HT36A3 8-Bit Music Synthesizer MCU Features · Operating voltage: 2.4V~5.0V · Sampling rate of 25kHz as 6.4MHz for system frequency · Operating frequency: 3.58MHz~12MHz (typ. 8MHz) · 20 bidirectional I/O lines · Eight-level subroutine nesting · Two 8-bit programmable timer with 8 stage prescaler · HALT function and wake-up feature to reduce power consumption · Watchdog Timer · Bit manipulation instructions · Built-in 8-bit MCU with 208´8 bits RAM · 16-bit table read instructions · Built-in 32K´16-bit ROM for program/data shared · 63 powerful instructions · Mono output · All instructions in 1 or 2 machine cycles · High D/A converter resolution: 16 bits · 28-pin SOP, 48-pin SSOP package · Polyphonic up to 8 notes · Independent pan and volume mix can be assigned to each sound component General Description The HT36A3 has a built-in 8-bit microprocessor which programs the synthesizer to generate the melody by setting the special register from 20H~2AH. A HALT feature is provided to reduce power consumption. The HT36A3 is an 8-bit high performance RISC-like microcontroller specifically designed for music applications. It provides an 8-bit MCU and a 8 channel wavetable synthesizer. The program ROM is composed of both program control codes and wavetable voice codes, and can be easily programmed. Block Diagram 3 2 K ´ 1 6 - b it R O M P A 0 ~ P A 7 V D V S V D V S P B 0 ~ P B 7 P C 0 ~ P C 3 O S C 1 8 - B it M C U 2 0 8 ´ 8 R A M D S D A S A O S C 2 R E S Rev. 1.00 M u ltip lie r /P h a s e G e n e ra l 1 1 6 - B it D A C A U D June 30, 2003 HT36A3 Pin Assignment P A 4 1 4 8 P A 3 P A 5 2 4 7 P A 2 P A 6 3 4 6 P A 1 P A 7 4 4 5 P A 0 P B 0 5 4 4 P C 3 P B 1 6 4 3 P C 2 P B 2 7 4 2 P C 1 P B 3 8 4 1 P C 0 P B 4 9 4 0 N C P B 5 1 0 3 9 N C P A 4 1 2 8 P A 3 P B 6 1 1 3 8 N C P A 5 2 2 7 P A 2 P B 7 1 2 3 7 N C P A 6 3 2 6 P A 1 N C 1 3 3 6 N C P A 7 4 2 5 P A 0 N C 1 4 3 5 N C N C 5 2 4 N C V S S 1 5 3 4 O S C 2 N C 6 2 3 N C V S S A 1 6 3 3 O S C 1 N C 7 2 2 O S C 2 V D D 1 7 3 2 N C V S S 8 2 1 N C V D D A 1 8 3 1 N C V S S A 9 2 0 O S C 1 N C 1 9 3 0 R E S V D D 1 0 1 9 N C N C 2 0 2 9 N C V D D A 1 1 1 8 R E S N C 2 1 2 8 N C N C 1 2 1 7 N C N C 2 2 2 7 N C T E S T 1 3 1 6 N C N C 2 3 2 6 A U D A U D 1 4 1 5 N C N C 2 4 2 5 T E S T H T 3 6 A 3 2 8 S O P -A H T 3 6 A 3 4 8 S S O P -A Pad Assignment P A 1 2 5 2 4 2 3 2 2 2 1 2 0 1 9 P C 0 P A 2 2 6 P C 1 P A 3 2 7 P C 2 P A 4 2 8 P A 0 P A 5 2 9 P C 3 P A 6 4 P A 7 3 P B 7 P B 0 2 P B 1 P B 5 P B 6 P B 2 1 P B 3 P B 4 1 8 1 7 1 6 1 5 1 4 (0 , 0 ) V S S V S S A 1 3 O S C 2 1 2 O S C 1 1 1 R E S 5 6 V D D 7 V D D A 8 9 1 0 A U D T E S T Chip size: 83 ´ 111 (mil)2 * The IC substrate should be connected to VSS in the PCB layout artwork. Rev. 1.00 2 June 30, 2003 HT36A3 Pad Coordinates Pad No. X Y Pad No. X Y 1 -879.100 1202.400 16 693.900 1240.150 2 -879.100 1097.100 17 583.300 1240.150 3 -879.100 