SCBS679K − DECEMBER 1996 − REVISED SEPTEMBER 2003
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
20
2Y4
1A1
1OE
VCC
1
19 2OE
18 1Y1
2
3
17 2A4
16 1Y2
4
5
15 2A3
14 1Y3
6
7
SN54LVTH240 . . . FK PACKAGE
(TOP VIEW)
1A2
2Y3
1A3
2Y2
1A4
13 2A2
12 1Y4
8
9
10
11
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
1Y1
2A4
1Y2
2A3
1Y3
2Y1
GND
2A1
1Y4
2A2
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
Need for External Pullup/Pulldown
Resistors
Latch-Up Performance Exceeds 500 mA Per
JESD 17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
SN74LVTH240 . . . RGY PACKAGE
(TOP VIEW)
VCC
SN54LVTH240 . . . J OR W PACKAGE
SN74LVTH240 . . . DB, DW, NS,
OR PW PACKAGE
(TOP VIEW)
D
2A1
D
D
1OE
D
GND
D
D Bus Hold on Data Inputs Eliminates the
Input and Output Voltages With 3.3-V VCC)
Support Unregulated Battery Operation
Down to 2.7 V
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
Ioff and Power-Up 3-State Support Hot
Insertion
2OE
D Support Mixed-Mode Signal Operation (5-V
description/ordering information
These octal buffers and line drivers are designed specifically for low-voltage (3.3-V) VCC operation, but with the
capability to provide a TTL interface to a 5-V system environment.
ORDERING INFORMATION
QFN − RGY
SN74LVTH240RGYR
Tube
SN74LVTH240DW
Tape and reel
SN74LVTH240DWR
SOP − NS
Tape and reel
SN74LVTH240NSR
LVTH240
SSOP − DB
Tape and reel
SN74LVTH240DBR
LXH240
Tube
SN74LVTH240PW
Tape and reel
SN74LVTH240PWR
TSSOP − PW
VFBGA − GQN
VFBGA − ZQN (Pb-free)
−55°C
125°C
−55
C to 125
C
TOP-SIDE
MARKING
Tape and reel
SOIC − DW
−40°C
−40
C to 85
85°C
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
LXH240
LVTH240
LXH240
SN74LVTH240GQNR
Tape and reel
SN74LVTH240ZQNR
LXH240
CDIP − J
Tube
SNJ54LVTH240J
SNJ54LVTH240J
CFP − W
Tube
SNJ54LVTH240W
SNJ54LVTH240W
LCCC − FK
Tube
SNJ54LVTH240FK
SNJ54LVTH240FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
!"#$%! & '("")% $& ! *(+,'$%! -$%)
"!-('%& '!!"# %! &*)''$%!& *)" %.) %)"#& ! )/$& &%"(#)%&
&%$-$"- 0$""$%1 "!-('%! *"!')&&2 -!)& !% )')&&$",1 ',(-)
%)&%2 ! $,, *$"$#)%)"&
*"!-('%& '!#*,$% %! 34 $,, *$"$#)%)"& $") %)&%)(,)&& !%.)"0&) !%)- $,, !%.)" *"!-('%& *"!-('%!
*"!')&&2 -!)& !% )')&&$",1 ',(-) %)&%2 ! $,, *$"$#)%)"&
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCBS679K − DECEMBER 1996 − REVISED SEPTEMBER 2003
description/ordering information (continued)
These devices are organized as two 4-bit buffer/line drivers with separate output-enable (OE) inputs. When OE
is low, the devices pass data from the A inputs to the Y outputs. When OE is high, the outputs are in the
high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors
with the bus-hold circuitry is not recommended.
These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry
disables the outputs, preventing damaging current backflow through the devices when they are powered down.
