TI 74ACT16841DLR

54ACT16841, 74ACT16841
20-BIT BUS-INTERFACE D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCAS174A – MAY 1991 – REVISED APRIL 1996
D
D
D
D
D
D
D
D
D
Members of the Texas Instruments
Widebus  Family
Inputs Are TTL-Voltage Compatible
3-State Outputs Drive Bus Lines Directly
Provide Extra Bus Driving/Latches
Necessary for Wider Address/Data Paths or
Buses With Parity
Flow-Through Architecture Optimizes
PCB Layout
Distributed VCC and GND Pin Configuration
Minimizes High-Speed Switching Noise
EPIC  (Enhanced-Performance Implanted
CMOS) 1-µm Process
500-mA Typical Latch-Up Immunity at
125°C
Package Options Include Plastic Thin
Shrink Small-Outline (DGG) Packages,
300-mil Shrink Small-Outline (DL) Packages
Using 25-mil Center-to-Center Pin
Spacings, and 380-mil Fine-Pitch Ceramic
Flat (WD) Packages Using 25-mil
Center-to-Center Pin Spacings
54ACT16841 . . . WD PACKAGE
74ACT16841 . . . DGG OR DL PACKAGE
(TOP VIEW)
1OE
1Q1
1Q2
GND
1Q3
1Q4
VCC
1Q5
1Q6
1Q7
GND
1Q8
1Q9
1Q10
2Q1
2Q2
2Q3
GND
2Q4
2Q5
2Q6
VCC
2Q7
2Q8
GND
2Q9
2Q10
2OE
description
These 20-bit latches feature 3-state outputs
designed specifically for driving highly capacitive
or relatively low-impedance loads. They are
particularly suitable for implementing buffer
registers, I/O ports, bidirectional bus drivers, and
working registers.
1
56
2
55
3
54
4
53
5
52
6
51
7
50
8
49
9
48
10
47
11
46
12
45
13
44
14
43
15
42
16
41
17
40
18
39
19
38
20
37
21
36
22
35
23
34
24
33
25
32
26
31
27
30
28
29
1LE
1D1
1D2
GND
1D3
1D4
VCC
1D5
1D6
1D7
GND
1D8
1D9
1D10
2D1
2D2
2D3
GND
2D4
2D5
2D6
VCC
2D7
2D8
GND
2D9
2D10
2LE
The ’ACT16841 can be used as two 10-bit latches
or one 20-bit latch. The 20 latches are transparent
D-type. While the latch-enable (1LE or 2LE) input
is high, the Q outputs of the corresponding 10-bit
latch follow the data (D) inputs. When LE is taken
low, the Q outputs are latched at the levels that
were set up at the D inputs.
A buffered output-enable (1OE or 2OE) input can be used to place the outputs of the corresponding 10-bit latch
in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state,
the outputs neither load nor drive the bus lines significantly.
OE does not affect the internal operation of the latches. Old data can be retained or new data can be entered
while the outputs are in the high-impedance state.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC and Widebus are trademarks of Texas Instruments Incorporated.
Copyright  1996, Texas Instruments Incorporated
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
54ACT16841, 74ACT16841
20-BIT BUS-INTERFACE D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCAS174A – MAY 1991 – REVISED APRIL 1996
description (continued)
The 74ACT16841 is packaged in TI’s shrink small-outline package (DL), which provides twice the I/O pin count
and functionality of standard small-outline packages in the same printed-circuit-board area.
The 54ACT16841 is characterized for operation over the full military temperature range of –55°C to 125°C. The
74ACT16841 is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
(each 10-bit latch)
INPUTS
OE
LE
D
OUTPUT
Q
L
H
H
H
L
H
L
L
L
L
X
Q0
H
X
X
Z
logic symbol†
1
1OE
1LE
56
28
2OE
2LE
1D1
1D2
1D3
1D4
1D5
1D6
1D7
1D8
1D9
1D10
2D1
2D2
2D3
2D4
2D5
2D6
2D7
2D8
2D9
2D10
29
55
EN2
C1
EN4
C3
1D
54
2
2
52
5
51
6
49
8
48
9
47
10
45
12
44
13
43
14
42
3D
41
4
15
16
40
17
38
19
37
20
36
21
34
23
33
24
31
26
30
27
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
2
3
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1Q1
1Q2
1Q3
1Q4
1Q5
1Q6
1Q7
1Q8
1Q9
1Q10
2Q1
2Q2
2Q3
2Q4
2Q5
2Q6
2Q7
2Q8
2Q9
2Q10
54ACT16841, 74ACT16841
20-BIT BUS-INTERFACE D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCAS174A – MAY 1991 – REVISED APRIL 1996
logic diagram (positive logic)
1OE
1LE
1
2OE
56
2LE
C1
1D1
2
55
28
29
C1
1Q1
2D1
1D
42
15
2Q1
1D
To Nine Other Channels
To Nine Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±500 mA
Maximum package power dissipation at TA = 55°C (in still air) (see Note 2): DGG package . . . . . . . . . . 1 W
DL package . . . . . . . . . . . 1.4 W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150_C and a board trace length of 750 mils.
recommended operating conditions (see Note 3)
54ACT16841
NOM
MAX
MIN
NOM
MAX
4.5
5
5.5
4.5
5
5.5
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
Input voltage
0
VO
IOH
Output voltage
0
High-level output current
IOL
∆t/∆v
Low-level output current
High-level input voltage
74ACT16841
MIN
2
2
0.8
Input transition rise or fall rate
TA
Operating free-air temperature
NOTE 3: Unused inputs must be held high or low to prevent them from floating.
