TI TS5A3357DCUT

W www.ti.com
SCDS177 – OCTOBER 2004
DESCRIPTION
The TS5A3357 is a high-performance, single-pole triple
throw (SP3T) analog switch that is designed to operate
from 1.65 V to 5.5 V. The device offers a low ON-state
resistance and low input/output capacitance and, thus,
causes a very low signal distortion. The
break-before-make feature allows transferring of a
signal from one port to another, with a minimal signal
distortion. This device also offers a low charge injection
which makes this device suitable for high-performance
audio and data acquisition systems.
FEATURES
D Specified Break-Before-Make Switching
D Low ON-State Resistance
D High Bandwidth
D Control Inputs are 5.5-V Tolerant
D Low Charge-Injection
D Excellent ON-State Resistance Matching
D Low Total Harmonic Distortion
D 1.65-V to 5.5-V Single-Supply Operation
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
APPLICATIONS
D ESD Performance Tested Per JESD 22
D Cell Phones
D PDAs
D Portable Instrumentation
− 2000-V Human-Body Model
(A114-B, Class II)
− 1000-V Charged-Device Model (C101)
SUMMARY OF CHARACTERISTICS
(V+ = 5 V AND TA = 25 °C)
SSOP OR VSSOP PACKAGE
(TOP VIEW)
TS5A3357
NO0
1
8 V+
NO1
2
7
COM
NO2
3
6
IN1
GND
4
5
IN2
Logic
Control
FUNCTION TABLE
IN1
IN2
COM TO NO0
COM TO NO1
COM TO NO2
L
L
OFF
OFF
OFF
H
L
ON
OFF
OFF
L
H
OFF
ON
OFF
H
H
OFF
OFF
ON
Configuration
3:1 Multiplexer/Demultiplexer
(1 × SP3T)
Number of Channels
1
ron
∆ron
5Ω
ron(flat)
tON/tOFF
6.5 Ω
tBBM
Charge-Injection
0.5 ns
Bandwidth
334 MHz
Off-Isolation
−82 dB at 10 MHz
Crosstalk
−62 dB at 10 MHz
Total Harmonic Distortion
0.05%
ICOM(OFF)
Package Option
±1 µA
0.1 Ω
6.5 ns/3.7 ns
3.4 pC
8 Pin DCT (SM8) or DCU
(US8)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
!"#$ % &'!!($ #% )'*+&#$ ,#$( !,'&$%
&!" $ %)(&&#$% )(! $-( $(!"% (.#% %$!'"($% %$#,#!, /#!!#$0
!,'&$ )!&(%%1 ,(% $ (&(%%#!+0 &+',( $(%$1 #++ )#!#"($(!%
Copyright  2004, Texas Instruments Incorporated
W www.ti.com
SCDS177 – OCTOBER 2004
ORDERING INFORMATION
−40°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE(1)
TA
TOP-SIDE
MARKING(2)
SSOP − DCT
Tape and reel
TS5A3357DCTR
JA9_ _ _
VSSOP − DCU
Tape and reel
TS5A3357DCUR
JA9_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and
one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb, • = Pb-free).
Absolute Minimum and Maximum Ratings(1)(2)
over operating free-air temperature range (unless otherwise noted)
V+
VNO
VCOM
IK
INO
ICOM
VI
IIK
I+
IGND
MIN
MAX
Supply voltage range(3)
−0.5
6.5
V
Analog voltage range(3)(4)(5)
−0.5
V+ + 0.5
V
−50
50
mA
−100
100
mA
−0.5
6.5
Analog port diode current
VNO, VCOM < 0 or VNO, VCOM > V+
On-state switch current
VNO, VCOM = 0 to V+
Digital input voltage range(3)(4)
Digital input clamp current
Continuous current through V+ or GND
VI < 0
−50
−100
UNIT
V
mA
100
mA
θJA
Package thermal impedance(6)
165
°C/W
Tstg
Storage temperature range
−65
150
°C
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified
is not implied.
(2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
(3) All voltages are with respect to ground unless otherwise specified.
(4) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(5) This value is limited to 5.5 V maximum.
(6) The package thermal impedance is calculated in accordance with JESD 51-7.
