HITACHI HSM107S

HSM107S
Silicon Schottky Barrier Diode for System Protection
ADE-208-058F(Z)
Rev 6
Sep. 1998
Features
• Low VF and high efficiency.
• HSM107S which is interconnected in series configuration is designed for protection from not only
external excessive voltage but also miss-operation on electric systems.
• MPAK package is suitable for high density surface mounting and high speed assembly.
Ordering Information
Type No.
Laser Mark
Package Code
HSM107S
C5
MPAK
Outline
3
2
(Top View)
1
1 Cathode 2
2 Anode 1
3 Cathode 1
Anode 2
HSM107S
Absolute Maximum Ratings (Ta = 25°C)
Item
Symbol
Value
Unit
Reverse voltage
VR
8
V
Peak forward current
I FM
0.1
A
0.5
A
*1
Non-Repetitive Peak
forward surge current
I FSM
Average forward current
IO
50
mA
Junction temperature
Tj
125
°C
Storage temperature
Tstg
–55 to +125
°C
Notes: 1. Square wave, 10ms
Electrical Characteristics (Ta = 25°C)
Item
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse voltage
VR
8
—
—
—
I R = 1.0 mA
Reverse current
IR
—
—
30
µA
VR = 5 V
Forward voltage
VF
—
—
0.3
V
I F = 10 mA
—
100
—
—
V
C=200pF, Both forward
and reverse direction 1 pulse
ESD Capability
*1
Notes: 1. Failure Criterion ; IR ≥60µA at V R =5V
2
HSM107S
Main Characteristic
10-1
10
-2
-2
Forward current IF
(A)
Reverse current I R (A)
10
10-3
-4
10
10 -5
10
10
10
-3
-4
10
-5
10
-6
-7
-6
0
0.1
0.2
0.3
0.4
0.5
10
0
2
4
6
8
10
Reverse voltage V R (V)
Forward voltage V F (V)
Fig.1 Forward current Vs. Forward voltage
Fig.2 Reverse current Vs. Reverse voltage
10
Capacitance C (pF)
f=1MHz
1.0
-1
10
1.0
10
40
Reverse voltage VR (V)
Fig.3 Capacitance Vs. Reverse voltage
3
HSM107S
Example of application circuite
SBD (EX. HSM107S)
Vcc
D1
Input
R
Vin
IC / LSI
D2
+
Surge
0.35V
Vcc
GND
GND
0.35V
-
4
Surge
Built-in diode
VF •=• 0.7 V
HSM107S
Package Dimensions
0.65 – 0.3
+ 0.10
0.4 – 0.05
Laser Mark
+ 0.1
Unit : mm
+ 0.10
0.16 – 0.06
0.3
2.8 +– 0.1
+ 0.2
– 0.6
2.8
+ 0.2
1.9
1 Cathode 2
2 Anode 1
3 Cathode 1
Anode 2
1.1 – 0.1
1
0.95
0 – 0.10
0.1
0.65 +– 0.3
2
0.95
0.3
C 5
1.5
3
Hitachi Code
JEDEC Code
EIAJ Code
Weight (g)
MPAK(1)
—
SC-59A
0.011
5
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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