS01N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74LS01N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SNJ5401J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type SNJ5401J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type SNJ5401W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type 1 N / A for Pkg Type SNJ5401W ACTIVE CFP W 14 TBD A42 SNJ54LS01FK OBSOLETE LCCC FK 20 TBD Call TI Call TI SNJ54LS01FK OBSOLETE LCCC FK 20 TBD Call TI Call TI SNJ54LS01J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type SNJ54LS01J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type SNJ54LS01W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ54LS01W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. 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