2
W www.ti.com
SCDS177 – OCTOBER 2004
ELECTRICAL CHARACTERISTICS FOR 5 V SUPPLY
(V+ = 4.5 V TO 5.5 V AND TA = −40 °C TO 85 °C) (UNLESS OTHERWISE NOTED)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
V+
MIN TYP(1)
MAX
UNIT
ANALOG SWITCH
Analog Signal Range
Peak On-Resistance
VCOM, VNO
rpeak
0
0 ≤ VNO ≤ V+, ICOM = −30 mA,
Switch ON,
see Figure 12
ron
VNO = 2.4 V, ICOM = −30 mA
4.5 V
25 °C
VNO = 0, ICOM = 30 mA
On-Resistance
Full
25 °C
Full
15
Ω
7
6
12
7
4.5 V
12
25 °C
VNO = 4.5 V, ICOM = −30 mA
V
5
Full
Switch ON,
see Figure 12
V+
7
Full
Ω
15
15
On-Resistance
match between
channels
∆ron
VNO = 3.15 V, ICOM = −30 mA,
Switch ON,
see Figure 12
25 °C
4.5 V
0.1
Ω
On-Resistance
flatness
ron(flat)
0 ≤ VNO ≤ V+,
ICOM = −30 mA
Switch ON,
see Figure 12
25 °C
5V
6.5
Ω
NO Off-Leakage
Current
INO(OFF)
VNO = 0 to V+, VCOM = V+ to 0,
Switch OFF,
see Figure 13
Full
COM Off-Leakage
Current
ICOM(OFF)
VNO = 0 to V+, VCOM = V+ to 0,
Switch OFF,
see Figure 13
Full
NO On-Leakage
Current
INO(ON)
VNO = 0 to V+, VCOM = Open,
Switch ON,
see Figure 13
Full
COM On-Leakage
Current
ICOM(ON)
VNO = Open, VCOM = 0 to V+,
Switch ON,
see Figure 13
Full
25 °C
25 °C
25 °C
25 °C
5.5 V
5.5 V
5.5 V
5.5 V
−0.1
0.1
−1
1
−0.1
0.1
−1
1
−0.1
0.1
−1
1
−0.1
0.1
−1
1
µA
µA
µA
µA
DIGITAL INPUTS (IN1, IN2)(2)
Input Logic High
VIH
Full
Input Logic Low
VIL
Full
Input Leakage
Current
IIH, IIL
VIN = 5.5 V or 0
25 °C
Full
0.7 × V+
0
5.5
V
0.3 × V+
V
0.1
5.5 V
1
µA
(1) All typical values are at V+ = 5 V, TA = 25°C.
(2) All unused digital inputs of the device must be held at V+ or GND to ensure proper device operation. Refer to the TI application report, Implications
of Slow or Floating CMOS Inputs, literature number SCBA004.
3
W www.ti.com
SCDS177 – OCTOBER 2004
Electrical Characteristics for 5 V Supply (continued)
(V+ = 4.5 V TO 5.5 V AND TA = −40 °C TO 85 °C) (UNLESS OTHERWISE NOTED)
PARAMETER
TEST CONDITIONS
SYMBOL
TA
V+
MIN TYP(1)
MAX
UNIT
DYNAMIC
25 °C
1.5
6.5
1.5
7
0.8
3.7
0.8
7
tON
VNO = V+ or GND,
RL = 500 Ω,
CL = 35 pF,
see Figure 15
tOFF
VNO = V+ or GND,
RL = 500 Ω,
CL = 35 pF,
see Figure 15
Break-Before-Make
Time
tBBM
VNO = V+,
RL = 500 Ω,
CL = 35 pF,
see Figure 16
Charge Injection
QC
CL = 0.1 nF, VGEN = 0 V,
see Figure 20
25 °C
5V
3.4
pC
NO Off-Capacitance
CNO(OFF)
VNO = V+ or GND,
Switch OFF,
see Figure 14
25 °C
5V
4.5
pF
COM
Off-Capacitance
CCOM(OFF)
VNO = V+ or GND,
Switch OFF,
see Figure 14
25 °C
5V
10.5
pF
NO On-Capacitance
CNO(ON)
VNO = V+ or GND,
Switch ON,
see Figure 14
25 °C
5V
17
pF
COM
On-Capacitance
CCOM(ON)
VCOM = V+ or GND,
Switch ON,
see Figure 14
25 °C
5V
17
pF
Digital Input
Capacitance
CIN
VIN = V+ or GND,
see Figure 14
25 °C
5V
3
pF
Bandwidth
BW
RL = 50 Ω,
Switch ON,
see Figure 17
25 °C
4.5 V to 5.5 V
334
MHz
Off-Isolation
OISO
RL = 50 Ω,
f = 10 MHz,
Switch OFF,
see Figure 18
25 °C
4.5 V to 5.5 V
−82
dB
Crosstalk
XTALK
RL = 50 Ω,
f = 10 MHz,
Switch ON,
see Figure 19
25 °C
4.5 V to 5.5 V
−62
dB
Total Harmonic
Distortion
THD
RL = 600 Ω,
CL = 50 pF,
f = 20 Hz to 20 kHz,
see Figure 21
25 °C
5V
0.05
%
I+
VIN = V+ or GND,
Switch ON or OFF
Turn-On Time
Turn-Off Time
Full
25 °C
Full
25 °C
Full
4.5 V to 5.5 V
4.5 V to 5.5 V
ns
ns
0.5
4.5 V to 5.5 V
ns
0.5
SUPPLY
Positive Supply
Current
(1) All typical values are at V+ = 5 V, TA = 25°C.