986.500 18 483.300 1240.150 4 -879.100 886.500 19 372.700 1240.150 5 -898.600 -805.050 20 272.700 1240.150 6 -898.600 -931.910 21 162.100 1240.150 7 -847.650 -1041.910 22 62.100 1240.150 8 -847.650 -1180.350 23 -48.500 1240.150 9 -193.090 -1200.600 24 -148.500 1240.150 10 -1200.600 25 -259.100 1240.150 11 -81.290 875.950 -1262.274 26 -359.100 1240.150 12 875.950 -1149.626 27 -469.700 1240.150 13 875.950 28 -569.700 1240.150 14 15 901.500 793.900 -471.774 1240.150 1240.150 29 -680.300 1240.150 Pad Description I/O Internal Connection PA0~PA7 I/O Pull-High or None Bidirectional 8-bit Input/Output port PB0~PB7 I/O Pull-High or None Bidirectional 8-bit Input/Output port PC0~PC3 I/O Pull-High or None Bidirectional 8-bit Input/Output port VSS ¾ ¾ Negative power supply, ground VSSA ¾ ¾ Negative power supply of DAC, ground VDD ¾ ¾ Digital power supply VDDA ¾ ¾ DAC power supply AUD O ¾ Audio output TEST ¾ ¾ No connection (open) RES I ¾ Reset input, active low (no pull-high) OSC1 OSC2 I O ¾ OSC1 and OSC2 are connected to an RC network or a crystal (by mask option) for the internal system clock. In the case of RC operation, OSC2 is the output terminal for 1/8 system clock. The system clock may come from the crystal, the two pins cannot be floating. Pad Name Rev. 1.00 Function 3 June 30, 2003 HT36A3 Absolute Maximum Ratings Supply Voltage .............................VSS-0.3V to VSS+6V Storage Temperature ...........................-50°C to 125°C Input Voltage .............................VSS-0.3V to VDD+0.3V Operating Temperature ..........................-25°C to 70°C Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. D.C. Characteristics Symbol Parameter Ta=25°C Test Conditions VDD Conditions ¾ ¾ Min. Typ. Max. Unit 2.2 4.5 5.5 V VDD Operating Voltage IDD Operating Current 4.5V No load, fOSC=8MHz ¾ 8 16 mA ISTB Standby Current (WDT Disabled) 4.5V No load, System HALT ¾ 1 3 mA IOH I/O Ports Source Current 4.5V VOH=4.5V 2 3 ¾ mA IOL I/O Ports Sink Current 4.5V VOL=0.5V 2 3 ¾ mA VIH Input High Voltage for I/O Ports 4.5V ¾ 0.8VDD ¾ VDD V VIL Input Low Voltage for I/O Ports 4.5V ¾ 0 ¾ 0.2VDD V Rev. 1.00 4 June 30, 2003 HT36A3 Application Circuit V D D 1 0 W 4 7 m F V D D A V D D 0 .1 m F P A 0 ~ P A 7 O S C 1 P B 0 ~ P B 7 V P C 0 ~ P C 3 A U D V D D S P K 8 W 1 k W D D 7 5 0 W 1 0 0 k W R E S V S S A 0 .1 m F V S S H T 3 6 A 3 V D D 1 0 W V D D 4 7 m F V D D A 0 .1 m F P A 0 ~ P A 7 O S C 1 8 M H z P B 0 ~ P B 7 V D D P C 0 ~ P C 3 O S C 2 4 7 m F A U D 2 0 k W V D D 1 0 m F 1 0 0 k W 0 .1 m F 2 V re f 3 IN 8 V D D H T 8 2 V 7 3 3 5 O U T N 1 V S S 4 S P K 8 W 7 O U T P C E R E S V S S A 0 .1 m F V S S H T 3 6 A 3 Rev. 1.00 5 June 30, 2003 HT36A3 Package Information 28-pin SOP (300mil) Outline Dimensions 2 8 1 5 A B 1 1 4 C C ' G H D E Symbol Rev. 1.00 a F Dimensions in mil Min. Nom. Max. A 394 ¾ 419 B 290 ¾ 300 C 14 ¾ 20 C¢ 697 ¾ 713 