TI SNJ54LVTH16245AWD

SCBS143P − MAY 1992 − REVISED SEPTEMBER 2003
D Members of the Texas Instruments
D
D
D
D
D
D
D
D
D
D
SN54LVTH16245A . . . WD PACKAGE
SN74LVTH16245A . . . DGG, DGV, OR DL PACKAGE
(TOP VIEW)
Widebus  Family
State-of-the-Art Advanced BiCMOS
Technology (ABT) Design for 3.3-V
Operation and Low Static-Power
Dissipation
Support Mixed-Mode Signal Operation
(5-V Input and Output Voltages With
3.3-V VCC )
Support Unregulated Battery Operation
Down to 2.7 V
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
Distributed VCC and GND Pins Minimize
High-Speed Switching Noise
Flow-Through Architecture Optimizes PCB
Layout
Ioff and Power-Up 3-State Support Hot
Insertion
Bus Hold on Data Inputs Eliminates the
Need for External Pullup/Pulldown
Resistors
Latch-Up Performance Exceeds 500 mA Per
JESD 17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
1DIR
1B1
1B2
GND
1B3
1B4
VCC
1B5
1B6
GND
1B7
1B8
2B1
2B2
GND
2B3
2B4
VCC
2B5
2B6
GND
2B7
2B8
2DIR
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
1OE
1A1
1A2
GND
1A3
1A4
VCC
1A5
1A6
GND
1A7
1A8
2A1
2A2
GND
2A3
2A4
VCC
2A5
2A6
GND
2A7
2A8
2OE
description/ordering information
The ’LVTH16245A devices are 16-bit (dual-octal) noninverting 3-state transceivers designed for low-voltage
(3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.
ORDERING INFORMATION
TOP-SIDE
MARKING
Tube
SN74LVTH16245ADL
Tape and reel
SN74LVTH16245ADLR
TSSOP − DGG
Tape and reel
SN74LVTH16245ADGGR
LVTH16245A
TVSOP − DGV
Tape and reel
SN74LVTH16245ADGVR
LL245A
SSOP − DL
−40°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
VFBGA − GQL
LVTH16245A
SN74LVTH16245AGQLR
VFBGA − ZQL (Pb-free)
Tape and reel
SN74LVTH16245AZQLR
LL245A
−55°C to 125°C
CFP − WD
Tube
SNJ54LVTH16245AWD
SNJ54LVTH16245AWD
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
Copyright  2003, Texas Instruments Incorporated
!"#$ % &'!!($ #% )'*+&#$ ,#$(
!,'&$% &!" $ %)(&&#$% )(! $-( $(!"% (.#% %$!'"($%
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)!&(%%1 ,(% $ (&(%%#!+0 &+',( $(%$1 #++ )#!#"($(!%
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SCBS143P − MAY 1992 − REVISED SEPTEMBER 2003
description/ordering information (continued)
These devices can be used as two 8-bit transceivers or one 16-bit transceiver. They allow data transmission
from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control
(DIR) input. The output-enable (OE) input can be used to disable the devices so that the buses are
effectively isolated.
Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors
with the bus-hold circuitry is not recommended.
When VCC is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor;
the minimum value of the resistor is determined by the current-sinking capability of the driver.
These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry
disables the outputs, preventing damaging current backflow through the devices when they are powered down.
The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
GQL OR ZQL PACKAGE
(TOP VIEW)
1
2
3
4
5
terminal assignments
6
1
2
3
4
5
6
A
A
1DIR
NC
NC
NC
NC
1OE
B
B
1B2
1B1
GND
GND
1A1
1A2
C
C
1B4
1B3
D
1B5
VCC
GND
1A4
1B6
VCC
GND
1A3
D
1A5
1A6
E
1B8
1B7
1A7
1A8
F
2B1
2B2
2A2
2A1
G
2B3
2B4
GND
GND
2A4
2A3
H
2B5
2B6
2B8
VCC
GND
2A5
2B7
VCC
GND
2A6
J
2A8
2A7
K
2DIR
NC
NC
NC
NC
2OE
E
F
G
H
J
K
NC − No internal connection
FUNCTION TABLE
(each 8-bit section)
INPUTS
OE
2
DIR
OPERATION
L
L
B data to A bus
L
H
A data to B bus
H
X
Isolation
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SCBS143P − MAY 1992 − REVISED SEPTEMBER 2003
logic diagram (positive logic)
1DIR
1
2DIR
48
1A1
25
1OE
47
2A1
2
24
2OE
36
13
1B1
To Seven Other Channels
2B1
To Seven Other Channels
Pin numbers shown are for the DGG, DGV, DL, and WD packages.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high-impedance
or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high state, VO (see Note 1) . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Current into any output in the low state, IO: SN54LVTH16245A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA
SN74LVTH16245A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Current into any output in the high state, IO (see Note 2): SN54LVTH16245A . . . . . . . . . . . . . . . . . . . . 48 mA
SN74LVTH16245A . . . . . . . . . . . . . . . . . . . . 64 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Package thermal impedance, θJA (see Note 3): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63°C/W
GQL/ZQL package . . . . . . . . . . . . . . . . . . . . . . . . . . . 42°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. This current flows only when the output is in the high state and VO > VCC.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
