Product Specification – Mar. 24, 2004 V.4 Supersedes Date of Feb. 10, 2004 DATA SHEET CHIP RESISTORS ARRAY TC164 (8Pin/4R) 5% 2 Chip Resistor Surface Mount TC SERIES 7 164 SCOPE This specification describes TC164 series chip resistors made by thick film process. ORDERING INFORMATION Part number is identified by the series, size, tolerance, packing style, temperature coefficient, special type and resistance value. TC164 – X X X XX XXXX (1) (2) (3) (4) (5) MARKING TC164 (1) TOLERANCE First two digits for significant figure and 3rd digit for number of zeros J = ±5% YNSC020 (2) PACKAGING TYPE Letter R: decimal place Fig. 1 5% Marking, Value=56Ω R = Paper taping reel (3) TEMPERATURE CHARACTERISTIC OF RESISTANCE G = ±200ppm/°C – = Base on spec DIMENSION Table 1 Concave termination TYPE T a B W1 (4) SPECIAL TYPE W2 07 = 7 inch dia. Reel 13 = 13 inch dia. Reel P L a (5) RESISTANCE VALUE: 56R, 560R, 5K6, 56K, 1M. TC164 B (mm) 0.3±0.15 H (mm) 0.5±0.15 P (mm) 0.8±0.05 L (mm) 3.2±0.20 T (mm) 0.6±0.1 W1 (mm) 0.3±0.15 W2 (mm) 1.6±0.15 YNSC021 H Fig. 2 TC164 series chip resistors construction SCHEMATIC For dimension see Fig. 2 and Table 1 8 7 R1 6 R2 5 R3 R4 YNSC022 1 Fig. 3 Equivalent circuit diagram 2 3 4 R1=R2=R3=R4 www.yageo.com Mar. 24, 2004 V.4 3 Chip Resistor Surface Mount POWER RATING TC SERIES 7 164 ELECTRICAL CHARACTERISTICS RATED POWER AT 70°C, TC164 =1/16W FOR ELEMENT MRA632 Pmax (%Prated) 100 50 Table 2 CHARACTERISTICS Operating Temperature Range TC164 1/16W –55°C to +155°C Maximum Working Voltage 50V Maximum Overload Voltage 100V Dielectric Withstanding Voltage 100V Number of Resistors 0 −55 0 50 70 155 100 Tamb (°C) Resistance Range Temperature Coefficient Fig. 4 Maximum dissipation (Pmax) in percentage of rated power as a function of the operating ambient temperature (Tamb) Jumper Criteria 4 10Ω to 1MΩ Zero Ohm Jumper <0.05Ω ±200ppm/°C Rated Current 1.0A Maximum Current 2.0A RATED VOLTAGE: The DC or AC (rms) continuous working voltage corresponding to the rated power is determined by the following formula: V=√(P X R) Where V=Continuous rated DC or AC (rms) working voltage (V) P=Rated power (W) R=Resistance value (X) www.yageo.com Mar. 24, 2004 V.4 4 Chip Resistor Surface Mount TC SERIES 7 164 TAPING REEL Table 3 DIMENSION For dimension see Table 3 TC164 Tape Width T gewidth 8mm ØA (mm) 180+0/–3 ØB (mm) 60+1/–0 ØC (mm) 13.0±0.2 ØD (mm) 21±0.8 W (mm) 9.0±0.3 T (mm) 11.4±1 C D Fig. 5 Reel dimension B A MSA284_b W PAPER TAPE SPECIFICATION Table 4 DIMENSION TC164 A (mm) 2.0±0.1 B (mm) 3.5±0.1 W (mm) 8.0±0.2 E (mm) 1.75±0.1 F (mm) 3.5±0.05 P0 (mm) 4.0±0.1 P1 (mm) 4.0±0.1 P2 (mm) 2.0±0.05 ØD0 (mm) T (mm) P0 T P2 D0 E F cover tape W B A MBD123_a P1 1.5+0.1/–0 Fig.6 0.85±0.1 Paper tape dimension For dimension see Table 4 PACKING METHOD LEADER/TRAILER TAPE SPECIFICATION leader end empty compartments with cover tape (min. 240 mm) trailer end trailer (max. 260 mm) leader ≥400 mm cover tape only CCB325 Fig. 7 Leader and trailer tape dimension Table 5 Packing style and packaging quantity PACKING STYLE Paper Taping Reel (R) REEL DIMENSION TC164 7" (178 mm) 5,000 13" (330 mm) 20,000 www.yageo.com Mar. 24, 2004 V.4 5 Chip Resistor Surface Mount TYPE TC SERIES 7 164 TEST METHOD Temperature Coefficient of Resistance (T.C.R.) Measure resistance at +25°C or specified room temperature as R1, then measure at –55°C or +155°C respectively as R2. Determine the temperature coefficient of resistance from the following formula: Thermal Shock ACCEPTANCE STANDARD Formula Refer to table 2 R2–R1 T.C.R. = ------------------------- ×106 (ppm/°C) R1(t2–t1) Where t1=+25°C or specified room temperature t2=–55°C or +155°C test temperature R1=resistance at reference temperature in ohms R2=resistance at test temperature in ohms At –55±3°C for 2 minutes and at +155±2°C for 2 minutes as one cycle. After 5 cycles, the specimen shall be stabilized at room temp. ±(1.0%+0.05Ω) Measure the resistance to determine ΔR/R(%) after one more hour. Low Temperature Operation Place the specimen in a test chamber maintained at –65 (+0/–5)°C. After one hour stabilization at this temperature, full rated working voltage shall be applied for 45 (+5/–0) minutes. Have15 (+5/–0 ) minutes after remove the voltage, the specimen shall be removed from the chamber and stabilized at room temperature for 24 hrs. ±(1.0%+0.05Ω) No visible damage Measure the resistance to determine ΔR/R(%). Short Time Overload Apply 2.5 times of rated voltage but not exceeding the maximum overload voltage for 5 seconds. Have the specimen stabilized at room temperature for 30 minutes minimum. ±(2.0%+0.05Ω) No visible damage Measure the resistance to determine ΔR/R(%). Insulation Resistance Place the specimen in the jig and apply a rated continues overload voltage (R.C.O.V) for one minute as shown. Type Voltage (DC) TC164 ≥10,000MΩ 100V Measure the insulation resistance. Dielectric Withstand Voltage Resistance To Soldering Heat Place the specimen in the jig and apply a specified value continuous overload voltage as shown for one minute. Type Voltage (AC) TC164 100Vrms Immerse the specimen in the solder pot at 260±5°C. for 10±1 seconds. Have the specimen stabilized at room temperature for 30 minutes minimum. Breakdown voltage> specification and without open/short ±(1.0%+0.05Ω) No visible damage Measure the resistance to determine ΔR/R(%). www.yageo.com Mar. 24, 2004 V.4 6 Chip Resistor Surface Mount TYPE Moisture Resistance TC SERIES 7 164 TEST METHOD ACCEPTANCE STANDARD Place the specimen in the test chamber and subject to 42 damp heat cycles. Each one of which consists of the steps 1 to 7 as figure 9. The total length of test is 1,000 hours. Have the specimen stabilized at room temperature for 24 hours after testing. No visible damage ±(2.0%+0.05Ω) Measure the resistance to determine ΔR/R(%). Life Place the specimen in the oven at 70±2°C. Apply the rated voltage to the specimen at the 1.5 hours on and 0.5 hour off cycle. The total length of test is 1,000 hours. Have the specimen stabilized at room temperature for one hour minimum after testing. ±(3.0%+0.1Ω) No visible damage Measure the ΔR/R(%). Solderability Bending Strength Immerse the specimen in the solder pot at 235±5°C for 5 sec. Mount the specimen on a test board as shown in the figure 8. Slowly apply the force till the board is bent for 5±1 sec. Type Bent Distance (d) At least 95% solder coverage on the termination TC164 1mm ±(1.0%+0.05Ω) No visible damage Measure the ΔR/R(%) at this position. Fig. 8 Principle of the bending test www.yageo.com Mar. 24, 2004 V.4 7 Chip Resistor Surface Mount 75 TC 80 − 98% RH 90 − 98% RH temperature [°C] SERIES 7 164 90 − 98% RH 80 − 98% RH 90 − 98% RH initial drying 24 hours rate of change of temperature is unspecified, however, specimens shall not be subjected to radiant heating from chamber conditioning processes 50 end of final cycle; measurements as specified in 2.7 +10 °C (+18 °F) −2 °C (−3.6 °F) 25 initial measurements as specified in 2.2 0 temperature tolerance ±2 °C (±3.6 °F) unless otherwise specified voltage applied as specified in 2.4 STEP1 STEP2 prior to first cycle only HBK073 optional sub-cycle if specified (2.3); sub-cycle performed during any 5 of the first 9 cycles; humidity uncontrolled during sub-cycle circulation of conditioning air shall be at a minimum cubic rate per minute equivalent to 10 times the volume of the chamber STEP3 STEP4 STEP5 STEP6 STEP7 one cycle 24 hours; repeat as specified in 2.5 0 5 10 15 20 25 time [h] Fig. 9 Conditions by change of temperature www.yageo.com Mar. 24, 2004 V.4