DATA SHEET MOS INTEGRATED CIRCUIT MC-4R256FKE8S Direct Rambus DRAM SO-RIMMTM Module 256M-BYTE (128M-WORD x 18-BIT) Description The Direct Rambus SO-RIMM module is a general-purpose high-performance memory module subsystem suitable for use in a broad range of applications including computer memory, mobile personal computers, networking systems, and other applications where high bandwidth and low latency are required. MC-4R256FKE8S modules consists of eight 288M Direct Rambus DRAM (Direct RDRAM) devices (µPD488588). These are extremely high-speed CMOS DRAMs organized as 16M words by 18 bits. The use of Rambus Signaling Level (RSL) technology permits 800MHz transfer rates while using conventional system and board design technologies. Direct RDRAM devices are capable of sustained data transfers at 1.25 ns per two bytes (10 ns per 16 bytes). The architecture of the Direct RDRAM enables the highest sustained bandwidth for multiple, simultaneous, randomly addressed memory transactions. The separate control and data buses with independent row and column control yield high bus efficiency. The Direct RDRAM's multi-bank architecture supports up to four simultaneous transactions per device. Features • 160 edge connector pads with 0.65mm pad spacing • 256 MB Direct RDRAM storage • Each RDRAM has 32 banks, for 256 banks total on module • Gold plated contacts • RDRAMs use Chip Scale Package (CSP) • Serial Presence Detect support • Operates from a 2.5 V supply • Powerdown self refresh modes • Separate Row and Column buses for higher efficiency The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local Elpida Memory, Inc. for availability and additional information. Document No. E0138N30 (Ver. 3.0) Date Published June 2002 (K) Japan URL: http://www.elpida.com Elpida Memory,Inc. 2001-2002 Elpida Memory, Inc. is a joint venture DRAM company of NEC Corporation and Hitachi, Ltd. MC-4R256FKE8S Order information Part number MC-4R256FKE8S - 845 Organization 128M x 18 I/O Freq. RAS access time MHz ns 800 45 Package 160 edge connector pads 8 pieces of µPD488588FF SO-RIMM with heat spreader FBGA (µBGA) package Edge connector: Gold plated 2 Mounted devices Data Sheet E0138N30 (Ver. 3.0) MC-4R256FKE8S Module Pad Configuration B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 B21 B22 B23 B24 B25 B26 B27 B28 B29 B30 B31 B32 B33 B34 B35 B36 B37 B38 B39 B40 GND LDQA7 GND LDQA5 GND LDQA3 GND LDQA1 GND LCFM GND LCFMN GND LROW2 GND LROW0 GND LCOL3 GND LCOL1 GND LDQB1 GND LDQB3 GND LDQB5 GND LDQB7 GND LDQB8 GND LCMD GND SIN VDD NC GND NC VCMOS NC GND LDQA8 GND LDQA6 GND LDQA4 GND LDQA2 GND LDQA0 GND LCTM GND LCTMN GND LROW1 GND LCOL4 GND LCOL2 GND LCOL0 GND LDQB0 GND LDQB2 GND LDQB4 GND LDQB6 GND LSCK GND SOUT VDD NC GND NC VCMOS NC A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22 A23 A24 A25 A26 A27 A28 A29 A30 A31 A32 A33 A34 A35 A36 A37 A38 A39 A40 LCFM, LCFMN, RCFM, RCFMN : Clock from master LCTM, LCTMN, Side B Side A RCTM, RCTMN : Clock to master LCMD, RCMD : Serial Command Pad LROW2 - LROW0, B41 B42 B43 B44 B45 B46 B47 B48 B49 B50 B51 B52 B53 B54 B55 B56 B57 B58 B59 B60 B61 B62 B63 B64 B65 B66 B67 B68 B69 B70 B71 B72 B73 B74 B75 B76 B77 B78 B79 B80 NC VREF SA0 VDD SA1 VDD SWP GND RCMD GND RDQB6 GND RDQB4 GND RDQB2 GND RDQB0 GND RCOL0 GND RCOL2 GND RCOL4 GND RROW1 GND RCTMN GND RCTM GND RDQA0 GND RDQA2 GND RDQA4 GND RDQA6 GND RDQA8 GND NC VREF SCL VDD SDA VDD SVDD GND RSCK GND RDQB8 GND RDQB7 GND RDQB5 GND RDQB3 GND RDQB1 GND RCOL1 GND RCOL3 GND RROW0 GND RROW2 GND RCFMN GND RCFM GND RDQA1 GND RDQA3 GND RDQA5 GND RDQA7 GND A41 A42 A43 A44 A45 A46 A47 A48 A49 A50 A51 A52 A53 A54 A55 A56 A57 A58 A59 A60 A61 A62 A63 A64 A65 A66 A67 A68 A69 A70 A71 A72 A73 A74 A75 A76 A77 A78 A79 A80 RROW2 - RROW0 : Row bus LCOL4 - LCOL0, RCOL4 - RCOL0 : Column bus LDQA8 - LDQA0, RDQA8 - RDQA0 : Data bus A LDQB8 - LDQB0, RDQB8 - RDQB0 : Data bus B LSCK, RSCK : Clock input SA0, SA1 : Serial Presence Detect Address SCL, SDA : Serial Presence Detect Clock SIN, SOUT : Serial I/O SVDD : SPD Voltage SWP : Serial Presence Detect Write Protect VCMOS : Supply voltage for serial pads VDD : Supply voltage VREF : Logic threshold GND : Ground reference NC : These pads are not connected Data Sheet E0138N30 (Ver. 3.0) 3 MC-4R256FKE8S Module Pad Names Pad 4 Signal Name Pad Signal Name Pad Signal Name Pad Signal Name A1 GND B1 GND A41 NC B41 NC A2 LDQA8 B2 LDQA7 A42 VREF B42 VREF A3 GND B3 GND A43 SCL B43 SA0 A4 LDQA6 B4 LDQA5 A44 VDD B44 VDD A5 GND B5 GND A45 SDA B45 SA1 A6 LDQA4 B6 LDQA3 A46 VDD B46 VDD A7 GND B7 GND A47 SVDD B47 SWP A8 LDQA2 B8 LDQA1 A48 GND B48 GND A9 GND B9 GND A49 RSCK B49 RCMD A10 LDQA0 B10 LCFM A50 GND B50 GND A11 GND B11 GND A51 RDQB8 B51 RDQB6 A12 LCTM B12 LCFMN A52 GND B52 GND A13 GND B13 GND A53 RDQB7 B53 RDQB4 A14 LCTMN B14 LROW2 A54 GND B54 GND A15 GND B15 GND A55 RDQB5 B55 RDQB2 A16 LROW1 B16 LROW0 A56 GND B56 GND A17 GND B17 GND A57 RDQB3 B57 RDQB0 A18 LCOL4 B18 LCOL3 A58 GND B58 GND A19 GND B19 GND A59 RDQB1 B59 RCOL0 A20 LCOL2 B20 LCOL1 A60 GND B60 GND RCOL2 A21 GND B21 GND A61 RCOL1 B61 A22 LCOL0 B22 LDQB1 A62 GND B62 GND A23 GND B23 GND A63 RCOL3 B63 RCOL4 A24 LDQB0 B24 LDQB3 A64 GND B64 GND A25 GND B25 GND A65 RROW0 B65 RROW1 A26 LDQB2 B26 LDQB5 A66 GND B66 GND A27 GND B27 GND A67 RROW2 B67 RCTMN A28 LDQB4 B28 LDQB7 A68 GND B68 GND A29 GND B29 GND A69 RCFMN B69 RCTM A30 LDQB6 B30 LDQB8 A70 GND B70 GND A31 GND B31 GND A71 RCFM B71 RDQA0 A32 LSCK B32 LCMD A72 GND B72 GND A33 GND B33 GND A73 RDQA1 B73 RDQA2 A34 SOUT B34 SIN A74 GND B74 GND A35 VDD B35 VDD A75 RDQA3 B75 RDQA4 A36 NC B36 NC A76 GND B76 GND A37 GND B37 GND A77 RDQA5 B77 RDQA6 A38 NC B38 NC A78 GND B78 GND A39 VCMOS B39 VCMOS A79 RDQA7 B79 RDQA8 A40 NC B40 NC A80 GND B80 GND Data Sheet E0138N30 (Ver. 3.0) MC-4R256FKE8S Module Connector Pad Description Signal I/O Type GND – – LCFM I RSL (1/2) Description Ground reference for RDRAM core and interface. Clock from master. Interface clock used for receiving RSL signals from the Channel. Positive polarity. LCFMN I RSL LCMD I VCMOS Clock from master. Interface clock used for receiving RSL signals from the Channel. Negative polarity. Serial Command used to read from and write to the control registers. Also used for power management. LCOL4..LCOL0 I RSL Column bus. 5-bit bus containing control and address information for column accesses. LCTM I RSL Clock to master. Interface clock used for transmitting RSL signals to the Channel. Positive polarity. LCTMN I RSL Clock to master. Interface clock used for transmitting RSL signals to the Channel. Negative polarity. LDQA8..LDQA0 I/O RSL Data bus A. A 9-bit bus carrying a byte of read or write data between the Channel LDQB8..LDQB0 I/O RSL Data bus B. A 9-bit bus carrying a byte of read or write data between the Channel and the RDRAM. LDQA8 is non-functional on modules with x16 RDRAM devices. and the RDRAM. LDQB8 is non-functional on modules with x16 RDRAM devices. LROW2..LROW0 I RSL LSCK I VCMOS Row bus. 3-bit bus containing control and address information for row accesses. Serial clock input. Clock source used to read from and write to the RDRAM control registers. NC – – These pads are not connected. These 8 connector pads are reserved for future use. RCFM I RSL Clock from master. Interface clock used for receiving RSL signals from the RCFMN I RSL Clock from master. Interface clock used for receiving RSL signals from the RCMD I VCMOS Channel. Positive polarity. Channel. Negative polarity. Serial Command Input used to read from and write to the control registers. Also used for power management. RCOL4..RCOL0 I RSL Column bus. 5-bit bus containing control and address information for column accesses. RCTM I RSL RCTMN I RSL Clock to master. Interface clock used for transmitting RSL signals to the Channel. Positive polarity. Clock to master. Interface clock used for transmitting RSL signals to the Channel. Negative polarity. RDQA8..RDQA0 I/O RSL Data bus A. A 9-bit bus carrying a byte of read or write data between the Channel and the RDRAM. RDQA8 is non-functional on modules with x16 RDRAM devices. RDQB8..RDQB0 I/O RSL Data bus B. A 9-bit bus carrying a byte of read or write data between the Channel I RSL Row bus. 3-bit bus containing control and address information for row accesses. and the RDRAM. RDQB8 is non-functional on modules with x16 RDRAM devices. RROW2..RROW0 Data Sheet E0138N30 (Ver. 3.0) 5 MC-4R256FKE8S (2/2) Signal I/O Type Description RSCK I VCMOS Serial clock input. Clock source used to read from and write to the RDRAM SA0 I SVDD Serial Presence Detect Address 0. SA1 I SVDD Serial Presence Detect Address 1. SCL I SVDD Serial Presence Detect Clock. SDA I/O SVDD Serial Presence Detect Data (Open Collector I/O). SIN I/O VCMOS Serial I/O for reading from and writing to the control registers. Attaches to SIO0 control registers. of the first RDRAM on the module. SOUT I/O VCMOS Serial I/O for reading from and writing to the control registers. Attaches to SIO1 SVDD — — SWP I SVDD VCMOS — — CMOS I/O Voltage. Used for signals CMD, SCK, SIN, SOUT. VDD — — Supply voltage for the RDRAM core and interface logic. VREF — — Logic threshold reference voltage for RSL signals. of the last RDRAM on the module. SPD Voltage. Used for signals SCL, SDA, SWP, SA0, SA1 and SA2. Serial Presence Detect Write Protect (active high). When low, the SPD can be written as well as read. 6 Data Sheet E0138N30 (Ver. 3.0) MC-4R256FKE8S Block Diagram DQA 8 DQA 7 DQA 6 DQA 5 DQA 4 DQA 3 DQA 2 DQA 1 DQA 0 CFM CFMN CTM CTMN ROW 2 ROW 1 ROW 0 COL 4 COL 3 COL 2 COL 1 COL 0 DQB 0 DQB 1 DQB 2 DQB 3 DQB 4 DQB 5 DQB 6 DQB 7 DQB 8 U1 SIO 1 DQA 8 DQA 7 DQA 6 DQA 5 DQA 4 DQA 3 DQA 2 DQA 1 DQA 0 CFM CFMN CTM CTMN ROW 2 ROW 1 ROW 0 COL 4 COL 3 COL 2 COL 1 COL 0 DQB 0 DQB 1 DQB 2 DQB 3 DQB 4 DQB 5 DQB 6 DQB 7 DQB 8 U2 SCK DQA 8 DQA 7 DQA 6 DQA 5 DQA 4 DQA 3 DQA 2 DQA 1 DQA 0 CFM CFMN CTM CTMN ROW 2 ROW 1 ROW 0 COL 4 COL 3 COL 2 COL 1 COL 0 DQB 0 DQB 1 DQB 2 DQB 3 DQB 4 DQB 5 DQB 6 DQB 7 DQB 8 DQA 8 DQA 7 DQA 6 DQA 5 DQA 4 DQA 3 DQA 2 DQA 1 DQA 0 CFM CFMN CTM CTMN ROW 2 ROW 1 ROW 0 COL 4 COL 3 COL 2 COL 1 COL 0 DQB 0 DQB 1 DQB 2 DQB 3 DQB 4 DQB 5 DQB 6 DQB 7 DQB 8 U8 SIO 1 RDQA 8 RDQA 7 RDQA 6 RDQA 5 RDQA 4 RDQA 3 RDQA 2 RDQA 1 RDQA 0 RCFM RCFMN RCTM RCTMN RROW 2 RROW 1 RROW 0 RCOL 4 RCOL 3 RCOL 2 RCOL 1 RCOL 0 RDQB 0 RDQB 1 RDQB 2 RDQB 3 RDQB 4 RDQB 5 RDQB 6 RDQB 7 RDQB 8 SOUT RSCK RCMD A0 A2 WP A1 7 Data Sheet E0138N30 (Ver. 3.0) SDA SWP SDA SCL U0 SCL VDD VCMOS LDQA 8 LDQA 7 LDQA 6 LDQA 5 LDQA 4 LDQA 3 LDQA 2 LDQA 1 LDQA 0 LCFM LCFMN LCTM LCTMN LROW 2 LROW 1 LROW 0 LCOL 4 LCOL 3 LCOL 2 LCOL 1 LCOL 0 LDQB 0 LDQB 1 LDQB 2 LDQB 3 LDQB 4 LDQB 5 LDQB 6 LDQB 7 LDQB 8 SIN LSCK LCMD VREF SIO 0 SCK CMD VREF SIO 0 SIO 1 CMD VREF SIO 0 SIO 1 SCK U3 CMD VREF SIO 0 SCK CMD VREF SVDD VCC 47 kΩ SA0 SA1 SA2 SERIAL PD Remarks 1. Rambus Channel signals form a loop through the SO-RIMM module, with the exception of the SIO chain. 2. See Serial Presence Detection Specification for information on the SPD device and its contents. MC-4R256FKE8S Electrical Specification Absolute Maximum Ratings Symbol Parameter MIN. MAX. Unit VI,ABS Voltage applied to any RSL or CMOS signal pad with respect to GND −0.3 VDD + 0.3 V VDD,ABS Voltage on VDD with respect to GND −0.5 VDD + 1.0 V TSTORE Storage temperature −50 +100 °C Caution Exposing the device to stress above those listed in Absolute Maximum Ratings could cause permanent damage. The device is not meant to be operated under conditions outside the limits described in the operational section of this specification. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. DC Recommended Electrical Conditions Symbol Parameter and conditions VDD Supply voltage VCMOS CMOS I/O power supply at pad MIN. MAX. Unit 2.50 − 0.13 2.50 + 0.13 V 2.5V controllers VDD VDD V 1.8V controllers 1.8 − 0.1 1.8 + 0.2 1.4 − 0.2 1.4 + 0.2 V 2.2 3.6 V VREF Reference voltage VSPD Serial presence detector-positive power supply VIL RSL input low voltage VREF − 0.5 VREF − 0.2 V VIH RSL input high voltage VREF + 0.2 VREF + 0.5 V VIL,CMOS CMOS input low voltage −0.3 0.5VCMOS − 0.25 V VIH,CMOS CMOS input high voltage 0.5VCMOS+0.25 VCMOS + 0.3 V VOL,CMOS CMOS output low voltage, IOL,CMOS = 1 mA — 0.3 V VOH,CMOS CMOS output high voltage, IOH,CMOS = −0.25 mA VCMOS − 0.3 — V IREF VREF current, VREF,MAX −80.0 +80.0 µA ISCK,CMD CMOS input leakage current, (0 ≤ VCMOS ≤ VDD) −80.0 +80.0 µA ISIN,SOUT CMOS input leakage current, (0 ≤ VCMOS ≤ VDD) −10.0 +10.0 µA 8 Data Sheet E0138N30 (Ver. 3.0) MC-4R256FKE8S AC Electrical Specifications Parameter and Conditions MIN. TYP. MAX. Unit Module Impedance of RSL signals 25.2 28.0 30.8 Ω Module Impedance of SCK and CMD signals 23.8 28.0 32.2 Symbol Z TPD Average clock delay from finger to finger of all RSL clock nets 1.32 ns (CTM, CTMN,CFM, and CFMN) ∆TPD Propagation delay variation of RSL signals with respect to TPD Note1,2 -21 +21 ps ∆TPD-CMOS Propagation delay variation of SCK signal with respect to an average clock -250 +250 ps -200 +200 ps delay Note1 ∆TPD- SCK,CMD Propagation delay variation of CMD signal with respect to SCK signal Vα/VIN Attenuation Limit -845 16.0 % VXF/VIN Forward crosstalk coefficient -845 4.0 % VXB/VIN Backward crosstalk coefficient -845 2.0 % RDC DC Resistance Limit -845 1.4 Ω Notes 1. TPD or Average clock delay is defined as the average delay from finger to finger of all RSL clock nets (CTM, CTMN, CFM, and CFMN). 2. If the SO-RIMM module meets the following specification, then it is compliant to the specification. If the SO-RIMM module does not meet these specifications, then the specification can be adjusted by the “Adjusted ∆TPD Specification” table. Adjusted ∆TPD Specification Symbol ∆TPD Parameter and conditions Propagation delay variation of RSL signals with respect to TPD Adjusted MIN./MAX. +/− [17+(18*N*∆Z0)] Note Absolute MIN. MAX. -30 +30 Unit ps Note N = Number of RDRAM devices installed on the SO-RIMM module. ∆Z0 = delta Z0% = (MAX. Z0 − MIN. Z0) / (MIN. Z0) (MAX. Z0 and MIN. Z0 are obtained from the loaded (high impedance) impedance coupons of all RSL layers on the module.) Data Sheet E0138N30 (Ver. 3.0) 9 MC-4R256FKE8S SO-RIMM Module Current Profile IDD RIMM module power conditions Note1 MAX. Unit -845 729.4 mA , balance in Standby mode -845 1330 mA , balance in Active mode -845 1645 mA -845 749.4 mA -845 1350 mA -845 1665 mA One RDRAM in Read Note2 , balance in NAP mode One RDRAM in Read Note2 IDD3 One RDRAM in Read Note2 IDD4 One RDRAM in Write, balance in NAP mode IDD5 One RDRAM in Write, balance in Standby mode IDD6 One RDRAM in Write, balance in Active mode IDD1 IDD2 Notes 1. Actual power will depend on individual RDRAM component specifications, memory controller and usage patterns. Power does not include Refresh Current. 2. I/O current is a function of the % of 1’s, to add I/O power for 50 % 1’s for a x16 need to add 257 mA or 290 mA for x18 ECC module for the following : VDD = 2.5 V, VTERM = 1.8 V, VREF = 1.4 V and VDIL = VREF − 0.5 V. 10 Data Sheet E0138N30 (Ver. 3.0) MC-4R256FKE8S Package Drawings 160 EDGE CONNECTOR PADS RIMM (SOCKET TYPE) (1/2) EEPROM A (AREA B) R 288M Direct RDRAM x 4 P O N M1 (AREA B) S M Q M2 (AREA A) L T A G D B E F C A1 (AREA A) K H I J ITEM detail of A part C1 W Y X R0.75 B1 Z MILLIMETERS A 67.60 TYP. A1 67.60 ± 0.15 B 30.00 B1 0.75 ± 0.10 C 4.00 C1 4.00 ± 0.10 D 25.35 E 13.60 F 25.35 G 1.65 H 21.00 I 17.00 J 21.00 K 4.30 L 0.65 TYP. M 31.25 ± 0.15 M1 8.75 M2 22.50 N 29.25 O 20.00 P 5.00 ± 0.10 Q R1.00 R 1.00 ± 0.10 S φ 2.00 T 1.0 ± 0.10 W 0.43 ± 0.03 X 2.55 MIN. Y 0.25 MAX. Z 1.50 ± 0.10 ECA-TS2-0035-02 Data Sheet E0138N30 (Ver. 3.0) 11 MC-4R256FKE8S 160 EDGE CONNECTOR PADS RIMM (SOCKET TYPE) (2/2) B E Pad A1 C Pad A80 C D G F H A1 DESCRIPTION PCB length MIN. 67.45 TYP. 67.60 MAX. 67.75 UNIT mm B PCB height 31.10 31.25 31.40 mm C Center-center pad width from pad A1 to A40, A41 to A80, B1 to B40 or B41 to B80 Spacing from PCB left edge to connector key notch - 25.35 - mm - 30.00 - mm Spacing from contact pad PCB edge to side edge retainer notch PCB thickness - 20.00 - mm 0.90 1.00 1.10 mm - 1.35 - mm - 3.70 - mm ITEM A1 D E F G H Heat spreader thickness from PCB surface (one side) to heat spreader top surface RIMM thickness ECA-TS2-0035-02 12 Data Sheet E0138N30 (Ver. 3.0) MC-4R256FKE8S CAUTION FOR HANDLING MEMORY MODULES When handling or inserting memory modules, be sure not to touch any components on the modules, such as the memory ICs, chip capacitors and chip resistors. It is necessary to avoid undue mechanical stress on these components to prevent damaging them. In particular, do not push module cover or drop the modules in order to protect from mechanical defects, which would be electrical defects. When re-packing memory modules, be sure the modules are not touching each other. Modules in contact with other modules may cause excessive mechanical stress, which may damage the modules. MDE0202 NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR MOS DEVICES Exposing the MOS devices to a strong electric field can cause destruction of the gate oxide and ultimately degrade the MOS devices operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it, when once it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. MOS devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. MOS devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor MOS devices on it. 2 HANDLING OF UNUSED INPUT PINS FOR CMOS DEVICES No connection for CMOS devices input pins can be a cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of being an output pin. The unused pins must be handled in accordance with the related specifications. 3 STATUS BEFORE INITIALIZATION OF MOS DEVICES Power-on does not necessarily define initial status of MOS devices. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the MOS devices with reset function have not yet been initialized. Hence, power-on does not guarantee output pin levels, I/O settings or contents of registers. MOS devices are not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for MOS devices having reset function. CME0107 Data Sheet E0138N30 (Ver. 3.0) 13 MC-4R256FKE8S Rambus, RDRAM and the Rambus logo are registered trademarks of Rambus Inc. RIMM, SO-RIMM, RaSer and QRSL are trademarks of Rambus Inc. µBGA is a registered trademark of Tessera, Inc. The information in this document is subject to change without notice. Before using this document, confirm that this is the latest version. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of Elpida Memory, Inc. Elpida Memory, Inc. does not assume any liability for infringement of any intellectual property rights (including but not limited to patents, copyrights, and circuit layout licenses) of Elpida Memory, Inc. or third parties by or arising from the use of the products or information listed in this document. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of Elpida Memory, Inc. or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of the customer's equipment shall be done under the full responsibility of the customer. Elpida Memory, Inc. assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. [Product applications] Elpida Memory, Inc. makes every attempt to ensure that its products are of high quality and reliability. However, users are instructed to contact Elpida Memory's sales office before using the product in aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment, medical equipment for life support, or other such application in which especially high quality and reliability is demanded or where its failure or malfunction may directly threaten human life or cause risk of bodily injury. [Product usage] Design your application so that the product is used within the ranges and conditions guaranteed by Elpida Memory, Inc., including the maximum ratings, operating supply voltage range, heat radiation characteristics, installation conditions and other related characteristics. Elpida Memory, Inc. bears no responsibility for failure or damage when the product is used beyond the guaranteed ranges and conditions. Even within the guaranteed ranges and conditions, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Elpida Memory, Inc. products does not cause bodily injury, fire or other consequential damage due to the operation of the Elpida Memory, Inc. product. [Usage environment] This product is not designed to be resistant to electromagnetic waves or radiation. This product must be used in a non-condensing environment. If you export the products or technology described in this document that are controlled by the Foreign Exchange and Foreign Trade Law of Japan, you must follow the necessary procedures in accordance with the relevant laws and regulations of Japan. Also, if you export products/technology controlled by U.S. export control regulations, or another country's export control laws or regulations, you must follow the necessary procedures in accordance with such laws or regulations. If these products/technology are sold, leased, or transferred to a third party, or a third party is granted license to use these products, that third party must be made aware that they are responsible for compliance with the relevant laws and regulations. M01E0107