TI CD54HC533F3A

[ /Title
(CD74H
C533,
CD74H
CT533,
CD74H
C563,
CD74H
CT563)
/Subject
(High
Speed
CD54/74HC533, CD54/74HCT533,
CD54/74HC563, CD74HCT563
Data sheet acquired from Harris Semiconductor
SCHS187C
January 1998 - Revised July 2003
High-Speed CMOS Logic Octal Inverting
Transparent Latch, Three-State Outputs
Features
Description
• Common Latch-Enable Control
The ’HC533, ’HCT533, ’HC563, and CD74HCT563 are
high-speed Octal Transparent Latches manufactured with
silicon gate CMOS technology. They possess the low power
consumption of standard CMOS integrated circuits, as well as
the ability to drive 15 LSTTL devices.
• Common Three-State Output Enable Control
• Buffered Inputs
• Three-State Outputs
The outputs are transparent to the inputs when the latch
enable (LE) is high. When the latch enable (LE) goes low the
data is latched. The output enable (OE) controls the
three-state outputs. When the output enable (OE) is high the
outputs are in the high impedance state. The latch operation
is independent of the state of the output enable.
• Bus Line Driving Capacity
• Typical Propagation Delay = 13ns at VCC = 5V,
CL = 15pF, TA = 25oC (Data to Output)
• Fanout (Over Temperature Range)
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
The ’HC533 and ’HCT533 are identical in function to the
’HC563 and CD74HCT563 but have different pinouts. The
’HC533 and ’HCT533 are similar to the ’HC373 and ’HCT373;
the latter are non-inverting types.
• Wide Operating Temperature Range . . . -55oC to 125oC
• Balanced Propagation Delay and Transition Times
Ordering Information
• Significant Power Reduction Compared to LSTTL
Logic ICs
• HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30% of VCC
at VCC = 5V
PART NUMBER
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
VIL= 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH
TEMP. RANGE
(oC)
CD54HC533F3A
-55 to 125
20 Ld CERDIP
CD54HC563F3A
-55 to 125
20 Ld CERDIP
CD54HCT533F3A
-55 to 125
20 Ld CERDIP
CD74HC533E
-55 to 125
20 Ld PDIP
CD74HC563E
-55 to 125
20 Ld PDIP
CD74HC563M
-55 to 125
20 Ld SOIC
CD74HCT533E
-55 to 125
20 Ld PDIP
CD74HCT563E
-55 to 125
20 Ld PDIP
CD74HCT563M
-55 to 125
20 Ld SOIC
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
© 2003, Texas Instruments Incorporated
1
PACKAGE
CD54/74HC533, CD54/74HCT533, CD54/74HC563, CD74HCT563
Pinouts
CD54HC533, CD54HCT533
(CERDIP)
CD74HC533, CD74HCT533
(PDIP)
TOP VIEW
CD54HC563
(CERDIP)
CD74HC563, CD74HCT563
(PDIP, SOIC)
TOP VIEW
OE 1
20 VCC
OE 1
Q0 2
19 Q7
D0 2
19 Q0
D0 3
18 D7
D1 3
18 Q1
20 VCC
D1 4
17 D6
D2 4
17 Q2
Q1 5
16 Q6
D3 5
16 Q3
Q2 6
15 Q5
D4 6
15 Q4
D2 7
14 D5
D5 7
14 Q5
D3 8
13 D4
D6 8
13 Q6
Q3 9
12 Q4
D7 9
12 Q7
GND 10
11 LE
GND 10
11 LE
Functional Block Diagram
HC/HCT533
D0
D1
D
O
D2
D
G
O
D3
D
G
O
D4
O
D
G
D5
D
G
O
D6
D
G
O
D7
D
G
O
D
G
O
G
LE
OE
O0
O1
O2
O3
O4
O5
O6
O7
TRUTH TABLE
OUTPUT ENABLE
LATCH ENABLE
DATA
Q OUTPUT
L
H
H
L
L
H
L
H
L
L
l
H
L
L
h
L
H
X
X
Z
H = High Voltage Level, L = Low Voltage Level, X = Don’t Care, Z = High Impedance State, l = Low voltage level one set-up time prior to
the high to low latch enable transition, h = High voltage level one set-up time prior to the high to low latch enable transition.
2
CD54/74HC533, CD54/74HCT533, CD54/74HC563, CD74HCT563
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Drain Current, per Output, IO
For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±35mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA
Thermal Resistance (Typical, Note 1)
θJA (oC/W)
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . .
69
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . .
58
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
Operating Conditions
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
TEST
CONDITIONS
PARAMETER
SYMBOL
VI (V)
VIH
-
25oC
IO (mA) VCC (V)
-40oC TO 85oC
-55oC TO 125oC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
2
1.5
-
-
1.5
-
1.5
-
V
4.5
3.15
-
-
3.15
-
3.15
-
V
6
4.2
-
-
4.2
-
4.2
-
V
HC TYPES
High Level Input
Voltage
Low Level Input
Voltage
High Level Output
Voltage
CMOS Loads
VIL
VOH
-
VIH or
VIL
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or
VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
Quiescent Device
Current
-
-
2
-
-
0.5
-
0.5
-
0.5
V
4.5
-
-
1.35
-
1.35
-
1.35
V
6
-
-
1.8
-
1.8
-
1.8
V
-0.02
2
1.9
-
-
1.9
-
1.9
-
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-0.02
6
5.9
-
-
5.9
-
5.9
-
V
-6
4.5
3.98
-
-
3.84
-
3.7
-
V
-7.8
6
5.48
-
-
5.34
-
5.2
-
V
0.02
2
-
-
0.1
-
0.1
-
0.1
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
0.02
6
-
-
0.1
-
0.1
-
0.1
V
6
4.5
-
-
0.26
-
0.33
-
0.4
V
7.8
6
-
-
0.26
-
0.33
-
0.4
V
II
VCC or
GND
-
6
-
-
±0.1
-
±1
-
±1
µA
ICC
VCC or
GND
0
6
-
-
8
-
80
-
160
µA
3
CD54/74HC533, CD54/74HCT533, CD54/74HC563, CD74HCT563
DC Electrical Specifications
(Continued)
TEST
CONDITIONS
25oC
SYMBOL
VI (V)
IO (mA) VCC (V)
-
VIL or
VIH
VO =
VCC or
GND
High Level Input
Voltage
VIH
-
Low Level Input
Voltage
VIL
High Level Output
Voltage
CMOS Loads
VOH
PARAMETER
Three-State Leakage
Current
-40oC TO 85oC
-55oC TO 125oC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
6
-
-
±0.5
-
±5
-
±10
µA
-
4.5 to
5.5
2
-
-
2
-
2
-
V
-
-
4.5 to
5.5
-
-
0.8
-
0.8
-
0.8
V
VIH or
VIL
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-6
4.5
3.98
-
-
3.84
-
3.7
-
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
6
4.5
-
-
0.26
-
0.33
-
0.4
V
HCT TYPES
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or
VIL
Low Level Output
Voltage
TTL Loads
II
VCC to
GND
-
5.5
-
-
±0.1
-
±1
-
±1
µA
ICC
VCC or
GND
0
5.5
-
-
8
-
80
-
160
µA
Three-State Leakage
Current
-
VIL or
VIH
VO =
VCC or
GND
5.5
-
-
±0.5
-
±5
-
±10
µA
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
∆ICC
(Note 2)
VCC
-2.1
-
4.5 to
5.5
-
100
360
-
450
-
490
µA
Input Leakage
Current
Quiescent Device
Current
NOTE:
2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
HCT Input Loading Table
INPUT
UNIT LOADS
D0 - D7
0.15
LE
0.30
OE
0.55
NOTE: Unit Load is ∆ICC limit specified in DC Electrical Specifications table, e.g., 360µA max at 25oC.
