SN74ALVC16244A 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCAS250O – JANUARY 1993 – REVISED OCTOBER 2005 FEATURES • • • • • • DGG OR DL PACKAGE (TOP VIEW) Member of the Texas Instruments Widebus™ Family Operates From 1.65 V to 3.6 V Max tpd of 3 ns at 3.3 V ±24-mA Output Drive at 3.3 V Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) 1OE 1Y1 1Y2 GND 1Y3 1Y4 VCC 2Y1 2Y2 GND 2Y3 2Y4 3Y1 3Y2 GND 3Y3 3Y4 VCC 4Y1 4Y2 GND 4Y3 4Y4 4OE DESCRIPTION/ORDERING INFORMATION This 16-bit buffer/driver is designed for 1.65-V to 3.6-V VCC operation. The SN74ALVC16244A is designed specifically to improve the performance and density of 3-state memory-address drivers, clock drivers, and bus-oriented receivers and transmitters. The device can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. It provides true outputs and symmetrical active-low output-enable (OE) inputs. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. 1 48 2 47 3 46 4 45 5 44 6 43 7 42 8 41 9 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 32 18 31 19 30 20 29 21 28 22 27 23 26 24 25 2OE 1A1 1A2 GND 1A3 1A4 VCC 2A1 2A2 GND 2A3 2A4 3A1 3A2 GND 3A3 3A4 VCC 4A1 4A2 GND 4A3 4A4 3OE ORDERING INFORMATION PACKAGE (1) TA FBGA – GRD FBGA – ZRD (Pb-free) SSOP – DL –40°C to 85°C TSSOP – DGG VFBGA – GQL VFBGA – ZQL (Pb-free) (1) ORDERABLE PART NUMBER Tape and reel SN74ALVC16244AGRDR SN74ALVC16244AZRDR Tube SN74ALVC16244ADL Tape and reel SN74ALVC16244ADLR Tape and reel Tape and reel SN74ALVC16244ADGGR SN74ALVC16244ADGGRE4 SN74ALVC16244AGQLR SN74ALVC16244AZQLR TOP-SIDE MARKING VC244A ALVC16244A ALVC16244A VC244A Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1993–2005, Texas Instruments Incorporated SN74ALVC16244A 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCAS250O – JANUARY 1993 – REVISED OCTOBER 2005 TERMINAL ASSIGNMENTS (1) (56-Ball GQL/ZQL Package) GQL OR ZQL PACKAGE (TOP VIEW) 1 2 3 4 5 6 A B C D E F G H J K 1 2 3 4 5 6 A 1OE NC NC NC NC 2OE B 1Y2 1Y1 GND GND 1A1 1A2 C 1Y4 1Y3 VCC VCC 1A3 1A4 D 2Y2 2Y1 GND GND 2A1 2A2 E 2Y4 2Y3 2A3 2A4 F 3Y1 3Y2 3A2 3A1 G 3Y3 3Y4 GND GND 3A4 3A3 H 4Y1 4Y2 VCC VCC 4A2 4A1 J 4Y3 4Y4 GND GND 4A4 4A3 K 4OE NC NC NC NC 3OE ABC (1) ABC NC – No internal connection GRD OR ZRD PACKAGE (TOP VIEW) 1 2 3 4 5 6 TERMINAL ASSIGNMENTS (1) (54-Ball GRD/ZRD Package) A B C D E F G 1 2 3 4 5 6 A 1Y1 NC 1OE 2OE NC 1A1 B 1Y3 1Y2 NC NC 1A2 1A3 C 2Y1 1Y4 VCC VCC 1A4 2A1 D 2Y3 2Y2 GND GND 2A2 2A3 E 3Y1 2Y4 GND GND 2A4 3A1 F 3Y3 3Y2 GND GND 3A2 3A3 G 4Y1 3Y4 VCC VCC 3A4 4A1 H 4Y3 4Y2 NC NC 4A2 4A3 J 4Y4 NC 4OE 3OE NC 4A4 H J (1) NC – No internal connection xxxxx FUNCTION TABLE (EACH 4-BIT BUFFER) INPUTS 2 OUTPUT Y OE A L H H L L L H X Z SN74ALVC16244A 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCAS250O – JANUARY 1993 – REVISED OCTOBER 2005 LOGIC DIAGRAM (POSITIVE LOGIC) 1OE 1A1 1A2 1A3 1A4 2OE 2A1 2A2 2A3 2A4 1 3OE 47 2 46 3 44 5 43 6 1Y1 3A1 1Y2 3A2 1Y3 3A3 1Y4 3A4 48 4OE 41 8 40 9 38 11 37 12 2Y1 4A1 2Y2 4A2 2Y3 4A3 2Y4 4A4 25 36 13 35 14 33 16 32 17 3Y1 3Y2 3Y3 3Y4 24 30 19 29 20 27 22 26 23 4Y1 4Y2 4Y3 4Y4 Pin numbers shown are for the DGG and DL packages. Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) VCC VI Supply voltage range Input voltage range (2) Control Inputs (3) Data Inputs MIN MAX –0.5 4.6 UNIT V –0.5 VCC + 0.5 V -0.5 4.6 –0.5 VCC + 0.5 VO Output voltage range (2) (3) IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA ±100 mA Continuous current through each VCC or GND θJA Package thermal impedance (4) Tstg Storage temperature range DGG package 70 DL package 63 GQL/ZQL package 42 GRD/ZRD package (1) (2) (3) (4) V °C/W 36 –65 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. This value is limited to 4.6 V maximum. The package thermal impedance is calculated in accordance with JESD 51-7. 3 SN74ALVC16244A 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCAS250O – JANUARY 1993 – REVISED OCTOBER 2005 Recommended Operating Conditions (1) VCC Supply voltage VCC = 1.65 V to 1.95 V VIH High-level input voltage MIN MAX 1.65 3.6 Low-level input voltage VCC = 2.3 V to 2.7 V 1.7 VCC = 2.7 V to 3.6 V 2 V 0.35 × VCC VCC = 2.3 V to 2.7 V 0.7 VCC = 2.7 V to 3.6 V VI Input voltage VO Output voltage IOH High-level output current IOL Low-level output current ∆t/∆v Input transition rise or fall rate TA Operating free-air temperature (1) V 0.65 × VCC VCC = 1.65 V to 1.95 V VIL UNIT V 0.8 Control Inputs 0 VCC Data Inputs 0 3.6 0 VCC VCC = 1.65 V –4 VCC = 2.3 V –12 VCC = 2.7 V –12 VCC = 3 V –24 VCC = 1.65 V 4 VCC = 2.3 V 12 VCC = 2.7 V 12 VCC = 3 V 24 –40 V V mA mA 10 ns/V 85 °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = –100 µA 1.65 V to 3.6 V MIN TYP (1) 1.65 V IOH = –6 mA 2.3 V 2 2.3 V 1.7 2.7 V 2.2 IOH = –12 mA MAX 1.2 V 3V 2.4 IOH = –24 mA 3V 2 IOL = 100 µA 1.65 V to 3.6 V 0.2 IOL = 4 mA 1.65 V 0.45 IOL = 6 mA 2.3 V 0.4 2.3 V 0.7 2.7 V 0.4 3V 0.55 IOL = 12 mA IOL = 24 mA UNIT VCC – 0.2 IOH = –4 mA VOH VOL VCC V II VI = VCC or GND 3.6 V ±5 µA IOZ VO = VCC or GND 3.6 V ±10 µA ICC VI = VCC or GND, IO = 0 3.6 V 40 µA One input at VCC – 0.6 V, Other inputs at VCC or GND 3 V to 3.6 V 750 µA ∆ICC Ci (1) 4 Control inputs Data inputs VI = VCC or GND All typical values are at VCC = 3.3 V, TA = 25°C. 3.3 V 3 6 pF SN74ALVC16244A 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCAS250O – JANUARY 1993 – REVISED OCTOBER 2005 Electrical Characteristics (continued) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER Co Outputs TEST CONDITIONS MIN TYP (1) VCC VO = VCC or GND 3.3 V MAX UNIT 7 pF Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) (1) VCC = 2.5 V ± 0.2 V TO (OUTPUT) VCC = 1.8 V tpd A Y (1) 1 3.7 3.6 1 3 ns ten OE Y (1) 1 5.7 5.4 1 4.4 ns tdis OE Y (1) 1 5.2 4.6 1 4.1 ns TYP MIN MAX VCC = 2.7 V VCC = 3.3 V ± 0.3 V FROM (INPUT) PARAMETER MIN MAX UNIT MIN MAX This information was not available at the time of publication. Operating Characteristics TA = 25°C PARAMETER Cpd (1) Power dissipation capacitance Outputs enabled Outputs disabled TEST CONDITIONS CL = 50 pF, f = 10 MHz VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V TYP TYP TYP (1) 16 19 (1) 4 5 UNIT pF This information was not available at the time of publication. 5 SN74ALVC16244A 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCAS250O – JANUARY 1993 – REVISED OCTOBER 2005 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test Open GND CL (see Note A) RL TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUT VCC 1.8 V 2.5 V ± 0.2 V 2.7 V 3.3 V ± 0.3 V VI tr/tf VCC VCC 2.7 V 2.7 V ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 ns VM VLOAD CL RL V∆ VCC/2 VCC/2 1.5 V 1.5 V 2 × VCC 2 × VCC 6V 6V 30 pF 30 pF 50 pF 50 pF 1 kΩ 500 Ω 500 Ω 500 Ω 0.15 V 0.15 V 0.3 V 0.3 V tw VI Timing Input VM VM VM 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VM VM 0V tPLH Output Control (low-level enabling) tPLZ VLOAD/2 VM tPZH VOH VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPHL VM VI VM tPZL VI Input VOLTAGE WAVEFORMS PULSE DURATION th VI Data Input VM 0V 0V tsu Output VI VM Input Output Waveform 2 S1 at GND (see Note B) VOL + V∆ VOL tPHZ VOH VM VOH − V∆ 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 6 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74ALVC16244ADGGRE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVC16244ADLRG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC16244ADGGR ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC16244ADL ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC16244ADLG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC16244ADLR ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVC16244AGQLR ACTIVE BGA MI CROSTA R JUNI OR GQL 56 1000 TBD SNPB Level-1-240C-UNLIM SN74ALVC16244AGRDR ACTIVE BGA MI CROSTA R JUNI OR GRD 54 1000 TBD SNPB Level-1-240C-UNLIM SN74ALVC16244AZQLR ACTIVE BGA MI CROSTA R JUNI OR ZQL 56 1000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0°–ā8° 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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