SCDS158A − OCTOBER 2003 − REVISED DECEMBER 2004
D Output Voltage Translation Tracks VCC
D Supports Mixed-Mode Signal Operation On
D
D
D
D
D
D
D VCC Operating Range From 2.3 V to 3.6 V
D Data I/Os Support 0- to 5-V Signaling
All Data I/O Ports
− 5-V Input Down To 3.3-V Output Level
Shift With 3.3-V VCC
− 5-V/3.3-V Input Down To 2.5-V Output
Level Shift With 2.5-V VCC
5-V-Tolerant I/Os With Device Powered Up
or Powered Down
Bidirectional Data Flow, With Near-Zero
Propagation Delay
Low ON-State Resistance (ron)
Characteristics (ron = 5 Ω Typical)
Low Input/Output Capacitance Minimizes
Loading (Cio(OFF) = 8 pF Typical)
Data and Control Inputs Provide
Undershoot Clamp Diodes
Low Power Consumption
(ICC = 20 µA Max)
D
D
D
D
D
D
Levels (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V,
5 V)
Control Inputs Can Be Driven by TTL or
5-V/3.3-V CMOS Outputs
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Performance Tested Per JESD 22
− 2000-V Human-Body Model
(A114-B, Class II)
− 1000-V Charged-Device Model (C101)
Supports Digital Applications: Level
Translation, Memory Interleaving, Bus
Isolation
Ideal for Low-Power Portable Equipment
DBQ, DGV, DW, OR PW PACKAGE
(TOP VIEW)
BE
1B1
1A1
1A2
1B2
2B1
2A1
2A2
2B2
3B1
3A1
GND
1
24
2
23
3
22
4
21
5
20
6
19
7
18
8
17
9
16
10
15
11
14
12
13
VCC
5B2
5A2
5A1
5B1
4B2
4A2
4A1
4B1
3B2
3A2
BX
description/ordering information
ORDERING INFORMATION
SOIC − DW
−40°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SSOP (QSOP) − DBQ
TSSOP − PW
Tube
SN74CB3T3383DW
Tape and reel
SN74CB3T3383DWR
Tape and reel
SN74CB3T3383DBQR
Tube
SN74CB3T3383PW
Tape and reel
SN74CB3T3383PWR
TOP-SIDE
MARKING
CB3T3383
CB3T3383
KS383
TVSOP − DGV
Tape and reel
SN74CB3T3383DGVR
KS383
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2004, Texas Instruments Incorporated
!"#$%&'(!$" !) *+%%,"( ') $# -+./!*'(!$" 0'(,
%$0+*() *$"#$%& ($ )-,*!#!*'(!$") -,% (1, (,%&) $# ,2') ")(%+&,"()
)('"0'%0 3'%%'"(4 %$0+*(!$" -%$*,))!"5 0$,) "$( ",*,))'%!/4 !"*/+0,
(,)(!"5 $# '// -'%'&,(,%)
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCDS158A − OCTOBER 2003 − REVISED DECEMBER 2004
description/ordering information (continued)
The SN74CB3T3383 is a high-speed TTL-compatible FET bus-exchange switch with low ON-state resistance
(ron), allowing for minimal propagation delay. The device fully supports mixed-mode signal operation on all data
I/O ports by providing voltage translation that tracks VCC. The SN74CB3T3383 supports systems using 5-V
TTL, 3.3-V LVTTL, and 2.5-V CMOS switching standards, as well as user-defined switching levels
(see Figure 1).
VCC
5.5 V
VCC
IN
≈VCC − 1 V
≈VCC
OUT
≈VCC − 1 V
CB3T
0V
0V
Input Voltages
Output Voltages
NOTE A: If the input high voltage (VIH) level is greater than or equal to VCC − 1 V, and less than or equal to 5.5 V, then the output high
voltage (VOH) level will be equal to approximately the VCC voltage level.