The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
SN74LVTH240 . . . GQN OR ZQN PACKAGE
(TOP VIEW)
1
2
3
terminal assignments
4
1
2
3
4
A
A
1A1
1OE
B
1A2
2A4
VCC
2Y4
2OE
B
C
C
1A3
2Y3
2A3
1Y2
D
D
1A4
2A2
2Y2
1Y3
E
E
GND
2Y1
2A1
1Y4
FUNCTION TABLE
(each 4-bit buffer)
INPUTS
2
OUTPUT
Y
OE
A
L
H
L
L
L
H
H
X
Z
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1Y1
SCBS679K − DECEMBER 1996 − REVISED SEPTEMBER 2003
logic diagram (positive logic)
1OE
1A1
1A2
1A3
1A4
1
2OE
2
18
4
16
6
14
8
12
1Y1
2A1
1Y2
2A2
1Y3
2A3
1Y4
2A4
19
11
9
13
7
15
5
17
3
2Y1
2Y2
2Y3
2Y4
Pin numbers shown are for the DB, DW, FK, J, NS, PW, RGY, and W packages.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high-impedance
or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high state, VO (see Note 1) . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Current into any output in the low state, IO: SN54LVTH240 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA
SN74LVTH240 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Current into any output in the high state, IO (see Note 2): SN54LVTH240 . . . . . . . . . . . . . . . . . . . . . . . 48 mA
SN74LVTH240 . . . . . . . . . . . . . . . . . . . . . . . 64 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Package thermal impedance, θJA (see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
(see Note 3): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
(see Note 3): GQN/ZQN package . . . . . . . . . . . . . . . . . . . . . . . . . . . 78°C/W
(see Note 3): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
(see Note 3): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
(see Note 4): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. This current flows only when the output is in the high state and VO > VCC.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
4. The package thermal impedance is calculated in accordance with JESD 51-5.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SCBS679K − DECEMBER 1996 − REVISED SEPTEMBER 2003
recommended operating conditions (see Note 5)
SN54LVTH240
SN74LVTH240
MIN
MAX
MIN
MAX
2.7
3.6
2.7
3.6
UNIT
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
0.8
0.8
Input voltage
5.5
5.5
V
IOH
IOL
High-level output current
−24
−32
mA
48
64
mA
∆t/∆v
Input transition rise or fall rate
10
10
ns/V
∆t/∆VCC
TA
Power-up ramp rate
200
Operating free-air temperature
−55
High-level input voltage
2
Low-level output current
Outputs enabled
2
V
−40
V
µs/V
200
125
V
85
°C
NOTE 5: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCBS679K − DECEMBER 1996 − REVISED SEPTEMBER 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
TEST CONDITIONS
VCC = 2.7 V,
VCC = 2.7 V to 3.6 V,
II = −18 mA
IOH = −100 µA
VCC = 2.7 V,
IOH = −8 mA
IOH = −24 mA
VCC = 3 V
VCC = 2.7 V
VOL
VCC = 3 V
Control inputs
II
Data inputs
Ioff
II(hold)
Data inputs
VCC = 0 or 3.6 V,
VCC = 3.6 V,
VCC = 3.6 V
SN54LVTH240
TYP†
MAX
MIN
SN74LVTH240
TYP†
MAX
MIN
−1.2
VCC−0.2
2.4
−1.2
V
VCC−0.2
2.4
V
2
IOH = −32 mA
IOL = 100 µA
2
0.2
0.2
IOL = 24 mA
IOL = 16 mA
0.5
0.5
0.4
0.4
IOL = 32 mA
IOL = 48 mA
0.5
0.5
V
0.55
IOL = 64 mA
VI = 5.5 V
0.55
VI = VCC or GND
VI = VCC
VI = 0
VCC = 0, VI or VO = 0 to 4.5 V
VI = 0.8 V
VCC = 3 V
VI = 2 V
UNIT
10
10
±1
±1
1
1
−5
A
µA
−5
±100
75
75
−75
−75
500
−750
µA
µA
VCC = 3.6 V‡,
VI = 0 to 3.6 V
IOZH
IOZL
VCC = 3.6 V,
VCC = 3.6 V,
VO = 3 V
VO = 0.5 V
5
5
µA
−5
−5
µA
IOZPU
VCC = 0 to 1.5 V, VO = 0.5 V to 3 V,
OE = don’t care
±100∗
±100
µA
IOZPD
VCC = 1.5 V to 0, VO = 0.5 V to 3 V,
OE = don’t care
±100∗
±100
µA
0.19
0.19
ICC
VCC = 3.6 V,
IO = 0,
VI = VCC or GND
5
5
0.19
0.19
0.2
0.2
∆ICC§
Ci
Outputs high
Outputs low
Outputs disabled
VCC = 3 V to 3.6 V,
One input at VCC − 0.6 V,
Other inputs at VCC or GND
VI = 3 V or 0
3
3
mA
mA
pF
Co
VO = 3 V or 0
7
7
pF
∗ On products compliant to MIL-PRF-38535, this parameter is not production tested.
† All typical values are at VCC = 3.3 V, TA = 25°C.
‡ This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another.
§ This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SCBS679K − DECEMBER 1996 − REVISED SEPTEMBER 2003
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Figure 1)
SN54LVTH240
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A
Y
tPZH
tPZL
OE
Y
tPHZ
tPLZ
OE
Y
VCC = 3.3 V
± 0.3 V
SN74LVTH240
VCC = 2.7 V
VCC = 2.7 V
MIN
MAX
MAX
MIN
TYP†
MAX
0.9
4.3
5.1
1.1
2.2
3.8
4.6
1.2
4.7
4.9
1.3
2.6
4
4.2
MIN
MIN
1
5.7
6.7
1.1
2.6
4.6
5.6
5.5
6.2
1.4
2.7
4.4
5
1
5.1
5.2
2
2.9
4.4
4.6
1.1
5.4
5.4
1.8
3
4.3
4.3
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
MAX
1.2
† All typical values are at VCC = 3.3 V, TA = 25°C.
6
VCC = 3.3 V
± 0.3 V
ns
ns
ns
SCBS679K − DECEMBER 1996 − REVISED SEPTEMBER 2003
PARAMETER MEASUREMENT INFORMATION
500 Ω
From Output
Under Test
6V
Open
S1
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
6V
GND
2.7 V
LOAD CIRCUIT
Timing Input
1.5 V
0V
tw
tsu
2.7 V
Input
1.5 V
1.5 V
th
2.7 V
1.5 V
Data Input
1.5 V
0V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
2.7 V
1.5 V
Input
1.5 V
0V
VOH
Output
1.5 V
1.5 V
VOL
1.5 V
tPLZ
3V
1.5 V
tPZH
VOH
Output
1.5 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
0V
Output
Waveform 1
S1 at 6 V
(see Note B)
tPLH
tPHL
1.5 V
tPZL
tPHL
tPLH
2.7 V
Output
Control
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.3 V
VOL
tPHZ
1.5 V
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
5962-9950801Q2A
ACTIVE
LCCC
FK
20
1
TBD
5962-9950801QRA
ACTIVE
CDIP
J
20
1
TBD
5962-9950801QSA
ACTIVE
CFP
W
20
1
5962-9950801V2A
ACTIVE
LCCC
FK
20
1
5962-9950801VRA
ACTIVE
CDIP
J
20
1
SN74LVTH240DBLE
OBSOLETE
SSOP
DB
20
SN74LVTH240DBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH240DBRE4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH240DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH240DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH240DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH240DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH240GQNR
ACTIVE
GQN
20
1000
SNPB
Level-1-240C-UNLIM
SN74LVTH240NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH240NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH240PW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH240PWE4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH240PWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH240PWLE
OBSOLETE
TSSOP
PW
20
SN74LVTH240PWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH240PWRE4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH240PWRG4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH240RGYR
ACTIVE
QFN
RGY
20
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SN74LVTH240RGYRG4
ACTIVE
QFN
RGY
20
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SN74LVTH240ZQNR
ACTIVE
ZQN
20
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
SNJ54LVTH240FK
ACTIVE
LCCC
FK
20
1
TBD
SNJ54LVTH240J
ACTIVE
CDIP
J
20
1
TBD
BGA MI
CROSTA
R JUNI
OR
BGA MI
CROSTA
R JUNI
OR
A42 SNPB
N / A for Pkg Type
TBD
A42
N / A for Pkg Type
TBD
Call TI
Call TI
TBD
Call TI
Call TI
Call TI
Call TI
TBD
TBD
TBD
Addendum-Page 1
POST-PLATE N / A for Pkg Type
Call TI
Call TI
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
Orderable Device
Status (1)
Package
Type
Package
Drawing
SNJ54LVTH240W
ACTIVE
CFP
W
Pins Package Eco Plan (2)
Qty
20
1
TBD
Lead/Ball Finish
A42
MSL Peak Temp (3)
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
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Addendum-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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