GMT G965

G965
Global Mixed-mode Technology Inc.
1.5A Low Dropout Regulator with Enable
Features
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General Description
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Adjustable Output from 1.2V to 4.8V Using External Resistors
1.5V, 1.8V and 2.5V Options by Setting ADJ Pin
Below 0.2V
Over Current and Over Temperature Protection
500mV Dropout @1.5A
Enable Pin
10µA Quiescent Current in Shutdown
SOP-8 Package
The G965 is a high performance positive voltage
regulator designed for use in applications requiring
very low dropout voltage at up to 1.5 Amps. Since it
has superior dropout characteristics compared to
regular LDOs, it can be used to supply 2.5V on motherboards or 1.5V, 1.8V on peripheral cards from the
3.3V supply thus allowing the elimination of costly
heatsinks. An enable pin further reduces power dissipation while shut down. The G965 provides excellent
regulation over variations in line, load and temperature.
Applications
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Notebook Computers
Battery Powered Systems
Motherboards
Peripheral Cards
Network Cards
Set Top Boxes
Medical Equipment
The SOP-8 is available with 1.5V, 1.8V and 2.5V internally preset outputs that are also adjustable using
external resistors.
Ordering Information
ORDER
NUMBER
ORDER NUMBER
(Pb free)
MARKING
TEMP. RANGE
PACKAGE
G965-15ADJP1U
G965-15ADJP1Uf
G965-15
-40°C ~ +85°C
SOP-8
G965-18ADJP1U
G965-25ADJP1U
G965-18ADJP1Uf
G965-25ADJP1Uf
G965-18
G965-25
-40°C ~ +85°C
-40°C ~ +85°C
SOP-8
SOP-8
Note: P1: SOP-8
U : Tape & Reel
e.g. 18 denotes the 1.8V output voltage.
Pin Configuration
Typical Application Circuit
VEN
VEN
VEN
8
1
GND
VIN
2
7
GND
VO
3
6
GND
ADJ
4
5
GND
G965
IENH
R3
G965
VIN
VIN
VO
VO
R1
C1
22µF
GND
ADJ
C2
47µF
R2
SOP-8
1.2 (R1+R2)
Volts
R2
R2=12kΩ is recommended
R3 should be connected for current IENH
restriction as VEN > VIN+0.3V
VO =
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.5
Apr 01, 2005
1
G965
Global Mixed-mode Technology Inc.
Absolute Maximum Ratings
(Note 1)
Input Voltage……………………….……..……….……7V
VEN Voltage…………..……………….…………VIN+0.3V
Power Dissipation Internally Limited
(Note 2)
Maximum Junction Temperature…………………150°C
Storage Temperature Range…..…-65°C ≤TJ ≤ +150°C
Reflow Temperature (soldering, 10sec)…….….260°C
Thermal Resistance Junction to Ambient, (θJA)
SOP-8……………………………………..….…162°C/W
Thermal Resistance Junction to Case, (θJC)
SOP-8……………………………………………....31°C/W
ESD Rating (Human Body Model)………..……..…2kV
Operation Conditions
(Note 1)
Input Voltage……………………………….….2.2V ~5.5V
Temperature Range………….………-40°C ≤TA ≤ +85°C
Electrical Characteristics
VEN=VIN, VIN =5V, IO = 0.5A, CIN = 4.7µF, COUT =10µF, TA = TJ = 25°C unless otherwise specified (Note 3)
PARAMETER
SYMBOL
Supply Voltage
Output Voltage
Line Regulation
Load Regulation
VIN
VO
Quiescent Current
IQ
Ripple Rejection
Dropout Voltage
VD
CONDITION
MIN
TYP
MAX
UNIT
2.2
-2
-----
--VO
0.2
0.8
5.5
2
2
2
V
%
%
%
VIN=3.3V,VEN=VIN
---
1.7
2.5
mA
VIN=3.3V,VEN=0V
fi=120Hz, 1VP-P, IO=100mA
-----
16
55
35
---
µA
dB
VIN=VO +0.7V, IO=10mA
VO+0.7V < VIN < 5.5V, IO=10mA
10mA < IO < 1.5A
IO=1.5A
Short Circuit Current
Over Temperature
VEN Voltage High
VEN Voltage Low
VENH
VENL
Output Active
Output Disabled
VEN Bias Current Low
ADJ Reference Voltage
IENL
VREF
VEN=0.4V
VIN=2.2V, VADJ=VOUT, IO=10mA
ADJ Pin Threshold
---
0.5
0.65
V
-----
0.8
150
-----
A
°C
1.6
---
-----
--0.4
V
V
--1.188
--1.2
20
1.212
µA
V
---
0.2
---
V
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For
guaranteed specifications and test conditions see the Electrical Characteristics.
Note2: The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal
resistance, θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient
temperature is (Tjmax-TA) / θJA. If this dissipation is exceeded, the die temperature will rise above 150°C
and IC will go into thermal shutdown.
Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
Note4: The type of output capacitor should be tantalum or aluminum.
Definitions
Load Regulation
The change in output voltage for a change in load
current at constant chip temperature. The measurement is made under conditions of low dissipation or by
using pulse techniques such that average chip temperature is not significantly affected.
Dropout Voltage
The input/output Voltage differential at which the regulator output no longer maintains regulation against further
reductions in input voltage. Measured when the output
drops 2% below its nominal value, dropout voltage is
affected by junction temperature, load current and minimum input supply requirements.
Maximum Power Dissipation
The maximum total device dissipation for which the
regulator will operate within specifications.
Line Regulation
The change in output voltage for a change in input voltage. The measurement is made under conditions of low
dissipation or by using pulse techniques such that average chip temperature is not significantly affected.
Quiescent Bias Current
Current which is used to operate the regulator chip
and is not delivered to the load.
TEL: 886-3-5788833
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Ver: 1.5
Apr 01, 2005
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Global Mixed-mode Technology Inc.
G965
Typical Performance Characteristics
VEN=VIN, VIN =5V, IO = 0.5A, CIN = 4.7µF, COUT =10µF, TA = TJ = 25°C
Line Transient(G965-15)
Load Transient(G965-15)
Line Transient Response(G965-18)
Load Transient Response(G965-18)
Line Transient Response(G965-25)
Load Transient Response(G965-25)
TEL: 886-3-5788833
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Ver: 1.5
Apr 01, 2005
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Global Mixed-mode Technology Inc.
G965
Typical Performance Characteristics (continued)
Overcurrent Protection Characteristics(G965-15)
Start-UP(G965-15)
Start-up(G965-18)
Overcurrent Protection Characteristics(G965-18)
Overcurrent Protection Characteristics(G965-25)
Start-up(G965-25)
TEL: 886-3-5788833
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Ver: 1.5
Apr 01, 2005
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G965
Global Mixed-mode Technology Inc.
Typical Performance Characteristics (continued)
Dropout Voltage vs.Temperature(G965-15)
700
1.65
600
Dropout Voltage (mV)
Quiescent Current (mA)
Quiescent Current vs. Temperature(G965-15)
1.7
1.6
VIN=5V
1.55
1.5
1.45
VIN=3V
1.4
500
IL=1A
400
300
200
100
1.35
IL=300mA
0
1.3
-25 -15 -5
5
-25 -15 -5
15 25 35 45 55 65 75 85
5
15 25 35 45 55 65 75 85
Temperature (°C)
Temperature (°C)
Quiescent Current vs. Temperature(G965-18)
Dropout Voltage vs. IL(G965-18)
2.00
700
600
1.90
Dropout Voltage (mV)
Quiescent Current (mA)
1.95
VIN=5V
1.85
1.80
1.75
1.70
VIN=3V
1.65
500
T=85°C
400
T=25°C
300
200
T=-25°C
1.60
100
1.55
1.50
0
-25 -15 -5
5
15 25 35 45 55 65 75 85
Temperature (°C)
0
700
3.75
600
Dropout Voltage (mV)
Quiescent Current (mA)
500
750
1000
IL (mA)
1250
1500
Dropout Voltage vs. IL(G965-25)
Quiescent Current vs. Temperature(G965-25)
4.00
3.50
VIN=5V
3.25
3.00
250
VIN=4V
2.75
500
T=85°C
400
T=25°C
300
200
100
T=-25°C
0
2.50
-25 -15 -5
5
0
15 25 35 45 55 65 75 85
Temperature (°C)
0.25
0.5
0.75
IL (A)
1
1.25
1.5
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Ver: 1.5
Apr 01, 2005
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G965
Global Mixed-mode Technology Inc.
Typical Performance Characteristics (continued)
Output Voltage vs. VIN(G965-15)
Output Voltage vs. Temperature(G965-15)
1.54
1.54
IL=10mA
IL=10mA
1.53
1.52
Output Voltage (V)
Output Voltage (V)
1.53
VIN=5V
1.51
VIN=3V
1.5
1.52
T=25°C
1.51
T=-25°C
1.5
1.49
1.49
1.48
1.48
-25 -15 -5
5
2.5
15 25 35 45 55 65 75 85
Temperature (°C)
1.824
3.5
4
4.5
VIN (V)
5
5.5
1.825
IL=10mA
IL=10mA
1.82
1.814
VIN=5V
Output Voltage (V)
Output Voltage (V)
3
Output Voltage vs. VIN(G965-18)
Output Voltage vs. Temperature(G965-18)
1.819
T=85°C
1.809
1.804
VIN=3V
1.799
1.794
T=85°C
1.815
1.81
T=25°C
1.805
1.789
T=-25°C
1.784
1.8
-25 -15 -5
5
15 25 35 45 55 65 75 85
Temperature (°C)
2.5
3.5
4.5
VIN (V)
5.5
6.5
Output Voltage vs. VIN(G965-25)
Output Voltage vs. Temperature(G965-25)
2.545
2.545
2.540
IL=10mA
IL=10mA
2.535
2.525
Output Voltage (V)
Output Voltage (V)
2.535
VIN=5V
2.515
2.505
VIN=4V
2.495
2.530
T=85°C
2.525
T=25°C
2.520
2.515
T=-25°C
2.510
2.485
2.505
2.475
2.500
-25 -15 -5
5
15 25 35 45 55 65 75 85
Temperature (°C)
3
4
5
VIN (V)
6
7
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Ver: 1.5
Apr 01, 2005
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G965
Global Mixed-mode Technology Inc.
Typical Performance Characteristics (continued)
Ripple Rejection
Short Circuit Current
60
IL=10mA
Ripple Rejection (dB)
50
IL=1.5A
40
IL=500mA
30
V IN=4V
COUT =10µF
V ripple=224mV
20
10
0
10
100
1000
10000
100000
1000000
Frequency (Hz)
G965 Max. Power Dissipation
vs. TAMB (still air)
G965 Max. Power Dissipation
vs. PCB Top Copper Area
2.5
Unit:in2
2.5
Max. Dissipation Power (W)
Max. Dissipation Power (W)
A=0.1
2
1.5
1
0.5
2
A=0.2
A=0.3
A=0.4
A=0.5
1.5
A=1.0
A=1.5
A=2.0
1
A=2.5
A=3.0
A=3.5
0.5
A=4.0
A=4.5
0
A=5.0
0
0
1
2
3
4
5
25
PCB Top Copper Area (in2)
35
45
55
65
75
85
TAMB (°C)
Recommended Minimum Footprint
SOP-8
TEL: 886-3-5788833
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Ver: 1.5
Apr 01, 2005
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G965
Global Mixed-mode Technology Inc.
Package Information
C
E
H
L
D
θ
7 ° (4X)
A2
A
A1
y
e
B
SOP-8 Package
Note:
1. Package body sizes exclude mold flash and gate burrs
2. Dimension L is measured in gage plane
3. Tolerance 0.10mm unless otherwise specified
4. Controlling dimension is millimeter converted inch dimensions are not necessarily exact.
MIN
DIMENSION IN MM
NOM
MAX
MIN
DIMENSION IN INCH
NOM
MAX
A
A1
A2
1.45
0.10
1.35
1.60
----1.45
1.75
0.25
1.55
0.057
0.004
0.053
0.063
----0.057
0.069
0.010
0.061
B
C
0.306
0.153
---------
0.506
0.253
0.012
0.006
---------
0.020
0.010
D
E
e
H
L
θ
4.81
3.84
----5.84
0.45
--------1.27
---------
5.01
4.04
----6.24
1.00
0.189
0.151
----0.230
0.018
--------0.050
---------
0.197
0.159
----0.246
0.039
0º
-----
8º
0º
-----
8º
SYMBOL
Taping Specification
PACKAGE
Q’TY/REEL
SOP-8
2,500 ea
Feed Direction
Typical SOP Package Orientation
GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.5
Apr 01, 2005
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