Figure 1. Typical DC Voltage Translation Characteristics
The SN74CB3T3383 is organized as a 10-bit bus switch or as a 5-bit bus-exchange with enable (BE) input.
When used as a 5-bit bus-exchange, the device provides data exchanging between four signal ports. When BE
is low, the bus-exchange switch is ON, and the select input (BX) controls the data path. When BE is high, the
bus-exchange switch is OFF, and a high-impedance state exists between the A and B ports.
This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that
damaging current will not backflow through the device when it is powered down. The device has isolation during
power off.
To ensure the high-impedance state during power up or power down, BE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCDS158A − OCTOBER 2003 − REVISED DECEMBER 2004
FUNCTION TABLE
(each 5-bit switch)
INPUTS
INPUTS/OUTPUTS
FUNCTION
BE
BX
A1
A2
L
L
B1
B2
A1 port = B1 port
A2 port = B2 port
L
H
B2
B1
A1 port = B2 port
A2 port = B1 port
H
X
Z
Z
Disconnect
logic diagram (positive logic)
2
3
1A1
1B1
SW
SW
SW
5
4
1A2
1B2
SW
20
21
5A1
5B1
SW
SW
SW
23
22
5A2
5B2
SW
1
BE
13
BX
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SCDS158A − OCTOBER 2003 − REVISED DECEMBER 2004
simplified schematic, each FET switch (SW)
A
B
VG†
Control
Circuit
EN‡
† Gate Voltage (VG) is approximately equal to VCC + VT when the switch is ON and VI > VCC + VT.
‡ EN is the internal enable signal applied to the switch.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)§
Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Control input voltage range, VIN (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Switch I/O voltage range, VI/O (see Notes 1, 2, and 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Control input clamp current, IIK (VIN < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
I/O port clamp current, II/OK (VI/O < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
ON-state switch current, II/O (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±128 mA
Continuous current through VCC or GND terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA
Package thermal impedance, θJA (see Note 5): DBQ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61°C/W
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
§ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to ground unless otherwise specified.
2. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
3. VI and VO are used to denote specific conditions for VI/O.
4. II and IO are used to denote specific conditions for II/O.
5. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 6)
VCC
Supply voltage
VIH
High-level control input voltage
VIL
Low-level control input voltage
VI/O
TA
Data input/output voltage
MIN
MAX
2.3
3.6
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VCC = 2.3 V to 2.7 V
1.7
5.5
2
5.5
0
0.7
VCC = 2.7 V to 3.6 V
0
0.8
0
5.5
V
−40
85
°C
Operating free-air temperature
UNIT
V
V
V
NOTE 6: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCDS158A − OCTOBER 2003 − REVISED DECEMBER 2004
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VIK
VCC = 3 V,
II = −18 mA
VOH
See Figures 3 and 4
IIN‡
Control inputs
IOZ§
VCC = 3.6 V,
VO = 0 to 5.5 V,
VI = 0,
Switch OFF,
VIN = VCC or GND
Ioff
VCC = 0,
VO = 0 to 5.5 V,
VI = 0,
ICC
∆ICC¶
Control inputs
Cin
Control inputs
TYP†
VCC = 3.6 V,
VIN‡ = 3.6 V to 5.5 V or GND
VCC = 3.6 V,
Switch ON,
VIN = VCC or GND
II
MIN
VCC = 3.6 V,
II/O = 0,
Switch ON or OFF,
VIN = VCC or GND
VCC = 3 V to 3.6 V,
One input at VCC − 0.6 V,
Other inputs at VCC or GND
MAX
UNIT
−1.2
V
±10
µA
±20
VI = VCC − 0.7 V to 5.5 V
VI = 0.7 V to VCC − 0.7 V
−40
µA
±5
VI = 0 to 0.7 V
±10
µA
10
µA
VI = VCC or GND
20
VI = 5.5 V
20
A
µA
300
µA
VCC = 3.3 V,
VIN = VCC or GND
4
pF
Cio(OFF)
VCC = 3.3 V,
VI/O = 5.5 V, 3.3 V, or GND,
Switch OFF,
VIN = VCC or GND
8
pF
VCC = 3.3 V,
Switch ON,
VIN = VCC or GND
VI/O = 5.5 V or 3.3 V
Cio(ON)
VI/O = GND
21
VCC = 2.3 V,
TYP at VCC = 2.5 V,
VI = 0
IO = 24 mA
5
9
IO = 16 mA
5
9
VCC = 3 V,
VI = 0
IO = 64 mA
IO = 32 mA
5
8
ron#
7
pF
Ω
5
8
† All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
‡ VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.
§ For I/O ports, the parameter IOZ includes the input leakage current.
¶ This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
# Measured by the voltage drop between A and B terminals at the indicated current through the switch. ON-state resistance is determined by the
lower of the voltages of the two (A or B) terminals.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SCDS158A − OCTOBER 2003 − REVISED DECEMBER 2004
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 2)
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
FROM
(INPUT)
TO
(OUTPUT)
A or B
B or A
tpd(s)
ten
BX
A or B
1
15
1
BE
A or B
1
13.5
1
9
ns
tdis
BE
A or B
1
7
1
8.5
ns
PARAMETER
tpd†
MIN
MAX
MIN
0.15
UNIT
MAX
0.25
10
ns
† The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance,
when driven by an ideal voltage source (zero output impedance).
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCDS158A − OCTOBER 2003 − REVISED DECEMBER 2004
PARAMETER MEASUREMENT INFORMATION
VCC
Input Generator
VIN
50 Ω
50 Ω
VG1
TEST CIRCUIT
DUT
Input Generator
VI
S1
RL
VO
50 Ω
VG2
CL
(see Note A)
RL
TEST
VCC
S1
RL
VI
CL
tpd(s)
2.5 V ± 0.2 V
3.3 V ± 0.3 V
Open
Open
500 Ω
500 Ω
3.6 V or GND
5.5 V or GND
30 pF
50 pF
tPLZ/tPZL
2.5 V ± 0.2 V
3.3 V ± 0.3 V
2 × VCC
2 × VCC
500 Ω
500 Ω
GND
GND
30 pF
50 pF
0.15 V
0.3 V
tPHZ/tPZH
2.5 V ± 0.2 V
3.3 V ± 0.3 V
Open
Open
500 Ω
500 Ω
3.6 V
5.5 V
30 pF
50 pF
0.15 V
0.3 V
Output
Control
(VIN)
V∆
VCC
VCC/2
VCC
VCC/2
0V
tPLH
VOH
Output
VCC/2
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPLZ
VCC
VCC/2
tPZH
tPHL
VCC/2
VOL
VCC/2
0V
tPZL
VCC/2
Open
GND
50 Ω
Output
Control
(VIN)
2 × VCC
Output
Waveform 2
S1 at Open
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES (tpd(s))
VOL + V∆
VOL
tPHZ
VCC/2
VOH − V∆
VOH
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd(s). The tpd propagation delay is the calculated RC time constant of the typical ON-state resistance
of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).
H. All parameters and waveforms are not applicable to all devices.
Figure 2. Test Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
SCDS158A − OCTOBER 2003 − REVISED DECEMBER 2004
TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE
vs
INPUT VOLTAGE
OUTPUT VOLTAGE
vs
INPUT VOLTAGE
4.0
VCC = 2.3 V
IO = 1 µA
TA = 25°C
3.0
V − Output Voltage − V
O
V − Output Voltage − V
O
4.0
2.0
1.0
0.0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
VCC = 3 V
IO = 1 µA
TA = 25°C
3.0
2.0
1.0
0.0
0.0
1.0
VI − Input Voltage − V
2.0
POST OFFICE BOX 655303
4.0
VI − Input Voltage − V
Figure 3. Data Output Voltage vs Data Input Voltage
8
3.0
• DALLAS, TEXAS 75265
5.0
6.0
SCDS158A − OCTOBER 2003 − REVISED DECEMBER 2004
TYPICAL CHARACTERISTICS (continued)
OUTPUT VOLTAGE HIGH
vs
SUPPLY VOLTAGE
OUTPUT VOLTAGE HIGH
vs
SUPPLY VOLTAGE
4.0
100 µA
8 mA
16 mA
24 mA
3.0
2.5
2.0
1.5
2.3
2.5
2.7
2.9
3.1
3.3
3.5
V
− Output Voltage High − V
OH
3.5
VCC = 2.3 V to 3.6 V
VI = 5.5 V
TA = 85°C
VCC = 2.3 V to 3.6 V
VI = 5.5 V
TA = 25°C
3.5
100 µA
8 mA
16 mA
24 mA
3.0
2.5
2.0
1.5
3.7
2.3
2.5
VCC − Supply Voltage − V
2.7
2.9
3.1
3.3
3.5
3.7
VCC − Supply Voltage − V
OUTPUT VOLTAGE HIGH
vs
SUPPLY VOLTAGE
4.0
V
− Output Voltage High − V
OH
V
− Output Voltage High − V
OH
4.0
3.5
VCC = 2.3 V to 3.6 V
VI = 5.5 V
TA = –40°C
100 µA
8 mA
16 mA
24 mA
3.0
2.5
2.0
1.5
2.3
2.5
2.7
2.9
3.1
3.3
3.5
3.7
VCC − Supply Voltage − V
Figure 4. VOH Values
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
PACKAGE OPTION ADDENDUM
www.ti.com
24-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74CB3T3383DBQRE4
ACTIVE
SSOP/
QSOP
DBQ
24
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
74CB3T3383DBQRG4
ACTIVE
SSOP/
QSOP
DBQ
24
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
74CB3T3383DGVRE4
ACTIVE
TVSOP
DGV
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CB3T3383DGVRG4
ACTIVE
TVSOP
DGV
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3T3383DBQR
ACTIVE
SSOP/
QSOP
DBQ
24
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN74CB3T3383DGVR
ACTIVE
TVSOP
DGV
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3T3383DW
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3T3383DWE4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3T3383DWG4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3T3383DWR
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3T3383DWRE4
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3T3383DWRG4
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3T3383PW
ACTIVE
TSSOP
PW
24
60
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3T3383PWE4
ACTIVE
TSSOP
PW
24
60
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3T3383PWG4
ACTIVE
TSSOP
PW
24
60
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3T3383PWR
ACTIVE
TSSOP
PW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3T3383PWRE4
ACTIVE
TSSOP
PW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3T3383PWRG4
ACTIVE
TSSOP
PW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
24-May-2007
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jul-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
16-Jul-2007
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74CB3T3383DBQR
DBQ
24
MLA
330
16
6.5
9.0
2.1
8
16
Q1
SN74CB3T3383DGVR
DGV
24
MLA
330
12
7.0
5.6
1.6
8
12
Q1
SN74CB3T3383DWR
DW
24
TAI
330
24
10.75
15.7
2.7
12
24
Q1
SN74CB3T3383PWR
PW
24
MLA
330
16
6.95
8.3
1.6
8
16
Q1
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN74CB3T3383DBQR
DBQ
24
MLA
346.0
346.0
33.0
SN74CB3T3383DGVR
DGV
24
MLA
346.0
346.0
29.0
SN74CB3T3383DWR
DW
24
TAI
346.0
346.0
41.0
SN74CB3T3383PWR
PW
24
MLA
346.0
346.0
33.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jul-2007
Pack Materials-Page 3
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties
may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Telephony
www.ti.com/telephony
Low Power
Wireless
www.ti.com/lpw
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated