1CY74FCT162H501 T Data sheet acquired from Cypress Semiconductor Corporation. Data sheet modified to remove devices not offered. CY74FCT16501T CY74FCT162501T CY74FCT162H501T SCCS057 - August 1994 - Revised March 2000 18-Bit Registered Transceivers Features Functional Description • FCT-E speed at 3.8 ns • Power-off disable outputs permits live insertion • Edge-rate control circuitry for significantly improved noise characteristics • Typical output skew < 250 ps • ESD > 2000V • TSSOP (19.6 mil pitch) and SSOP (25-mil pitch) packages • Industrial temperature range of −40˚C to +85˚C • VCC = 5V ± 10% CY74FCT16501T Features: • 64 mA sink current, 32 mA source current • Typical VOLP (ground bounce) <1.0V at VCC = 5V, TA = 25˚C These 18-bit universal bus transceivers can be operated in transparent, latched or clock modes by combining D-type latches and D-type flip-flops. Data flow in each direction is controlled by output enable (OEAB and OEBA), latch enable (LEAB and LEBA), and clock inputs (CLKAB and CLKBA). For A-to-B data flow, the device operates in transparent mode when LEAB is HIGH. When LEAB is LOW, the A data is latched if CLKAB is held at a HIGH or LOW logic level. If LEAB is LOW, the A bus data is stored in the latch/flip-flop on the LOW-to-HIGH transition of CLKAB. OEAB performs the output enable function on the B port. Data flow from B-to-A is similar to that of A-to-B and is controlled by OEBA, LEBA, and CLKBA. The output buffers are designed with a power-off disable feature to allow live insertion of boards. The CY74FCT16501T is ideally suited for driving high-capacitance loads and low-impedance backplanes. THE CY74FCT162501T has 24-mA balanced output drivers with current limiting resistors in the outputs. This reduces the need for external terminating resistors and provides for minimal undershoot and reduced ground bounce. The CY74FCT162501T is ideal for driving transmission lines. CY74FCT162501T Features: • Balanced 24 mA output drivers • Reduced system switching noise • Typical VOLP (ground bounce) <0.6V at VCC = 5V, TA= 25˚C CY74FCT162H501T Features: • Bus hold retains last active state • Eliminates the need for external pull-up or pull-down resistors The CY74FCT162H501T is a 24-mA balanced output part, that has “bus hold” on the data inputs. The device retains the input’s last state whenever the input goes to high impedance. This eliminates the need for pull-up/down resistors and prevents floating inputs. Pin Configuration Functional Block Diagram SSOP/TSSOP Top View OEAB LEAB A1 GND A2 OEAB A3 CLKBA VCC A4 A5 A6 LEBA OEBA CLKAB LEAB A1 C C D D B1 C C D D TO 17 OTHER CHANNELS GND A7 A8 A9 A 10 A 11 A 12 GND A 13 A 14 A 15 VCC FCT16501-1 A 16 A 17 GND A 18 OEBA LEBA 1 2 56 55 3 4 54 53 5 6 7 52 51 50 8 9 49 48 10 11 12 13 14 15 16 17 18 19 20 21 22 23 47 46 45 44 43 42 41 40 39 38 37 36 35 34 24 25 26 27 28 33 32 31 30 29 GND CLKAB B1 GND B2 B3 VCC B4 B5 B6 GND B7 B8 B9 B10 B11 B12 GND B13 B14 B15 VCC B16 B17 GND B18 CLKBA GND FCT16501-2 Copyright © 2000, Texas Instruments Incorporated CY74FCT16501T CY74FCT162501T CY74FCT162H501T Maximum Ratings[6, 7] Pin Description Name (Above which the useful life may be impaired. For user guidelines, not tested.) Description OEAB A-to-B Output Enable Input OEBA B-to-A Output Enable Input (Active LOW) LEAB A-to-B Latch Enable Input LEBA B-to-A Latch Enable Input DC Input Voltage................................................. −0.5V to +7.0V CLKAB A-to-B Clock Input DC Output Voltage.............................................. −0.5V to +7.0V CLKBA B-to-A Clock Input A A-to-B Data Inputs or B-to-A Three-State Outputs[1] DC Output Current (Maximum Sink Current/Pin)........................... −60 to +120 mA B B-to-A Data Inputs or A-to-B Three-State Outputs[1] Storage Temperature .................................... −55°C to +125°C Ambient Temperature with Power Applied.................................................. −55°C to +125°C Power Dissipation.......................................................... 1.0W Static Discharge Voltage ........................................... >2001V (per MIL-STD-883, Method 3015) Operating Range Function Table[2, 3] Inputs Range Outputs OEAB LEAB CLKAB A B L X X X Z H H X L L H H X H H H L L L H L H H H L L X B[4] H L H X B[5] Industrial Ambient Temperature VCC −40°C to +85°C 5V ± 10% Notes: 1. On the 74FCT162H501T these pins have bus hold. 2. A-to-B data flow is shown. B-to-A data flow is similar but uses OEBA, LEBA, and CLKBA. 3. H = HIGH Voltage Level L = LOW Voltage Level X = Don’t Care Z = High-impedance = LOW-to-HIGH Transition 4. Output level before the indicated steady-state input conditions were established. 5. Output level before the indicated steady-state input conditions were established, provided that CLKAB was HIGH before LEAB went LOW. 6. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature range. 7. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground. 2 CY74FCT16501T CY74FCT162501T CY74FCT162H501T Electrical Characteristics Over the Operating Range Parameter Description VIH Input HIGH Voltage VIL Input LOW Voltage Test Conditions Min. Input Hysteresis VIK Input Clamp Diode Voltage IIH Input HIGH Current 100 −0.7 VCC=Min., IIN=−18 mA Standard Input LOW Current Standard VCC=Max., VI=VCC V mV −1.2 V ±1 µA ±100 VCC=Max., VI=GND Bus Hold Input[10] Unit V 0.8 Bus Hold IIL Max. 2.0 [9] VH Typ.[8] VCC=Min., ±1 µA ±100 µA VI=2.0V −50 µA VI=0.8V +50 µA IBBH IBBL Bus Hold Sustain Current on Bus Hold IBHHO IBHLO Bus Hold Overdrive Current on Bus Hold Input[10] VCC=Max., VI=1.5V IOZH High Impedance Output Current (Three-State Output pins) IOZL IOS TBD mA VCC=Max., VOUT=2.7V ±1 µA High Impedance Output Current (Three-State Output pins) VCC=Max., VOUT=0.5V ±1 µA Short Circuit Current[11] VCC=Max., VOUT=GND −80 −200 mA Current[11] VCC=Max., VOUT=2.5V −50 −180 mA ±1 µA Max. Unit IO Output Drive IOFF Power-Off Disable −140 VCC=0V, VOUT≤4.5V[12] Output Drive Characteristics for CY74FCT16501T Parameter VOH VOL Description Output HIGH Voltage Output LOW Voltage Min. Typ.[8] VCC=Min., IOH=−3 mA 2.5 3.5 VCC=Min., IOH=−15 mA 2.4 3.5 VCC=Min., IOH=−32 mA 2.0 3.0 Test Conditions VCC=Min., IOL=64 mA V 0.2 0.55 V Min. Typ.[8] Max. Unit Output Drive Characteristics for CY74FCT162501T, CY74FCT162H501T Parameter Description Test Conditions Output LOW Current[11] VCC=5V, VIN=VIH or VIL, VOUT=1.5V 60 115 150 mA IODH Output HIGH Current[11] VCC=5V, VIN=VIH or VIL, VOUT=1.5V −60 −115 −150 mA VOH Output HIGH Voltage VCC=Min., IOH=−24 mA 2.4 3.3 VOL Output LOW Voltage VCC=Min., IOL=24 mA IODL 0.3 V 0.55 V Notes: 8. Typical values are at VCC= 5.0V, TA= +25˚C ambient. 9. This parameter is specified but not tested. 10. Pins with bus hold are described in Pin Description. 11. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last. 12. Tested at +25˚C. 3 CY74FCT16501T CY74FCT162501T CY74FCT162H501T Capacitance[9] (TA = +25˚C, f = 1.0 MHz) Parameter Description Test Conditions Typ.[8] Max. Unit CIN Input Capacitance VIN = 0V 4.5 6.0 pF COUT Output Capacitance VOUT = 0V 5.5 8.0 pF Power Supply Characteristics Sym. Test Conditions[13] Parameter VIN<0.2V VIN>VCC−0.2V Min. Typ.[8] Max. Unit — 5 500 µA — 0.5 1.5 mA ICC Quiescent Power Supply Current VCC=Max. ∆ICC Quiescent Power Supply Current TTL inputs HIGH VCC= Max., VIN = 3.4V[14] ICCD Dynamic Power Supply Current[15] VCC=Max., Outputs Open OEAB=OEBA=VCC or GND One Input Toggling, 50% Duty Cycle VIN=VCC or VIN=GND — 75 120 µA/ MHz IC Total Power Supply Current[16] VCC=Max., Outputs Open f0 =10MHz (CLKAB) 50% Duty Cycle OEAB=OEBA=VCC LEAB = GND, One Bit Toggling f1 = 5MHz, 50% Duty Cycle VIN=VCC or VIN=GND — 0.8 1.7 mA VIN=3.4V or VIN=GND — 1.3 3.2 VIN=VCC or VIN=GND — 3.8 6.5[17] VIN=3.4V or VIN=GND — 8.5 20.8[17] VCC=Max., Outputs Open f0 = 10MHz (CLKAB) 50% Duty Cycle OEAB=OEBA=VCC LEAB=GND Eighteen Bits Toggling f1=2.5MHz, 50% Duty Cycle Notes: 13. For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type. 14. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND. 15. This parameter is not directly testable, but is derived for use in Total Power Supply. 16. IC= IQUIESCENT + IINPUTS + IDYNAMIC IC = ICC+∆ICCDHNT+ICCD(f0/2 + f1N1) ICC = Quiescent Current with CMOS input levels ∆ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V) = Duty Cycle for TTL inputs HIGH DH = Number of TTL inputs at DH NT ICCD = Dynamic Current caused by an input transition pair (HLH or LHL) = Clock frequency for registered devices, otherwise zero f0 = Input signal frequency f1 = Number of inputs changing at f1 N1 All currents are in milliamps and all frequencies are in megahertz. 17. Values for these conditions are examples of the ICC formula. These limits are specified but not tested. 4 CY74FCT16501T CY74FCT162501T CY74FCT162H501T Switching Characteristics Over the Operating Range[18] CY74FCT16501AT CY74FCT162501AT Parameter Description CY74FCT162501CT CY74FCT162H501CT CY74FCT16501ET CY74FCT162501ET CY74FCT162H501ET Min. Max. Min. Max. Min. Max. Unit Fig. No.[19] fMAX CLKAB or CLKBA frequency[20] — 150 — 150 — 150 MHz — tPLH tPHL Propagation Delay A to B or B to A 1.5 5.1 1.5 4.6 1.5 3.8 ns 1,3 tPLH tPHL Propagation Delay LEBA to A, LEAB to B 1.5 5.6 1.5 5.3 1.5 4.2 ns 1,5 tPLH tPHL Propagation Delay CLKBA to A, CLKAB to B 1.5 5.6 1.5 5.3 1.5 4.2 ns 1,5 tPZH tPZL Output Enable Time OEBA to A, OEAB to B 1.5 6.0 1.5 5.6 1.5 4.8 ns 1,7,8 tPHZ tPLZ Output Disable Time OEBA to A, OEAB to B 1.5 5.6 1.5 5.2 1.5 5.2 ns 1,7,8 tSU Set-Up Time, HIGH or LOW A to CLKAB, B to CLKBA 3.0 — 3.0 — 2.4 — ns 4 tH Hold Time HIGH or LOW A to CLKAB, B to CLKBA 0 — 0 — 0 — ns 4 tSU Set-Up Time, Clock HIGH or LOW LOW A to LEAB, Clock B to LEBA HIGH 3.0 — 3.0 — 2.0 — ns 4 1.5 — 1.5 — 1.5 — ns 4 tH Hold Time, HIGH or LOW, A to LEAB, B to LEBA 1.5 — 1.5 — 0.5 — ns 4 tW LEAB or LEBA Pulse Width HIGH[20] 3.0 — 3.0 — 3.0 — ns 5 tW CLKAB or CLKBA Pulse Width HIGH or LOW[20] 3.0 — 3.0 — 3.0 — ns 5 tSK(O) Output Skew[21] — 0.5 — 0.5 — 0.5 ns — Notes: 18. Minimum limits are specified, but not tested, on propagation delays. 19. See “Parameter Measurement Information” in the General Information section. 20. This parameter is guaranteed but not tested. 21. Skew between any two outputs of the same package switching in the same direction. This parameter ensured by design. 5 CY74FCT16501T CY74FCT162501T CY74FCT162H501T Ordering Information CY74FCT16501T Speed (ns) 3.8 5.1 Ordering Code Package Name Package Type CY74FCT16501ETPACT Z56 56-Lead (240-Mil) TSSOP CY74FCT16501ETPVC/PVCT O56 56-Lead (300-Mil) SSOP CY74FCT16501ATPVC/PVCT O56 56-Lead (300-Mil) SSOP Operating Range Industrial Industrial Ordering Information CY74FCT162501T Speed (ns) 3.8 4.6 5.1 Ordering Code Package Name Package Type 74FCT162501ETPACT Z56 56-Lead (240-Mil) TSSOP CY74FCT162501ETPVC O56 56-Lead (300-Mil) SSOP 74FCT162501ETPVCT O56 56-Lead (300-Mil) SSOP 74FCT162501CTPACT Z56 56-Lead (240-Mil) TSSOP CY74FCT162501CTPVC O56 56-Lead (300-Mil) SSOP 74FCT162501CTPVCT O56 56-Lead (300-Mil) SSOP 74FCT162501ATPACT Z56 56-Lead (240-Mil) TSSOP CY74FCT162501ATPVC O56 56-Lead (300-Mil) SSOP 74FCT162501ATPVCT O56 56-Lead (300-Mil) SSOP Operating Range Industrial Industrial Industrial Ordering Information CY74FCT162H501T Speed (ns) 3.8 4.6 Ordering Code Package Name Package Type 74FCT162H501ETPACT Z56 56-Lead (240-Mil) TSSOP 74FCT162H501ETPVC/PVCT O56 56-Lead (300-Mil) SSOP 74FCT162H501CTPACT Z56 56-Lead (240-Mil) TSSOP 74FCT162H501CTPVC/PVCT O56 56-Lead (300-Mil) SSOP 6 Operating Range Industrial Industrial CY74FCT16501T CY74FCT162501T CY74FCT162H501T Package Diagrams 56-Lead Shrunk Small Outline Package O56 56-Lead Thin Shrunk Small Outline Package Z56 7 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof. Copyright 2000, Texas Instruments Incorporated