HSM2693A Silicon Epitaxial Planar Diode for Tuner Band Switch ADE-208-094B (Z) Rev. 2 Jun. 1993 Features • Low forward resistance. (rf = 0.9 max) • Low capacitance. (C = 1.2pFmax) • MPAK package is suitable for high density surface mounting and high speed assembly. Ordering Information Type No. Laser Mark Package Code HSM2693A B4 MPAK Pin Arrangement 3 2 (Top View) 1 1 Anode 2 Anode 3 Cathode HSM2693A Absolute Maximum Ratings (Ta = 25°C) Item Symbol Value Unit Reverse voltage VR 35 V Power dissipation Pd* 150 mW Junction temperature Tj 125 °C Storage temperature Tstg –45 to +125 °C Operation temperature Topr –20 to +60 °C Note: Two device total Electrical Characteristics (Ta = 25°C)* Item Symbol Min Typ Max Unit Test Condition Reverse voltage VR 35 — — V I R = 10µA Reverse current IR — — 50 nA VR = 25V Forward voltage VF — — 1.0 V I F = 10mA Capacitance C — — 1.2 pF VR = 6V, f = 1MHz Forward resistance rf — — 0.9 Ω I F = 2mA, f = 100MHz Note: Per one device 2.0 Forward resistance r f (Ω ) f = 100MHz 1.5 1.0 0.5 0 10–4 10–3 Forward current I F (A) 10–2 Fig.1 Forward resistance Vs. Forward current 2 HSM2693A 10 Capacitance C (pF) f = 1MHz 1.0 –1 10 1.0 10 40 Reverse voltage VR (V) Fig.2 Capacitance Vs. Reverse voltage Forward resistance r f (Ω ) IF = 2mA 10 1.0 –1 10 1.0 10 Frequency f (MHz) 102 Fig.3 Forward resistance Vs. Frequency 3 HSM2693A Package Dimensions 0.65 – 0.3 + 0.10 0.4 – 0.05 Laser Mark + 0.1 Unit: mm + 0.10 0.16 – 0.06 2 0.95 1 0.95 1.9 + 0.2 – 0.6 2.8 1 Anode 2 Anode 3 Cathode 1.1 – 0.1 + 0.2 0.3 0.3 2.8 +– 0.1 0 – 0.10 0.1 0.65 +– 0.3 B 4 1.5 3 4 HITACHI Code MPAK(1) JEDEC Code — EIAJ Code SC-59A Weight (g) 0.011 Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. 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