54ACT16825, 74ACT16825 18-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCAS155B – JANUARY 1991 – REVISED APRIL 1996 D D D D D D D 54ACT16825 . . . DW PACKAGE 74ACT16825 . . . DL PACKAGE (TOP VIEW) Members of the Texas Instruments Widebus Family Inputs Are TTL-Voltage Compatible Provide Extra Data Width Necessary for Wider Address/Data Paths or Buses With Parity Flow-Through Architecture Optimizes PCB Layout Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-µm Process Package Options Include Plastic 300-mil Shrink Small-Outline (DL) Packages Using 25-mil Center-to-Center Pin Spacings and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Spacings 1OE1 1Y1 1Y2 GND 1Y3 1Y4 VCC 1Y5 1Y6 1Y7 GND 1Y8 1Y9 GND GND 2Y1 2Y2 GND 2Y3 2Y4 2Y5 VCC 2Y6 2Y7 GND 2Y8 2Y9 2OE1 description The ’ACT16825 18-bit buffers/drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The ’ACT16825 can be used as two 9-bit buffers or one 18-bit buffer. They provide true data from A to Y. The 3-state control gate is a 2-input NOR gate; therefore, if either output-enable (OE1 or OE2) input is high, all nine affected outputs are in the high-impedance state. 1 56 2 55 3 54 4 53 5 52 6 51 7 50 8 49 9 48 10 47 11 46 12 45 13 44 14 43 15 42 16 41 17 40 18 39 19 38 20 37 21 36 22 35 23 34 24 33 25 32 26 31 27 30 28 29 1OE2 1A1 1A2 GND 1A3 1A4 VCC 1A5 1A6 1A7 GND 1A8 1A9 GND GND 2A1 2A2 GND 2A3 2A4 2A5 VCC 2A6 2A7 GND 2A8 2A9 2OE2 The 74ACT16825 is packaged in TI’s shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area. The 54ACT16825 is characterized for operation over the full military temperature range of –55°C to 125°C. The 74ACT16825 is characterized for operation from –40°C to 85°C. FUNCTION TABLE (each 9-bit section) INPUTS OE1 OE2 A OUTPUT Y L L L L H L L H H X X Z X H X Z Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC and Widebus are trademarks of Texas Instruments Incorporated. Copyright 1996, Texas Instruments Incorporated UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 54ACT16825, 74ACT16825 18-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCAS155B – JANUARY 1991 – REVISED APRIL 1996 logic symbol† 1 & 1OE1 1OE2 EN1 56 28 2OE1 2OE2 1A1 1A2 1A3 1A4 1A5 1A6 1A7 1A8 1A9 2A1 2A2 2A2 2A3 2A4 2A5 2A6 2A7 2A8 & 29 EN2 55 2 1 54 3 52 5 51 6 49 8 48 9 47 10 45 12 44 13 41 16 2 40 17 38 19 37 20 36 21 34 23 33 24 31 26 30 27 1Y1 1Y2 1Y3 1Y4 1Y5 1Y6 1Y7 1Y8 1Y9 2Y1 2Y2 2Y3 2Y4 2Y5 2Y6 2Y7 2Y8 2Y9 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. logic diagram (positive logic) 1OE1 1OE2 1A1 1 2OE1 56 2OE2 2 55 1Y1 2A1 28 29 41 To Eight Other Channels To Eight Other Channels 2 POST OFFICE BOX 655303 16 • DALLAS, TEXAS 75265 2Y1 54ACT16825, 74ACT16825 18-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCAS155B – JANUARY 1991 – REVISED APRIL 1996 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±450 mA Maximum package power dissipation at TA = 55°C (in still air) (see Note 2): DL package . . . . . . . . . . . 