HITTITE HMC264LM3

MICROWAVE CORPORATION
HMC264LM3
v01.1201
GaAs MMIC SUB-HARMONIC
SMT MIXER, 20 - 30 GHz
Typical Applications
Features
The HMC264LM3 is ideal for:
Integrated LO Amplifier: -4 dBm Input
• 20 and 30 GHz Microwave Radios
Sub-Harmonically Pumped (x2) LO
• Up and Down Converter for
Point to Point Radios
High 2LO/RF Isolation: 35 dB
LM3 SMT Package
• LMDS and SATCOM
Functional Diagram
General Description
The HMC264LM3 is a 20 - 30 GHz surface mount
sub-harmonically pumped (x2) MMIC mixer with
an integrated LO amplifier in a SMT leadless chip
carrier package. The 2LO to RF isolation is an
excellent 25 to 35 dB, eliminating the need for
additional filtering. The LO amplifier is a single
bias (+3V to +4V) two stage design with only -4
dBm drive requirement. All data is with the nonhermetic, epoxy sealed LM3 packaged device
mounted in a 50 ohm test fixture. Utilizing the
HMC264LM3 eliminates the need for wirebonding, thereby providing a consistent connection
interface for the customer.
MIXERS - SMT
12
Electrical Specifications, TA = +25° C, As a Function of LO Drive & Vdd
IF = 1 GHz
LO = -4 dBm & Vdd = +4V
Parameter
Min.
Typ.
IF = 1 GHz
LO = -4 dBm & Vdd = +3V
Max.
Min.
Typ.
Units
Max.
Frequency Range, RF
20 - 30
21 - 30
GHz
Frequency Range, LO
10 - 15
10.5 - 15
GHz
Frequency Range, IF
DC - 4
DC - 4
GHz
Conversion Loss
9
12
9
12
dB
Noise Figure (SSB)
9
12
9
12
dB
2LO to RF Isolation
20
35
16
30
dB
2LO to IF Isolation
30
40
26
38
dB
IP3 (Input)
5
12
4
10
dBm
1 dB Compression (Input)
-2
+4
-1
+2
dBm
25
mA
Supply Current (Idd)
28
*Unless otherwise noted, all measurements performed as downconverter, IF= 1 GHz.
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
MICROWAVE CORPORATION
HMC264LM3
v01.1201
GaAs MMIC SUB-HARMONIC
SMT MIXER, 20 - 30 GHz
Conversion Gain vs.
Temperature @ LO = -4 dBm, Vdd= +3V
0
0
-5
-5
-10
-15
+25C
-40C
+85C
-20
-25
-10
-15
+25C
-40C
+85C
-20
-25
18
20
22
24
26
28
30
32
34
18
20
22
RF FREQUENCY (GHz)
24
Conversion Gain
vs. LO Drive @ Vdd = +4V
30
32
34
0
-4 dBm
-5
-2 dBm
-10
-15
0 dBm
-8 dBm
-6 dBm
-20
CONVERSION GAIN (dB)
-4 dBm
CONVERSION GAIN (dB)
28
Conversion Gain
vs. LO Drive @ Vdd = +3V
0
-25
-5
0 dBm
-10
-2 dBm
-15
-8 dBm
-6 dBm
-20
12
-25
18
20
22
24
26
28
30
32
34
18
20
22
RF FREQUENCY (GHz)
24
26
28
30
32
34
RF FREQUENCY (GHz)
Isolation @ LO = -4 dBm, Vdd = +4V
Isolation @ LO = -4 dBm, Vdd = +3V
10
10
0
0
LO/IF
-10
LO/IF
-10
LO/RF
RF/IF
ISOLATION (dB)
ISOLATION (dB)
26
RF FREQUENCY (GHz)
MIXERS - SMT
CONVERSION GAIN (dB)
CONVERSION GAIN (dB)
Conversion Gain vs.
