HSD278 Silicon Schottky Barrier Diode ADE-208-1015A (Z) Rev.1 Jan. 2001 Features • Low forward voltage, Low capacitance. • Super small Flat Package (SFP) is suitable for surface mount design. Ordering Information Type No. Laser Mark Package Code HSD278 S1 SFP Outline Cathode mark Mark 1 S1 2 1. Cathode 2. Anode HSD278 Absolute Maximum Ratings (Ta = 25°C) Item Symbol Value Unit Repetitive peak reverse voltage VRRM 30 V Reverse voltage VR 30 V Non-Repetitive peak forward surge current IFSM * 200 mA Peak forward current IFM 150 mA Average rectified current IO 30 mA Junction temperature Tj 125 °C Storage temperature Tstg −55 to +125 °C Note: 10 msec sine wave 1 pulse Electrical Characteristics (Ta = 25°C) Item Symbol Min Typ Max Unit Test Condition Forward voltage VF1 — — 0.30 V I F = 1 mA VF2 — — 0.95 IR — — 700 nA VR = 10 V C — — 1.50 pF VR = 1 V, f = 1 MHz — 100 — — V C = 200 pF, RL = 0 Ω, Both forward and reverse direction 1 pulse. Reverse current Capacitance 1 ESD-Capability * I F = 30 mA Notes: 1. Failure criterion ; IR ≥ 1.4 µA at V R = 10 V 2. Please do not use the soldering iron due to avoid high stress to the SFP package. 2 HSD278 Main Characteristic 10−4 101 100 −2 10 Reverse current IR (A) Forward current IF (A) 10−1 Ta = 75°C 10−3 Ta = 25°C 10−4 10−5 10−6 10−5 Ta = 75°C 10−6 Ta = 25°C 10−7 10−7 10−8 0 0.2 0.4 0.6 0.8 1.0 10−8 0 5 10 15 20 Forward voltage VF (V) Reverse voltage VR (V) Fig.1 Forward current Vs. Forward voltage Fig.2 Reverse current Vs. Reverse voltage f=1MHz Capacitance C (pF) 10 1.0 0.1 0.1 1.0 10 Reverse voltage VR (V) Fig.3 Capacitance Vs. Reverse voltage 3 HSD278 Package Dimensions 0.13 ± 0.05 1.4 ± 0.10 0.5 − 0.55 1.0 ± 0.10 0.3 ± 0.05 0.6 ± 0.05 Unit: mm Hitachi Code JEDEC EIAJ Mass (reference value) 4 SFP 0.0010 g HSD278 Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. 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(Taipei Branch Office) 4/F, No. 167, Tun Hwa North Road, Hung-Kuo Building, Taipei (105), Taiwan Tel : <886>-(2)-2718-3666 Fax : <886>-(2)-2718-8180 Telex : 23222 HAS-TP URL : http://www.hitachi.com.tw Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road Tsim Sha Tsui, Kowloon, Hong Kong Tel : <852>-(2)-735-9218 Fax : <852>-(2)-730-0281 URL : http://www.hitachi.com.hk Copyright Hitachi, Ltd., 2000. All rights reserved. Printed in Japan. Colophon 2.0 5 This datasheet has been download from: www.datasheetcatalog.com Datasheets for electronics components.