1.4 W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The maximum package power dissipation is calculated using a junction temperature of 150_C and a board trace length of 750 mils. recommended operating conditions (see Note 3) 54ACT16825 NOM MAX MIN NOM MAX 4.5 5 5.5 4.5 5 5.5 VCC VIH Supply voltage VIL VI Low-level input voltage Input voltage 0 VO IOH Output voltage 0 High-level output current IOL ∆t/∆v Low-level output current High-level input voltage 74ACT16825 MIN 2 2 0.8 Input transition rise or fall rate TA Operating free-air temperature NOTE 3: Unused inputs must be held high or low to prevent them from floating. UNIT V V 0.8 V VCC VCC V –24 –24 mA 24 24 mA VCC VCC 0 0 V 0 10 0 10 ns/V –55 125 –40 85 °C PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 54ACT16825, 74ACT16825 18-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCAS155B – JANUARY 1991 – REVISED APRIL 1996 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC 4.5 V IOH = –50 50 µA VOH 24 mA IOH = –24 IOH = –75 mA† II IOZ ICC TA = 25°C TYP MAX IOL = 75 mA† VI = VCC or GND VO = VCC or GND VI = VCC or GND, MIN ∆ICC‡ One input at 3.4 V, Other inputs at VCC or GND Ci VI = VCC or GND VO = VCC or GND 74ACT16825 MIN 4.4 5.5 V 5.4 5.4 5.4 4.5 V 3.94 3.8 3.8 5.5 V 4.94 4.8 4.8 3.85 3.85 0.1 0.1 MAX UNIT V 0.1 5.5 V 0.1 0.1 0.1 4.5 V 0.36 0.44 0.44 5.5 V 0.36 0.44 0.44 1.65 1.65 ±1 ±1 µA 5.5 V IO = 0 MAX 4.4 4.5 V IOL = 24 mA 54ACT16825 4.4 5.5 V IOL = 50 µA VOL MIN V 5.5 V ±0.1 5.5 V ±0.5 ±5 ±5 µA 5.5 V 8 80 80 µA 5.5 V 0.9 1 1 mA 5V 4 pF Co 5V 16 † Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms. ‡ This is the increase in supply current for each input that is at one of the specified TTL voltage levels rather than 0 V or VCC. pF switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A Y tPZH tPZL OE Y tPHZ tPLZ OE Y MIN TA = 25°C TYP MAX 54ACT16825 74ACT16825 MIN MAX MIN MAX 4.1 7.5 9.3 4.1 10.5 4.1 10.5 3.1 7.5 9.6 3.1 10.3 3.1 10.3 3.3 7.9 9.9 3.3 11 3.3 11 4.1 9.5 12.1 4.1 13.2 4.1 13.2 5.7 9 10.8 5.7 11.5 5.7 11.5 5.5 8.5 10 5.5 10.6 5.5 10.6 UNIT ns ns ns operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd d TEST CONDITIONS Outputs enabled Power dissipation capacitance Outputs disabled PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 pF CL = 50 pF, f = 1 MHz TYP 42 12 UNIT pF 54ACT16825, 74ACT16825 18-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCAS155B – JANUARY 1991 – REVISED APRIL 1996 PARAMETER MEASUREMENT INFORMATION 2 × VCC S1 500 Ω From Output Under Test Open GND CL = 50 pF (see Note A) TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 2 × VCC GND 500 Ω LOAD CIRCUIT Output Control (low-level enabling) 3V Input 1.5 V 1.5 V 0V tPHL tPLH In-Phase Output 50% VCC 50% VCC 0V tPZL VOH 50% VCC VOL Output Waveform 2 S1 at GND (see Note B) [ VCC tPLZ Output Waveform 1 S1 at 2 × VCC (see Note B) tPLH tPHL Out-of-Phase Output VOH 50% VCC VOL 3V 1.5 V 1.5 V 50% VCC VOL tPHZ tPZH VOLTAGE WAVEFORMS 20% VCC 50% VCC 80% VCC VOH [0V VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns. D. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 24-Feb-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74ACT16825DL ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ACT16825DLG4 ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ACT16825DLR ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ACT16825DLRG4 ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0°–ā8° 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Telephony www.ti.com/telephony Low Power Wireless www.ti.com/lpw Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated