ETC TC164-JRG0756K

Product Specification – Mar. 24, 2004 V.4
Supersedes Date of Feb. 10, 2004
DATA SHEET
CHIP RESISTORS ARRAY
TC164 (8Pin/4R)
5%
2
Chip Resistor Surface Mount
TC
SERIES
7
164
SCOPE
This specification describes TC164 series chip resistors made by thick film process.
ORDERING INFORMATION
Part number is identified by the series, size, tolerance, packing style, temperature coefficient, special type and
resistance value.
TC164 – X X X XX XXXX
(1) (2) (3)
(4)
(5)
MARKING
TC164
(1) TOLERANCE
First two digits for significant figure and
3rd digit for number of zeros
J = ±5%
YNSC020
(2) PACKAGING TYPE
Letter R: decimal place
Fig. 1 5% Marking, Value=56Ω
R = Paper taping reel
(3) TEMPERATURE
CHARACTERISTIC OF
RESISTANCE
G = ±200ppm/°C
– = Base on spec
DIMENSION
Table 1
Concave termination
TYPE
T
a
B
W1
(4) SPECIAL TYPE
W2
07 = 7 inch dia. Reel
13 = 13 inch dia. Reel
P
L
a
(5) RESISTANCE VALUE:
56R, 560R, 5K6, 56K, 1M.
TC164
B (mm)
0.3±0.15
H (mm)
0.5±0.15
P (mm)
0.8±0.05
L (mm)
3.2±0.20
T (mm)
0.6±0.1
W1 (mm)
0.3±0.15
W2 (mm)
1.6±0.15
YNSC021
H
Fig. 2 TC164 series chip resistors construction
SCHEMATIC
For dimension see Fig. 2 and Table 1
8
7
R1
6
R2
5
R3
R4
YNSC022
1
Fig. 3 Equivalent circuit diagram
2
3
4
R1=R2=R3=R4
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Mar. 24, 2004 V.4
3
Chip Resistor Surface Mount
POWER RATING
TC
SERIES
7
164
ELECTRICAL CHARACTERISTICS
RATED POWER AT 70°C,
TC164 =1/16W FOR ELEMENT
MRA632
Pmax
(%Prated)
100
50
Table 2
CHARACTERISTICS
Operating Temperature Range
TC164 1/16W
–55°C to +155°C
Maximum Working Voltage
50V
Maximum Overload Voltage
100V
Dielectric Withstanding Voltage
100V
Number of Resistors
0
−55
0
50 70
155
100
Tamb (°C)
Resistance Range
Temperature Coefficient
Fig. 4 Maximum dissipation (Pmax) in
percentage of rated power as
a function of the operating
ambient temperature (Tamb)
Jumper Criteria
4
10Ω to 1MΩ
Zero Ohm Jumper <0.05Ω
±200ppm/°C
Rated Current
1.0A
Maximum Current
2.0A
RATED VOLTAGE:
The DC or AC (rms) continuous
working voltage corresponding to
the rated power is determined by
the following formula:
V=√(P X R)
Where
V=Continuous rated DC
or AC (rms) working voltage (V)
P=Rated power (W)
R=Resistance value (X)
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Mar. 24, 2004 V.4
4
Chip Resistor Surface Mount
TC
SERIES
7
164
TAPING REEL
Table 3
DIMENSION
For dimension see Table 3
TC164
Tape Width
T
gewidth
8mm
ØA (mm)
180+0/–3
ØB (mm)
60+1/–0
ØC (mm)
13.0±0.2
ØD (mm)
21±0.8
W (mm)
9.0±0.3
T (mm)
11.4±1
C
D
Fig. 5 Reel dimension
B
A
MSA284_b
W
PAPER TAPE SPECIFICATION
Table 4
DIMENSION
TC164
A (mm)
2.0±0.1
B (mm)
3.5±0.1
W (mm)
8.0±0.2
E (mm)
1.75±0.1
F (mm)
3.5±0.05
P0 (mm)
4.0±0.1
P1 (mm)
4.0±0.1
P2 (mm)
2.0±0.05
ØD0 (mm)
T (mm)
P0
T
P2
D0
E
F
cover tape
W
B
A
MBD123_a
P1
1.5+0.1/–0
Fig.6
0.85±0.1
Paper tape dimension
For dimension see Table 4
PACKING METHOD
LEADER/TRAILER TAPE SPECIFICATION
leader end
empty compartments
with cover tape
(min. 240 mm)
trailer end
trailer (max. 260 mm)
leader ≥400 mm
cover tape only
CCB325
Fig. 7 Leader and trailer tape dimension
Table 5 Packing style and packaging quantity
PACKING STYLE
Paper Taping Reel (R)
REEL DIMENSION
TC164
7" (178 mm)
5,000
13" (330 mm)
20,000
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Mar. 24, 2004 V.4
5
Chip Resistor Surface Mount
TYPE
TC
SERIES
7
164
TEST METHOD
Temperature
Coefficient of
Resistance
(T.C.R.)