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SCBS143P − MAY 1992 − REVISED SEPTEMBER 2003
recommended operating conditions (see Note 4)
SN54LVTH16245A
SN74LVTH16245A
MIN
MAX
MIN
MAX
2.7
3.6
2.7
3.6
UNIT
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
0.8
0.8
Input voltage
5.5
5.5
V
IOH
IOL
High-level output current
−24
−32
mA
48
64
mA
∆t/∆v
Input transition rise or fall rate
10
10
ns/V
∆t/∆VCC
TA
Power-up ramp rate
200
Operating free-air temperature
−55
High-level input voltage
2
Low-level output current
Outputs enabled
2
V
−40
V
µs/V
200
125
V
85
°C
NOTE 4: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
4
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SCBS143P − MAY 1992 − REVISED SEPTEMBER 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
VCC = 2.7 V,
VCC = 2.7 V to 3.6 V,
II = −18 mA
IOH = −100 µA
VCC = 2.7 V,
IOH = −8 mA
IOH = −24 mA
VCC = 3 V
VCC = 2.7 V
VOL
VCC = 3 V
Control
inputs
II
A or B
ports‡
Ioff
SN74LVTH16245A
MIN
TYP†
MAX
−1.2
VCC−0.2
2.4
−1.2
2
0.2
0.2
IOL = 24 mA
IOL = 16 mA
0.5
0.5
0.4
0.4
IOL = 32 mA
IOL = 48 mA
0.5
0.5
0.55
±1
±1
10
20
20
VCC = 3.6 V
VI = VCC
VI = 0
5
1
VCC = 0,
VI or VO = 0 to 4.5 V
VI = 0.8 V
VCC = 3.6 V§,
V
0.55
IOL = 64 mA
VI = VCC or GND
10
A or B ports
V
V
2
IOH = −32 mA
IOL = 100 µA
VI = 2 V
UNIT
VCC−0.2
2.4
VI = 5.5 V
VI = 5.5 V
VCC = 3.6 V,
VCC = 0 or 3.6 V,
VCC = 3 V
II(hold)
SN54LVTH16245A
MIN
TYP†
MAX
TEST CONDITIONS
−5
µA
−5
±100
75
75
−75
−75
500
−750
VI = 0 to 3.6 V
µA
µA
IOZPU
VCC = 0 to 1.5 V, VO = 0.5 V to 3 V,
OE = don’t care
±100*
±100
µA
IOZPD
VCC = 1.5 V to 0, VO = 0.5 V to 3 V,
OE = don’t care
±100*
±100
µA
VCC = 3.6 V,
IO = 0,
VI = VCC or GND
0.19
0.19
ICC
Outputs high
Outputs low
Outputs disabled
∆ICC¶
VCC = 3 V to 3.6, One input at VCC − 0.6 V,
Other inputs at VCC or GND
Ci
VI = 3 V or 0
VO = 3 V or 0
Cio
5
5
0.19
0.19
0.2
0.2
mA
mA
4
4
pF
10
10
pF
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
† All typical values are at VCC = 3.3 V, TA = 25°C.
‡ Unused pins at VCC or GND.
§ This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another.
¶ This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
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SCBS143P − MAY 1992 − REVISED SEPTEMBER 2003
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
SN54LVTH16245A
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A or B
B or A
tPZH
tPZL
OE
A or B
tPHZ
tPLZ
OE
A or B
VCC = 3.3 V
± 0.3 V
SN74LVTH16245A
VCC = 2.7 V
VCC = 2.7 V
MAX
MIN
TYP†
MAX
4.5
4.6
1.5
2.3
3.3
3.7
4.4
3.9
1.3
2.1
3.3
3.5
0.5
6.5
6.6
1.5
2.8
4.5
5.3
0.5
5.4
6.2
1.6
2.9
4.6
5.2
1
6.8
7
2.3
3.7
5.1
5.5
1
6.2
6.3
2.2
3.5
5.1
5.4
0.5
0.5
MIN
MAX
0.5
0.5
MIN
tsk(o)
† All typical values are at VCC = 3.3 V, TA = 25°C.
6
VCC = 3.3 V
± 0.3 V
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MIN
UNIT
MAX
ns
ns
ns
ns
SCBS143P − MAY 1992 − REVISED SEPTEMBER 2003
PARAMETER MEASUREMENT INFORMATION
6V
S1
500 Ω
From Output
Under Test
GND
CL = 50 pF
(see Note A)
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
6V
GND
Open
500 Ω
2.7 V
LOAD CIRCUIT
1.5 V
Timing Input
0V
tw
tsu
2.7 V
1.5 V
Input
1.5 V
th
2.7 V
1.5 V
Data Input
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
2.7 V
Input
1.5 V
1.5 V
0V
tPHL
tPLH
VOH
1.5 V
Output
1.5 V
VOL
VOH
Output
1.5 V
Output
Waveform 1
S1 at 6 V
(see Note B)
1.5 V
1.5 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
0V
tPLZ
tPZL
3V
1.5 V
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.3 V
VOL
tPHZ
tPZH
tPLH
tPHL
2.7 V
Output
Control
1.5 V
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
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7
MECHANICAL DATA
MCFP010B – JANUARY 1995 – REVISED NOVEMBER 1997
WD (R-GDFP-F**)
CERAMIC DUAL FLATPACK
48 LEADS SHOWN
0.120 (3,05)
0.075 (1,91)
0.009 (0,23)
0.004 (0,10)
1.130 (28,70)
0.870 (22,10)
0.370 (9,40)
0.250 (6,35)
0.390 (9,91)
0.370 (9,40)
0.370 (9,40)
0.250 (6,35)
48
1
0.025 (0,635)
A
0.014 (0,36)
0.008 (0,20)
25
24
NO. OF
LEADS**
48
56
A MAX
0.640
(16,26)
0.740
(18,80)
A MIN
0.610
(15,49)
0.710
(18,03)
4040176 / D 10/97
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification only
Falls within MIL STD 1835: GDFP1-F48 and JEDEC MO -146AA
GDFP1-F56 and JEDEC MO -146AB
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MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
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MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
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MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
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