D 92 ¾ 104 E ¾ 50 ¾ F 4 ¾ ¾ G 32 ¾ 38 H 4 ¾ 12 a 0° ¾ 10° 6 June 30, 2003 HT36A3 48-pin SSOP (300mil) Outline Dimensions 4 8 2 5 A B 2 4 1 C C ' G H D E Symbol Rev. 1.00 a F Dimensions in mil Min. Nom. Max. A 395 ¾ 420 B 291 ¾ 299 C 8 ¾ 12 C¢ 613 ¾ 637 D 85 ¾ 99 E ¾ 25 ¾ F 4 ¾ 10 G 25 ¾ 35 H 4 ¾ 12 a 0° ¾ 8° 7 June 30, 2003 HT36A3 Product Tape and Reel Specifications Reel Dimensions D T 2 A C B T 1 SOP 28W (300mil) Symbol Description Dimensions in mm A Reel Outer Diameter 330±1.0 B Reel Inner Diameter 62±1.5 C Spindle Hole Diameter 13.0+0.5 -0.2 D Key Slit Width 2.0±0.5 T1 Space Between Flange 24.8+0.3 -0.2 T2 Reel Thickness 30.2±0.2 SSOP 48W Symbol Description Dimensions in mm A Reel Outer Diameter 330±1.0 B Reel Inner Diameter 100±0.1 C Spindle Hole Diameter 13.0+0.5 -0.2 D Key Slit Width 2.0±0.5 T1 Space Between Flange 32.2+0.3 -0.2 T2 Reel Thickness 38.2±0.2 Rev. 1.00 8 June 30, 2003 HT36A3 Carrier Tape Dimensions P 0 D P 1 t E F W C D 1 B 0 P K 0 A 0 SOP 28W (300mil) Symbol Description Dimensions in mm W Carrier Tape Width 24.0±0.3 P Cavity Pitch 12.0±0.1 E Perforation Position 1.75±0.1 F Cavity to Perforation (Width Direction) 11.5±0.1 D Perforation Diameter 1.5+0.1 D1 Cavity Hole Diameter 1.5+0.25 P0 Perforation Pitch 4.0±0.1 P1 Cavity to Perforation (Length Direction) 2.0±0.1 A0 Cavity Length 10.85±0.1 B0 Cavity Width 18.34±0.1 K0 Cavity Depth 2.97±0.1 t Carrier Tape Thickness 0.35±0.01 C Cover Tape Width Rev. 1.00 21.3 9 June 30, 2003 HT36A3 P 0 D P 1 t E F W D 1 C B 0 K 1 P K 2 A 0 SSOP 48W Symbol Description Dimensions in mm W Carrier Tape Width 32.0±0.3 P Cavity Pitch 16.0±0.1 E Perforation Position 1.75±0.1 F Cavity to Perforation (Width Direction) 14.2±0.1 D Perforation Diameter 2.0 Min. D1 Cavity Hole Diameter 1.5+0.25 P0 Perforation Pitch 4.0±0.1 P1 Cavity to Perforation (Length Direction) 2.0±0.1 A0 Cavity Length 12.0±0.1 B0 Cavity Width 16.20±0.1 K1 Cavity Depth 2.4±0.1 K2 Cavity Depth 3.2±0.1 t Carrier Tape Thickness C Cover Tape Width Rev. 1.00 0.35±0.05 25.5 10 June 30, 2003 HT36A3 Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor Inc. (Shanghai Sales Office) 7th Floor, Building 2, No.889, Yi Shan Rd., Shanghai, China 200233 Tel: 021-6485-5560 Fax: 021-6485-0313 http://www.holtek.com.cn Holtek Semiconductor Inc. (Shenzhen Sales Office) 43F, SEG Plaza, Shen Nan Zhong Road, Shenzhen, China 518031 Tel: 0755-8346-5589 Fax: 0755-8346-5590 ISDN: 0755-8346-5591 Holtek Semiconductor Inc. (Beijing Sales Office) Suite 1721, Jinyu Tower, A129 West Xuan Wu Men Street, Xicheng District, Beijing, China 100031 Tel: 010-6641-0030, 6641-7751, 6641-7752 Fax: 010-6641-0125 Holmate Semiconductor, Inc. (North America Sales Office) 46712 Fremont Blvd., Fremont, CA 94538 Tel: 510-252-9880 Fax: 510-252-9885 http://www.holmate.com Copyright Ó 2003 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw. Rev. 1.00 11 June 30, 2003