UNIT
V
V
0.8
V
VCC
VCC
V
–24
–24
mA
24
24
mA
VCC
VCC
0
0
V
0
10
0
10
ns/V
–55
125
–40
85
°C
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
54ACT16841, 74ACT16841
20-BIT BUS-INTERFACE D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCAS174A – MAY 1991 – REVISED APRIL 1996
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
4.5 V
IOH = –50
50 µA
VOH
24 mA
IOH = –24
IOH = –75 mA†
II
IOZ
ICC
IOL = 75 mA†
VI = VCC or GND
54ACT16841
MIN
∆ICC‡
One input at 3.4 V,
Other inputs at VCC or GND
Ci
VI = VCC or GND
VO = VCC or GND
74ACT16841
MIN
4.4
4.4
5.5 V
5.4
5.4
5.4
4.5 V
3.94
3.8
3.8
5.5 V
4.94
4.8
4.8
3.85
3.85
0.1
0.1
MAX
UNIT
V
0.1
5.5 V
0.1
0.1
0.1
4.5 V
0.36
0.44
0.44
5.5 V
0.36
0.44
0.44
1.65
1.65
±1
±1
µA
5.5 V
IO = 0
MAX
4.4
4.5 V
IOL = 24 mA
VO = VCC or GND
VI = VCC or GND,
TA = 25°C
TYP
MAX
5.5 V
IOL = 50 µA
VOL
MIN
V
5.5 V
±0.1
5.5 V
±0.5
±5
±5
µA
5.5 V
8
80
80
µA
5.5 V
0.9
1
1
mA
5V
3
pF
Co
5V
11
† Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.
‡ This is the increase in supply current for each input that is at one of the specified TTL voltage levels rather than 0 V or VCC.
pF
timing requirements over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
MAX
tw
tsu
th
Pulse duration, LE high
Setup time, data before LE↓
Hold time,
time data after LE↓
54ACT16841
MIN
MAX
74ACT16841
MIN
MAX
UNIT
4
4
4
ns
ns
1.5
1.5
1.5
High
3
3
3
Low
4.5
4.5
4.5
ns
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
D
Q
tPLH
tPHL
LE
Q
tPZH
tPZL
OE
Q
tPHZ
tPLZ
OE
Q
TA = 25°C
MIN
TYP
MAX
POST OFFICE BOX 655303
74ACT16841
MIN
MAX
MIN
MAX
4
7.1
10.3
4
11.8
4
11.8
3.2
6.9
11
3.2
12.2
3.2
12.2
4.5
7.7
11.3
4.5
12.7
4.5
12.7
4.3
7.8
11.4
4.3
12.7
4.3
12.7
3.1
6.4
10.1
3.1
11.3
3.1
11.3
3.8
7.6
12.1
3.8
13.7
3.8
13.7
4
7.3
9.5
4
10.2
4
10.2
4
6.8
8.9
4
9.6
4
9.6
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
4
54ACT16841
• DALLAS, TEXAS 75265
UNIT
ns
ns
ns
ns
54ACT16841, 74ACT16841
20-BIT BUS-INTERFACE D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCAS174A – MAY 1991 – REVISED APRIL 1996
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
d
TEST CONDITIONS
Outputs enabled
Power dissipation capacitance
pF
CL = 50 pF,
Outputs disabled
TYP
f = 1 MHz
41
10
UNIT
pF
PARAMETER MEASUREMENT INFORMATION
2 × VCC
S1
500 Ω
From Output
Under Test
Open
GND
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
GND
500 Ω
CL = 50 pF
(see Note A)
LOAD CIRCUIT
3V
Timing Input
(see Note B)
1.5 V
0V
tw
tsu
3V
Input
1.5 V
th
1.5 V
3V
1.5 V
1.5 V
Data Input
0V
0V
VOLTAGE WAVEFORMS
VOLTAGE WAVEFORMS
Output
Control
(low-level
enabling)
3V
1.5 V
Input
1.5 V
0V
tPHL
tPLH
In-Phase
Output
50% VCC
50% VCC
0V
tPZL
VOH
50% VCC
VOL
Output
Waveform 2
S1 at GND
(see Note B)
[ VCC
tPLZ
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPLH
tPHL
Out-of-Phase
Output
VOH
50% VCC
VOL
3V
1.5 V
1.5 V
50% VCC
VOL
tPHZ
tPZH
VOLTAGE WAVEFORMS
20% VCC
50% VCC
80% VCC
VOH
[0V
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74ACT16841DGGR
OBSOLETE
TSSOP
DGG
56
74ACT16841DL
ACTIVE
SSOP
DL
56
74ACT16841DLG4
ACTIVE
SSOP
DL
56
74ACT16841DLR
ACTIVE
SSOP
DL
74ACT16841DLRG4
ACTIVE
SSOP
DL
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
74ACT16841DGGR
TSSOP
DGG
56
0
330.0
24.4
8.6
15.6
1.8
12.0
24.0
Q1
74ACT16841DLR
SSOP
DL
56
1000
330.0
32.4
11.35
18.67
3.1
16.0
32.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
74ACT16841DGGR
TSSOP
DGG
74ACT16841DLR
SSOP
DL
56
0
346.0
346.0
41.0
56
1000
346.0
346.0
49.0
Pack Materials-Page 2
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