4
25 °C
Full
1
5.5 V
10
µA
W www.ti.com
SCDS177 – OCTOBER 2004
Electrical Characteristics for 3.3 V Supply
(V+ = 3 V TO 3.6 V AND TA = −40 °C TO 85 °C) (UNLESS OTHERWISE NOTED)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
V+
MIN TYP(1)
MAX
UNIT
ANALOG SWITCH
Analog Signal Range
Peak On-Resistance
VCOM, VNO
rpeak
0
0 ≤ VNO ≤ V+, ICOM = −24 mA,
VNO = 0 V, ICOM = 24 mA
On-Resistance
ron
Switch ON,
see Figure 12
Full
3V
25 °C
Switch ON,
see Figure 12
VNO = 3 V, ICOM = −24 mA
V
25
Ω
6.5
9
9
20
Full
25 °C
V+
9
3V
Full
Ω
20
On-Resistance
match between
channels
∆ron
VNO = 2.1 V,
ICOM = −24 mA,
Switch ON,
see Figure 12
25 °C
3V
0.1
Ω
On-Resistance
flatness
ron(flat)
0 ≤ VNO ≤ V+,
ICOM = −24 mA,
Switch ON,
see Figure 12
25 °C
3.3 V
13.5
Ω
NO Off-Leakage
Current
INO(OFF)
VNO = 0 to V+, VCOM = V+ to 0,
Switch OFF,
see Figure 13
Full
COM Off-Leakage
Current
ICOM(OFF)
VNO = 0 to V+, VCOM = V+ to 0,
Switch OFF,
see Figure 13
Full
NO On-Leakage
Current
INO(ON)
VNO = 0 to V+, VCOM = Open,
Switch ON,
see Figure 13
Full
COM On-Leakage
Current
ICOM(ON)
VNO = Open, VCOM = 0 to V+,
Switch ON,
see Figure 13
Full
25 °C
25 °C
25 °C
25 °C
3.6 V
3.6 V
3.6 V
3.6 V
−0.1
0.1
−1
1
−0.1
0.1
−1
1
−0.1
0.1
−1
1
−0.1
0.1
−1
1
µA
A
µA
A
µA
A
µA
A
DIGITAL INPUTS (IN1, IN2)(2)
Input Logic High
VIH
Full
Input Logic Low
VIL
Full
Input Leakage
Current
IIH, IIL
VIN = 5.5 V or 0
25 °C
Full
0.7 × V+
3.6 V
5.5
V
0
0.3 × V+
V
−1
0.1
1
µA
(1) All typical values are at V+ = 3.3 V, TA = 25°C.
(2) All unused digital inputs of the device must be held at V+ or GND to ensure proper device operation. Refer to the TI application report, Implications
of Slow or Floating CMOS Inputs, literature number SCBA004.
5
W www.ti.com
SCDS177 – OCTOBER 2004
Electrical Characteristics for 3.3 V Supply (continued)
(V+ = 3 V TO 3.6 V AND TA = −40 °C TO 85 °C) (UNLESS OTHERWISE NOTED)
PARAMETER
TEST CONDITIONS
SYMBOL
TA
V+
MIN TYP(1)
MAX
UNIT
DYNAMIC
25 °C
2
9.5
2
11
1.3
5.1
1.5
5.5
tON
VNO = V+ or GND,
RL = 500 Ω,
CL = 50 pF,
see Figure 15
Full
tOFF
VNO = V+ or GND,
RL = 500 Ω,
CL = 50 pF,
see Figure 15
Full
Break-Before-Make
Time
tBBM
VNO = V+,
RL = 500 Ω,
CL = 35 pF,
see Figure 16
Full
Charge Injection
QC
CL = 0.1 nF, VGEN = 0 V,
see Figure 20
25 °C
3.3 V
1.75
pC
NO Off-Capacitance
CNO(OFF)
VNO = V+ or GND,
Switch OFF,
see Figure 14
25 °C
3.3 V
4.5
pF
COM
Off-Capacitance
CCOM(OFF)
VNO = V+ or GND,
Switch OFF,
see Figure 14
25 °C
3.3 V
10.5
pF
NO On-Capacitance
CNO(ON)
VNO = V+ or GND,
Switch ON,
see Figure 14
25 °C
3.3V
17
pF
COM
On-Capacitance
CCOM(ON)
VCOM = V+ or GND,
Switch ON,
see Figure 14
25 °C
3.3 V
17
pF
Digital Input
Capacitance
CIN
VIN = V+ or GND,
see Figure 14
25 °C
3.3 V
3
pF
Bandwidth
BW
RL = 50 Ω,
Switch ON,
see Figure 17
25 °C
3 V to 3.6 V
327
MHz
Off-Isolation
OISO
RL = 50 Ω,
f = 10 MHz,
Switch OFF,
see Figure 18
25 °C
3 V to 3.6 V
−82
dB
Crosstalk
XTALK
RL = 50 Ω,
f = 10 MHz,
Switch ON,
see Figure 19
25 °C
3 V to 3.6 V
−62
dB
I+
VIN = V+ or GND,
Switch ON or OFF
Turn-On Time
Turn-Off Time
25 °C
25 °C
3 V to 3.6 V
3 V to 3.6 V
ns
ns
0.5
3 V to 3.6 V
ns
0.5
SUPPLY
Positive Supply
Current
(1) All typical values are at V+ = 3.3 V, TA = 25°C.
6
25 °C
Full
1
3.6 V
10
µA
W www.ti.com
SCDS177 – OCTOBER 2004
Electrical Characteristics for 2.5 V Supply
(V+ = 2.3 V TO 2.7 V AND TA = −40 °C TO 85 °C) (UNLESS OTHERWISE NOTED)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
V+
MIN TYP(1)
MAX
UNIT
ANALOG SWITCH
Analog Signal Range
Peak On-Resistance
VCOM, VNO
rpeak
0
0 ≤ VNO ≤ V+, ICOM = −8 mA,
VNO = 0 V, ICOM = 8 mA
On-Resistance
ron
Switch ON,
see Figure 12
Full
2.3 V
25 °C
Switch ON,
see Figure 12
VNO = 2.3 V, ICOM = −8 mA
8
Full
25 °C
V+
V
50
Ω
12
12
2.3 V
11
Full
30
Ω
30
On-Resistance
match between
channels
∆ron
VNO = 1.6 V,
ICOM = −8 mA,
Switch ON,
see Figure 12
25 °C
2.3 V
0.3
Ω
On-Resistance
flatness
ron(flat)
0 ≤ VNO ≤ V+,
ICOM = −8 mA,
Switch ON,
see Figure 12
25 °C
2.5 V
39
Ω
NO Off-Leakage
Current
INO(OFF)
VNO = 0 to V+, VCOM = V+ to 0,
Switch OFF,
see Figure 13
Full
COM Off-Leakage
Current
ICOM(OFF)
VNO = 0 to V+, VCOM = V+ to 0,
Switch OFF,
see Figure 13
Full
NO On-Leakage
Current
INO(ON)
VNO = 0 to V+, VCOM = Open,
Switch ON,
see Figure 13
Full
COM On-Leakage
Current
ICOM(ON)
VNO = Open, VCOM = 0 to V+,
Switch ON,
see Figure 13
Full
25 °C
25 °C
25 °C
25 °C
2.7 V
2.7 V
2.7 V
2.7 V
−0.1
0.1
−1
1
−0.1
0.1
−1
1
−0.1
0.1
−1
1
−0.1
0.1
−1
1
µA
A
µA
A
µA
A
µA
A
DIGITAL INPUTS (IN1, IN2)(2)
Input Logic High
VIH
Full
Input Logic Low
VIL
Full
Input Leakage
Current
IIH, IIL
VIN = 5.5 V or 0
25 °C
Full
0.75 × V+
0
5.5
V
0.25 × V+
V
0.1
2.3 V
1
µA
(1) All typical values are at V+ = 2.5 V, TA = 25°C.
(2) All unused digital inputs of the device must be held at V+ or GND to ensure proper device operation. Refer to the TI application report, Implications
of Slow or Floating CMOS Inputs, literature number SCBA004.
7
W www.ti.com
SCDS177 – OCTOBER 2004
Electrical Characteristics for 2.5 V Supply (continued)
(V+ = 2.3 V TO 2.7 V AND TA = −40 °C TO 85 °C) (UNLESS OTHERWISE NOTED)
PARAMETER
TEST CONDITIONS
SYMBOL
TA
V+
MIN TYP(1)
MAX
UNIT
DYNAMIC
25 °C
3
15
3
16.5
2
7.2
2
7.8
tON
VNO = V+ or GND,
RL = 500 Ω,
CL = 50 pF,
see Figure 15
Full
tOFF
VNO = V+ or GND,
RL = 500 Ω,
CL = 50 pF,
see Figure 15
Full
Break-Before-Make
Time
tBBM
VNO = V+,
RL = 500 Ω,
CL = 35 pF,
see Figure 16
Full
Charge Injection
QC
CL = 0.1 nF, VGEN = 0 V,
see Figure 20
25 °C
2.5 V
1.15
pC
NO Off-Capacitance
CNO(OFF)
VNO = V+ or GND,
Switch OFF,
see Figure 14
25 °C
2.5 V
4.5
pF
COM
Off-Capacitance
CCOM(OFF)
VNO = V+ or GND,
Switch OFF,
see Figure 14
25 °C
2.5 V
10.5
pF
NO On-Capacitance
CNO(ON)
VNO = V+ or GND,
Switch ON,
see Figure 14
25 °C
2.5V
17
pF
COM
On-Capacitance
CCOM(ON)
VCOM = V+ or GND,
Switch ON,
see Figure 14
25 °C
2.5 V
17
pF
Digital Input
Capacitance
CIN
VIN = V+ or GND,
see Figure 14
25 °C
2.5 V
3
pF
Bandwidth
BW
RL = 50 Ω,
Switch ON,
see Figure 17
25 °C
2.3 V to 2.7 V
320
MHz
Off-Isolation
OISO
RL = 50 Ω,
f = 10 MHz,
Switch OFF,
see Figure 18
25 °C
2.3 V to 2.7 V
−81
dB
Crosstalk
XTALK
RL = 50 Ω,
f = 10 MHz,
Switch ON,
see Figure 19
25 °C
2.3 V to 2.7 V
−61
dB
I+
VIN = V+ or GND,
Switch ON or OFF
Turn-On Time
Turn-Off Time
25 °C
25 °C
2.3 V to 2.7 V
2.3 V to 2.7 V
ns
ns
0.5
2.3 V to 2.7 V
ns
0.5
SUPPLY
Positive Supply
Current
(1) All typical values are at V+ = 2.5 V, TA = 25°C.
8
25 °C
Full
1
2.7 V
10
µA
W www.ti.com
SCDS177 – OCTOBER 2004
Electrical Characteristics for 1.8 V Supply
(V+ = 1.65 V TO 1.95 V AND TA = −40 °C TO 85 °C) (UNLESS OTHERWISE NOTED)
PARAMETER
TEST CONDITIONS
SYMBOL
TA
V+
MIN TYP(1)
MAX
UNIT
ANALOG SWITCH
Analog Signal Range
Peak On-Resistance
VCOM, VNO
rpeak
0
0 ≤ VNO ≤ V+,
ICOM = −4 mA,
VNO = 0 V,
ICOM = 4 mA
On-Resistance
ron
VNO = 1.8 V,
ICOM = −4 mA
Switch ON,
see Figure 12
Full
1.65 V
25 °C
Switch ON,
see Figure 12
10
Full
25 °C
V+
V
150
Ω
20
20
1.65 V
17
Full
50
Ω
50
On-Resistance
match between
channels
∆ron
VNO = 1.15 V,
ICOM = −4 mA,
Switch ON,
see Figure 12
25 °C
1.65 V
0.3
Ω
On-Resistance
flatness
ron(flat)
0 ≤ VNO ≤ V+,
ICOM = −4 mA,
Switch ON,
see Figure 12
25 °C
1.8 V
140
Ω
NO Off-Leakage
Current
INO(OFF)
VNO = 0 to V+,
VCOM = V+ to 0,
Switch OFF,
see Figure 13
Full
COM Off-Leakage
Current
ICOM(OFF)
VNO = 0 to V+,
VCOM = V+ to 0,
Switch OFF,
see Figure 13
Full
NO On-Leakage
Current
INO(ON)
VNO = 0 to V+,
VCOM = Open,
Switch ON,
see Figure 13
Full
COM On-Leakage
Current
ICOM(ON)
VNO = Open,
VCOM = 0 to V+,
Switch ON,
see Figure 13
Full
25 °C
25 °C
25 °C
25 °C
1.95 V
1.95 V
1.95 V
1.95 V
−0.1
0.1
−1
1
−0.1
0.1
−1
1
−0.1
0.1
−1
1
−0.1
0.1
−1
1
µA
A
µA
A
µA
A
µA
A
DIGITAL INPUTS (IN1, IN2)(2)
Input Logic High
VIH
Full
Input Logic Low
VIL
Full
Input Leakage
Current
IIH, IIL
VIN = 5.5 V or 0
25 °C
Full
0.75 × V+
0
5.5
V
0.25 × V+
V
0.1
1.95 V
1
µA
(1) All typical values are at V+ = 1.8 V, TA = 25°C.
(2) All unused digital inputs of the device must be held at V+ or GND to ensure proper device operation. Refer to the TI application report, Implications
of Slow or Floating CMOS Inputs, literature number SCBA004.
9
W www.ti.com
SCDS177 – OCTOBER 2004
Electrical Characteristics for 1.8 V Supply (continued)
(V+ = 1.65 V TO 1.95 V AND TA = −40 °C TO 85 °C) (UNLESS OTHERWISE NOTED)
PARAMETER
TEST CONDITIONS
SYMBOL
TA
V+
MIN TYP(1)
MAX
UNIT
DYNAMIC
25 °C
5
32
5
34
tON
VNO = V+ or GND,
RL = 500 Ω,
CL = 50 pF,
see Figure 15
Full
tOFF
VNO = V+ or GND,
RL = 500 Ω,
CL = 50 pF,
see Figure 15
Full
Break-Before-Make
Time
tBBM
VNO = V+,
RL = 500 Ω,
CL = 35 pF,
see Figure 16
Full
Charge Injection
QC
CL = 0.1 nF, VGEN = 0 V,
see Figure 20
25 °C
1.8 V
0.3
pC
NO Off-Capacitance
CNO(OFF)
VNO = V+ or GND,
Switch OFF,
see Figure 14
25 °C
1.8 V
4.5
pF
COM
Off-Capacitance
CCOM(OFF)
VNO = V+ or GND,
Switch OFF,
see Figure 14
25 °C
1.8 V
10.5
pF
NO On-Capacitance
CNO(ON)
VNO = V+ or GND,
Switch ON,
see Figure 14
25 °C
1.8V
17
pF
COM
On-Capacitance
CCOM(ON)
VCOM = V+ or GND,
Switch ON,
see Figure 14
25 °C
1.8 V
17
pF
Digital Input
Capacitance
CIN
VIN = V+ or GND,
see Figure 14
25 °C
1.8 V
3
pF
Bandwidth
BW
RL = 50 Ω,
Switch ON,
see Figure 17
25 °C
1.65 V to 1.95 V
341
MHz
Off-Isolation
OISO
RL = 50 Ω,
f = 10 MHz,
Switch OFF,
see Figure 18
25 °C
1.65 V to 1.95 V
−81
dB
Crosstalk
XTALK
RL = 50 Ω,
f = 10 MHz,
Switch ON,
see Figure 19
25 °C
1.65 V to 1.95 V
−61
dB
I+
VIN = V+ or GND,
Switch ON or OFF
Turn-On Time
Turn-Off Time
25 °C
25 °C
1.65 V to 1.95 V
1.65 V to 1.95 V
3
14
3
14.5
ns
ns
0.5
1.65 V to 1.95 V
ns
0.5
SUPPLY
Positive Supply
Current
(1) All typical values are at V+ = 1.8 V, TA = 25°C.
10
25 °C
Full
1
1.95 V
10
µA
W www.ti.com
SCDS177 – OCTOBER 2004
TYPICAL PERFORMANCE
160
25
TA = 2.5_C
140
V+ = 1.65 V
120
TA = 25_C
100
ron (Ω)
ron (Ω)
TA = 85_C
20
80
60
15
TA = −40_C
10
V+ = 2.3 V
40
V+ = 3 V
20
5
V+ = 4.5 V
0
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0
0.5
1
1.5
VCOM (V)
Figure 1. ron vs VCOM
3
3.5
400
TA = 85_C
10
350
Leakage Current (nA)
12
ron (Ω)
2.5
Figure 2. ron vs VCOM (V+ = 3 V)
14
TA = 25_C
8
TA = −40_C
6
4
ICOM(ON)/INO(ON)
300
250
200
INO(OFF)/ICOM(OFF)
150
100
2
50
0
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
−40°C
5
85°C
Figure 4. Leakage Current vs Temperature
(V+ = 5 V)
Figure 3. ron vs VCOM (V+ = 4.5 V)
4
12
V+ = 0
3.5
25°C
Temperature (°C)
VCOM (V)
tr = 2.5 ns,
tf = 2.5 ns
10
3
tON/tOFF (ns)
Charge Injection (pC)
2
VCOM (V)
2.5
2
1.5
1
8
tON
6
4
tOFF
2
0.5
0
0
1
2
3
4
5
V+ (V)
Figure 5. Charge Injection Current vs V+
6
0
0
1
2
3
4
5
6
V+ (V)
Figure 6. tON and tOFF vs V+
11
W www.ti.com
SCDS177 – OCTOBER 2004
TYPICAL PERFORMANCE (continued)
4.5
3
4
TA = 2.5_C
tON
VIH
3
Logic Threshold
tON/tOFF (ns)
3.5
tOFF
2.5
2
1.5
1
2
VIL
1
tr = 2.5 ns,
tf = 2.5 ns
0.5
0
0
0
85°C
25°C
Temperature (°C)
−40°C
1
2
3
4
5
V+ (V)
Figure 7. tON and tOFF vs Temperature (V+ = 5 V)
Figure 8. Logic Threshold vs V+
0
0
−1
−20
−2
Gain (dB)
Gain (dB)
−40
−3
−4
−5
Crosstalk
−60
OFF Isolation
−80
−6
−100
−7
−8
0.1
−120
1
10
100
0.1
100
1
Frequency (MHz)
10
100
Frequency (MHz)
Figure 9. Frequency Response (V+ = 3 V)
Figure 10. OFF Isolation and Crosstalk
vs Frequency (V+ = 3 V)
0.06
494
0.05
492
V+ = 5 V
490
I+ (nA)
THD + Noise (%)
0.04
0.03
486
0.02
484
0.01
482
V+ = 5 V
0.00
0
10
480
100
1000
10000
Frequency (Hz)
Figure 11. Total Harmonic Distortion vs
Frequency (V+ = 5 V)
12
488
100000
−40°C
25°C
85°C
Temperature (°C)
Figure 12. Power Supply Current vs
Temperature (V+ = 5 V)
1000
W www.ti.com
SCDS177 – OCTOBER 2004
PIN DESCRIPTION
PIN NUMBER
NAME
DESCRIPTION
1
NO0
Normally-open terminal
2
NO1
Normally-open terminal
3
NO2
Normally-open terminal
4
GND
Digital ground
5
IN2
Digital control pin to connect the COM terminal to the NO terminals
6
IN1
Digital control pin to connect the COM terminal to the NO terminals
7
COM
Common terminal
8
V+
Power supply
PARAMETER DESCRIPTION
SYMBOL
DESCRIPTION
VCOM
Voltage at the COM pin.
VNO
Voltage at the NO pin.
ron
Resistance between COM and NO ports, when the channel is ON.
∆ron
Difference of ron between channels.
ron(flat)
Difference between the maximum and minimum value of ron in a channel over the specified range of conditions.
INO(OFF)
Leakage current measured at the NO port with the corresponding channel (NO to COM) in the OFF-state under worst
case input and output conditions.
INO(ON)
Leakage current measured at the NO port with the corresponding channel (NO to COM) in the ON-state and the output
(COM) being open.
ICOM(OFF)
Leakage current measured at the COM port with the corresponding channel (COM to NO) in the OFF-state under worst
case input and output conditions.
ICOM(ON)
Leakage current measured at the COM port with the corresponding channel (COM to NO) in the ON-state and the output
(NO) being open.
VIH
Minimum input voltage for logic high for the control input (IN)
VIL
Maximum input voltage for logic low for the control input (IN)
VIN
Voltage at the IN pin.
IIH, IIL
Leakage current measured at the IN pin.
tON
Turn-on time for the switch. This parameter is measured under the specified range of conditions and by the propagation
delay between the digital control (IN) signal and analog outputs (COM/NO) signal, when the switch is turning ON.
tOFF
Turn-off time for the switch. This parameter is measured under the specified range of conditions and by the propagation
delay between the digital control (IN) signal and analog outputs (COM/NO) signal, when the switch is turning OFF.
tBBM
Break-Before-Make time. This parameter is measured under the specified range of conditions and by the propagation
delay between the output of two adjacent analog channels (NO), when the control signal changes state.
QC
Charge-injection is a measurement of unwanted signal coupling from the control (IN) input to the analog (NO or COM)
output. This is measured in coulomb (C) and measured by the total charge induced due to switching of the control input.
Charge-injection, QC = CL × ∆VO, CL is the load capacitance and ∆VO is the change in analog output voltage.
CNO(OFF)
Capacitance at the NO port when the corresponding channel (NO to COM) is OFF.
CNO(ON)
Capacitance at the NO port when the corresponding channel (NO to COM) is ON.
CCOM(OFF)
Capacitance at the COM port when the corresponding channel (COM to NO) is OFF.
CCOM(ON)
Capacitance at the COM port when the corresponding channel (COM to NO) is ON.
CIN
Capacitance of the IN input.
13
W www.ti.com
SCDS177 – OCTOBER 2004
PARAMETER DESCRIPTION (continued)
SYMBOL
14
DESCRIPTION
OISO
Off-isolation of the switch is a measurement of off-state switch impedance. This is measured in dB in a specific
frequency with the corresponding channel (NO to COM) in the OFF state.
XTALK
Crosstalk is a measurement of unwanted signal coupling from an ON channel to an OFF channel. This is measured in a
specific frequency and in dB.
BW
Bandwidth of the switch. This is the frequency where the gain of an ON channel is −3 dB below the DC gain.
I+
Static power supply current with the control (IN) pin at V+ or GND.
W www.ti.com
SCDS177 – OCTOBER 2004
PARAMETER MEASUREMENT INFORMATION
V+
VNO
NO0
VCOM
Channel ON
NO1/NO2
COM
r on +
VIN1
VIN2
Logic
Control
VCOM * VNO
W
I COM
VIN = VIH or VIL
ICOM
GND
Figure 13. ON-State Resistance (ron)
V+
VNO
NO0
VCOM
NO1/NO2
VIN1
VIN2
OFF-State Leakage Current
Channel OFF
VIN = VIH or VIL
COM
VNO = 0 to V+
or
VCOM = 0 to V+
ON-State Leakage Current
Channel ON
VIN = VIH or VIL
Logic
Control
VNO = 0 to V+, VCOM = Open
or
VNO = Open, VCOM = 0 to V+
GND
Figure 14. ON and OFF State Leakage Current (ICOM(ON), ICOM(OFF), INO(OFF), INO(ON))
V+
VNO
NO0−NO2
Capacitance
Meter
VBIAS = V+ or GND
VCOM
VBIAS
VIN1
VIN2
VIN = VIH or VIL
COM
Capacitance is measured at NO,
COM, and IN inputs during ON
and OFF conditions.
Logic
Control
GND
Figure 15. Capacitance (CIN, CCOM(ON), CCOM(OFF), CNO(OFF), CNO(ON))
15
W www.ti.com
SCDS177 – OCTOBER 2004
V+
VNO
NO0
RL
VCOM
2 × V+
Open
GND
NO1/NO2
COM
CL
RL
IN1
VIN1
VIN2
Logic
Input
S1
Logic
IN2 Control
GND
V+
Logic Input
(VIN)
50%
50%
0V
tPZL
TEST
RL
CL
tON
tPZH
tPZL
500 Ω
50 pF
VNO0
V+
S1
500 Ω
50 pF
GND
2 y V+
tOFF
tPHZ
tPLZ
500 Ω
50 pF
500 Ω
50 pF
V+
GND
2 y V+
GND
Switch Output
(VCOM)
S1 at 2 × V+
tPLZ
VOH
50%
VOL + 0.3 V
VOL
tPZH
GND
Switch Output
(VCOM)
S1 at GND
tPHZ
VOH
VOH − 0.3 V
50%
0V
Figure 16. Turn-ON (tON) and Turn-OFF (tOFF) Time
tr < 2.5 ns
tf < 2.5 ns
V+
VI
NO0
VCOM
NO1/NO2
RL
Logic
Input
VIN2
50%
Switch Output
(VCOM)
90%
CL
Logic
IN2 Control
GND
VI = V+
RL = 500 Ω
CL = 35 pF
Figure 17. Break-Before-Make (tBBM) Time
16
0
COM
IN1
VIN1
V+
Logic Input
(VIN)
90%
tBBM
VOH
W www.ti.com
SCDS177 – OCTOBER 2004
V+
Network Analyzer
50 W
VNO
NO0
COM
Source
Signal
VCOM
Channel ON: NO0 to COM
NO1/NO2
IN1
VIN1
VIN2
50 W
Network Analyzer Setup
Logic
IN2 Control
Source Power = 0 dBM
DC Bias = 350 mV
GND
Figure 18. Frequency Response (BW)
V+
Network Analyzer
50 W
VNO
NO0
COM
Source
Signal
50 W
VCOM
Channel OFF: NO0 to COM
NO1/NO2
Network Analyzer Setup
GND
Source Power = 0 dBM
50 W
DC Bias = 350 mV
Figure 19. Off-Isolation (OISO)
V+
Network Analyzer
50 W
Channel ON: NO0 to COM
NO0
VCOM
Source
Signal
Channel OFF: NO1/NO2 to COM
NO1/NO2
50 W
50 W
Network Analyzer Setup
GND
Source Power = 0 dBM
DC Bias = 350 mV
Figure 20. Crosstalk (XTALK)
17
W www.ti.com
SCDS177 – OCTOBER 2004
V+
RGEN
VGEN
+
Logic Input
(VIN)
NO0
VIH
OFF
ON
OFF V
IL
VOUT
∆VOUT
VOUT
NO1/NO2
COM
CL
IN1
VIN1
Logic
Input
VIN2
VGEN = 0
RGEN = 0
CL = 35 pF
QC = CL × ∆VOUT
VIN = VIH or VIL
Logic
IN2 Control
GND
Figure 21. Charge-Injection (QC)
Channel ON: COM to NO0
VSOURCE = V+ P-P
VI = VIH or VIL
V+/2
V+
fSOURCE = 20 Hz to 20 kHz
RL = 600 Ω
CL = 50 pF
RL
10 mF
VO
COM
NO1/NO2
VSOURCE
RL
VI
CL(1)
IN
+
GND
(1) CL includes probe and jig capacitance.
Figure 22. Total Harmonic Distortion (THD)
18
10 mF
NO0
Analyzer
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jun-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
TS5A3357DCTR
PREVIEW
SM8
DCT
8
3000
TBD
Call TI
TS5A3357DCUR
ACTIVE
US8
DCU
8
3000
Pb-Free
(RoHS)
CU NIPDAU
Call TI
Level-1-260C-UNLIM
TS5A3357DCURE4
ACTIVE
US8
DCU
8
3000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-260C-UNLIM
TS5A3357DCUT
ACTIVE
US8
DCU
8
250
Pb-Free
(RoHS)
CU NIPDAU
Level-1-260C-UNLIM
TS5A3357DCUTE4
ACTIVE
US8
DCU
8
250
Pb-Free
(RoHS)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MPDS049B – MAY 1999 – REVISED OCTOBER 2002
DCT (R-PDSO-G8)
PLASTIC SMALL-OUTLINE PACKAGE
0,30
0,15
0,65
8
0,13 M
5
0,15 NOM
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
2,90
2,70
4,25
3,75
Gage Plane
PIN 1
INDEX AREA
1
0,25
4
0° – 8°
3,15
2,75
0,60
0,20
1,30 MAX
Seating Plane
0,10
0,10
0,00
NOTES: A.
B.
C.
D.
4188781/C 09/02
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion
Falls within JEDEC MO-187 variation DA.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright  2005, Texas Instruments Incorporated