Measure resistance at
+25°C or specified room
temperature as R1, then
measure at –55°C or
+155°C respectively as R2.
Determine the
temperature coefficient of
resistance from the
following formula:
Thermal
Shock
ACCEPTANCE STANDARD
Formula
Refer to table 2
R2–R1
T.C.R. = ------------------------- ×106 (ppm/°C)
R1(t2–t1)
Where
t1=+25°C or specified room temperature
t2=–55°C or +155°C test temperature
R1=resistance at reference temperature in ohms
R2=resistance at test temperature in ohms
At –55±3°C for 2 minutes and at +155±2°C for 2 minutes as one cycle. After 5
cycles, the specimen shall be stabilized at room temp.
±(1.0%+0.05Ω)
Measure the resistance to determine ΔR/R(%) after one more hour.
Low
Temperature
Operation
Place the specimen in a test chamber maintained at –65 (+0/–5)°C. After one hour
stabilization at this temperature, full rated working voltage shall be applied for 45
(+5/–0) minutes. Have15 (+5/–0 ) minutes after remove the voltage, the specimen
shall be removed from the chamber and stabilized at room temperature for 24 hrs.
±(1.0%+0.05Ω)
No visible damage
Measure the resistance to determine ΔR/R(%).
Short
Time
Overload
Apply 2.5 times of rated voltage but not exceeding the maximum overload voltage
for 5 seconds. Have the specimen stabilized at room temperature for 30 minutes
minimum.
±(2.0%+0.05Ω)
No visible damage
Measure the resistance to determine ΔR/R(%).
Insulation
Resistance
Place the specimen in the jig and apply a rated
continues overload voltage (R.C.O.V) for one
minute as shown.
Type
Voltage (DC)
TC164
≥10,000MΩ
100V
Measure the insulation resistance.
Dielectric
Withstand
Voltage
Resistance
To Soldering
Heat
Place the specimen in the jig and apply a
specified value continuous overload voltage as
shown for one minute.
Type
Voltage (AC)
TC164
100Vrms
Immerse the specimen in the solder pot at 260±5°C. for 10±1 seconds. Have the
specimen stabilized at room temperature for 30 minutes minimum.
Breakdown voltage>
specification and without
open/short
±(1.0%+0.05Ω)
No visible damage
Measure the resistance to determine ΔR/R(%).
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Mar. 24, 2004 V.4
6
Chip Resistor Surface Mount
TYPE
Moisture
Resistance
TC
SERIES
7
164
TEST METHOD
ACCEPTANCE STANDARD
Place the specimen in the test chamber and subject to 42 damp heat cycles. Each
one of which consists of the steps 1 to 7 as figure 9. The total length of test is 1,000
hours. Have the specimen stabilized at room temperature for 24 hours after testing.
No visible damage
±(2.0%+0.05Ω)
Measure the resistance to determine ΔR/R(%).
Life
Place the specimen in the oven at 70±2°C. Apply the rated voltage to the specimen
at the 1.5 hours on and 0.5 hour off cycle. The total length of test is 1,000 hours.
Have the specimen stabilized at room temperature for one hour minimum after
testing.
±(3.0%+0.1Ω)
No visible damage
Measure the ΔR/R(%).
Solderability
Bending
Strength
Immerse the specimen in the solder pot at 235±5°C for 5 sec.
Mount the specimen on a test board as
shown in the figure 8. Slowly apply the force
till the board is bent for 5±1 sec.
Type
Bent Distance (d)
At least 95% solder coverage on
the termination
TC164
1mm
±(1.0%+0.05Ω)
No visible damage
Measure the ΔR/R(%) at this position.
Fig. 8 Principle of the bending
test
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Mar. 24, 2004 V.4
7
Chip Resistor Surface Mount
75
TC
80 − 98%
RH
90 − 98% RH
temperature
[°C]
SERIES
7
164
90 − 98% RH
80 − 98%
RH
90 − 98% RH
initial drying
24 hours
rate of change of temperature is unspecified,
however, specimens shall not be subjected to
radiant heating from chamber conditioning processes
50
end of final cycle;
measurements
as specified in 2.7
+10 °C (+18 °F)
−2 °C (−3.6 °F)
25
initial measurements
as specified in 2.2
0
temperature
tolerance
±2 °C (±3.6 °F)
unless otherwise
specified
voltage applied as specified in 2.4
STEP1
STEP2
prior to first
cycle only
HBK073
optional sub-cycle if specified
(2.3); sub-cycle performed during
any 5 of the first 9 cycles; humidity
uncontrolled during sub-cycle
circulation of conditioning air shall be at a
minimum cubic rate per minute equivalent to
10 times the volume of the chamber
STEP3
STEP4
STEP5
STEP6
STEP7
one cycle 24 hours; repeat as specified in 2.5
0
5
10
15
20
25
time [h]
Fig. 9
Conditions by change of temperature
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