ELPIDA EDS2516APTA-TI

PRELIMINARY DATA SHEET
256M bits SDRAM
WTR (Wide Temperature Range)
EDS2504APTA-TI (64M words × 4 bits)
EDS2508APTA-TI (32M words × 8 bits)
EDS2516APTA-TI (16M words × 16 bits)
Description
Pin Configurations
The EDS2504AP is a 256M bits SDRAM organized as
16,777,216 words × 4 bits × 4 banks. The EDS2508
AP is a 256M bits SDRAM organized as 8,388,608
words × 8 bits × 4 banks. The EDS2516 AP is a 256M
bits SDRAM organized as 4194304 words × 16 bits × 4
banks. All inputs and outputs are referred to the rising
edge of the clock input. It is packaged in standard 54pin plastic TSOP (II).
/xxx indicates active low signal.
Features
•
•
•
•
•
3.3V power supply
Clock frequency: 133MHz (max.)
LVTTL interface
Single pulsed /RAS
4 banks can operate simultaneously and
independently
• Burst read/write operation and burst read/single write
operation capability
• Programmable burst length (BL): 1, 2, 4, 8, full page
• 2 variations of burst sequence
 Sequential (BL = 1, 2, 4, 8)
 Interleave (BL = 1, 2, 4, 8)
• Programmable /CAS latency (CL): 2, 3
• Byte control by DQM
: DQM (EDS2504/08AP)
: UDQM, LDQM (EDS2516AP)
• Refresh cycles: 8192 refresh cycles/64ms
• 2 variations of refresh
 Auto refresh
 Self refresh
• Ambient temperature range: –40 to +85°C
54-pin TSOP
VDD VDD
NC DQ0
VDD
DQ0
VDDQ VDDQ VDDQ
NC
NC
DQ0 DQ1
DQ1
DQ2
VSSQ VSSQ VSSQ
NC
NC
NC DQ2
DQ3
DQ4
VDDQ VDDQ VDDQ
NC
NC
DQ1 DQ3
DQ5
DQ6
VSSQ VSSQ VSSQ
NC
VDD
NC
/WE
/CAS
/RAS
/CS
BA0
BA1
A10
A0
A1
A2
A3
VDD
NC DQ7
VDD VDD
NC LDQM
/WE /WE
/CAS /CAS
/RAS /RAS
/CS
/CS
BA0 BA0
BA1 BA1
A10 A10
A0
A0
A1
A1
A2
A2
A3
A3
VDD VDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
VSS VSS VSS
DQ15 DQ7 NC
VSSQ VSSQ VSSQ
DQ14 NC NC
DQ13 DQ6 DQ3
VDDQ VDDQ VDDQ
DQ12 NC NC
DQ11 DQ5 NC
VSSQ VSSQ VSSQ
DQ10 NC NC
DQ9 DQ4 DQ2
VDDQ VDDQ VDDQ
DQ8 NC
VSS VSS
NC
NC
UDQM DQM
CLK CLK
CKE CKE
A12 A12
A11 A11
A9
A9
A8
A8
A7
A7
A6
A6
A5
A5
A4
A4
VSS VSS
NC
VSS
NC
DQM
CLK
CKE
A12
A11
A9
A8
A7
A6
A5
A4
VSS
X 16
X8
X4
(Top view)
Address input
Bank select address
DQ0 to DQ15 Data-input/output
Chip select
/CS
Row address strobe
/RAS
/CAS
Column address strobe
/WE
Write enable
A0 to A12,
BA0, BA1
DQM
CKE
CLK
VDD
VSS
Input/output mask
Clock enable
Clock input
Power for internal circuit
Ground for internal circuit
VDDQ Power for DQ circuit
VSSQ Ground for DQ circuit
NC
No connection
Document No. E0248E10 (Ver. 1.0)
Date Published March 2002 (K) Japan
URL: http://www.elpida.com
Elpida Memory, Inc. 2002
EDS2504APTA/08APTA/16APTA-TI
Ordering Information
Part number
EDS2504APTA-7ATI
EDS2504APTA-75TI
EDS2508APTA-7ATI
EDS2508APTA-75TI
EDS2516APTA-7ATI
EDS2516APTA-75TI
Mask
Version
P
Organization
(words × bits)
64M × 4
Internal Banks
4
Clock frequency
MHz (max.)
133
32M × 8
16M × 16
/CAS latency
Package
2, 3
3
2, 3
3
2, 3
3
54-pin Plastic
TSOP (II)
Part Number
E D S 25 04 A P TA - 7A TI
Elpida Memory
Material Type
D: Mono
Function
S: SDRAM
Density & Bank
25: 256M/4 Banks
Bit Organization
04: x4
08: x8
16: x16
Interface
A: 3.3V, LVTTL
Mask Revision
Package
TA: TSOP (II)
Speed
7A: 133MHz/CL2, 3
75: 133MHz/CL3
100MHz/CL2
Wide Temperature Range
TI: −40 to +85°C
Preliminary Data Sheet E0248E10 (Ver. 1.0)
2
EDS2504APTA/08APTA/16APTA-TI
CONTENTS
Description .................................................................................................................................................... 1
Features ........................................................................................................................................................ 1
Pin Configurations ......................................................................................................................................... 1
Ordering Information ..................................................................................................................................... 2
Part Number .................................................................................................................................................. 2
Electrical Specifications................................................................................................................................. 4
Block Diagram ............................................................................................................................................... 8
Pin Function ................................................................................................................................................ 13
Command Operation ................................................................................................................................... 15
Simplified State Diagram............................................................................................................................. 23
Mode Register Configuration ...................................................................................................................... 24
Power-up sequence .................................................................................................................................... 25
Operation of the SDRAM ............................................................................................................................ 26
Timing Waveforms ...................................................................................................................................... 42
Package Drawing ........................................................................................................................................ 48
Recommended Soldering Conditions.......................................................................................................... 49
Revision History .......................................................................................................................................... 52
Preliminary Data Sheet E0248E10 (Ver. 1.0)
3
EDS2504APTA/08APTA/16APTA-TI
Electrical Specifications
• All voltages are referenced to VSS (GND).
• After power up, wait more than 100 µs and then, execute Power on sequence and CBR (auto) Refresh before
proper device operation is achieved.
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Voltage on any pin relative to VSS
VT
–0.5 to VDD + 0.5 (≤ 4.6 (max.))
V
Supply voltage relative to VSS
VDD
–0.5 to +4.6
V
Short circuit output current
IOS
50
mA
Power dissipation
PD
1.0
W
Operating temperature
TA
–40 to +85
°C
Storage temperature
Tstg
–55 to +125
°C
Note
Notes: 1. Respect to VSS.
Caution
Exposing the device to stress above those listed in Absolute Maximum Ratings could cause
permanent damage. The device is not meant to be operated under conditions outside the limits
described in the operational section of this specification. Exposure to Absolute Maximum Rating
conditions for extended periods may affect device reliability.
Recommended Operating Conditions (TA = –40 to +85°°C)
Parameter
Symbol
min.
max.
Unit
Notes
Supply voltage
VDD, VDDQ
3.0
3.6
V
1, 2
VSS, VSSQ
0
0
V
3
Input high voltage
VIH
2.0
VDD + 0.3
V
1, 4
Input low voltage
VIL
–0.3
0.8
V
1, 5
Notes: 1.
2.
3.
4.
5.
All voltage referred to VSS.
The supply voltage with all VDD and VDDQ pins must be on the same level.
The supply voltage with all VSS and VSSQ pins must be on the same level.
VIH (max.) = VDD + 2.0 V for pulse width ≤ 3ns at VDD.
VIL (min.) = VSS – 2.0 V for pulse width ≤ 3ns at VSS.
Preliminary Data Sheet E0248E10 (Ver. 1.0)
4
EDS2504APTA/08APTA/16APTA-TI
DC Characteristics 1 (TA = –40 to +85°°C, VDD, VDDQ = 3.3V ± 0.3V, VSS, VSSQ = 0V)
Parameter
/CAS latency
Operating current
Standby current in power
down
Standby current in power
down (input signal stable)
Standby current in non
power down
Standby current in non
power down (input signal
stable)
Active standby current in
power down
Active standby current in
power down (input signal
stable)
Active standby current in
non power down
Active standby current in
non power down (input
signal stable)
max.
Symbol
Grade
×4
×8
× 16
Unit
Test condition
Burst length = 1
tRC = min.
Burst length = 1
tRC = min.
Notes
ICC1
-7A
130
130
135
mA
1, 2, 3
ICC1
-75
110
110
115
mA
ICC2P
3
3
3
mA
CKE = VIL, tCK = min.
6
ICC2PS
2
2
2
mA
CKE = VIL, tCK = ∞
7
ICC2N
20
20
20
mA
CKE, /CS = VIH,
tCK = min.
4
ICC2NS
9
9
9
mA
CKE = VIH, tCK = ∞,
/CS = VIH
8
ICC3P
4
4
4
mA
CKE = VIL, tCK = min.
1, 2, 6
ICC3PS
3
3
3
mA
CKE = VIL, tCK = ∞
2, 7
ICC3N
30
30
30
mA
CKE, /CS = VIH,
tCK = min.
1, 2, 4
ICC3NS
15
15
15
mA
CKE = VIH, tCK = ∞,
/CS = VIH
2, 8
Burst operating current
ICC4
130
135
145
mA
tCK = min., BL = 4
1, 2, 5
Refresh current
ICC5
-7A
250
250
250
mA
tRC = min.
3
ICC5
-75
220
220
220
mA
tRC = min.
mA
VIH ≥ VDD – 0.2V
VIL ≤ 0.2V
Self refresh current
ICC6
3
3
3
Notes: 1. ICC depends on output load condition when the device is selected. ICC (max.) is specified at the output
open condition.