Temperature @ LO = -4 dBm, Vdd= +4V
-20
-30
-40
2LO/RF
-50
LO/RF
RF/IF
-20
-30
-40
2LO/RF
-50
2LO/IF
2LO/IF
-60
-60
-70
-70
18
20
22
24
26
28
RF FREQUENCY (GHz)
30
32
34
18
20
22
24
26
28
30
32
34
RF FREQUENCY (GHz)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
12 - 87
MICROWAVE CORPORATION
HMC264LM3
v01.1201
GaAs MMIC SUB-HARMONIC
SMT MIXER, 20 - 30 GHz
Input IP3 vs. LO Drive @ Vdd = +4V *
Input IP3 vs. LO Drive @ Vdd = +3V *
30
30
25
-2 dBm
-2 dBm
20
INPUT IP3 (dBm)
INPUT IP3 (dBm)
25
15
10
5
20
15
10
5
-4 dBm
0
-4 dBm
0
-6 dBm
-5
12
-5
18
20
22
24
26
28
30
32
34
18
20
22
RF FREQUENCY (GHz)
24
26
30
34
80
-6 dBm
-6 dBm
70
60
INPUT IP2 (dBm)
50
40
30
-2 dBm
20
60
50
40
30
-2 dBm
20
-4 dBm
-4 dBm
10
10
0
0
18
20
22
24
26
28
30
32
34
18
20
22
RF FREQUENCY (GHz)
24
26
28
30
32
34
RF FREQUENCY (GHz)
Input P1dB @ LO = -4 dBm, Vdd = +4V
Input P1dB @ LO = -4 dBm, Vdd = +3V
7
6
6
5
5
INPUT P1dB (dBm)
7
4
3
2
1
0
4
3
2
1
0
-1
-1
-2
-2
-3
-3
18
20
22
24
26
28
30
32
34
RF FREQUENCY (GHz)
18
20
22
24
26
28
30
RF FREQUENCY (GHz)
* Two-tone input power = -10 dBm each tone, 1 MHz spacing.
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32
Input IP2 vs. LO Drive @ Vdd = +3V *
70
INPUT P1dB (dBm)
28
RF FREQUENCY (GHz)
Input IP2 vs. LO Drive @ Vdd = +4V *
INPUT IP2 (dBm)
MIXERS - SMT
-6 dBm
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
32
34
HMC264LM3
v01.1201
MICROWAVE CORPORATION
GaAs MMIC SUB-HARMONIC
SMT MIXER, 20 - 30 GHz
Upconverter Performance
Conversion Gain, LO = -4 dBm Vdd = +4V
IF Bandwidth @ LO = -4 dBm
0
Vdd = +3V
Vdd = +4V
-5
CONVERSION GAIN (dB)
-10
-15
-20
-25
-5
-10
-15
-20
Vdd = +3V
Vdd = +4V
-25
18
20
22
24
26
28
30
32
34
0
1
2
3
RF FREQUENCY (GHz)
5
6
7
8
9
10
7
8
9
10
IF Return Loss
@ LO = -4 dBm, Vdd = +4V
0
0
-5
-5
RETURN LOSS (dB)
RETURN LOSS (dB)
RF & LO Return Loss
@ LO = -4 dBm, Vdd = +4V
-10
-15
-20
-10
-15
-20
RF
LO
-25
12
-25
0
5
10
15
20
25
30
35
0
1
2
IF FREQUENCY (GHz)
±4
±3
±2
4
5
6
Absolute Maximum Ratings
nLO
±5
3
IF FREQUENCY (GHz)
MxN Spurious Outputs
@ LO = -4 dBm, Vdd = +4V
mRF
4
IF FREQUENCY (GHz)
MIXERS - SMT
CONVERSION GAIN (dB)
0
±1
0
RF / IF Input (Vdd = +5V)
+13 dBm
LO Drive (Vdd = +5V)
+13 dBm
Vdd
5.5V
Continuous Pdiss (Ta = 85 °C)
(derate 2.52 mW/°C above 85 °C)
227 mW
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
-3
-2
34.8
-1
61.8
26.1
32.6
0
14.1
-26.9
1
X
33.8
2
3
49.0
78.8
12.3
48.1
81.3
RF = 30 GHz @ -10 dBm
LO = 13.5 GHz @ -4 dBm
All values in dBc below IF power level.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
12 - 89
MICROWAVE CORPORATION
HMC264LM3
v01.1201
GaAs MMIC SUB-HARMONIC
SMT MIXER, 20 - 30 GHz
Outline Drawing
MIXERS - SMT
12
12 - 90
NOTES:
1. MATERIAL: PLASTIC
2. PLATING: GOLD OVER NICKEL
3. DIMENSIONS ARE IN INCHES [MILLIMETERS].
4. ALL TOLERANCES ARE ± 0.005 [± 0.13].
5. ALL GROUNDS MUST BE SOLDERED TO PCB RF GROUND.
6.
• INDICATES PIN 1
Pin Descriptions
Pin Number
Function
Description
1, 2
N/C
This pin may be connected to the housing ground or left unconnected.
3
Vdd
Power supply for the LO Amplifier. An external RF bypass capacitor of
100 - 330 pF is required as close to the package as possible.
4
RF
RF Port. This pin is AC coupled an matched to 50 Ohm from
20 - 30 GHz.
5
IF
IF Port. This pin is DC coupled and should be DC blocked externally
using a series capacitor whose value has been chosen to pass the
necessary IF frequency range. Any applied DC voltage to this pin will
result in die non-function and possible die failure.
6
LO
LO Port. This pin is AC coupled and matched to 50 Ohm from
10 - 15 GHz.
7
GND
Interface Schematic
Must be soldered to PCB RF ground.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
MICROWAVE CORPORATION
HMC264LM3
v01.1201
GaAs MMIC SUB-HARMONIC
SMT MIXER, 20 - 30 GHz
Evaluation PCB
The grounded Co-Planar Wave Guide (CPWG) PCB input/output transitions allow use of Ground-Signal-Ground
(GSG) probes for testing. Suggested probe pitch is 400mm (16 mils). Alternatively, the board can be mounted in
a metal housing with 2.4 mm coaxial connectors.
MIXERS - SMT
12
Evaluation Circuit Board Layout Design Details
Layout Technique
Micro Strip to CPWG
Material
Rogers 4003 with 1/2 oz. Cu
Dielectric Thickness
0.008” (0.20 mm)
Microstrip Line Width
0.018” (0.46 mm)
CPWG Line Width
0.016” (0.41 mm)
CPWG Line to GND Gap
0.005” (0.13 mm)
Ground to Via Hole Diameter
0.008” (0.20 mm)
C1
100 pF Capacitor, 0402 Pkg.
LM3 package mounted to evaluation PCB
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
12 - 91
MICROWAVE CORPORATION
v01.1201
HMC264LM3
GaAs MMIC SUB-HARMONIC
SMT MIXER, 20 - 30 GHz
Suggested LM3-01 PCB Land Pattern Tolerance: ± 0.003” (± 0.08 mm)
MIXERS - SMT
12
12 - 92
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
MICROWAVE CORPORATION
HMC264LM3
v01.1201
GaAs MMIC SUB-HARMONIC
SMT MIXER, 20 - 30 GHz
HMC264LM3 Recommended SMT Attachment Technique
Preparation & Handling of the LM3 Millimeterwave Package for Surface Mounting
Cleanliness: Observe proper handling procedures to ensure
clean devices and PCBs. LM3 devices should remain in their
original packaging until component placement to ensure no
contamination or damage to RF, DC & ground contact areas.
200
0
175
150
125
100
75
12
50
25
0
1
2
3
4
5
TIME (min)
6
7
8
Static Sensitivity: Follow ESD precautions to protect against ESD strikes.
General Handling: Handle the LM3 package on the top with a vacuum collet or along the edges with a sharp pair of bent
tweezers. Avoiding damaging the RF, DC, & ground contacts on the package bottom. Do not apply excess pressure to
the top of the lid.
Solder Materials & Temperature Profile: Follow the information contained in the application note. Hand soldering is not
recommended. Conductive epoxy attachment is not recommended.
Solder Paste
Solder paste should be selected based on the user’s experience and be compatible with the metallization systems used.
See the LM3 data sheet Outline drawing for pin & ground contact metallization schemes.
Solder Paste Application
MIXERS - SMT
Follow these precautions to avoid permanent damage:
225
TEMPERATURE ( C)
The HMC LM3 package was designed to be compatible with
high volume surface mount PCB assembly processes. The
LM3 package requires a specific mounting pattern to allow
proper mechanical attachment and to optimize electrical performance at millimeterwave frequencies. This PCB layout pattern can be found on each LM3 product data sheet. It can also
be provided as an electronic drawing upon request from Hittite
Sales & Application Engineering.
Solder paste is generally applied to the PCB using either a stencil printer or dot placement. The volume of solder paste
will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical & electrical
performance. Excess solder may create unwanted electrical parasitics at high frequencies.
Solder Reflow
The soldering process is usually accomplished in a reflow oven but may also use a vapor phase process. A solder
reflow profile is suggested above.
Prior to reflowing product, temperature profiles should be measured using the same mass as the actual assemblies.
The thermocouple should be moved to various positions on the board to account for edge and corner effects and varying component masses. The final profile should be determined by mounting the thermocouple to the PCB at the location
of the device.
Follow solder paste and oven vendor’s recommendations when developing a solder reflow profile. A standard profile
will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock.
Allow enough time between reaching pre-heat temperature and reflow for the solvent in the paste to evaporate and the
flux to completely activate. Reflow must then occur prior to the flux being completely driven off. The duration of peak
reflow temperature should not exceed 15 seconds. Packages have been qualified to withstand a peak temperature of
235°C for 15 seconds. Verify that the profile will not expose device to temperatures in excess of 235°C.
Cleaning
A water-based flux wash may be used.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
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