4
CD54/74HC533, CD54/74HCT533, CD54/74HC563, CD74HCT563
Prerequisite For Switching Specifications
PARAMETER
25oC
-40oC TO 85oC -55oC TO 125oC
SYMBOL
TEST
CONDITIONS
VCC
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
tW
-
2
80
-
-
100
-
120
-
ns
4.5
16
-
-
20
-
24
-
ns
6
14
-
-
17
-
20
-
ns
2
50
-
-
65
-
75
-
ns
4.5
10
-
-
13
-
15
-
ns
6
9
-
-
11
-
13
-
ns
2
35
-
-
45
-
55
-
ns
4.5
7
-
-
9
-
11
-
ns
6
6
-
-
8
-
7
-
ns
2
4
-
-
4
-
4
-
ns
4.5
4
-
-
4
-
4
-
ns
6
4
-
-
4
-
4
-
ns
HC TYPES
LE Pulse Width
Set-up Time Data to LE
tSU
Hold Time, Data to LE
(533)
-
tH
Hold Time, Data to LE
(563)
-
tH
-
HCT TYPES
LE Pulse Width
tw
-
4.5
16
-
-
20
-
24
-
ns
Set-up Time Data to LE
tw
-
4.5
10
-
-
13
-
15
-
ns
Hold Time, Data to LE (533)
tH
-
4.5
8
-
-
10
-
12
-
ns
Hold Time, Data to LE (563)
tH
-
4.5
5
-
-
5
-
5
-
ns
Switching Specifications
PARAMETER
HC TYPES
Propagation Delay,
Data to Qn
(HC533)
Input tr, tf = 6ns
Propagation Delay,
LE to Qn
(HC533)
-55oC TO
125oC
TEST
CONDITIONS
VCC (V)
TYP
MAX
MAX
MAX
UNITS
tPLH, tPHL
CL = 50pF
2
-
165
205
250
ns
4.5
-
33
41
50
ns
6
-
28
35
43
ns
5
13
-
-
-
ns
tPLH, tPHL
tPLH, tPHL
CL = 50pF
2
-
150
190
225
ns
4.5
-
30
38
45
ns
6
-
26
33
38
ns
CL = 15pF
5
12
-
-
-
ns
CL = 50pF
2
-
175
220
265
ns
4.5
-
35
44
53
ns
6
-
30
37
45
ns
5
14
-
-
-
ns
CL = 15pF
Propagation Delay,
LE to Qn
(HC563)
-40oC TO 85oC
SYMBOL
CL = 15pF
Propagation Delay,
Data to Qn
(HC563)
25oC
tPLH, tPHL
CL = 50pF
CL = 15pF
2
-
165
205
250
ns
4.5
-
33
41
50
ns
6
-
28
35
43
ns
5
13
-
-
-
ns
5
CD54/74HC533, CD54/74HCT533, CD54/74HC563, CD74HCT563
Switching Specifications
PARAMETER
Enable Times
(HC533)
Disable Times
(HC533)
Input tr, tf = 6ns (Continued)
SYMBOL
TEST
CONDITIONS
tPZH, tPZL
CL = 50pF
tPHZ, tPLZ
tPZH, tPZL,
tPHZ, tPLZ
VCC (V)
-40oC TO 85oC
-55oC TO
125oC
TYP
MAX
MAX
MAX
UNITS
2
-
150
190
225
ns
4.5
-
30
38
45
ns
6
-
26
33
38
ns
CL = 15pF
5
12
-
-
-
ns
CL = 50pF
2
-
150
190
225
ns
4.5
-
30
38
45
ns
6
-
26
33
38
ns
5
12
-
-
-
ns
CL = 15pF
Enable and Disable Times
(HC563)
25oC
CL = 50pF
2
-
150
190
225
ns
4.5
-
30
38
45
ns
6
-
26
33
38
ns
CL = 15pF
5
12
-
-
-
ns
Input Capacitance
CI
-
-
-
10
10
10
pF
Three-State Output
Capacitance
CO
-
-
-
20
20
20
pF
Power Dissipation
Capacitance
(Notes 3, 4)
CPD
-
5
42
-
-
-
pF
tPLH, tPHL
CL = 50pF
4.5
-
34
43
51
ns
CL = 15pF
5
14
-
-
-
ns
CL = 50pF
4.5
-
30
38
45
ns
CL = 15pF
5
12
-
-
-
ns
CL = 50pF
4.5
-
38
48
57
ns
CL = 15pF
5
16
-
-
-
ns
CL = 50pF
4.5
-
35
44
53
ns
CL = 15pF
5
14
-
-
-
ns
CL = 50pF
4.5
-
35
44
53
ns
CL = 15pF
5
14
-
-
-
ns
CL = 50pF
4.5
-
30
38
45
ns
CL = 15pF
5
12
-
-
-
ns
HCT TYPES
Propagation Delay,
Data to Qn
(HC/HCT533)
Propagation Delay,
Data to Qn
(HC/HCT563)
tPLH, tPHL
Propagation Delay,
LE to Qn
(HC/HCT533)
tPLH, tPHL
Propagation Delay,
LE to Qn
(HC/HCT563)
tPZL, tPZH
Enable Times
(HC/HCT533)
tPLZ, tPZH
Disable Times
(HC/HCT533)
tTLH, tTHL
Enable and Disable Times
(HC/HCT563)
tPZH, tPZL,
tPHZ, tPLZ
CL = 50pF
4.5
-
35
44
53
ns
CL = 15pF
5
14
-
-
-
ns
Input Capacitance
CI
-
-
-
10
10
10
pF
Power Dissipation
Capacitance
(Notes 3, 4)
CPD
-
5
42
-
-
-
pF
NOTES:
3. CPD is used to determine the no-load dynamic power consumption, per latch.
4. PD (total power per latch) = CPD VCC2 fi + Σ CL VCC2 fo where fi = Input Frequency, fo = Output Frequency, CL = Output Load
Capacitance, VCC = Supply Voltage.
6
CD54/74HC533, CD54/74HCT533, CD54/74HC563, CD74HCT563
Test Circuits and Waveforms
tWL + tWH =
tfCL
trCL
50%
10%
10%
tf = 6ns
tr = 6ns
tTLH
90%
INVERTING
OUTPUT
tPHL
FIGURE 3. HC TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
tPLH
FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
trCL
tfCL
VCC
tfCL
GND
1.3V
0.3V
GND
tH(H)
tH(L)
VCC
DATA
INPUT
3V
2.7V
CLOCK
INPUT
50%
tH(H)
tTLH
1.3V
10%
tPLH
10%
GND
tTHL
90%
50%
10%
90%
3V
2.7V
1.3V
0.3V
GND
tTHL
trCL
tWH
FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
INPUT
INVERTING
OUTPUT
GND
NOTE: Outputs should be switching from 10% VCC to 90% VCC in
accordance with device truth table. For fMAX, input duty cycle = 50%.
VCC
90%
50%
10%
1.3V
1.3V
tWL
tf = 6ns
tPHL
1.3V
0.3V
tWH
FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
INPUT
2.7V
0.3V
GND
tr = 6ns
DATA
INPUT
50%
tH(L)
3V
1.3V
1.3V
1.3V
GND
tSU(H)
tSU(H)
tSU(L)
tTLH
90%
OUTPUT
tTHL
90%
50%
10%
tTLH
90%
1.3V
OUTPUT
tREM
3V
SET, RESET
OR PRESET
GND
tTHL
1.3V
10%
FIGURE 5. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE
TRIGGERED SEQUENTIAL LOGIC CIRCUITS
tPHL
1.3V
GND
IC
CL
50pF
GND
90%
tPLH
50%
IC
tSU(L)
tPHL
tPLH
I
fCL
3V
NOTE: Outputs should be switching from 10% VCC to 90% VCC in
accordance with device truth table. For fMAX, input duty cycle = 50%.
tREM
VCC
SET, RESET
OR PRESET
tfCL = 6ns
CLOCK
50%
50%
tWL
CLOCK
INPUT
tWL + tWH =
trCL = 6ns
VCC
90%
CLOCK
I
fCL
CL
50pF
FIGURE 6. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE
TRIGGERED SEQUENTIAL LOGIC CIRCUITS
7
CD54/74HC533, CD54/74HCT533, CD54/74HC563, CD74HCT563
Test Circuits and Waveforms
6ns
(Continued)
6ns
OUTPUT
DISABLE
tr
VCC
90%
50%
10%
OUTPUTS
ENABLED
OUTPUT HIGH
TO OFF
50%
OUTPUTS
DISABLED
FIGURE 7. HC THREE-STATE PROPAGATION DELAY
WAVEFORM
OTHER
INPUTS
TIED HIGH
OR LOW
OUTPUT
DISABLE
IC WITH
THREESTATE
OUTPUT
GND
1.3V
tPZH
90%
OUTPUTS
ENABLED
OUTPUTS
ENABLED
0.3
10%
tPHZ
tPZH
90%
3V
tPZL
tPLZ
OUTPUT LOW
TO OFF
50%
OUTPUT HIGH
TO OFF
6ns
GND
10%
tPHZ
tf
2.7
1.3
tPZL
tPLZ
OUTPUT LOW
TO OFF
6ns
OUTPUT
DISABLE
1.3V
OUTPUTS
DISABLED
OUTPUTS
ENABLED
FIGURE 8. HCT THREE-STATE PROPAGATION DELAY
WAVEFORM
OUTPUT
RL = 1kΩ
CL
50pF
VCC FOR tPLZ AND tPZL
GND FOR tPHZ AND tPZH
NOTE: Open drain waveforms tPLZ and tPZL are the same as those for three-state shown on the left. The test circuit is Output RL = 1kΩ to
VCC, CL = 50pF.
FIGURE 9. HC AND HCT THREE-STATE PROPAGATION DELAY TEST CIRCUIT
8
PACKAGE OPTION ADDENDUM
www.ti.com
10-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-8606201RA
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
5962-8681301RA
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
CD54HC533F3A
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
CD54HC563F3A
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
CD54HCT533F3A
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
CD74HC533E
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC533EE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC563E
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC563EE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC563M
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC563ME4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC563MG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT533E
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT533EE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT563E
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT563EE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT563M
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT563ME4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT563MG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-May-2007
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
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