2. One bank operation.
3. Input signals are changed once per one clock.
4. Input signals are changed once per two clocks.
5. Input signals are changed once per four clocks.
6. After power down mode, CLK operating current.
7. After power down mode, no CLK operating current.
8. Input signals are VIH or VIL fixed.
Preliminary Data Sheet E0248E10 (Ver. 1.0)
5
EDS2504APTA/08APTA/16APTA-TI
DC Characteristics 2 (TA = –40 to +85°°C, VDD, VDDQ = 3.3V ± 0.3V, VSS, VSSQ = 0V)
Parameter
Symbol
min.
max.
Unit
Test condition
Notes
Input leakage current
ILI
–1
1
µA
0 ≤ VIN ≤ VDD
Output leakage current
ILO
–1.5
1.5
µA
0 ≤ VOUT ≤ VDD, DQ = disable
Output high voltage
VOH
2.4
—
V
IOH = –4 mA
Output low voltage
VOL
—
0.4
V
IOL = 4 mA
Pin Capacitance (TA = 25°C, VDD, VDDQ = 3.3V ± 0.3V)
Pins
min.
Typ
max.
Unit
Notes
CI1
CLK
2.5
—
3.5
pF
1, 2, 4
CI2
Address, CKE, /CS, /RAS,
/CAS, /WE, DQM,
2.5
—
3.8
pF
CI/O
DQ
4
—
6.5
pF
Parameter
Symbol
Input capacitance
Data input/output capacitance
1, 2, 4
1, 2, 3, 4
Notes: 1. Capacitance measured with Boonton Meter or effective capacitance measuring method.
2. Measurement condition: f = 1MHz, 1.4V bias, 200mV swing.
3. DQM = VIH to disable DOUT.
4. This parameter is sampled and not 100% tested.
AC Characteristics (TA = –40 to +85°°C, VDD, VDDQ = 3.3V ± 0.3V, VSS, VSSQ = 0V)
-7A
-75
Parameter
Symbol
min.
min.
max.
Unit
Notes
System clock cycle time
tCK
7.5
7.5
—
ns
1
CLK high pulse width
tCH
2.5
2.5
—
ns
1
CLK low pulse width
tCL
2.5
2.5
—
ns
1
Access time from CLK
tAC
—
—
5.4
ns
1, 2
Data-out hold time
tOH
2.7
2.7
—
ns
1, 2
CLK to Data-out low impedance
tLZ
1
1
—
ns
1, 2, 3
CLK to Data-out high impedance
tHZ
—
—
5.4
ns
1, 4
Input setup time
tSI
1.5
1.5
—
ns
1
Input hold time
tHI
0.8
0.8
—
ns
1
Ref/Active to Ref/Active command period tRC
60
67.5
—
ns
1
Active to Precharge command period
tRAS
45
45
120000
ns
1
Active command to column command
(same bank)
tRCD
15
20
—
ns
1
Precharge to active command period
tRP
15
20
—
ns
1
Write recovery or data-in to precharge
lead time
tDPL
15
15
—
ns
1
Last data into active latency
tDAL
2CLK + 15ns 2CLK + 20ns —
1
Active (a) to Active (b) command period tRRD
15
15
—
ns
Transition time (rise and fall)
tT
0.5
0.5
5
ns
Refresh period
(8192 refresh cycles)
tREF
—
—
64
ms
Notes: 1.
2.
3.
4.
AC measurement assumes tT = 0.5ns. Reference level for timing of input signals is 1.4V.
Access time is measured at 1.4V. Load condition is CL = 50pF.
tLZ (min.) defines the time at which the outputs achieves the low impedance state.
tHZ (max.) defines the time at which the outputs achieves the high impedance state.
Preliminary Data Sheet E0248E10 (Ver. 1.0)
6
EDS2504APTA/08APTA/16APTA-TI
Test Conditions
• Input and output timing reference levels: 1.4V
• Input waveform and output load: See following figures
2.4 V
input
0.4 V
I/O
2.0 V
0.8 V
CL
tT
tT
Output load
Relationship Between Frequency and Minimum Latency
Parameter
-7A
Frequency (MHz)
133
tCK (ns)
-75
Symbol
7.5
7.5
Notes
lRCD
2
3
1
lRC
8
9
1
lRAS
6
6
1
lRP
2
3
1
lDPL
2
2
1
lRRD
2
2
1
Self refresh exit time
lSREX
1
1
2
Last data in to active command
(Auto precharge, same bank)
lDAL
4
5
= [lDPL + lRP]
Self refresh exit to command input
lSEC
8
9
= [lRC]
3
Precharge command to high impedance
(CL = 2)
lHZP
2
(CL = 3)
lHZP
3
3
lAPR
1
1
lEP
–1
–1
Active command to column command
(same bank)
Active command to active command
(same bank)
Active command to precharge command
(same bank)
Precharge command to active command
(same bank)
Write recovery or data-in to precharge
command (same bank)
Active command to active command
(different bank)
Last data out to active command
(auto precharge) (same bank)
Last data out to precharge (early precharge)
(CL = 2)
2
(CL = 3)
lEP
–2
–2
Column command to column command
lCCD
1
1
Write command to data in latency
lWCD
0
0
DQM to data in
lDID
0
0
DQM to data out
lDOD
2
2
CKE to CLK disable
lCLE
1
1
Register set to active command
lMRD
2
2
/CS to command disable
lCDD
0
0
Power down exit to command input
lPEC
1
1
Notes: 1.IRCD to IRRD are recommended value.
2. Be valid [DESL] or [NOP] at next command of self refresh exit.
3. Except [DESL] and [NOP]
Preliminary Data Sheet E0248E10 (Ver. 1.0)
7
EDS2504APTA/08APTA/16APTA-TI
VIL/VIH Clamp
This SDRAM component has VIL and VIH clamp for CLK, CKE, /CS, DQM and DQ pins.
[Minimum VIL Clamp Current]
VIL (V)
I (mA)
–2
–32
–1.8
–25
–1.6
–19
–1.4
–13
–1.2
–8
–1
–4
–0.9
–2
–0.8
–0.6
–0.6
0
–0.4
0
–0.2
0
0
0
0
–5
–2
–1.5
–1
I (mA)
–10
–15
–20
–25
–30
–35
VIL (V)
Minimum VIL Clamp Current
Preliminary Data Sheet E0248E10 (Ver. 1.0)
8
–0.5
0
EDS2504APTA/08APTA/16APTA-TI
[Minimum VIH Clamp Current]
VIH (V)
I (mA)
VDD + 2
10
VDD + 1.8
8
VDD + 1.6
5.5
VDD + 1.4
3.5
VDD + 1.2
1.5
VDD + 1
0.3
VDD + 0.8
0
VDD + 0.6
0
VDD + 0.4
0
VDD + 0.2
0
VDD + 0
0
10
I (mA)
8
6
4
2
0
VDD + 0
VDD + 0.5
VDD + 1
VDD + 1.5
VIH (V)
Minimum VIH Clamp Current
Preliminary Data Sheet E0248E10 (Ver. 1.0)
9
VDD + 2
EDS2504APTA/08APTA/16APTA-TI
IOL/IOH Characteristics
[Output Low Current (IOL)]
IOL
IOL
VOUT (V)
min. (mA)
max. (mA)
0
0
0
0.4
27
71
0.65
41
108
0.85
51
134
1
58
151
1.4
70
188
1.5
72
194
1.65
75
203
1.8
77
209
1.95
77
212
3
80
220
3.45
81
223
250
IOL (mA)
200
150
min.
max.
100
50
0
0
0.5
1
1.5
2
2.5
VOUT (V)
Output Low Current (IOL)
Preliminary Data Sheet E0248E10 (Ver. 1.0)
10
3
3.5
EDS2504APTA/08APTA/16APTA-TI
[Output High Current (IOH)]
IOH
IOH
VOUT (V)
min. (mA)
max. (mA)
3.45
—
–3
3.3
—
–28
3
0
–75
2.6
–21
–130
2.4
–34
–154
2
–59
–197
1.8
–67
–227
1.65
–73
–248
1.5
–78
–270
1.4
–81
–285
1
–89
–345
0
–93
–503
250
IOL (mA)
200
150
min.
max.
100
50
0
0
0.5
1
1.5
2
2.5
VOUT (V)
Output High Current (IOH)
Preliminary Data Sheet E0248E10 (Ver. 1.0)
11
3
3.5
EDS2504APTA/08APTA/16APTA-TI
Block Diagram
CLK
CKE
Clock
Generator
Bank 3
Bank 2
Bank 1
Mode
Register
Row
Address
Buffer
&
Refresh
Counter
Row Decoder
Address
Bank 0
Data Control Circuit
Preliminary Data Sheet E0248E10 (Ver. 1.0)
12
Input & Output
Buffer
/WE
DQM
Column Decoder &
Latch Circuit
Column
Address
Buffer
&
Burst
Counter
Latch Circuit
/CAS
Control Logic
/RAS
Command Decoder
Sense Amplifier
/CS
DQ
EDS2504APTA/08APTA/16APTA-TI
Pin Function
CLK (input pin)
CLK is the master clock input to this pin. The other input signals are referred at CLK rising edge.
/CS (input pin)
When /CS is Low, the command input cycle becomes valid. When /CS is High, all inputs are ignored. However,
internal operations (bank active, burst operations, etc.) are held.
/RAS, /CAS, and /WE (input pins)
Although these pin names are the same as those of conventional DRAMs, they function in a different way. These
pins define operation commands (read, write, etc.) depending on the combination of their voltage levels. For details,
refer to the command operation section.
A0 toA12 (input pins)
Row address (AX0 to AX12) is determined by A0 to A12 at the bank active command cycle CLK rising edge.
Column address is determined by A0 to A8, A9 or A11 (see Address Pins Table) at the read or write command cycle
CLK rising edge. And this column address becomes burst access start address.
[Address Pins Table]
Address (A0 to A12)
Part number
Row address
Column address
EDS2504AP
AX0 to AX12
AY0 to AY9, AY11
EDS2508AP
AX0 to AX12
AY0 to AY9
EDS2516AP
AX0 to AX12
AY0 to AY8
A10 defines the precharge mode. When A10 = High at the precharge command cycle, all banks are precharged.
But when A10 = Low at the precharge command cycle, only the bank that is selected by BA0 and BA1 (BS) is
precharged. For details refer to the command operation section.
BA0 and BA1 (input pin)
BA0 and BA1 are bank select signal (BS). (See Bank Select Signal Table)
[Bank Select Signal Table]
BA0
BA1
Bank 0
L
L
Bank 1
H
L
Bank 2
L
H
Bank 3
H
H
Remark: H: VIH. L: VIL. ×: VIH or VIL
CKE (input pin)
This pin determines whether or not the next CLK is valid. If CKE is High, the next CLK rising edge is valid. If CKE is
Low, the next CLK rising edge is invalid. This pin is used for power-down mode, clock suspend mode and self
refresh mode.
Preliminary Data Sheet E0248E10 (Ver. 1.0)
13
EDS2504APTA/08APTA/16APTA-TI
DQM, UDQM and LDQM (input pins)
DQM controls input/output buffers. In 16M × 16 products, UDQM and LDQM control upper byte (DQ8 to DQ15) and
lower byte (DQ0 to DQ7).
Read operation: If DQM is High, the output buffer becomes High-Z. If the DQM is Low, the output buffer becomes
Low-Z. (The latency of DQM during reading is 2 clocks.)
Write operation: If DQM is High, the previous data is held (the new data is not written). If DQM is Low, the data is
written. (The latency of DQM during writing is 0 clock.)
DQ0 toDQ15 (input/output pins)
Data is input to and output from these pins (DQ0 to DQ3; EDS2504AP , DQ0 to DQ7; EDS2508AP, DQ0 to DQ15;
EDS2516AP).
VDD, VSS, VDDQ, VSSQ (Power supply)
VDD and VSS are power supply pins for internal circuits. VDDQ and VSSQ are power supply pins for the output
buffers.
Preliminary Data Sheet E0248E10 (Ver. 1.0)
14
EDS2504APTA/08APTA/16APTA-TI
Command Operation
Command Truth Table
The SDRAM recognizes the following commands specified by the /CS, /RAS, /CAS, /WE and address pins.
CKE
Function
Symbol
n–1
n
/CS
/RAS
/CAS
/WE
BA1,BA0 A10
A0 to A12
Device deselect
DESL
H
×
H
×
×
×
×
×
×
No operation
NOP
H
×
L
H
H
H
×
×
×
Burst stop
BST
H
×
L
H
H
L
×
×
×
Read
READ
H
×
L
H
L
H
V
L
V
Read with auto precharge
READA
H
×
L
H
L
H
V
H
V
Write
WRIT
H
×
L
H
L
L
V
L
V
Write with auto precharge
WRITA
H
×
L
H
L
L
V
H
V
Bank activate
ACT
H
×
L
L
H
H
V
V
V
Precharge select bank
PRE
H
×
L
L
H
L
V
L
×
Precharge all banks
PALL
H
×
L
L
H
L
×
H
×
Mode register set
MRS
H
×
L
L
L
L
L
L
V
Remark: H: VIH. L: VIL. ×: VIH or VIL
Device deselect command [DESL]
When this command is set (/CS is High), the SDRAM ignore command input at the clock. However, the internal
status is held.
No operation [NOP]
This command is not an execution command. However, the internal operations continue.
Burst stop command [BST]
This command can stop the current burst operation.
Column address strobe and read command [READ]
This command starts a read operation. In addition, the start address of burst read is determined by the column
address (see Address Pins Table in Pin Function) and the bank select address. After the read operation, the output
buffer becomes High-Z.
Read with auto-precharge [READA]
This command automatically performs a precharge operation after a burst read with a burst length of 1, 2, 4 or 8.
Column address strobe and write command [WRIT]
This command starts a write operation. When the burst write mode is selected, the column address (see Address
Pins Table in Pin Function) and the bank select address (BA0, BA1) become the burst write start address. When the
single write mode is selected, data is only written to the location specified by the column address (see Address Pins
Table in Pin Function) and the bank select address (BA0, BA1).
Write with auto-precharge [WRITA]
This command automatically performs a precharge operation after a burst write with a length of 1, 2, 4 or 8, or after a
single write operation.
Preliminary Data Sheet E0248E10 (Ver. 1.0)
15
EDS2504APTA/08APTA/16APTA-TI
Row address strobe and bank activate [ACT]
This command activates the bank that is selected by BA0, BA1 and determines the row address (AX0 to AX12).
(See Bank Select Signal Table)
Precharge selected bank [PRE]
This command starts precharge operation for the bank selected by BA0, BA1. (See Bank Select Signal Table)
[Bank Select Signal Table]
BA0
BA1
Bank 0
L
L
Bank 1
H
L
Bank 2
L
H
Bank 3
H
H
Remark: H: VIH. L: VIL. ×: VIH or VIL
Precharge all banks [PALL]
This command starts a precharge operation for all banks.
Refresh [REF/SELF]
This command starts the refresh operation. There are two types of refresh operation, the one is auto-refresh, and
the other is self-refresh. For details, refer to the CKE truth table section.
Mode register set [MRS]
The SDRAM has a mode register that defines how it operates. The mode register is specified by the address pins
(A0 to BA0 and BA1) at the mode register set cycle. For details, refer to the mode register configuration. After
power on, the contents of the mode register are undefined, execute the mode register set command to set up the
mode register.
Preliminary Data Sheet E0248E10 (Ver. 1.0)
16
EDS2504APTA/08APTA/16APTA-TI
DQM Truth Table
CKE
DQM
Commands
Symbol
n–1
n
UDQM
Write enable/output enable
ENB
H
×
L
Write inhibit/output disable
MASK
H
×
H
LDQM
Upper byte write enable/output enable
ENBU
H
×
L
×
Lower byte write enable/output enable
ENBL
H
×
×
L
Upper byte write inhibit/output disable
MASKU
H
×
H
×
Lower byte write inhibit/output disable
MASKL
H
×
×
H
Remark: H: VIH. L: VIL. ×: VIH or VIL
Write: IDID is needed.
Read: IDOD is needed.
CKE Truth Table
CKE
Current state
Function
Activating
Clock suspend mode entry
Symbol
n–1
n
/CS
/RAS
/CAS
/WE
Address
H
L
×
×
×
×
×
Any
Clock suspend mode
L
L
×
×
×
×
×
Clock suspend
Clock suspend mode exit
L
H
×
×
×
×
×
Idle
CBR (auto) refresh command
REF
H
H
L
L
L
H
×
Idle
Self refresh entry
SELF
H
L
L
L
L
H
×
Self refresh
Self refresh exit
Idle
Power down
Power down entry
Power down exit
L
H
L
H
H
H
×
L
H
H
×
×
×
×
H
L
L
H
H
H
×
H
L
H
×
×
×
×
L
H
H
×
×
×
×
L
H
L
H
H
H
×
Remark: H: VIH. L: VIL. ×: VIH or VIL
Preliminary Data Sheet E0248E10 (Ver. 1.0)
17
EDS2504APTA/08APTA/16APTA-TI
Function Truth Table
The following table shows the operations that are performed when each command is issued in each mode of the
SDRAM.
The following table assumes that CKE is high.
Current state
/CS
Precharge
H
L
L
Idle
Row active
Read
/RAS
/CAS
/WE
Address
Command
Operation
×
×
×
×
DESL
Enter IDLE after tRP
H
H
H
×
NOP
Enter IDLE after tRP
H
H
L
×
BST
ILLEGAL
L
H
L
H
BA, CA, A10
READ/READA
ILLEGAL*3
L
H
L
L
BA, CA, A10
WRIT/WRITA
ILLEGAL*3
L
L
H
H
BA, RA
ACT
ILLEGAL*3
L
L
H
L
BA, A10
PRE, PALL
NOP*5
L
L
L
H
×
REF, SELF
ILLEGAL
L
L
L
L
MODE
MRS
ILLEGAL
H
×
×
×
×
DESL
NOP
L
H
H
H
×
NOP
NOP
L
H
H
L
×
BST
ILLEGAL
L
H
L
H
BA, CA, A10
READ/READA
ILLEGAL*4
L
H
L
L
BA, CA, A10
WRIT/WRITA
ILLEGAL*4
L
L
H
H
BA, RA
ACT
Bank and row active
L
L
H
L
BA, A10
PRE, PALL
NOP
L
L
L
H
×
REF, SELF
Refresh
L
L
L
L
MODE
MRS
Mode register set*8
H
×
×
×
×
DESL
NOP
L
H
H
H
×
NOP
NOP
L
H
H
L
×
BST
ILLEGAL
L
H
L
H
BA, CA, A10
READ/READA
Begin read*6
L
H
L
L
BA, CA, A10
WRIT/WRITA
Begin write*6
L
L
H
H
BA, RA
ACT
Other bank active
ILLEGAL on same bank*2
L
L
H
L
BA, A10
PRE, PALL
Precharge*7
L
L
L
H
×
REF, SELF
ILLEGAL
L
L
L
L
MODE
MRS
ILLEGAL
H
×
×
×
×
DESL
Continue burst to end
L
H
H
H
×
NOP
Continue burst to end
L
H
H
L
×
BST
Burst stop
L
H
L
H
BA, CA, A10
READ/READA
Continue burst read to /CAS
latency and New read
L
H
L
L
BA, CA, A10
WRIT/WRITA
Term burst read/start write
L
L
H
H
BA, RA
ACT
Other bank active
ILLEGAL on same bank*2
L
L
H
L
BA, A10
PRE, PALL
Term burst read and Precharge
L
L
L
H
×
REF, SELF
ILLEGAL
L
L
L
L
MODE
MRS
ILLEGAL
Preliminary Data Sheet E0248E10 (Ver. 1.0)
18
EDS2504APTA/08APTA/16APTA-TI
Current state
/CS
/RAS
/CAS
/WE
Address
Command
Read with autoprecharge
H
×
×
×
×
DESL
L
H
H
H
×
NOP
L
H
H
L
×
BST
ILLEGAL
L
H
L
H
BA, CA, A10
READ/READA
ILLEGAL*3
L
H
L
L
BA, CA, A10
WRIT/WRITA
ILLEGAL*3
L
L
H
H
BA, RA
ACT
Other bank active
ILLEGAL on same bank*2
L
L
H
L
BA, A10
PRE, PALL
ILLEGAL*3
L
L
L
H
×
REF, SELF
ILLEGAL
L
L
L
L
MODE
MRS
ILLEGAL
H
×
×
×
×
DESL
Continue burst to end
L
H
H
H
×
NOP
Continue burst to end
L
H
H
L
×
BST
Burst stop
L
H
L
H
BA, CA, A10
READ/READA
Term burst and New read
L
H
L
L
BA, CA, A10
WRIT/WRITA
Term burst and New write
L
L
H
H
BA, RA
ACT
Other bank active
ILLEGAL on same bank*3
L
L
H
L
BA, A10
PRE, PALL
Term burst write and Precharge*1
L
L
L
H
×
REF, SELF
ILLEGAL
L
L
L
L
MODE
MRS
ILLEGAL
H
×
×
×
×
DESL
L
H
H
H
×
NOP
L
H
H
L
×
BST
ILLEGAL
L
H
L
H
BA, CA, A10
READ/READA
ILLEGAL*3
L
H
L
L
BA, CA, A10
WRIT/WRITA
ILLEGAL*3
L
L
H
H
BA, RA
ACT
Other bank active
ILLEGAL on same bank*3
L
L
H
L
BA, A10
PRE, PALL
ILLEGAL*3
L
L
L
H
×
REF, SELF
ILLEGAL
L
L
L
L
MODE
MRS
ILLEGAL
H
×
×
×
×
DESL
Enter IDLE after tRC
L
H
H
H
×
NOP
Enter IDLE after tRC
Write
Write with autoprecharge
Refresh (auto-refresh)
Operation
Continue burst to end and
precharge
Continue burst to end and
precharge
Continue burst to end and
precharge
Continue burst to end and
precharge
L
H
H
L
×
BST
ILLEGAL
L
H
L
H
BA, CA, A10
READ/READA
ILLEGAL*4
L
H
L
L
BA, CA, A10
WRIT/WRITA
ILLEGAL*4
L
L
H
H
BA, RA
ACT
ILLEGAL*4
L
L
H
L
BA, A10
PRE, PALL
ILLEGAL*4
L
L
L
H
×
REF, SELF
ILLEGAL
L
L
L
L
MODE
MRS
ILLEGAL
Preliminary Data Sheet E0248E10 (Ver. 1.0)
19
EDS2504APTA/08APTA/16APTA-TI
Current state
/CS
/RAS
/CAS
/WE
Address
Command
Operation
Mode register set
H
×
×
×
×
DESL
NOP
L
H
H
H
×
NOP
NOP
L
H
H
L
×
BST
ILLEGAL
L
H
L
H
BA, CA, A10
READ/READA
ILLEGAL*4
L
H
L
L
BA, CA, A10
WRIT/WRITA
ILLEGAL*4
L
L
H
H
BA, RA
ACT
Bank and row active*9
L
L
H
L
BA, A10
PRE, PALL
NOP
L
L
L
H
×
REF, SELF
Refresh*9
L
L
L
L
MODE
MRS
Mode register set*8
Remark: H: VIH. L: VIL. ×: VIH or VIL
Notes: 1.An interval of tDPL is required between the final valid data input and the precharge command.
2. If tRRD is not satisfied, this operation is illegal.
3. Illegal for same bank, except for another bank.
4. Illegal for all banks.
5. NOP for same bank, except for another bank.
6. Illegal if tRCD is not satisfied.
7. Illegal if tRAS is not satisfied.
8. MRS command must be issued after DOUT finished, in case of DOUT remaining.
9. Illegal if lMRD is not satisfied.
Preliminary Data Sheet E0248E10 (Ver. 1.0)
20
EDS2504APTA/08APTA/16APTA-TI
Command Truth Table for CKE
CKE
Current State
n–1 n
Self refresh
H
Self refresh recovery
/CS
/RAS /CAS /WE Address
Operation
×
×
×
×
×
×
INVALID, CLK (n – 1) would exit self refresh
L
H
H
×
×
×
×
Self refresh recovery
L
H
L
H
H
×
×
Self refresh recovery
L
H
L
H
L
×
×
ILLEGAL
L
H
L
L
×
×
×
ILLEGAL
L
L
×
×
×
×
×
Continue self refresh
H
H
H
×
×
×
×
Idle after tRC
H
H
L
H
H
×
×
Idle after tRC
H
H
L
H
L
×
×
ILLEGAL
H
H
L
L
×
×
×
ILLEGAL
H
L
H
×
×
×
×
ILLEGAL
H
L
L
H
H
×
×
ILLEGAL
H
L
L
H
L
×
×
ILLEGAL
H
L
L
L
×
×
×
ILLEGAL
H
×
×
×
×
×
L
H
H
×
×
×
×
EXIT power down
L
H
L
H
H
H
×
EXIT power down
L
L
×
×
×
×
×
Continue power down mode
H
H
H
×
×
×
Refer to operations in Function Truth Table
H
H
L
H
×
×
Refer to operations in Function Truth Table
H
H
L
L
H
×
H
H
L
L
L
H
×
H
H
L
L
L
L
OPCODE Refer to operations in Function Truth Table
H
L
H
×
×
×
Begin power down next cycle
H
L
L
H
×
×
Refer to operations in Function Truth Table
H
L
L
L
H
×
Refer to operations in Function Truth Table
H
L
L
L
L
H
×
H
L
L
L
L
L
OPCODE Refer to operations in Function Truth Table
L
H
×
×
×
×
×
Exit power down next cycle
L
L
×
×
×
×
×
Power down
Row active
H
×
×
×
×
×
×
Refer to operations in Function Truth Table
L
×
×
×
×
×
×
Clock suspend
Any state other than
H
H
×
×
×
×
listed above
H
L
×
×
×
×
×
Begin clock suspend next cycle
L
H
×
×
×
×
×
Exit clock suspend next cycle
L
L
×
×
×
×
×
Maintain clock suspend
Power down
All banks idle
Notes
INVALID, CLK (n – 1) would exit power down
Refer to operations in Function Truth Table
CBR (auto) Refresh
Self refresh
1
1
1
Refer to operations in Function Truth Table
2
Remark: H: VIH. L: VIL. ×: VIH or VIL
Notes: 1. Self refresh can be entered only from the all banks idle state. Power down can be entered only from all
banks idle. Clock suspend can be entered only from following states, row active, read, read with autoprecharge, write and write with auto precharge.
2. Must be legal command as defined in Function Truth Table.
Preliminary Data Sheet E0248E10 (Ver. 1.0)
21
EDS2504APTA/08APTA/16APTA-TI
Clock suspend mode entry
The SDRAM enters clock suspend mode from active mode by setting CKE to Low. If command is input in the clock
suspend mode entry cycle, the command is valid. The clock suspend mode changes depending on the current
status (1 clock before) as shown below.
ACTIVE clock suspend
This suspend mode ignores inputs after the next clock by internally maintaining the bank active status.
READ suspend and READ with Auto-precharge suspend
The data being output is held (and continues to be output).
WRITE suspend and WRIT with Auto-precharge suspend
In this mode, external signals are not accepted. However, the internal state is held.
Clock suspend
During clock suspend mode, keep the CKE to Low.
Clock suspend mode exit
The SDRAM exits from clock suspend mode by setting CKE to High during the clock suspend state.
IDLE
In this state, all banks are not selected, and completed precharge operation.
Auto-refresh command [REF]
When this command is input from the IDLE state, the SDRAM starts auto-refresh operation. (The auto-refresh is the
same as the CBR refresh of conventional DRAMs.) During the auto-refresh operation, refresh address and bank
select address are generated inside the SDRAM. For every auto-refresh cycle, the internal address counter is
updated. Accordingly, 8192 times are required to refresh the entire memory. Before executing the auto-refresh
command, all the banks must be in the IDLE state. In addition, since the precharge for all banks is automatically
performed after auto-refresh, no precharge command is required after auto-refresh.
Self-refresh entry [SELF]
When this command is input during the IDLE state, the SDRAM starts self-refresh operation. After the execution of
this command, self-refresh continues while CKE is Low. Since self-refresh is performed internally and automatically,
external refresh operations are unnecessary.
Power down mode entry
When this command is executed during the IDLE state, the SDRAM enters power down mode. In power down
mode, power consumption is suppressed by cutting off the initial input circuit.
Self-refresh exit
When this command is executed during self-refresh mode, the SDRAM can exit from self-refresh mode. After exiting
from self-refresh mode, the SDRAM enters the IDLE state.
Power down exit
When this command is executed at the power down mode, the SDRAM can exit from power down mode. After
exiting from power down mode, the SDRAM enters the IDLE state.
Preliminary Data Sheet E0248E10 (Ver. 1.0)
22
EDS2504APTA/08APTA/16APTA-TI
Simplified State Diagram
SELF
REFRESH
SR ENTRY
SR EXIT
MRS
MODE
REGISTER
SET
REFRESH
IDLE
*1
AUTO
REFRESH
CKE
CKE_
IDLE
POWER
DOWN
ACTIVE
ACTIVE
CLOCK
SUSPEND
CKE_
CKE
ROW
ACTIVE
BST
BST
WRITE
Write
WRITE
SUSPEND
CKE_
WRITE
READ
WRITE
WITH
AP
READ
WRITE
CKE
READ
WITH AP
WRITE
WITH AP
WRITEA
CKE_
READ
CKE
CKE
POWER
ON
READ
SUSPEND
READ
WITH AP
CKE_
READA
CKE
PRECHARGE
POWER
APPLIED
WRITE
WITH AP
Read
PRECHARGE
CKE_
WRITEA
SUSPEND
READ
WITH
AP
READA
SUSPEND
PRECHARGE
PRECHARGE
PRECHARGE
Automatic transition after completion of command.
Transition resulting from command input.
Note: 1. After the auto-refresh operation, precharge operation is performed automatically and
enter the IDLE state.
Preliminary Data Sheet E0248E10 (Ver. 1.0)
23
EDS2504APTA/08APTA/16APTA-TI
Mode Register Configuration
The mode register is set by the input to the address pins (A0 to A12, BA0 and BA1) during mode register set cycles.
The mode register consists of five sections, each of which is assigned to address pins.
BA1, BA0, A8, A9, A10, A11, A12: (OPCODE): The SDRAM has two types of write modes. One is the burst write
mode, and the other is the single write mode. These bits specify write mode.
Burst read and burst write: Burst write is performed for the specified burst length starting from the column address
specified in the write cycle.
Burst read and single write: Data is only written to the column address specified during the write cycle, regardless of
the burst length.
A7: Keep this bit Low at the mode register set cycle. If this pin is high, the vender test mode is set.
A6, A5, A4: (LMODE): These pins specify the /CAS latency.
A3: (BT): A burst type is specified.
A2, A1, A0: (BL): These pins specify the burst length.
BA1 BA0 A12
A11
A10
A9
A8
OPCODE
A7
A6
0
BA1 BA0 A12 A11 A10
0
0
0
0
A3
A2
BT
A1
A0
BL
A3 Burst type
0
R
0 Sequential
1
A2 A1 A0
Burst length
BT=0
BT=1
0
0
1
R
0
0
0
1
1
0
1
0
2
0
0
1
2
2
0
1
1
3
0
1
0
4
4
1
X
X
R
0
1
1
8
8
1
0
0
R
R
A9
0
0
0
A4
LMODE
A6 A5 A4 CAS latency
0
A5
A8
0
X
X
X
X
X
0
1
X
X
X
X
X
1
0
X
X
X
X
X
1
1
Interleave
Write mode
Burst read and burst write
R
Burst read and single write
R
Mode Register Set Timing
Preliminary Data Sheet E0248E10 (Ver. 1.0)
24
1
0
1
R
R
1
1
0
R
R
1
1
1
R
R
R is Reserved (inhibit)
X: 0 or 1
EDS2504APTA/08APTA/16APTA-TI
Burst length = 2
Burst length = 4
Starting Ad. Addressing(decimal)
A0
Starting Ad. Addressing(decimal)
Sequential Interleave
A1
A0
0
0, 1,
0, 1,
0
0
0, 1, 2, 3,
0, 1, 2, 3,
1
1, 0,
1, 0,
0
1
1, 2, 3, 0,
1, 0, 3, 2,
1
0
2, 3, 0, 1,
2, 3, 0, 1,
1
1
3, 0, 1, 2,
3, 2, 1, 0,
Sequential
Interleave
Burst length = 8
Addressing(decimal)
Starting Ad.
A2
A1
A0 Sequential
0
0
0
0, 1, 2, 3, 4, 5, 6, 7,
0, 1, 2, 3, 4, 5, 6, 7,
0
0
1
1, 2, 3, 4, 5, 6, 7, 0,
1, 0, 3, 2, 5, 4, 7, 6,
0
1
0
2, 3, 4, 5, 6, 7, 0, 1,
2, 3, 0, 1, 6, 7, 4, 5,
0
1
1
3, 4, 5, 6, 7, 0, 1, 2,
3, 2, 1, 0, 7, 6, 5, 4,
1
0
0
4, 5, 6, 7, 0, 1, 2, 3,
4, 5, 6, 7, 0, 1, 2, 3,
1
0
1
5, 6, 7, 0, 1, 2, 3, 4,
5, 4, 7, 6, 1, 0, 3, 2,
1
1
0
6, 7, 0, 1, 2, 3, 4, 5,
6, 7, 4, 5, 2, 3, 0, 1,
1
1
1
7, 0, 1, 2, 3, 4, 5, 6,
7, 6, 5, 4, 3, 2, 1, 0,
Interleave
Burst Sequence
Power-up sequence
Power-up sequence
The SDRAM should be goes on the following sequence with power up.
The CLK, CKE, /CS, DQM and DQ pins keep low till power stabilizes.
The CLK pin is stabilized within 100 µs after power stabilizes before the following initialization sequence.
The CKE and DQM is driven to high between power stabilizes and the initialization sequence.
This SDRAM has VDD clamp diodes for CLK, CKE, /CS DQM and DQ pins. If these pins go high before power up,
the large current flows from these pins to VDD through the diodes.
Initialization sequence
When 200 µs or more has past after the above power-up sequence, all banks must be precharged using the
precharge command (PALL). After tRP delay, set 8 or more auto refresh commands (REF). Set the mode register
set command (MRS) to initialize the mode register. We recommend that by keeping DQM and CKE to High, the
output buffer becomes High-Z during Initialization sequence, to avoid DQ bus contention on memory system formed
with a number of device.
Initialization sequence
Power up sequence
100 µs
VDD, VDDQ
200 µs
0V
CKE, DQM
Low
CLK
Low
/CS, DQ
Low
Power stabilize
Power-up sequence and Initialization sequence
Preliminary Data Sheet E0248E10 (Ver. 1.0)
25
EDS2504APTA/08APTA/16APTA-TI
Operation of the SDRAM
Read/Write Operations
Bank active
Before executing a read or write operation, the corresponding bank and the row address must be activated by the
bank active (ACT) command. An interval of tRCD is required between the bank active command input and the
following read/write command input.
Read operation
A read operation starts when a read command is input. Output buffer becomes Low-Z in the (/CAS Latency - 1)
cycle after read command set. The SDRAM can perform a burst read operation.
The burst length can be set to 1, 2, 4 and 8. The start address for a burst read is specified by the column address
and the bank select address at the read command set cycle. In a read operation, data output starts after the number
of clocks specified by the /CAS Latency. The /CAS Latency can be set to 2 or 3.
When the burst length is 1, 2, 4 and 8 the DOUT buffer automatically becomes High-Z at the next clock after the
successive burst-length data has been output.
The /CAS latency and burst length must be specified at the mode register.
CLK
tRCD
Command
ACT
READ
Address
Row
Column
DQ
out 0
CL = 2
CL = 3
out 1
out 2
out 3
out 0
out 1
out 2
out 3
CL = /CAS latency
Burst Length = 4
/CAS Latency
CLK
tRCD
Command
ACT
READ
Address
Row
Column
BL = 1
out 0
out 0 out 1
DQ
BL = 2
out 0 out 1 out 2 out 3
BL = 4
out 0 out 1 out 2 out 3 out 4 out 5 out 6 out 7
BL = 8
BL : Burst Length
/CAS Latency = 2
Burst Length
Preliminary Data Sheet E0248E10 (Ver. 1.0)
26
EDS2504APTA/08APTA/16APTA-TI
Write operation
Burst write or single write mode is selected by the OPCODE of the mode register.
1. Burst write: A burst write operation is enabled by setting OPCODE (A9, A8) to (0, 0). A burst write starts in the
same clock as a write command set. (The latency of data input is 0 clock.) The burst length can be set to 1, 2, 4
and 8, like burst read operations. The write start address is specified by the column address and the bank select
address at the write command set cycle.
CLK
tRCD
Command
ACT
WRIT
Address
Row
Column
in 0
BL = 1
DQ
in 0
in 1
in 0
in 1
in 2
in 3
in 0
in 1
in 2
in 3
BL = 2
BL = 4
in 4
in 5
in 6
BL = 8
in 7
CL = 2, 3
Burst write
2. Single write: A single write operation is enabled by setting OPCODE (A9, A8) to (1, 0). In a single write
operation, data is only written to the column address and the bank select address specified by the write
command set cycle without regard to the burst length setting. (The latency of data input is 0 clock).
CLK
tRCD
Command
Address
DQ
ACT
Row
WRIT
Column
in 0
Single write
Preliminary Data Sheet E0248E10 (Ver. 1.0)
27
EDS2504APTA/08APTA/16APTA-TI
Auto Precharge
Read with auto-precharge
In this operation, since precharge is automatically performed after completing a read operation, a precharge
command need not be executed after each read operation. The command executed for the same bank after the
execution of this command must be the bank active (ACT) command. In addition, an interval defined by lAPR is
required before execution of the next command.
[Clock cycle time]
/CAS latency
Precharge start cycle
3
2 cycle before the final data is output
2
1 cycle before the final data is output
CLK
CL=2 Command
ACT
READA
ACT
lRAS
DQ
out0
out1
out2
out3
lAPR
CL=3 Command
ACT
READA
ACT
lRAS
DQ
out0
out1
Note: Internal auto-precharge starts at the timing indicated by " ".
And an interval of tRAS (lRAS) is required between previous active (ACT) command and internal precharge "
out2
out3
lAPR
".
Burst Read (BL = 4)
Write with auto-precharge
In this operation, since precharge is automatically performed after completing a burst write or single write operation,
a precharge command need not be executed after each write operation. The command executed for the same bank
after the execution of this command must be the bank active (ACT) command. In addition, an interval of lDAL is
required between the final valid data input and input of next command.
CLK
Command
ACT
ACT
WRITA
IRAS
DQ
in0
in1
in2
in3
lDAL
Note: Internal auto-precharge starts at the timing indicated by " ".
and an interval of tRAS (lRAS) is required between previous active (ACT) command
and internal precharge " ".
Burst Write (BL = 4)
Preliminary Data Sheet E0248E10 (Ver. 1.0)
28
EDS2504APTA/08APTA/16APTA-TI
CLK
Command
ACT
ACT
WRITA
IRAS
DQ
in
lDAL
Note: Internal auto-precharge starts at the timing indicated by " ".
and an interval of tRAS (lRAS) is required between previous active (ACT) command
and internal precharge " ".
Single Write
Preliminary Data Sheet E0248E10 (Ver. 1.0)
29
EDS2504APTA/08APTA/16APTA-TI
Burst Stop Command
During a read cycle, when the burst stop command is issued, the burst read data are terminated and the data bus
goes to High-Z after the /CAS latency from the burst stop command.
CLK
Command
READ
BST
DQ
(CL = 2)
out
DQ
(CL = 3)
out
out
out
out
High-Z
out
High-Z
Burst Stop at Read
During a write cycle, when the burst stop command is issued, the burst write data are terminated and data bus goes
to High-Z at the same clock with the burst stop command.
CLK
Command
WRITE
BST
High-Z
DQ
in
in
in
Burst Stop at Write
Preliminary Data Sheet E0248E10 (Ver. 1.0)
30
in
EDS2504APTA/08APTA/16APTA-TI
Command Intervals
Read command to Read command interval
1. Same bank, same ROW address: When another read command is executed at the same ROW address of the
same bank as the preceding read command execution, the second read can be performed after an interval of no
less than 1 clock. Even when the first command is a burst read that is not yet finished, the data read by the
second command will be valid.
CLK
Command
ACT
Address
Row
READ
READ
Column A Column B
BS
DQ
out A0 out B0 out B1 out B2 out B3
Bank0
Active
Column =A Column =B Column =A Column =B
Dout
Read
Read
Dout
CL = 3
BL = 4
Bank 0
READ to READ Command Interval (same ROW address in same bank)
2. Same bank, different ROW address: When the ROW address changes on same bank, consecutive read
commands cannot be executed; it is necessary to separate the two read commands with a precharge command
and a bank active command.
3. Different bank: When the bank changes, the second read can be performed after an interval of no less than 1
clock, provided that the other bank is in the bank active state. Even when the first command is a burst read that
is not yet finished, the data read by the second command will be valid.
CLK
Command
Address
ACT
ACT
READ READ
Row 0
Row 1
Column A Column B
BS
DQ
out A0 out B0 out B1 out B2 out B3
Bank0
Active
Bank3 Bank0 Bank3
Active Read Read
Bank0 Bank3
Dout
Dout
READ to READ Command Interval (different bank)
Preliminary Data Sheet E0248E10 (Ver. 1.0)
31
CL = 3
BL = 4
EDS2504APTA/08APTA/16APTA-TI
Write command to Write command interval
1. Same bank, same ROW address: When another write command is executed at the same ROW address of the
same bank as the preceding write command, the second write can be performed after an interval of no less than
1 clock. In the case of burst writes, the second write command has priority.
CLK
Command
ACT
Address
Row
WRIT
WRIT
Column A Column B
BS
DQ
in A0
Bank0
Active
in B0
in B1
in B2
in B3
Burst Write Mode
BL = 4
Bank 0
Column =A Column =B
Write
Write
WRITE to WRITE Command Interval (same ROW address in same bank)
2. Same bank, different ROW address: When the ROW address changes, consecutive write commands cannot be
executed; it is necessary to separate the two write commands with a precharge command and a bank active
command.
3. Different bank: When the bank changes, the second write can be performed after an interval of no less than 1
clock, provided that the other bank is in the bank active state. In the case of burst write, the second write
command has priority.
CLK
Command
Address
ACT
ACT
WRIT
Row 0
Row 1
Column A Column B
WRIT
BS
DQ
in A0
Bank0
Active
in B0
in B1
in B2
in B3
Burst Write Mode
BL = 4
Bank3 Bank0 Bank3
Active Write Write
WRITE to WRITE Command Interval (different bank)
Preliminary Data Sheet E0248E10 (Ver. 1.0)
32
EDS2504APTA/08APTA/16APTA-TI
Read command to Write command interval
1. Same bank, same ROW address: When the write command is executed at the same ROW address of the same
bank as the preceding read command, the write command can be performed after an interval of no less than 1
clock. However, DQM must be set High so that the output buffer becomes High-Z before data input.
CLK
Command
READ WRIT
CL=2
DQM
CL=3
in B0
DQ (input)
in B1
in B2
in B3
BL = 4
Burst write
High-Z
DQ (output)
READ to WRITE Command Interval (1)
CLK
Command
READ
WRIT
DQM
CL=2
2 clock
out
out
out
in
in
in
in
out
out
in
in
in
in
DQ
CL=3
READ to WRITE Command Interval (2)
2. Same bank, different ROW address: When the ROW address changes, consecutive write commands cannot be
executed; it is necessary to separate the two commands with a precharge command and a bank active
command.
3. Different bank: When the bank changes, the write command can be performed after an interval of no less than 1
cycle, provided that the other bank is in the bank active state. However, DQM must be set High so that the
output buffer becomes High-Z before data input.
Preliminary Data Sheet E0248E10 (Ver. 1.0)
33
EDS2504APTA/08APTA/16APTA-TI
Write command to Read command interval:
1. Same bank, same ROW address: When the read command is executed at the same ROW address of the same
bank as the preceding write command, the read command can be performed after an interval of no less than 1
clock. However, in the case of a burst write, data will continue to be written until one clock before the read
command is executed.
CLK
Command
WRIT
READ
DQM
DQ (input)
in A0
DQ (output)
out B0
Column = A
Write
Column = B
Read
out B1
out B2
out B3
Burst Write Mode
CL = 2
BL = 4
Bank 0
/CAS Latency
Column = B
Dout
WRITE to READ Command Interval (1)
CLK
Command
WRIT
READ
DQM
DQ (input)
in A1
in A0
DQ (output)
out B0
Column = A
Write
out B1
/CAS Latency
Column = B
Read
Column = B
Dout
out B2
out B3
Burst Write Mode
CL = 2
BL = 4
Bank 0
WRITE to READ Command Interval (2)
2. Same bank, different ROW address: When the ROW address changes, consecutive read commands cannot be
executed; it is necessary to separate the two commands with a precharge command and a bank active
command.
3. Different bank: When the bank changes, the read command can be performed after an interval of no less than 1
clock, provided that the other bank is in the bank active state. However, in the case of a burst write, data will
continue to be written until one clock before the read command is executed (as in the case of the same bank and
the same address).
Preliminary Data Sheet E0248E10 (Ver. 1.0)
34
EDS2504APTA/08APTA/16APTA-TI
Read with auto precharge to Read command interval
1. Different bank: When some banks are in the active state, the second read command (another bank) is executed.
Even when the first read with auto-precharge is a burst read that is not yet finished, the data read by the second
command is valid. The internal auto-precharge of one bank starts at the next clock of the second command.
CLK
Command
READA
READ
bank0
Read A
bank3
Read
BS
DQ
out A0
out A1
Note: Internal auto-precharge starts at the timing indicated by "
out B0
out B1
CL= 3
BL = 4
".
Read with Auto Precharge to Read Command Interval (Different bank)
2. Same bank: The consecutive read command (the same bank) is illegal.
Write with auto precharge to Write command interval
1. Different bank: When some banks are in the active state, the second write command (another bank) is executed.
In the case of burst writes, the second write command has priority. The internal auto-precharge of one bank
starts 2 clocks later from the second command.
CLK
Command
WRITA
WRIT
BS
DQ
in A0
bank0
Write A
in A1
in B0
in B1
in B2
in B3
bank3
Write
BL= 4
Note: Internal auto-precharge starts at the timing indicated by "
".
Write with Auto Precharge to Write Command Interval (Different bank)
2. Same bank: The consecutive write command (the same bank) is illegal.
Preliminary Data Sheet E0248E10 (Ver. 1.0)
35
EDS2504APTA/08APTA/16APTA-TI
Read with auto precharge to Write command interval
1. Different bank: When some banks are in the active state, the second write command (another bank) is executed.
However, DQM must be set High so that the output buffer becomes High-Z before data input. The internal autoprecharge of one bank starts at the next clock of the second command.
CLK
Command
READA
WRIT
BS
CL = 2
DQM
CL = 3
DQ (input)
in B0
DQ (output)
in B1
in B2
in B3
High-Z
bank0
ReadA
BL = 4
bank3
Write
Note: Internal auto-precharge starts at the timing indicated by "
".
Read with Auto Precharge to Write Command Interval (Different bank)
2. Same bank: The consecutive write command from read with auto precharge (the same bank) is illegal. It is
necessary to separate the two commands with a bank active command.
Write with auto precharge to Read command interval
1. Different bank: When some banks are in the active state, the second read command (another bank) is executed.
However, in case of a burst write, data will continue to be written until one clock before the read command is
executed. The internal auto-precharge of one bank starts at 2 clocks later from the second command.
CLK
Command
WRITA
READ
BS
DQM
DQ (input)
in A0
DQ (output)
out B0
bank0
WriteA
out B1
out B2
out B3
CL = 3
BL = 4
bank3
Read
Note: Internal auto-precharge starts at the timing indicated by "
".
Write with Auto Precharge to Read Command Interval (Different bank)
2. Same bank: The consecutive read command from write with auto precharge (the same bank) is illegal. It is
necessary to separate the two commands with a bank active command.
Preliminary Data Sheet E0248E10 (Ver. 1.0)
36
EDS2504APTA/08APTA/16APTA-TI
Read command to Precharge command interval (same bank)
When the precharge command is executed for the same bank as the read command that preceded it, the minimum
interval between the two commands is one clock. However, since the output buffer then becomes High-Z after the
clocks defined by lHZP, there is a case of interruption to burst read data output will be interrupted, if the precharge
command is input during burst read. To read all data by burst read, the clocks defined by lEP must be assured as
an interval from the final data output to precharge command execution.
CLK
PRE/PALL
READ
Command
DQ
out A0
out A1
CL=2
out A2
out A3
lEP = -1 cycle
READ to PRECHARGE Command Interval (same bank): To output all data (CL = 2, BL = 4)
CLK
PRE/PALL
READ
Command
DQ
out A0
CL=3
out A1
out A2
out A3
lEP = -2 cycle
READ to PRECHARGE Command Interval (same bank): To output all data (CL = 3, BL = 4)
CLK
Command
READ
PRE/PALL
High-Z
DQ
out A0
lHZP = 2
READ to PRECHARGE Command Interval (same bank): To stop output data (CL = 2, BL = 1, 2, 4, 8)
CLK
Command
READ
PRE/PALL
High-Z
DQ
out A0
lHZP =3
READ to PRECHARGE Command Interval (same bank): To stop output data (CL = 3, BL = 1, 2, 4, 8)
Preliminary Data Sheet E0248E10 (Ver. 1.0)
37
EDS2504APTA/08APTA/16APTA-TI
Write command to Precharge command interval (same bank)
When the precharge command is executed for the same bank as the write command that preceded it, the minimum
interval between the two commands is 1 clock. However, if the burst write operation is unfinished, the input data
must be masked by means of DQM for assurance of the clock defined by tDPL.
CLK
Command
WRIT
PRE/PALL
DQM
DQ
tDPL
CLK
Command
PRE/PALL
WRIT
DQM
DQ
in A0
in A1
tDPL
WRITE to PRECHARGE Command Interval (same bank) (BL = 4 (To stop write operation))
CLK
Command
PRE/PALL
WRIT
DQM
DQ
in A0
in A1
in A2
in A3
tDPL
WRITE to PRECHARGE Command Interval (same bank) (BL = 4 (To write all data))
Preliminary Data Sheet E0248E10 (Ver. 1.0)
38
EDS2504APTA/08APTA/16APTA-TI
Bank active command interval
1. Same bank: The interval between the two bank active commands must be no less than tRC.
2. In the case of different bank active commands: The interval between the two bank active commands must be no
less than tRRD.
CLK
Command
ACT
ACT
Address
ROW
ROW
BS
tRC
Bank 0
Active
Bank 0
Active
Bank Active to Bank Active for Same Bank
CLK
Command
Address
ACT
ACT
ROW:0
ROW:1
BS
tRRD
Bank 0
Active
Bank 3
Active
Bank Active to Bank Active for Different Bank
Mode register set to Bank active command interval
The interval between setting the mode register and executing a bank active command must be no less than lMRD.
CLK
Command
Address
MRS
ACT
OPCODE
BS & ROW
IMRD
Mode
Register Set
Bank
Active
Mode register set to Bank active command interval
Preliminary Data Sheet E0248E10 (Ver. 1.0)
39
EDS2504APTA/08APTA/16APTA-TI
DQM Control
The DQM mask the DQ data. The UDQM and LDQM mask the upper and lower bytes of the DQ data, respectively.
The timing of UDQM/LDQM is different during reading and writing.
Reading
When data is read, the output buffer can be controlled by DQM. By setting DQM to Low, the output buffer becomes
Low-Z, enabling data output. By setting DQM to High, the output buffer becomes High-Z, and the corresponding
data is not output. However, internal reading operations continue. The latency of DQM during reading is 2 clocks.
Writing
Input data can be masked by DQM. By setting DQM to Low, data can be written. In addition, when DQM is set to
High, the corresponding data is not written, and the previous data is held. The latency of DQM during writing is 0
clock.
CLK
DQM
DQ
High-Z
out 0
out 1
out 3
lDOD = 2 Latency
Reading
CLK
DQM
DQ
in 0
in 3
in 1
lDID = 0 Latency
Writing
Preliminary Data Sheet E0248E10 (Ver. 1.0)
40
EDS2504APTA/08APTA/16APTA-TI
Refresh
Auto-refresh
All the banks must be precharged before executing an auto-refresh command. Since the auto-refresh command
updates the internal counter every time it is executed and determines the banks and the ROW addresses to be
refreshed, external address specification is not required. The refresh cycles are required to refresh all the ROW
addresses within tREF (max.). The output buffer becomes High-Z after auto-refresh start. In addition, since a
precharge has been completed by an internal operation after the auto-refresh, an additional precharge operation by
the precharge command is not required.
Self-refresh
After executing a self-refresh command, the self-refresh operation continues while CKE is held Low. During selfrefresh operation, all ROW addresses are refreshed by the internal refresh timer. A self-refresh is terminated by a
self-refresh exit command. Before and after self-refresh mode, execute auto-refresh to all refresh addresses in or
within tREF (max.) period on the condition 1 and 2 below.
1. Enter self-refresh mode within time as below* after either burst refresh or distributed refresh at equal interval to
all refresh addresses are completed.
2. Start burst refresh or distributed refresh at equal interval to all refresh addresses within time as below*after
exiting from self-refresh mode.
Note: tREF (max.) / refresh cycles.
Others
Power-down mode
The SDRAM enters power-down mode when CKE goes Low in the IDLE state. In power down mode, power
consumption is suppressed by deactivating the input initial circuit. Power down mode continues while CKE is held
Low. In addition, by setting CKE to High, the SDRAM exits from the power down mode, and command input is
enabled from the next clock. In this mode, internal refresh is not performed.
Clock suspend mode
By driving CKE to Low during a bank active or read/write operation, the SDRAM enters clock suspend mode. During
clock suspend mode, external input signals are ignored and the internal state is maintained. When CKE is driven
High, the SDRAM terminates clock suspend mode, and command input is enabled from the next clock. For details,
refer to the "CKE Truth Table".
Preliminary Data Sheet E0248E10 (Ver. 1.0)
41
EDS2504APTA/08APTA/16APTA-TI
Timing Waveforms
Read Cycle
tCK
tCH t CL
CLK
t RC
VIH
CKE
t RP
tRAS
tRCD
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
/CS
tSI tHI
tSI tHI
/RAS
tSI tHI
tSI tHI
/CAS
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
/WE
tSI tHI
BS
tSI tHI
tSI tHI
A10
tSI tHI
tSI tHI
tSI tHI
Address
tSI
tHI
DQM
DQ (input)
tAC
tAC
tAC
tHZ
DQ (output)
t AC
tOH
tOH
Bank 0
Active
Bank 0
Read
tLZ
tOH
Bank 0
Precharge
Preliminary Data Sheet E0248E10 (Ver. 1.0)
42
tOH
/CAS latency = 2
Burst length = 4
Bank 0 access
= VIH or VIL
EDS2504APTA/08APTA/16APTA-TI
Write Cycle
tCK
tCH tCL
CLK
tRC
VIH
CKE
tRP
tRAS
tRCD
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
/CS
tSI tHI
tSI tHI
/RAS
tSI tHI
tSI tHI
/CAS
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
tSI tHI
/WE
tSI tHI
tSI tHI
BS
tSI tHI
tSI tHI
A10
tSI tHI
tSI tHI
tSI tHI
Address
tSI
tHI
DQM
tSI
t HI
tSI
tHI tSI
tHI
tSI
tHI
DQ (input)
tDPL
DQ (output)
Bank 0
Precharge
Bank 0
Write
Bank 0
Active
CL = 2
BL = 4
Bank 0 access
= VIH or VIL
Mode Register Set Cycle
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
b+3
b’
b’+1
b’+2
b’+3
19
CLK
CKE
VIL
/CS
/RAS
/CAS
/WE
BS
Address
code
valid
C: b’
C: b
R: b
DQM
DQ (output)
b
High-Z
DQ (input)
lMRD
lRP
Precharge
If needed
Mode
register
Set
Bank 3
Active
lRCD
Output mask
Bank 3
Read
Preliminary Data Sheet E0248E10 (Ver. 1.0)
43
lRCD = 3
/CAS latency = 3
Burst length = 4
= VIH or VIL
EDS2504APTA/08APTA/16APTA-TI
Read Cycle/Write Cycle
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
CLK
CKE
VIH
Read cycle
/RAS-/CAS delay = 3
/CAS latency = 3
Burst length = 4
= VIH or VIL
/CS
/RAS
/CAS
/WE
BS
Address
R:a
C:a
R:b
C:b
C:b'
C:b"
DQM
DQ (output)
DQ (input)
CKE
a
a+1 a+2 a+3
b
b+1 b+2 b+3 b'
b'+1 b"
b"+1 b"+2 b"+3
High-Z
Bank 0
Active
Bank 0
Read
Bank 3
Active
Bank 3 Bank 0
Read
Precharge
Bank 3
Read
Bank 3
Read
Bank 3
Precharge
VIH
Write cycle
/RAS-/CAS delay = 3
/CAS latency = 3
Burst length = 4
= VIH or VIL
/CS
/RAS
/CAS
/WE
BS
Address
R:a
C:a
R:b
C:b
C:b'
C:b"
DQM
High-Z
DQ (output)
DQ (input)
a
Bank 0
Active
a+1 a+2 a+3
Bank 0
Write
b
Bank 3
Active
b+1 b+2 b+3 b'
Bank 3
Write
Bank 0
Precharge
b'+1 b"
Bank 3
Write
b"+1 b"+2 b"+3
Bank 3
Write
Bank 3
Precharge
Read/Single Write Cycle
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
CLK
CKE
VIH
/CS
/RAS
/CAS
/WE
BS
R:a
Address
C:a
R:b
C:a' C:a
DQM
a
DQ (input)
DQ (output)
a
Bank 0
Active
CKE
Bank 0
Read
Bank 3
Active
C:a
R:b
a+1 a+2 a+3
a
Bank 0 Bank 0
Read
Write
a+1 a+2 a+3
Bank 0
Precharge
Bank 3
Precharge
VIH
/CS
/RAS
/CAS
/WE
BS
Address
R:a
C:a
C:b C:c
a
b
DQM
DQ (input)
DQ (output)
a
Bank 0
Active
Bank 0
Read
a+1
c
a+3
Bank 0
Write
Bank 3
Active
Bank 0 Bank 0
Write
Write
Bank 0
Precharge
Read/Single write
/RAS-/CAS delay = 3
/CAS latency = 3
Burst length = 4
= VIH or VIL
Preliminary Data Sheet E0248E10 (Ver. 1.0)
44
EDS2504APTA/08APTA/16APTA-TI
Read/Burst Write Cycle
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
CLK
CKE
/CS
/RAS
/CAS
/WE
BS
R:a
Address
C:a
R:b
C:a'
DQM
a
DQ (input)
DQ (output)
a
Bank 0
Active
CKE
Clock
suspend
Bank 0
Read
Bank 3
Active
C:a
R:b
a+1 a+2 a+3
a+1 a+2 a+3
Bank 0
Precharge
Bank 0
Write
Bank 3
Precharge
VIH
/CS
/RAS
/CAS
/WE
BS
R:a
Address
C:a
DQM
a
DQ (input)
DQ (output)
a
Bank 0
Active
Bank 0
Read
a+1
a+1 a+2 a+3
a+3
Bank 0
Write
Bank 3
Active
Bank 0
Precharge
Read/Burst write
/RAS-/CAS delay = 3
/CAS latency = 3
Burst length = 4
= VIH or VIL
Auto Refresh Cycle
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
a
a+1
CLK
CKE
VIH
/CS
/RAS
/CAS
/WE
BS
Address
R:a
A10=1
C:a
DQM
DQ (input)
High-Z
DQ (output)
t RP
Precharge
If needed
t RC
Auto Refresh
t RC
Auto Refresh
Preliminary Data Sheet E0248E10 (Ver. 1.0)
45
Active
Bank 0
Read
Bank 0
Refresh cycle and
Read cycle
/RAS-/CAS delay = 2
/CAS latency = 2
Burst length = 4
= VIH or VIL
EDS2504APTA/08APTA/16APTA-TI
Self Refresh Cycle
CLK
lSREX
CKE Low
CKE
/CS
/RAS
/CAS
/WE
BS
Address
A10=1
DQM
DQ (input)
High-Z
DQ (output)
t RP
Precharge command
If needed
t RC
t RC
Self refresh entry
command
Next
clock
enable
Self refresh exit
ignore command
or No operation
Auto
Next
clock refresh
enable
Self refresh entry
command
Self refresh cycle
/RAS-/CAS delay = 3
CL = 3
BL = 4
= VIH or VIL
Clock Suspend Mode
tSI
0
1
2
3
4
5
tSI
tHI
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
CLK
CKE
Read cycle
/RAS-/CAS delay = 2
/CAS latency = 2
Burst length = 4
= VIH or VIL
/CS
/RAS
/CAS
/WE
BS
Address
R:a
C:a
R:b
C:b
DQM
DQ (output)
a
a+1 a+2
a+3
b
b+1 b+2 b+3
High-Z
DQ (input)
Bank0 Active clock
Active suspend start
Active clock Bank0
suspend end Read
Bank3
Active
Read suspend
start
Read suspend
end
Bank3
Read
Bank0
Precharge
Earliest Bank3
Precharge
CKE
Write cycle
/RAS-/CAS delay = 2
/CAS latency = 2
Burst length = 4
= VIH or VIL
/CS
/RAS
/CAS
/WE
BS
Address
C:a R:b
R:a
C:b
DQM
High-Z
DQ (output)
DQ (input)
a
Bank0
Active
Active clock
suspend start
a+1 a+2
Active clock Bank0 Bank3
supend end Write Active
Write suspend
start
a+3 b
Write suspend
end
Preliminary Data Sheet E0248E10 (Ver. 1.0)
46
b+1 b+2 b+3
Bank3 Bank0
Write Precharge
Earliest Bank3
Precharge
EDS2504APTA/08APTA/16APTA-TI
Power Down Mode
CLK
CKE Low
CKE
/CS
/RAS
/CAS
/WE
BS
Address
R: a
A10=1
DQM
DQ (input)
High-Z
DQ (output)
tRP
Precharge command
If needed
Power down cycle
Power down entry
Power down
/RAS-/CAS delay = 3
mode exit
Active Bank 0 /CAS latency = 3
Burst length = 4
= VIH or VIL
Initialization Sequence
0
1
2
3
4
5
6
7
8
9
10
48
49
50
51
52
53
54
CLK
CKE
VIH
/CS
/RAS
/CAS
/WE
DQM
code
valid
Address
Valid
VIH
High-Z
DQ
t RC
tRP
All banks
Precharge
tRC
Auto Refresh
Auto Refresh
Preliminary Data Sheet E0248E10 (Ver. 1.0)
47
l MRD
Mode register
Set
Bank active
If needed
55
EDS2504APTA/08APTA/16APTA-TI
Package Drawing
Unit: mm
22.22 ± 0.10
A
10.16
28
PIN#1 ID
1
11.76 ± 0.20
54
27
B
0.80
0.25 to 0.40
0.16 M S A B
0.80
Nom
0.91 max.
0.25
0.10 +0.08
−0.05
0.10 S
0.09 to 0.20
S
1.2 max.
1.0 ± 0.05
0 to 8°
0.60 ± 0.15
Note: Dimension "A" does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or
gate burrs shall not exceed 0.20mm per side.
ECA-TS2-0016-01
Preliminary Data Sheet E0248E10 (Ver. 1.0)
48
EDS2504APTA/08APTA/16APTA-TI
Recommended Soldering Conditions
Please consult with our sales offices for soldering conditions of the EDS25XXAPTA.
Type of Surface Mount Device
EDS25XXAPTA: 54-pin Plastic TSOP (II)
Preliminary Data Sheet E0248E10 (Ver. 1.0)
49
EDS2504APTA/08APTA/16APTA-TI
NOTES FOR CMOS DEVICES
1
PRECAUTION AGAINST ESD FOR MOS DEVICES
Exposing the MOS devices to a strong electric field can cause destruction of the gate
oxide and ultimately degrade the MOS devices operation. Steps must be taken to stop
generation of static electricity as much as possible, and quickly dissipate it, when once
it has occurred. Environmental control must be adequate. When it is dry, humidifier
should be used. It is recommended to avoid using insulators that easily build static
electricity. MOS devices must be stored and transported in an anti-static container,
static shielding bag or conductive material. All test and measurement tools including
work bench and floor should be grounded. The operator should be grounded using
wrist strap. MOS devices must not be touched with bare hands. Similar precautions
need to be taken for PW boards with semiconductor MOS devices on it.
2
HANDLING OF UNUSED INPUT PINS FOR CMOS DEVICES
No connection for CMOS devices input pins can be a cause of malfunction. If no
connection is provided to the input pins, it is possible that an internal input level may be
generated due to noise, etc., hence causing malfunction. CMOS devices behave
differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed
high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected
to VDD or GND with a resistor, if it is considered to have a possibility of being an output
pin. The unused pins must be handled in accordance with the related specifications.
3
STATUS BEFORE INITIALIZATION OF MOS DEVICES
Power-on does not necessarily define initial status of MOS devices. Production process
of MOS does not define the initial operation status of the device. Immediately after the
power source is turned ON, the MOS devices with reset function have not yet been
initialized. Hence, power-on does not guarantee output pin levels, I/O settings or
contents of registers. MOS devices are not initialized until the reset signal is received.
Reset operation must be executed immediately after power-on for MOS devices having
reset function.
CME0107
Preliminary Data Sheet E0248E10 (Ver. 1.0)
50
EDS2504APTA/08APTA/16APTA-TI
The information in this document is subject to change without notice. Before using this document, confirm that this is the latest version.
No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of Elpida Memory, Inc.
Elpida Memory, Inc. does not assume any liability for infringement of any intellectual property rights
(including but not limited to patents, copyrights, and circuit layout licenses) of Elpida Memory, Inc. or
third parties by or arising from the use of the products or information listed in this document. No license,
express, implied or otherwise, is granted under any patents, copyrights or other intellectual property
rights of Elpida Memory, Inc. or others.
Descriptions of circuits, software and other related information in this document are provided for
illustrative purposes in semiconductor product operation and application examples. The incorporation of
these circuits, software and information in the design of the customer's equipment shall be done under
the full responsibility of the customer. Elpida Memory, Inc. assumes no responsibility for any losses
incurred by customers or third parties arising from the use of these circuits, software and information.
[Product applications]
Elpida Memory, Inc. makes every attempt to ensure that its products are of high quality and reliability.
However, users are instructed to contact Elpida Memory's sales office before using the product in
aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment,
medical equipment for life support, or other such application in which especially high quality and
reliability is demanded or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury.
[Product usage]
Design your application so that the product is used within the ranges and conditions guaranteed by
Elpida Memory, Inc., including the maximum ratings, operating supply voltage range, heat radiation
characteristics, installation conditions and other related characteristics. Elpida Memory, Inc. bears no
responsibility for failure or damage when the product is used beyond the guaranteed ranges and
conditions. Even within the guaranteed ranges and conditions, consider normally foreseeable failure
rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so
that the equipment incorporating Elpida Memory, Inc. products does not cause bodily injury, fire or other
consequential damage due to the operation of the Elpida Memory, Inc. product.
[Usage environment]
This product is not designed to be resistant to electromagnetic waves or radiation. This product must be
used in a non-condensing environment.
If you export the products or technology described in this document that are controlled by the Foreign
Exchange and Foreign Trade Law of Japan, you must follow the necessary procedures in accordance
with the relevant laws and regulations of Japan. Also, if you export products/technology controlled by
U.S. export control regulations, or another country's export control laws or regulations, you must follow
the necessary procedures in accordance with such laws or regulations.
If these products/technology are sold, leased, or transferred to a third party, or a third party is granted
license to use these products, that third party must be made aware that they are responsible for
compliance with the relevant laws and regulations.
M01E0107
Preliminary Data Sheet E0248E10 (Ver. 1.0)
51